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January 27, 2009

Draper Laboratory

   IMAPS EVENTS
Button Registration Deadline TOMORROW, January 28 for the PDC Webinar Series on Wire Bonding (read more...)

Button Hotel Deadline Extended Until Next Monday, February 2 for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications (read more...)

Button Abstracts Due This Friday, January 30 for the Topical Workshop on Wire Bonding (read more...)

Button Abstracts Due This Friday, January 30 for the New Topical Workshop on Adhesives/Encapsulants/Molding (read more...)

Button Device Packaging Conference - Early Registration and Hotel Deadlines Next Friday, February 6 (read more...)

Button GBC Spring Conference on Supply Chain Development for 3D Packaging - Early Registration and Hotel Deadlines Next Friday, February 6 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS France - the ATW on Micropackaging and Thermal Management Begins Next Week (read more...)

Bullet IMAPS UK Announces MicroTech 2009 - Call For Papers on Bio-Sensors and MEMS Packaging (read more...)

Bullet INTERCONEX 2009 Technical Abstracts Due January 31 (read more...)

Bullet International Conference on Electronic Packaging (ICEP 2009) Being Held April 14-16 in Kyoto, Japan (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

   PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

AI Technology

IMAPS Events (view full Web Calendar)

Registration Deadline TOMORROW, January 28 for the PDC Lunch and Learn Webinar Series on Wire Bonding   ^ Top
This two-session on-line Professional Development Course (PDC) webinar on Wire Bonding will be held Thursday, January 29 and Thursday, February 5, 2009. All webinars will be held 12:00 noon - 1:00 pm EST.

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: January 28 and February 4, 2009
Register On-line

Key Words
Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA. 3D packaging, SOP

Program Description
Wire bonding remains the dominant chip interconnect method, with more than 90% of the chip interconnect market place. The ultrasonic weld produced by wire bonding has proven to be a highly reliable and versatile form of interconnection, and the process has continuously evolved to meet the demands of increasingly complex devices.

These 2 one-hour PDC lectures that can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 2: Thursday, January 29 -- 12:00-1:00 PM EST

In Session 1 we will focus on the wire bonding process and variations.

  • Background
  • The ball bonding process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Diffusion
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Cu-Al bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on the reliability of Au-Al ball bonds

Session 2 of 2: Thursday, February 5 -- 12:00-1:00 PM EST

In Session 2 we will focus on the process variables and the use of Designed Experiments to understand the process.

  • Wire bonding process variables
  • Testing wire bonds and response variables
  • The use of Designed Experiments to understand a complex process
  • Experiments for high yield processes
  • Analysis methods
    • DOE Analysis
    • Pareto diagrams
    • Control charts for high yield processes

Register On-line

Thomas Green

Presenter

Lee is an internationally recognized semiconductor assembly process expert with over 25 years of targeted experience in technical process development and optimization. He is known for keen analytical and troubleshooting skills in the creative and effective resolution of problems in production processes. He consistently produces business results that create enhanced revenue opportunities, higher yields and trouble free operations.

Previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He was awarded 4 patents, published more than 50 technical papers, and won the 1999 John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society, IMAPS. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS.

Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

Hotel Deadline Extended Until Next Monday, February 2 for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications   ^ Top
This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. The technical program, exhibitor information, registration forms and other information can be found on-line at www.imaps.org/printed.

Hotel reservations must be made on-line before January 22, 2009. IMAPS cannot guarantee room rates or availability after the 22nd. Early registration pricing ends on February 11.

This workshop will feature five technical sessions on: Industry Convergence and Technology Transformation; Materials: Substrates, Inks & Epoxies; Digital Printing & Deposition Technology; Printed Devices - Active & Passive; and The New Design and Application Paradigm. Dr. Jennifer Ricklin of the DARPA Strategic Technology Office will deliver a lunch keynote presentation on Thursday. The technical program will also include a university poster session as well as poster presentations from local high school students.

A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

IMAPS has also negotiated Walt Disney Theme Parks Discounted Tickets (Deadline: February 25, 2009). For advance purchase of specially priced Disney Meeting/Convention Theme Park tickets, please visit: http://www.disneyconventionear.com/IMPS.

Abstracts Due This Friday, January 30 for the Topical Workshop on Wire Bonding   ^ Top
This 2nd Annual Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/wirebonding.

This event will run parallel to the Adhesives, Encapsulants and Molding workshop with one admission fee prior to SEMICON West 2009 – July 14-16.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

  • Ultra Fine-Pitch Ball Bonding
  • Copper Ball Bonding
  • Stacked Die SiP Packages
  • Wire Bonding on Cu/Low-K Dielectrics
  • New Loop Shapes and Applications
  • Wire and Tools
  • Aluminum and Copper Wedge Bonding
  • Heavy Wire Bonding and Applications
  • Failure Analysis and Reliability
  • New Materials
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by January 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Abstracts Due This Friday, January 30 for the New Topical Workshop on Adhesives/Encapsulants/Molding   ^ Top
This new Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/aem.

This event will run parallel to the Wire Bonding workshop with one admission fee prior to SEMICON West 2009 – July 14-16.

The objective of the Adhesives, Encapsulation and Molding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people who have been working in this area of technology. This workshop has been specifically organized to allow for the presentation on the latest current thinking on these focus areas of technologies.

  • Glob Top Encapsulants
  • Thermo-Compression Molded Packages
  • Corner and Edge Bond of CSP Devices
  • CSP Underfill
  • Flip Chip Underfill
  • Flip Chip Underfill and Molding
  • Surface Preparation to Improve Adhesion and Flow Characteristics
  • • Simulation and Modeling
  • Failure Analysis and Reliability
  • UV Adhesives
  • Alternative Interconnect for Flip Chip

Those wishing to present a paper at the Adhesives, Encapsulants and Molding Topical Workshop must submit a 200-300 word abstract electronically by January 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Device Packaging Conference - Early Registration and Hotel Deadlines Next Friday, February 6   ^ Top
The 5th International Conference and Exhibition on Device Packaging is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

This year’s conference will feature technical sessions across 6 technical tracks, panel discussions, a poster session, 8 professional development courses and a sold-out vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; MEMS; Flip Chip; Wafer Level Packaging; Power LED Devices and Biomedical. Technical presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these 6 topical areas of microelectronics and offer an additional valuable resource to attendees.

The Global Business Council (GBC) will co-locate its Spring Conference March 8-9, focusing on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.

The Device Packaging Conference and Exhibition has nearly doubled in attendance and sold out exhibit space every year since its inception. 2009 is no different - the hall is now sold out!

The Hotel cut-off and early registration deadlines are February 6, 2009. IMAPS cannot guarantee room rates or availability after the 22nd. Registration pricing also increases after February 6.

Visit www.imaps.org/devicepackaging today to learn more about this conference and to register on-line.

GBC Spring Conference on Supply Chain Development for 3D Packaging - Early Registration and Hotel Deadlines Next Friday, February 6   ^ Top
The Global Business Council (GBC) Spring Conference on Supply Chain Development for 3D Packaging is being held March 8-9, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. This year's conference focuses on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.

Sunday March 8, 2009
12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - www.wekopa.com 
Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.

6:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)

Monday, March 9, 2009
All listed times are approximate.
7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

8:00 AM -- Opening Remarks and Keynote Address:

Opening Remarks:
Lee Smith, VP of Business Development, Amkor Technology, Inc.

Keynote address:
Market Demand, Applications and Requirements for 3D Packaging and 3D IC
Jan Vardaman, President, TechSearch International

Session 1: Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects

Role of Consortia: 9:00 AM - 10:00 AM

9:00 AM
Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool

9:30 AM
3D Integration Technology and the Micro-Electronics Supply Chain, Barriers and Solutions

Eric Beyne, Director, Packaging and Interconnect Center, IMEC

10:00 - 10:15 AM - Break

Perspectives from IC Suppliers: 10:20 AM - 11:50 AM

10:20 AM
TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm

10:50 AM
3D Integration – Packaging Innovation through Common Platform Ecosystem
Jean Trewhella, Director of Packaging Research and Development, IBM

11:20 AM
Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure
Bob Patti, CTO, Tezzaron Semiconductor

11:50 AM - 12:55 PM - Lunch and Keynote on IC Market

Keynote address:
Poised for Quick Rebound
Bill McClean, President, IC Insights

Session 2: 3D Packaging and TSV Roadmap and Supply Chain/Technology Development Packages

1:00 PM
3D Electronics and System in Package Integration: Where it’s at...Where it’s going...
W. R. “Bill” Bottoms, CEO, NanoNexus

1:30 PM
Key Requirements for 3D Packaging using TSVs
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.

2:00 PM
Materials Requirements and Development Issues for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas

2:30 PM
Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Semiconductor Manufacturing, Gartner Dataquest

3:00 - 3:15 PM - Break

Session 3: Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products

3:20 PM
3D Packaging Trends in Multimedia Handsets from Teardown Analysis
David Carey, President, Portelligent

3:50 PM
Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer Materials, Intel

4:20 PM
Rolling Out a New Packaging Technology; Benefiting from and Maximizing Supply Chain Opportunities that Span the Chain
Marc Robinson, CTO, Vertical Circuits, Inc.

4:50 PM - Closing Remarks and Adjourn
Greg Caswell, VP of Engineering, Reactive Nano Technologies

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

The Hotel cut-off and early registration deadlines are February 6, 2009. IMAPS cannot guarantee room rates or availability after the 22nd. Registration pricing also increases after February 6.

Visit www.imaps.org/gbc today to learn more about this conference and to register on-line.

The GBC is co-located with the 5th International Conference and Exhibition on Device Packaging which is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.

Chapter Activities (events listed in chronological order)

IMAPS France - the 4th European ATW on Micropackaging and Thermal Management Begins Next Week    ^ Top
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle.

The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components.

A CD Rom including the presentations will be distributed to the attendees only.

  • Final Registration ends on January 25, 2009
  • Formulaire de Convention de formation sur demande

The workshop will feature sessions on:

  • Keynote
  • Cooling Systems
  • Simulation, Modeling and Test
  • Materials
  • Applications

To view the full technical program, visit www.imapsfrance.org or contact Florence Vireton at imaps.france@imapsfrance.org.

Organized by:
International Microelectronics And Packaging Society France
49 rue Lamartine 78035 Versailles
Tel : + 33 (0) 1 39 67 17 73/ Fax : + 33 (0) 1 39 02 71 93 E-mail :

IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging    ^ Top
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh.  The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.

The Program and other information are available at www.imaps.org.uk.

Prof Nihal Sinnadurai
Conference Chair MicroTech 2009

INTERCONEX 2009 Technical Abstracts Due January 31    ^ Top

Date: April 7-8, 2009
Location:

Congress Centre of La Villette
Paris, France

Within INTERCONEX 2009, the technical committee proposes the following topics:

KEYNOTE PAPERS:

  • Packaging & Application of Power LED Devices
  • Packaging and reliability challenges of high pin count circuits

A one day technical workshop on:

  • Microelectronics and packaging for medical and healthcare applications

Technical conferences on the following subjects:

  • Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
  • Flip-chip (substrates and board technologies),
  • Reliability, thermal management,
  • Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
  • Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
  • Modelling, simulation & design, ….
  • Characterization & test,
  • Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
  • Systems (optic, photonic, harsh environment, …)

We kindly ask you to send us your proposals with one page abstract word size before January 31, 2009. You may submit your abstract via email - imaps.france@imapsfrance.org. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.

International Conference on Electronic Packaging (ICEP 2009) Being Held April 14-16 in Kyoto, Japan    ^ Top

Date: April 14-16, 2009
Location:

Kyoto International Conference Center
Kyoto, Japan

The technical committee is preparing the program on the following topics:

Packaging

Advanced Packaging, Area Array Packages, SiP, SiP/3D-SiP, PoP, Wafer Level Packaging, VLSI Packaging, Stacked Structure, LCD Module Packaging, MCM

Substrates/Materials

Lamination, Printing, Dispensing, Spraying, Transfer Techniques, Underfilling, Potting, Fine Pitch, Interposer, Solder, Conductive Paste, Built-up Substrates, EPD/EAD Technology, Lead Free

Design/Evaluation/Simulation

Reliability and Testing, Modeling, Simulation, Thermal Management, High Speed Board Design, High frequency Devices, EMI, EMC, High Power

Manufacturing/Process

Flip Chip Technology, Manufacturing, Plating, Inkjet Technologies, Process Control, Equipment, Thin Film Technologies

Interconnection

Low Temperature Adhesion, Soldering, Adhesion, Self-assembly, Bump Formation

Optoelectronics

Devices, Fibers, Waveguides, Design, SSC, WDM, QD, Interface, OE/EO, LEDs

Nano technologies

Materials, Devices, Process, Design, Application

MEMS

MEMS devices, Process

RF/RFID

Devices design, Process, System

Organic semiconductors

Materials, Devices, Application

Trend/Education Aspects

Industrial Trend, Economic Analyses

Energy/Environmental Aspects

PV, Natural Resources, Regulation

Application

LCD, Display, Batteries, Fuel Cells, Lighting, Storage, High Power Modules

Other subject matter relating to electronics packaging

For more information, please visit www.jiep.or.jp/icep.

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 
 

CAD Design Software

Oneida Research Services

PDC Webinar Series on Wire Bonding (2 Sessions)
Session 1: January 29, 2009
Session 2: February 5, 2009

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 1: February 10, 2009
Session 2: February 17, 2009
Session 3: February 24, 2009

ATW and Tabletop Exhibition on Printed Devices and Applications
February 25-27, 2009
Orlando, FL

*Exhibitors contact abell@imaps.org

Device Packaging Conference and Exhibition
March 9-12, 2009
Scottsdale/Ftn. Hills, AZ

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Lead-free Electronics – Technology, Manufacturing & Reliability (2 Sessions)
Session 1: March 18, 2009
Session 2: March 25, 2009

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact abell@imaps.org

TW on Wire Bonding
July 13, 2009
San Francisco, CA
Parallel to the Adhesives workshop with one admission fee

TW on Adhesives, Encapsulants, Molding
July 13, 2009
San Francisco, CA

Parallel to the Wire Bonding workshop with one admission fee

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

TW and Tabletop Exhibition on Intelligent Uses of Precious Metals in Microelectronics
November 5-6, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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