On-line Registration Closes Friday at Noon Eastern for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications^
Top This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. The technical program, exhibitor information, registration forms and other information can be found on-line at www.imaps.org/printed.
On-line registration closes this Friday, February 20. You will need to register on-site in Orlando after this time.
This workshop will feature five technical sessions on: Industry Convergence and Technology Transformation; Materials: Substrates, Inks & Epoxies; Digital Printing & Deposition Technology; Printed Devices - Active & Passive; and The New Design and Application Paradigm. Dr. Jennifer Ricklin of the DARPA Strategic Technology Office will deliver a lunch keynote presentation on Thursday. The technical program will also include a university poster session as well as poster presentations from local high school students.
A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at firstname.lastname@example.org or 202-548-8717 for information about Tabletop exhibits.
IMAPS has also negotiated Walt Disney Theme Parks Discounted Tickets (Deadline: February 25, 2009). For advance purchase of specially priced Disney Meeting/Convention Theme Park tickets, please visit: http://www.disneyconventionear.com/IMPS.
PDC Webinar Series on Lead-free Electronics – Technology, Manufacturing & Reliability^
This two-session on-line Professional Development Course (PDC) webinar will be held:
Wednesday, March 18 and Wednesday, March 25, 2009
All webinars will be held 12:00 noon - 1:00 pm EST
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375
Lead-free alloys, lead-free solder joint reliability, lead-free package and assembly reliability, system reliability, SnPb vs. Pb-free, fatigue, creep, mechanical testing, microstructure, failure mechanisms, failure mode, solder joint surface crack, lead-free solder technology, lead-free production
These 2 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest. Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.
Session 1 of 2: Wednesday, March 18 -- 12:00-1:00 PM EST
On the tenth anniversary of lead-free implementation in electronics, this lecture provides a holistic view of the state-of-the-art lead-free technology, performance and reliability for both solder joints and assembly systems. A wide array of global production results and the product field service performance have been generated during the last decade. Some were deemed positive and some remain to be resolved, and test results may appear not all coinciding. Yet all product performance and test results manifest the criticality of sound practice. The lecture will highlight the sound practice in all key areas of lead-free electronics. Based on the presenter’s three textbooks: ”Environment-Friendly Electronics-Lead Free Technology” (Electrochemical Publ., Great Britain), “Lead-free Implementation—A Manufacturing Guide” (McGraw-Hills, U.S.A.) and "Modern Solder Technology for Competitive Electronics Manufacturing" (McGraw-Hill, U.S.A.), representative test results will be illustrated. Technology fundamentals in lead-free alloy design will also be summarized including the main differences between SnPb and Pb-free.
Industry trends vs. solder joint reliability
Lead-free solder technology – fundamentals and critical areas
Solder joint reliability – mechanical properties and microstructure evolution vs. services
Lead free system – solder joint, PCB/ceramic substrate and components
Differences and commonalties between SnPb and Pb-free systems
PCB surface finishes – options and impact on performance & reliability
Component coatings – options and impact on performance & reliability
Two most important production performance parameters
Production approaches and representative results
Production defects - types
Session 2 of 2: Wednesday, March 25 -- 12:00-1:00 PM EST
The second part of this lecture series will focus on the reliability of electronics packages and assemblies.
Likely failure processes and prevention – solder joint vs. system
Solder joint thermo-mechancial behavior and degradation – fatigue and creep interaction
Testing solder joint reliability – discriminating tests and discerning parameters
Solder joint strengthening metallurgy for increased fatigue resistance and creep resistance
Solder joint microstructure evolution vs. strengthening
Thermal cycling conditions - effects on test results and results interpretation
System reliability including components, PCB/ceramic substrates
Reliability and performance in harsh environment – results, comparison, fundamentals, practices
Who Should Attend?
The lecture series provides a working knowledge to all who are involved with or interested in the production and reliability of Pb-free electronic packaging and assembling; also designed for those who desire the broad-based information including the underlying fundamental lead-free technology.
Dr. Hwang, a pioneer and long-standing leader in lead-free electronics, brings her 29-year manufacturing experience combined with her sustained 19-year lead-free R&D and hands-on production implementation to this lecture. She has been a major contributor to the implementation of Surface Mount production since its inception through hands-on operation and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications including U.S. Dept. of Defense F-22 program. Among her many awards and honors are citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering. She holds patents and has 300 publications to her credit, including the sole authorship of several internationally-used textbooks related to electronic packaging and assembly. Her books, columns, and publications have been widely cited worldwide. Dr. Hwang has been a frequent keynote/featured speaker at worldwide events (United States Patent and Trademark Office, Federal Women’s Program, numerous industry events). Over the years, she has lectured to more than 25,000 professionals and researchers in professional development courses. Her formal education includes Harvard Business School Executive Program and Ph.D. M.S., M.S., B.S. degrees in Materials & Metallurgical Engineering, Inorganic Chemistry, Liquid Crystals Science and Chemistry, respectively. She has held various senior executive positions with Lockheed Martin, SCM Corp, Sherwin Williams Co, and IEM Corp. She is currently a principal of H-Technologies Group, providing business and manufacturing solutions to the electronics industry. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees. Her books have received a wide circulation worldwide.
(ISBN-0-07-143048-2) “Lead-free Implementation: A Guide to Manufacturing” McGraw-Hill, New York, 2005
Device Packaging Conference Features 8 Professional Development Courses^
The 5th International Conference and Exhibition on Device Packaging is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.
GBC Spring Conference on Supply Chain Development for 3D Packaging - Less Than 3 Weeks Away^
The Global Business Council (GBC) Spring Conference on Supply Chain Development for 3D Packaging is being held March 8-9, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. This year's conference focuses on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.
Sunday March 8, 2009 12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - www.wekopa.com Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.
6:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)
Monday, March 9, 2009 All listed times are approximate. 7:00 AM - 5:00 PM -- Registration 7:00 AM - 8:00 AM -- Continental breakfast
8:00 AM -- Opening Remarks and Keynote Address:
Lee Smith, VP of Business Development, Amkor Technology, Inc.
Keynote address: Market Demand, Applications and Requirements for 3D Packaging and 3D IC
Jan Vardaman, President, TechSearch International
Session 1: Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects
Role of Consortia: 9:00 AM - 10:00 AM
9:00 AM Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool
3D Integration Technology and the Micro-Electronics Supply Chain, Barriers and Solutions
Eric Beyne, Director, Packaging and Interconnect Center, IMEC
10:00 - 10:15 AM - Break
Perspectives from IC Suppliers: 10:20 AM - 11:50 AM
10:20 AM TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm
10:50 AM 3D Integration – Packaging Innovation through Common Platform Ecosystem Jean Trewhella, Director of Packaging Research and Development, IBM
11:20 AM Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure
Bob Patti, CTO, Tezzaron Semiconductor
11:50 AM - 12:55 PM - Lunch and Keynote on IC Market
Keynote address: Poised for Quick Rebound
Bill McClean, President, IC Insights
Session 2: 3D Packaging and TSV Roadmap and Supply Chain/Technology Development Packages
1:00 PM 3D Electronics and System in Package Integration: Where it’s at...Where it’s going...
W. R. “Bill” Bottoms, CEO, NanoNexus
1:30 PM Key Requirements for 3D Packaging using TSVs
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.
2:00 PM Materials Requirements and Development Issues for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas
2:30 PM Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Semiconductor Manufacturing, Gartner Dataquest
3:00 - 3:15 PM - Break
Session 3: Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products
3:20 PM 3D Packaging Trends in Multimedia Handsets from Teardown Analysis
David Carey, President, Portelligent
3:50 PM Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer Materials, Intel
4:20 PM Rolling Out a New Packaging Technology; Benefiting from and Maximizing Supply Chain Opportunities that Span the Chain
Marc Robinson, CTO, Vertical Circuits, Inc.
4:50 PM - Closing Remarks and Adjourn Greg Caswell, VP of Engineering, Reactive Nano Technologies
The Hotel deadline has been extended and rooms are still available at the IMAPS rates.
Visit www.imaps.org/gbc today to learn more about this conference and to register on-line.
The GBC is co-located with the 5th International Conference and Exhibition on Device Packaging which is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.
Abstracts Due This Friday, February 20 for the Topical Workshop on Wire Bonding^
This 2nd Annual Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/wirebonding.
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
Ultra Fine-Pitch Ball Bonding
Copper Ball Bonding
Stacked Die SiP Packages
Wire Bonding on Cu/Low-K Dielectrics
New Loop Shapes and Applications
Wire and Tools
Aluminum and Copper Wedge Bonding
Heavy Wire Bonding and Applications
Failure Analysis and Reliability
Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by February 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.
Abstracts Due This Friday, February 20 for the New Topical Workshop on Adhesives/Encapsulants/Molding^
This new Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/aem.
The objective of the Adhesives, Encapsulation and Molding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people who have been working in this area of technology. This workshop has been specifically organized to allow for the presentation on the latest current thinking on these focus areas of technologies.
Glob Top Encapsulants
Thermo-Compression Molded Packages
Corner and Edge Bond of CSP Devices
Flip Chip Underfill
Flip Chip Underfill and Molding
Surface Preparation to Improve Adhesion and Flow Characteristics
• Simulation and Modeling
Failure Analysis and Reliability
Alternative Interconnect for Flip Chip
Those wishing to present a paper at the Adhesives, Encapsulants and Molding Topical Workshop must submit a 200-300 word abstract electronically by February 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.
To comply with government regulations, DuPont has on-site security policies :
1. Cameras (and cell-phone camera) are not allowed on the site; visitors will told to either to leave their device with security and pick it up upon leaving or to return the device to their vehicle.
2. All visitors who are not employed by DuPont are required to show two forms of identification to Security:
A. At least one must be a government-issued photo ID such as a driver license, Passport, Green Card, etc.
B. The secondary ID is a second government-issued ID, with or without a photo, or an employer-issued photo ID.
C. An employer-issued ID without a photo of the person is acceptable, as long as the individual’s name on the ID matches their driver’s license.
D. Credit cards cannot be accepted as secondary ID.
Next Thursday: Orange Chapter Technical Dinner Meeting February 26 on Advanced TpG Material For The Thermal Management Of Electronics^
February 26, 2009
7762 Beach Blvd
Buena Park, CA About 1/2 mile south of 91 FWY
Advanced TpG Material For The Thermal Management Of Electronics
Xiang Liu, Ph.D
Momentive Performance Materials, Inc.
The continuous demand on higher chip power dissipations and shrinking device footprints require innovative thermal management solutions, including materials and cooling technologies. Momentive Performance Materials manufactures a specialty thermal material, Thermal Pyrolitic Graphite (TPG*), which exhibits thermal conductivity greater than 1550W/mK. TC1050* is a composite material Momentive developed to encapsulate TPG* in metal, polymer, and other materials which enables it to be used in heat spreaders, heat sinks, and other thermal management products. In this talk, the characteristics of TPG and TC1050 will be presented. Experimental data from TC1050 applications will also be discussed.
I received my Bachelor of Science degree from Tsinghua University, Beijing, China, and Ph.D. from Northwestern University, Evanston, IL. Both degrees are in Material Science & Engineering. I started my career as a Materials Scientist with GE Advanced Materials (now Momentive Performance Materials) in 2003. I have worked on CVD of nitride films and PVD metal coatings for wafer processing tools for the semiconductor industry. Recently, I’ve worked as an Applications Development Scientist & Engineer, focusing on Momentive’s high thermal conductivity materials, including TPG, for thermal management of electronics.
IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
Professor Roger Ruan,, U of MN
Director of the Center for Biorefiining
Conversion of Plant Algae into BioDiesel Fuel Help Solve our Nations Energy Dependence with a Plentiful Resource!
Dr. Ruan is a worldwide expert in the creation of renewable energy and other products. He currently is working on the conversion of biomass into food, feed, and fuels, chemicals, and materials, as well as energy crop production, biopolymer and food process improvement.
Tour: Great River Energy Co-op
The U.S. Green Building Council has awarded the Great River Energy headquarters building Platinum LEED (Leadership in Energy and Environmental Design) certification. The award is the highest designation available to buildings that demonstrate energy efficiency and sustainability. The building is the first in Minnesota to achieve the distinction and one of fewer than 100 buildings worldwide to receive the designation.
Besides efficient lighting it also features rooftop solar photovoltaic panels, its own wind turbine, a state-of-the-art geothermal heating and cooling system and multiple atriums to harvest maximum daylight. They even capture rainwater to use for flushing toilets and irrigation. See GRE’s media kit. The building will reduce energy consumption by 40%, decrease water usage by 90% and with on site renewable energy replace up to 15% of the buildings energy needs.
These valuable presentations and dinner are complimentary by registering by March 20 with Greg Chesmar at GregChes@aol.com or 215-822-0510.
4:30 Keystone Chapter Leadership Meeting Please attend if you would like to benefit by organizing & presenting at future events.
5:30 Happy Hour – Cash Bar Build connections with local peers.
6:15 Buffet Dinner
A brief chapter business meeting will be held during the dinner hour.
7:15 First Speaker: Daniel Quain Director, Mission Success and Product Assurance, Cobham Defense Systems “Manufacturing Trends for Low Volume, High Complexity Microelectronic Assemblies and Subsystems”
(Abstract: A discussion of industry trends in the manufacturing and packaging of microelectronic assemblies for high reliability defense applications.)
7:45 Second Speaker: Matthew Gruber Manager, Cabinets & Electronics Packaging, Lockheed Martin – MS2 “Non-Hermetic Packaging of RF Multi-Chip Modules”
(Abstract: The packaging of RF multi-chip modules for military applications traditionally employs the use of hermetic, ceramic-based substrates. Although these packaging schemes have proven to be highly robust in a variety of environments, they also carry a significantly higher cost than non-hermetic alternatives. In order to take advantage of the significant cost opportunities available, a multi-chip module was developed using Monolithic Microwave Integrated Circuits (MMICs) in plastic over-molded QFN packages. The completed assembly was tested and performed almost as well as a ceramic chip and wire module using the same chipset, for less than 25% of the packaging cost.).
Within INTERCONEX 2009, the technical committee is organizing the technical program on the following topics:
Packaging & Application of Power LED Devices
Packaging and reliability challenges of high pin count circuits
A one day technical workshop on:
Microelectronics and packaging for medical and healthcare applications
Technical conferences on the following subjects:
Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
Flip-chip (substrates and board technologies),
Reliability, thermal management,
Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
Modelling, simulation & design, ….
Characterization & test,
Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
Systems (optic, photonic, harsh environment, …)
The deadline for abstracts has passed and the organizers are now creating the technical program. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Products and Publications
Announcing iKnow Microelectronics Library Subscription^
IMAPS iKnow MicroelectronicsLibrary Subscription gives academic, corporate and government agency libraries unlimited access to the most current research papers, presentations and other downloads from all available IMAPS journals, magazines, workshop presentations, and conference proceedings.
IKnow now features "IP Recognition” which allows for seamless use by all users within your institution’s network to instantly access the following technical publications without the hassle of log-ins, passwords or download credits:
Unlimited downloads of all peer-reviewed Journal of Microelectronics and Electronic Packaging papers. Currently 2004-2009. Additional Archives added in first quarter 2009.
Unlimited downloads of all Advancing Microelectronics magazines.
Currently 2003-2009. Additional Archives added in 2009.
Unlimited downloads of archived technical workshop presentations, conference and symposium proceedings. Currently 2003-2009. Additional Archives added in first quarter 2009.
Emerging research from the leading innovators in microelectronics and packaging technologies.
Robust search tools with a user-friendly interface.
How it Works:
The subscribing library will provide IMAPS with the applicable internet protocol (IP) address(es). IMAPS will set-up the subscriber’s account to recognize that IP range only. All computers using the IPs provided will immediately have instant, 24-7 access to all of the iKnow downloads. Any users on said computers may then visit IMAPS website, perform an advanced search for topics/publications of interest, and simply click on the “Download Now” link to automatically view/download the PDF file. There is no log-in process, no usernames or passwords to remember, and no download counter to worry about.