Registration Deadline TOMORROW, January 28 for the PDC Lunch and Learn Webinar Series on Wire Bonding ^
This two-session on-line Professional Development Course (PDC) webinar on Wire Bonding will be held Thursday, January 29 and Thursday, February 5, 2009. All webinars will be held 12:00 noon - 1:00 pm EST.
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375
Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA. 3D packaging, SOP
Wire bonding remains the dominant chip interconnect method, with more than 90% of the chip interconnect market place. The ultrasonic weld produced by wire bonding has proven to be a highly reliable and versatile form of interconnection, and the process has continuously evolved to meet the demands of increasingly complex devices.
These 2 one-hour PDC lectures that can be taken in total or separately depending on the experience level of the student and topics of interest. Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.
Session 1 of 2: Thursday, January 29 -- 12:00-1:00 PM EST
In Session 1 we will focus on the wire bonding process and variations.
The ball bonding process: Step by Step Wire Bonding
The effect of ultrasonics on weld formation and materials properties
Metallurgy and Intermetallics
A comparison of the welds associated with Au-Al and Cu-Al bonding
Au-Al failure mechanisms in ultra-fine pitch bonding
The effect of wire alloying on the reliability of Au-Al ball bonds
Session 2 of 2: Thursday, February 5 -- 12:00-1:00 PM EST
In Session 2 we will focus on the process variables and the use of Designed Experiments to understand the process.
Wire bonding process variables
Testing wire bonds and response variables
The use of Designed Experiments to understand a complex process
Lee is an internationally recognized semiconductor assembly process expert with over 25 years of targeted experience in technical process development and optimization. He is known for keen analytical and troubleshooting skills in the creative and effective resolution of problems in production processes. He consistently produces business results that create enhanced revenue opportunities, higher yields and trouble free operations.
Previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He was awarded 4 patents, published more than 50 technical papers, and won the 1999 John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society, IMAPS. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS.
Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.
Hotel Deadline Extended Until Next Monday, February 2 for the Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications^
Top This new Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications is being held February 25-27, 2009, at the International Plaza Resort in Orlando, Florida. The technical program, exhibitor information, registration forms and other information can be found on-line at www.imaps.org/printed.
Hotel reservations must be made on-line before January 22, 2009. IMAPS cannot guarantee room rates or availability after the 22nd. Early registration pricing ends on February 11.
This workshop will feature five technical sessions on: Industry Convergence and Technology Transformation; Materials: Substrates, Inks & Epoxies; Digital Printing & Deposition Technology; Printed Devices - Active & Passive; and The New Design and Application Paradigm. Dr. Jennifer Ricklin of the DARPA Strategic Technology Office will deliver a lunch keynote presentation on Thursday. The technical program will also include a university poster session as well as poster presentations from local high school students.
A limited number of table-top exhibits will be available for companies working in the technical areas listed above. To view information about this exhibition, or to reserve your booth(s), visit www.imaps.org/printed. You may also contact Ann Bell at firstname.lastname@example.org or 202-548-8717 for information about Tabletop exhibits.
IMAPS has also negotiated Walt Disney Theme Parks Discounted Tickets (Deadline: February 25, 2009). For advance purchase of specially priced Disney Meeting/Convention Theme Park tickets, please visit: http://www.disneyconventionear.com/IMPS.
Abstracts Due This Friday, January 30 for the Topical Workshop on Wire Bonding^
This 2nd Annual Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/wirebonding.
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.
Ultra Fine-Pitch Ball Bonding
Copper Ball Bonding
Stacked Die SiP Packages
Wire Bonding on Cu/Low-K Dielectrics
New Loop Shapes and Applications
Wire and Tools
Aluminum and Copper Wedge Bonding
Heavy Wire Bonding and Applications
Failure Analysis and Reliability
Simulation and Modeling
Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by January 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.
Abstracts Due This Friday, January 30 for the New Topical Workshop on Adhesives/Encapsulants/Molding^
This new Topical Workshop organized by IMAPS and SEMI is being held Monday, July 13, 2009, at the Moscone Center in San Francisco, California. For more information, visit www.imaps.org/aem.
The objective of the Adhesives, Encapsulation and Molding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people who have been working in this area of technology. This workshop has been specifically organized to allow for the presentation on the latest current thinking on these focus areas of technologies.
Glob Top Encapsulants
Thermo-Compression Molded Packages
Corner and Edge Bond of CSP Devices
Flip Chip Underfill
Flip Chip Underfill and Molding
Surface Preparation to Improve Adhesion and Flow Characteristics
• Simulation and Modeling
Failure Analysis and Reliability
Alternative Interconnect for Flip Chip
Those wishing to present a paper at the Adhesives, Encapsulants and Molding Topical Workshop must submit a 200-300 word abstract electronically by January 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 12, 2009.
Device Packaging Conference - Early Registration and Hotel Deadlines Next Friday, February 6^
The 5th International Conference and Exhibition on Device Packaging is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.
This year’s conference will feature technical sessions across 6 technical tracks, panel discussions, a poster session, 8 professional development courses and a sold-out vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3-D Packaging; MEMS; Flip Chip; Wafer Level Packaging; Power LED Devices and Biomedical. Technical presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these 6 topical areas of microelectronics and offer an additional valuable resource to attendees.
GBC Spring Conference on Supply Chain Development for 3D Packaging - Early Registration and Hotel Deadlines Next Friday, February 6^
The Global Business Council (GBC) Spring Conference on Supply Chain Development for 3D Packaging is being held March 8-9, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. This year's conference focuses on Supply Chain Development for 3D Packaging. There will be several networking receptions and gatherings throughout the week, including a golf outing, the opening reception, meals, and other social events.
Sunday March 8, 2009 12:00 Noon -- GBC Golf Outing.
We-ko-pa Golf Course at the Ft. McDowell Radisson - www.wekopa.com Tee-time of optional golf outing - Cost is $200 and includes green fees, shuttle from hotel, and lunch.
6:00 PM -- Registration Opens and GBC Welcome Reception (Beverages and Appetizers)
Monday, March 9, 2009 All listed times are approximate. 7:00 AM - 5:00 PM -- Registration 7:00 AM - 8:00 AM -- Continental breakfast
8:00 AM -- Opening Remarks and Keynote Address:
Lee Smith, VP of Business Development, Amkor Technology, Inc.
Keynote address: Market Demand, Applications and Requirements for 3D Packaging and 3D IC
Jan Vardaman, President, TechSearch International
Session 1: Supply Chain Collaboration - From Research and Development to Commercialization of 3D ICs with through Si Via (TSV) Interconnects
Role of Consortia: 9:00 AM - 10:00 AM
9:00 AM Benefits of Supply Chain Collaboration: TSV Integrated Solutions and Advancements with EMC3D Consortium for Achieving Cost Effective 3D Integration
Rozalia Beica, Applications Director for 3D Interconnect, Semitool
3D Integration Technology and the Micro-Electronics Supply Chain, Barriers and Solutions
Eric Beyne, Director, Packaging and Interconnect Center, IMEC
10:00 - 10:15 AM - Break
Perspectives from IC Suppliers: 10:20 AM - 11:50 AM
10:20 AM TSS/TSV Process Partitioning to Leverage Supplier Capability and to Provide Maximum Sourcing Flexibility
Tom Gregorich, Vice President of Packaging, Qualcomm
10:50 AM 3D Integration – Packaging Innovation through Common Platform Ecosystem Jean Trewhella, Director of Packaging Research and Development, IBM
11:20 AM Lessons Learned in Quest to be First/Early Commercial Supplier of 3D IC Product. Obstacles Faced from Lack of 3D IC / TSV Supply Chain Infrastructure
Bob Patti, CTO, Tezzaron Semiconductor
11:50 AM - 12:55 PM - Lunch and Keynote on IC Market
Keynote address: Poised for Quick Rebound
Bill McClean, President, IC Insights
Session 2: 3D Packaging and TSV Roadmap and Supply Chain/Technology Development Packages
1:00 PM 3D Electronics and System in Package Integration: Where it’s at...Where it’s going...
W. R. “Bill” Bottoms, CEO, NanoNexus
1:30 PM Key Requirements for 3D Packaging using TSVs
Robert Lanzone, Vice President of Advanced Packaging, Amkor Technology, Inc.
2:00 PM Materials Requirements and Development Issues for 3D Packaging and TSV
Leo Linehan, Global Advanced Packaging Business Development, Rohm & Haas
2:30 PM Front End/Back End: Morphing the Manufacturing Model for Tough Times
Jim Walker, Research Vice President, Semiconductor Manufacturing, Gartner Dataquest
3:00 - 3:15 PM - Break
Session 3: Multi Sources of Supply and Lessons Learned from 3D Packaging-Based Products
3:20 PM 3D Packaging Trends in Multimedia Handsets from Teardown Analysis
David Carey, President, Portelligent
3:50 PM Role of TSVs in Future Packaging
Suresh Golwalkar, Principal Engineer Materials, Intel
4:20 PM Rolling Out a New Packaging Technology; Benefiting from and Maximizing Supply Chain Opportunities that Span the Chain
Marc Robinson, CTO, Vertical Circuits, Inc.
4:50 PM - Closing Remarks and Adjourn Greg Caswell, VP of Engineering, Reactive Nano Technologies
The Hotel cut-off and early registration deadlines are February 6, 2009. IMAPS cannot guarantee room rates or availability after the 22nd. Registration pricing also increases after February 6.
Visit www.imaps.org/gbc today to learn more about this conference and to register on-line.
The GBC is co-located with the 5th International Conference and Exhibition on Device Packaging which is being held March 9-12, 2009, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, Arizona. For more information, visit www.imaps.org/devicepackaging.
listed in chronological order)
IMAPS France - the 4th European ATW on Micropackaging and Thermal Management Begins Next Week^
The French Chapter of IMAPS will hold its 4th European Advanced Technology Workshop on Micropackaging and Thermal Management on February 4-5, 2009, at Mercure Oceanide, Vieux Port, Sud La Rochelle.
The workshop will be dedicated to the thermal management and particularly to convenient cooling solutions for high integration level of equipments. Rising speed of the components leads to increase the power dissipation while miniaturisation and low cost technologies don’t facilitate the mastering of the thermal impedances. In such conditions, the thermal management, as a part of the packaging solutions, is and will continue to be one of the main technological keys for the future progress of the electronic components.
A CD Rom including the presentations will be distributed to the attendees only.
International Microelectronics And Packaging Society France
49 rue Lamartine 78035 Versailles
Tel : + 33 (0) 1 39 67 17 73/ Fax : + 33 (0) 1 39 02 71 93 E-mail :
IMAPS UK Announces MicroTech 2009 - Seminar on Bio-Sensors and MEMS Packaging ^
IMAPS-UK will be holding a key MicroTech Seminar on “Bio-Sensors and MEMS Packaging” scheduled for Tuesday 3rd March 2009 at the Heriot Watt University in Edinburgh. The Seminar is co-sponsored by IEEE-CPMT-UK&RI. We seek submissions of learned papers of how the challenge of Design, Fabrication or Applications of Bio-sensors or MEMS packaging is being met by researchers and practitioners.
INTERCONEX 2009 Technical Abstracts Due January 31^
April 7-8, 2009
Congress Centre of La Villette
Within INTERCONEX 2009, the technical committee proposes the following topics:
Packaging & Application of Power LED Devices
Packaging and reliability challenges of high pin count circuits
A one day technical workshop on:
Microelectronics and packaging for medical and healthcare applications
Technical conferences on the following subjects:
Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
Flip-chip (substrates and board technologies),
Reliability, thermal management,
Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
Modelling, simulation & design, ….
Characterization & test,
Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
Systems (optic, photonic, harsh environment, …)
We kindly ask you to send us your proposals with one page abstract word size before January 31, 2009. You may submit your abstract via email - email@example.com. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.
International Conference on Electronic Packaging (ICEP 2009) Being Held April 14-16 in Kyoto, Japan^
April 14-16, 2009
Kyoto International Conference Center
The technical committee is preparing the program on the following topics:
EMPC 2009 - European Microelectronics and Packaging Conference^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies. The Call for Papers, exhibitors details and other information are available at www.empc2009.org.
The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.
Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:
• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to firstname.lastname@example.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website. http://www.imaps.org/jmep/copyright.pdf.
Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.
Please send all submissions, comments, or questions to email@example.com or feel free to contact me at the phone/e-mail below.