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December 8, 2009
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Abstracts Due December 11 for IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan (read more...)

Button Device Packaging 2010 - Exhibit Space Still Available But Hall Will Sell Out Again (read more...)

Button International Conference on High Temperature Electronics (HiTEC 2010) - Abstracts Still Being Accepted, Tabletops and Registration Now Available (read more...)

Button ATW on Printed Devices and Appilcations - Abstracts Still Being Accepted and Tabletops Now Available (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS New England, 37th Symposium & Expo - Abstracts Due December 31 (read more...)

   MEMBERS IN THE NEWS
Ray Petit and Sam Yoshikawa join Abstract Electronics (read more...)

   PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Abstracts Due December 11 for IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan    ^ Top
The Sixth Annual CICMT Conference will be held in Chiba, Japan, on April 18-21, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS) and co-sponsored by the American Ceramics Society (ACerS), IMAPS Japan, Ceramics Society of Japan, Ferroelectric Committee of Japan (FMA), Japan Society of Applied Physics, MRS-Japan, and AIST .
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.cicmt.org.

Abstracts must be submitted electronically at www.cicmt.org by December 11, 2009.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both topical areas, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems topics of the CICMT conference target new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Sessions Include:

Session 1) Organized by IMAPs Japan

Dr. Kishio Yokouchi (Fujitu Interconnect Tech.)

Dr. Shinichi Nishi (Konicaminolta IJ Technologies, Inc.)

Session 2) Multilayer Ceramic Microsystems

Amy Moll, Boise State University

Leszek Golonka,Wroclaw University

Keisuke Kageyama, Murata Manu. 

Session 3) Electromagnetic Properties

Dr.-Ing. Jens Mueller, Technical University Ilmanau

Mike Janezic, NIST Boulder

Dr. Soshu Kirihara, Osaka Univ., Japan

Session 4) Direct Write Technology

Jun Akedo, Ntnl Inst of Advanced Industrial Sci.and Tech, Japan

Chris Apblett, Sandia National Laboratory

Session 5) Piezoelectric applications including MEMS

Yuji Noguchi, Tokyo Univ., Japan

Richard Eitel, University of Kentucky

Wei Ren, Xian Jiaotong University

Session 6) Ceramics in Energy Systems

Dr. Masanobu Awano, AIST., Japan

Nigel Sammes, Colorado School of Mines

Session 7) Novel Processing Techniques

Dr. Minoru Osada (NIMS., Japan)

Session 8) Dielectric and Ferroelectric Materials and Components

 Dr. Hyotae Kim (KICET)

Yong Cho (Yonsei University)

Session 9) Poster Session

Dr. Hiroaki Takeda (Tokyo Tech., Japan)

Abstract Cut-off Date: December 11, 2009
Notice of Acceptance: January 8, 2010
Final Manuscripts Due: February 19, 2010

Please send your 250-300 word abstract electronically only by December 11, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

Device Packaging 2010 - Exhibit Space Still Available But Hall Will Sell Out Again    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging and the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. There are booths still available. The program will be published in the next two weeks, so reserve your spot before it's too late, and in time to have your name in print in the program before it mails.

Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

International Conference on High Temperature Electronics (HiTEC 2010) - Abstracts Still Being Accepted, Tabletops and Registration Now Available    ^ Top
IMAPS International Conference on High Temperature Electronics (HiTEC 2010) will be held May 11-13, 2010, at the Hyatt Regency in Albuquerque, New Mexico. Abstracts are being accepted until December 11. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/hitec.

Tabletop reservations and conference registration are now available on-line at www.imaps.org/hitec.

HiTEC 2010 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society, HiTEC 2010 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

 

Those wishing to present a paper at the HiTEC 2010 Conference must submit a 200-300 word abstract electronically by December 11, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 200-300 word abstract electronically no later than December 11, 2009; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on April 2, 2010.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

ATW on Printed Devices and Appilcations - Abstracts Still Being Accepted and Tabletops Now Available    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are still being accepted. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/printed.

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

  Chapter Activities (events listed in chronological order)
 

IMAPS New England, 37th Symposium & Expo - Abstracts Due December 31    ^ Top

Dates: May 4, 2010
Schedule: Deadline for Abstract Submission – December 31, 2009
Location:

Holiday Inn – Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to weihan.vivian@gmail.com or visit us at - www.imapsne.org – for details

Symposium Technical Chair:
Wei Han, Ph.D
Gillette/P&G, Boston, MA

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal  Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Emerging Technologies

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic Packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green Packaging / Compliance with RoHS
  • Flip-Chip and Bumping: Processes, Reliability
  • Wirebonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Visit us at - www.imapsne.org – for details.

  Members In The News
 

Ray Petit and Sam Yoshikawa join Abstract Electronics   ^ Top
Ray Petit is a mechanical/process engineer who has over 30 years of general material, assembly, and process engineering experience in the various sectors of the semiconductor / electronic components industry.  He has helped several companies set up factories around the world for clock oscillators, switching systems, and hybrid circuits.  Ray has developed a strong sense of the components industry just by his interactions with his long established customer base.

Sam Yoshikawa is an electrical engineer who has worked on testing and handling of semiconductor devices and electronic components.  Sam has over 25 years of semiconductor / component industry experience and has worked with many instrument and equipment manufacturers.  Sam also migrated into the semiconductor device manufacturing process and assembly industry to further his knowledge of the industry.

Both Ray and Sam have extensive engineering backgrounds and will help produce a much closer relationship with Abstract Electronics customers as well as enhance the ability to provide technical/customer support.
  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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