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February 18, 2009

Draper Laboratory

   IMAPS EVENTS
Button On-line Registration Closes Friday at Noon Eastern for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications (read more...)

Button PDC Webinar Series on Lead-free Electronics – Technology, Manufacturing & Reliability  (read more...)

Button Device Packaging Conference Features 8 Professional Development Courses (read more...)

Button GBC Spring Conference on Supply Chain Development for 3D Packaging Less Than 3 Weeks Away  (read more...)

Button Abstracts Due This Friday, February 20 for the Topical Workshop on Wire Bonding (read more...)

Button Abstracts Due This Friday, February 20 for the New Topical Workshop on Adhesives/Encapsulants/Molding (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Next Tuesday: Carolinas Chapter Technical Meeting February 24 at DuPont (read more...)

Bullet Next Thursday: Orange Chapter Technical Dinner Meeting February 26 on Advanced TpG Material For The Thermal Management Of Electronics (read more...)

Bullet IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read more...)

Bullet Viking Chapter March 5 Spring Meeting and Tour at Great River Energy (read more...)

Bullet Keystone Chapter March 26 Dinner Meeting (read more...)

Bullet Don't Miss INTERCONEX 2009 (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

   PRODUCTS AND PUBLICATIONS
Announcing iKnow Microelectronics Library Subscription (read more...)

AI Technology

IMAPS Events (view full Web Calendar)

On-line Registration Closes Friday at Noon Eastern for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications   ^ Top
This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. The technical program, exhibitor information, registration forms and other information can be found on-line at www.imaps.org/printed.

On-line registration closes this Friday, February 20. You will need to register on-site in Orlando after this time.

This workshop will feature five technical sessions on: Industry Convergence and Technology Transformation; Materials: Substrates, Inks & Epoxies; Digital Printing & Deposition Technology; Printed Devices - Active & Passive; and The New Design and Application Paradigm. Dr. Jennifer Ricklin of the DARPA Strategic Technology Office will deliver a lunch keynote presentation on Thursday. The technical program will also include a university poster session as well as poster presentations from local high school students.

A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

IMAPS has also negotiated Walt Disney Theme Parks Discounted Tickets (Deadline: February 25, 2009). For advance purchase of specially priced Disney Meeting/Convention Theme Park tickets, please visit: http://www.disneyconventionear.com/IMPS.

PDC Webinar Series on Lead-free Electronics – Technology, Manufacturing & Reliability   ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held:
Wednesday, March 18 and Wednesday, March 25, 2009

All webinars will be held 12:00 noon - 1:00 pm EST

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Register On-line
Registration Deadlines: March 17, 2009

Key Words

Lead-free alloys, lead-free solder joint reliability, lead-free package and assembly reliability, system reliability, SnPb vs. Pb-free, fatigue, creep, mechanical testing, microstructure, failure mechanisms, failure mode, solder joint surface crack, lead-free solder technology, lead-free production

Program Description

These 2 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 2: Wednesday, March 18 -- 12:00-1:00 PM EST

On the tenth anniversary of lead-free implementation in electronics, this lecture provides a holistic view of the state-of-the-art lead-free technology, performance and reliability for both solder joints and assembly systems. A wide array of global production results and the product field service performance have been generated during the last decade. Some were deemed positive and some remain to be resolved, and test results may appear not all coinciding. Yet all product performance and test results manifest the criticality of sound practice. The lecture will highlight the sound practice in all key areas of lead-free electronics. Based on the presenter’s three textbooks: ”Environment-Friendly Electronics-Lead Free Technology” (Electrochemical Publ., Great Britain), “Lead-free Implementation—A Manufacturing Guide” (McGraw-Hills, U.S.A.) and "Modern Solder Technology for Competitive Electronics Manufacturing" (McGraw-Hill, U.S.A.), representative test results will be illustrated. Technology fundamentals in lead-free alloy design will also be summarized including the main differences between SnPb and Pb-free.

  • Industry trends vs. solder joint reliability
  • Lead-free solder technology – fundamentals and critical areas
  • Solder joint reliability – mechanical properties and microstructure evolution vs. services
  • Lead free system – solder joint, PCB/ceramic substrate and components
  • Differences and commonalties between SnPb and Pb-free systems
  • PCB surface finishes – options and impact on performance & reliability
  • Component coatings – options and impact on performance & reliability
  • Two most important production performance parameters
  • Production approaches and representative results
  • Production defects - types

Session 2 of 2: Wednesday, March 25 -- 12:00-1:00 PM EST

The second part of this lecture series will focus on the reliability of electronics packages and assemblies.

  • Likely failure processes and prevention – solder joint vs. system
  • Solder joint thermo-mechancial behavior and degradation – fatigue and creep interaction
  • Solder joint failures modes - interfacial, near-interfacial, bulk, inter-phase, intra-phase, voids-induced, surface-crack, and others
  • Solder joint failure mechanisms – ductile, brittle, ductile-brittle transition fracture
  • Testing solder joint reliability – discriminating tests and discerning parameters
  • Solder joint strengthening metallurgy for increased fatigue resistance and creep resistance
  • Solder joint microstructure evolution vs. strengthening
  • Thermal cycling conditions - effects on test results and results interpretation
  • System reliability including components, PCB/ceramic substrates
  • Reliability and performance in harsh environment – results, comparison, fundamentals, practices

Who Should Attend?

The lecture series provides a working knowledge to all who are involved with or interested in the production and reliability of Pb-free electronic packaging and assembling; also designed for those who desire the broad-based information including the underlying fundamental lead-free technology.

Thomas Green

Presenter

Dr. Hwang, a pioneer and long-standing leader in lead-free electronics, brings her 29-year manufacturing experience combined with her sustained 19-year lead-free R&D and hands-on production implementation to this lecture. She has been a major contributor to the implementation of Surface Mount production since its inception through hands-on operation and as an advisor to OEMs, EMS and U.S. government. She has provided solutions to many challenging problems, ranging from production yield to field failure diagnosis to reliability issues. Her work covers both commercial and military applications including U.S. Dept. of Defense F-22 program. Among her many awards and honors are citations by the U.S. Congress, Honorary Doctoral degree, induction into WITI International Hall of Fame, named “R&D Star-to-Watch” by Industry Week; YWCA Women of Achievement Award; election to the National Academy of Engineering. She holds patents and has 300 publications to her credit, including the sole authorship of several internationally-used textbooks related to electronic packaging and assembly. Her books, columns, and publications have been widely cited worldwide. Dr. Hwang has been a frequent keynote/featured speaker at worldwide events (United States Patent and Trademark Office, Federal Women’s Program, numerous industry events). Over the years, she has lectured to more than 25,000 professionals and researchers in professional development courses. Her formal education includes Harvard Business School Executive Program and Ph.D. M.S., M.S., B.S. degrees in Materials & Metallurgical Engineering, Inorganic Chemistry, Liquid Crystals Science and Chemistry, respectively. She has held various senior executive positions with Lockheed Martin, SCM Corp, Sherwin Williams Co, and IEM Corp. She is currently a principal of H-Technologies Group, providing business and manufacturing solutions to the electronics industry. She is also an invited distinguished adj. Professor of Engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees. Her books have received a wide circulation worldwide.

  • (ISBN-0-07-143048-2) “Lead-free Implementation: A Guide to Manufacturing” McGraw-Hill, New York, 2005
  • (ISBN-0 901 150 401) “Environment-Friendly Electronics—Lead Free Technology”, Electrochemical Publications, LTD, Great Britain, 2001
  • (ISBN-0-07-031749-3) "Modern Solder Technology for Competitive Electronics Manufacturing", , McGraw-Hill, New York, 1996
  • (ISBN-0-90-115029-0)"IC Ball Grid Array & Fine Pitch Peripheral Interconnections”, Electrochemical Publications, LTD, Great Britain, 1995
  • In Japanese, "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1989
  • (ISBN-0442-2075-49) "Solder Paste: Technology and Applications for Surface Mount, Hybrid Circuits, and IC Component Manufacturing", Van Nostrand Reinhold, New York, 1988

Register On-line

Device Packaging Conference Features 8 Professional Development Courses   ^ Top
The 5th International Conference and Exhibition on Device Packaging is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

This year’s conference will feature technical sessions across 6 technical tracks, panel discussions, a poster session and a sold-out vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; MEMS; Flip Chip; Wafer Level Packaging; Power LED Devices and Biomedical.

This year’s conference will feature 8 professional development courses also focused on these 6 topical areas of microelectronics. The following PDCs offer an additional valuable resource to attendees:

The Global Business Council (GBC) will co-locate its Spring Conference March 8-9, focusing on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.

The Device Packaging Conference and Exhibition has nearly doubled in attendance and sold out exhibit space every year since its inception. 2009 is no different - the hall is now sold out!

The Hotel deadline has been extended and rooms are still available at the IMAPS rates.

Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line.

GBC Spring Conference on Supply Chain Development for 3D Packaging - Less Than 3 Weeks Away   ^ Top
The Global Business Council (GBC) Spring Conference on Supply Chain Development for 3D Packaging is being held March 8-9, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. This year's conference focuses on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.

Sunday March 8, 2009
12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - www.wekopa.com 
Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.

6:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)

Monday, March 9, 2009
All listed times are approximate.
7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

8:00 AM -- Opening Remarks and Keynote Address:

Opening Remarks:
Lee Smith, VP of Business Development, Amkor Technology, Inc.

Keynote address:
Market Demand, Applications and Requirements for 3D Packaging and 3D IC
Jan Vardaman, President, TechSearch International

Session 1: Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects

Role of Consortia: 9:00 AM - 10:00 AM

9:00 AM
Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool

9:30 AM
3D Integration Technology and the Micro-Electronics Supply Chain, Barriers and Solutions

Eric Beyne, Director, Packaging and Interconnect Center, IMEC

10:00 - 10:15 AM - Break

Perspectives from IC Suppliers: 10:20 AM - 11:50 AM

10:20 AM
TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm

10:50 AM
3D Integration – Packaging Innovation through Common Platform Ecosystem
Jean Trewhella, Director of Packaging Research and Development, IBM

11:20 AM
Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure
Bob Patti, CTO, Tezzaron Semiconductor

11:50 AM - 12:55 PM - Lunch and Keynote on IC Market

Keynote address:
Poised for Quick Rebound
Bill McClean, President, IC Insights

Session 2: 3D Packaging and TSV Roadmap and Supply Chain/Technology Development Packages

1:00 PM
3D Electronics and System in Package Integration: Where it’s at...Where it’s going...
W. R. “Bill” Bottoms, CEO, NanoNexus

1:30 PM
Key Requirements for 3D Packaging using TSVs
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.

2:00 PM
Materials Requirements and Development Issues for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas

2:30 PM
Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Semiconductor Manufacturing, Gartner Dataquest

3:00 - 3:15 PM - Break

Session 3: Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products

3:20 PM
3D Packaging Trends in Multimedia Handsets from Teardown Analysis
David Carey, President, Portelligent

3:50 PM
Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer Materials, Intel

4:20 PM
Rolling Out a New Packaging Technology; Benefiting from and Maximizing Supply Chain Opportunities that Span the Chain
Marc Robinson, CTO, Vertical Circuits, Inc.

4:50 PM - Closing Remarks and Adjourn
Greg Caswell, VP of Engineering, Reactive Nano Technologies

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

The Hotel deadline has been extended and rooms are still available at the IMAPS rates.

Visit www.imaps.org/gbc today to learn more about this conference and to register on-line.

The GBC is co-located with the 5th International Conference and Exhibition on Device Packaging which is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

Abstracts Due This Friday, February 20 for the Topical Workshop on Wire Bonding   ^ Top
This 2nd Annual Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/wirebonding.

This event will run parallel to the Adhesives, Encapsulants and Molding workshop with one admission fee prior to SEMICON West 2009 – July 14-16.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

  • Ultra Fine-Pitch Ball Bonding
  • Copper Ball Bonding
  • Stacked Die SiP Packages
  • Wire Bonding on Cu/Low-K Dielectrics
  • New Loop Shapes and Applications
  • Wire and Tools
  • Aluminum and Copper Wedge Bonding
  • Heavy Wire Bonding and Applications
  • Failure Analysis and Reliability
  • New Materials
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by February 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Abstracts Due This Friday, February 20 for the New Topical Workshop on Adhesives/Encapsulants/Molding   ^ Top
This new Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/aem.

This event will run parallel to the Wire Bonding workshop with one admission fee prior to SEMICON West 2009 – July 14-16.

The objective of the Adhesives, Encapsulation and Molding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people who have been working in this area of technology. This workshop has been specifically organized to allow for the presentation on the latest current thinking on these focus areas of technologies.

  • Glob Top Encapsulants
  • Thermo-Compression Molded Packages
  • Corner and Edge Bond of CSP Devices
  • CSP Underfill
  • Flip Chip Underfill
  • Flip Chip Underfill and Molding
  • Surface Preparation to Improve Adhesion and Flow Characteristics
  • • Simulation and Modeling
  • Failure Analysis and Reliability
  • UV Adhesives
  • Alternative Interconnect for Flip Chip

Those wishing to present a paper at the Adhesives, Encapsulants and Molding Topical Workshop must submit a 200-300 word abstract electronically by February 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

 

Chapter Activities (events listed in chronological order)

Next Tuesday: Carolinas Chapter Technical Meeting February 24 at DuPont    ^ Top

Date: February 24, 2009
Time: 12:00 - 3:30 pm
Location:

DuPont Electronic Technologies
14 T.W. Alexander Drive
Research Triangle Park, NC 27709

Registration:

Register on-line at: http://www.imaps.org/registration/2009feb_carolinas.htm
Registration Deadline: Friday, Feburary 20

Program:
12:00:  Catered Lunch

1:00:  Welcome and Self-Introductions
                Kurt Theorin, Americas Business Director of Microcircuit Materials,                                        DuPont Electronic Technologies

1:15  “The Evolution to 3D IC Integration.” 
                Phil Garrou, Consultant, Microelectronic Consultants of NC. 

2:00:  “Overview on Photovoltaics.” 
                Robert Cockerill, Americas PV Segment Leader, DuPont Electronic Technologies

2:30:   Refreshment Break and DuPont Posters

3:00  “Highlights of Semiconductor Research Corporation’s Sponsored University
                Research in Advanced Packaging’
                Dr. David Seeger, Semiconductor Research Corporation-IBM 

3:30   Wrap-up.
                Draft program for next event (compile possible dates, locations, and presenters).
                Possible Chapter Elections.

Register on-line at: http://www.imaps.org/registration/2009feb_carolinas.htm

To comply with government regulations, DuPont has on-site security policies :

1.  Cameras (and cell-phone camera) are not allowed on the site; visitors will told to either to leave their device with security and pick it up upon leaving or to return the device to their vehicle.  
2.  All visitors who are not employed by DuPont are required to show two forms of identification to Security:
A.  At least one must be a government-issued photo ID such as a driver license, Passport, Green Card, etc.
B.  The secondary ID is a second government-issued ID, with or without a photo, or an employer-issued photo ID.
C.  An employer-issued ID without a photo of the person is acceptable, as long as the individual’s name on the ID matches their driver’s license.  
D.  Credit cards cannot be accepted as secondary ID.

Next Thursday: Orange Chapter Technical Dinner Meeting February 26 on Advanced TpG Material For The Thermal Management Of Electronics    ^ Top

Date: February 26, 2009
Time: 6:00 pm
Location:

Radisson Suites
7762 Beach Blvd
Buena Park, CA
About 1/2 mile south of 91 FWY

Registration:

Please RSVP to Hossein Ahmad at hossein.ahmad@boeing.com 310-662-6251 or Bill Gaines -626-812-2199 - william.gaines@NGC.com

Advanced TpG Material For The Thermal Management Of Electronics
Xiang Liu, Ph.D
Momentive Performance Materials, Inc.

PRESENTATION ABSTRACT:
The continuous demand on higher chip power dissipations and shrinking device footprints require innovative thermal management solutions, including materials and cooling technologies. Momentive Performance Materials manufactures a specialty thermal material, Thermal Pyrolitic Graphite (TPG*), which exhibits thermal conductivity greater than 1550W/mK. TC1050* is a composite material Momentive developed to encapsulate TPG* in metal, polymer, and other materials which enables it to be used in heat spreaders, heat sinks, and other thermal management products. In this talk, the characteristics of TPG and TC1050 will be presented. Experimental data from TC1050 applications will also be discussed.

SPEAKER BIO:
I received my Bachelor of Science degree from Tsinghua University, Beijing, China, and Ph.D. from Northwestern University, Evanston, IL. Both degrees are in Material Science & Engineering. I started my career as a Materials Scientist with GE Advanced Materials (now Momentive Performance Materials) in 2003. I have worked on CVD of nitride films and PVD metal coatings for wafer processing tools for the semiconductor industry. Recently, I’ve worked as an Applications Development Scientist & Engineer, focusing on Momentive’s high thermal conductivity materials, including TPG, for thermal management of electronics.

IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging    ^ Top
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh.  The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

The Program and other information are available at www.imaps.org.uk.

Prof Nihal Sinnadurai
Conference Chair MicroTech 2009

Viking Chapter March 5 Spring Meeting and Tour at Great River Energy    ^ Top

Date: March 5, 2009
Time: 2:00 - 4:30 pm
Registration: 2:00 - 2:30 pm
Speaker and Tour to Follow
Location:

Great River Energy
12300 Elm Creek Blvd North
Maple Grove, MN 55369
763-445-5000

Registration:

RSVP by March 3 to Char Thomas at REStronics Northland
northlandsales@restronics.com
952-941-9135

Program:
Professor Roger Ruan,, U of MN
Director of the Center for Biorefiining

Topic:
Conversion of Plant Algae into BioDiesel Fuel
Help Solve our Nations Energy Dependence with a Plentiful Resource!

Speaker:
Dr. Ruan is a worldwide expert in the creation of renewable energy and other products. He currently is working on the conversion of biomass into food, feed, and fuels, chemicals, and materials, as well as energy crop production, biopolymer and food process improvement.

Tour:
Great River Energy Co-op
The U.S. Green Building Council has awarded the Great River Energy headquarters building Platinum LEED (Leadership in Energy and Environmental Design) certification. The award is the highest designation available to buildings that demonstrate energy efficiency and sustainability. The building is the first in Minnesota to achieve the distinction and one of fewer than 100 buildings worldwide to receive the designation.

Building Features:
Besides efficient lighting it also features rooftop solar photovoltaic panels, its own wind turbine, a state-of-the-art geothermal heating and cooling system and multiple atriums to harvest maximum daylight. They even capture rainwater to use for flushing toilets and irrigation. See GRE’s media kit. The building will reduce energy consumption by 40%, decrease water usage by 90% and with on site renewable energy replace up to 15% of the buildings energy needs.

Keystone Chapter March 26 Dinner Meeting    ^ Top

Date: March 26, 2009
Time: 4:30 - 8:15 pm
Location:

Holiday Inn and Conference Center
432 Pennsylvania Avenue
Ft. Washington, PA 19034

Directions: http://www.fwholiday.com/location.php

Registration:

These valuable presentations and dinner are complimentary by registering by March 20 with Greg Chesmar at GregChes@aol.com or 215-822-0510.

Program:

4:30    Keystone Chapter Leadership Meeting
            Please attend if you would like to benefit by organizing & presenting at future events.

5:30    Happy Hour – Cash Bar
            Build connections with local peers.

6:15    Buffet Dinner 
            A brief chapter business meeting will be held during the dinner hour.

7:15    First Speaker:  Daniel Quain
           Director, Mission Success and Product Assurance, Cobham Defense Systems
            “Manufacturing Trends for Low Volume, High Complexity Microelectronic                              Assemblies and Subsystems”

(Abstract: A discussion of industry trends in the manufacturing and packaging of microelectronic assemblies for high reliability defense applications.)

7:45    Second Speaker:   Matthew Gruber  
           Manager, Cabinets & Electronics Packaging, Lockheed Martin – MS2
           “Non-Hermetic Packaging of RF Multi-Chip Modules”

(Abstract: The packaging of RF multi-chip modules for military applications traditionally employs the use of hermetic, ceramic-based substrates. Although these packaging schemes have proven to be highly robust in a variety of environments, they also carry a significantly higher cost than non-hermetic alternatives. In order to take advantage of the significant cost opportunities available, a multi-chip module was developed using Monolithic Microwave Integrated Circuits (MMICs) in plastic over-molded QFN packages. The completed assembly was tested and performed almost as well as a ceramic chip and wire module using the same chipset, for less than 25% of the packaging cost.).

Don't Miss INTERCONEX 2009    ^ Top

Date: April 7-8, 2009
Location:

Congress Centre of La Villette
Paris, France

Within INTERCONEX 2009, the technical committee is organizing the technical program on the following topics:

KEYNOTE PAPERS:

  • Packaging & Application of Power LED Devices
  • Packaging and reliability challenges of high pin count circuits

A one day technical workshop on:

  • Microelectronics and packaging for medical and healthcare applications

Technical conferences on the following subjects:

  • Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
  • Flip-chip (substrates and board technologies),
  • Reliability, thermal management,
  • Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
  • Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
  • Modelling, simulation & design, ….
  • Characterization & test,
  • Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
  • Systems (optic, photonic, harsh environment, …)

The deadline for abstracts has passed and the organizers are now creating the technical program. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
Products and Publications

Announcing iKnow Microelectronics Library Subscription    ^ Top
IMAPS iKnow Microelectronics Library Subscription gives academic, corporate and government agency libraries unlimited access to the most current research papers, presentations and other downloads from all available IMAPS journals, magazines, workshop presentations, and conference proceedings.

IKnow now features "IP Recognition” which allows  for seamless use by all users within your institution’s network to instantly access the following technical publications without the hassle of log-ins, passwords or download credits:

  • Unlimited downloads of all peer-reviewed Journal of Microelectronics and Electronic Packaging papers. Currently 2004-2009. Additional Archives added in first quarter 2009.
  • Unlimited downloads of all Advancing Microelectronics magazines.
    Currently 2003-2009. Additional Archives added in 2009.
  • Unlimited downloads of archived technical workshop presentations, conference and symposium proceedings. Currently 2003-2009. Additional Archives added in first quarter 2009.
  • Emerging research from the leading innovators in microelectronics and packaging technologies.
  • Robust search tools with a user-friendly interface. 

How it Works:

The subscribing library will provide IMAPS with the applicable internet protocol (IP) address(es). IMAPS  will set-up the subscriber’s account to recognize that IP range only. All computers using the IPs provided will immediately have instant, 24-7 access to all of the iKnow downloads. Any users on said computers may then visit IMAPS website, perform an advanced search for topics/publications of interest, and simply click on the “Download Now” link to automatically view/download the PDF file. There is no log-in process, no usernames or passwords to remember, and no download counter to worry about.  

How to Subscribe:

IMAPS Library Subscription is available for an annual subscription fee of $2,500 (US). On-line subscription form

For more information about the IMAPS iKnow Microelectronics Library Subscription, please contact Brian Schieman at bschieman@imaps.org .

Already a Library Subscriber?

If you are already a Library Subscriber there is no log-in process, no usernames or passwords to remember, and no download counter to worry about. Through "IP Recognition" your computer has been identified within iKnow and you are ready to search and download: http://www.imaps.org/imapsstore/custsignin.aspx?returnpage=search.aspx?Advanced=1x

 

 
 

CAD Design Software

RGL Enterprises LLC

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 3: February 24, 2009

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact abell@imaps.org

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Lead-free Electronics – Technology, Manufacturing & Reliability (2 Sessions)
Session 1: March 18, 2009
Session 2: March 25, 2009

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact abell@imaps.org

TW on Wire Bonding
July 13, 2009
San Francisco, CA
Parallel to the Adhesives workshop with one admission fee

TW on Adhesives, Encapsulants, Molding
July 13, 2009
San Francisco, CA

Parallel to the Wire Bonding workshop with one admission fee

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

TW and Tabletop Exhibition on Intelligent Uses of Precious Metals in Microelectronics
November 5-6, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

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Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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