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July 23, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button Abstracts Due Tomorrow for the Advanced Technology Workshop on Thermal Management (read more...)

Button Program and Registration Now Available for IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Northern California Chapter August 5 Lunch Meeting on Impact of Solar Cell/Panel Interconnects on Long-term Reliability and Economics (read more...)

Bullet San Diego Chapter Summer Social on August 19 (read more...)

Bullet Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Journal of Microelectronics and Electronic Packaging - Don't Miss First Quarter 2009  (read more...)

The Benefits of Individual Membership  (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

Abstracts Due Tomorrow for the Advanced Technology Workshop on Thermal Management    ^ Top
IMAPS is holding the Advanced Technology Workshop on Thermal Management October 5 - 8, 2009, at Dinah's Garden Hotel in Palo Alto, California . Full workshop details are on-line at www.imaps.org/thermal.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and telcom systems.  Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.

This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. The 2008 Workshop featured 42 technical presentations, eight of which were competition-selected presentations from university engineering graduate students.

Speakers are asked to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers pay a reduced registration fee.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
  • Thermal Analysis and Modeling: Tools for thermal analysis, practical techniques for thermal modeling and empirical work, and case studies of difficult thermal design problems with proposed and final solutions.
  • Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing.  Metallic, polymer matrix, CNT, thermal adhesives, and other materials.
  • High Conductivity Materials: Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
  • Liquid, Phase-Change, and Refrigeration Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.        
  • Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
  • Telecommunications and Consumer Electronics: Component- and system-level thermal solutions for telcom, consumer, handheld, display, router, and similar systems.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 24, 2009.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 4, 2009.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433.

Student Abstract and Stipend Competition: Students submitting their work and identifying that “Yes, I’m a full-time student” on the abstract submission form, will automatically be considered for the competition. The review committee will evaluate all student papers and award multiple "stipends" to winning students at the ATW. The selected students must attend the event to present his or her work and receive the award. Registration fee for the winners will be complimentary. The winners must pay for travel and lodging expenses. Full 2009 Student Competition details.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Program and Registration Now Available for IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full program, lodging and registration details are available at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, September 13th

Dinner: 7:00 pm – 8:00 pm

Monday, September 14th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Capacitors and Connectors
Chair: Colin Johnston, Oxford Applied Technology - UK
9:00 am – 1:00 pm

Architecture Analysis of High Performance Capacitors
Jeffery T. Stricker, Hiroyuki Kosai, Tyler W. Bixel, Seana A. McNeal, James D. Scofield, Jennifer DeCerbo, Biswajit Ray, US Air Force Research Laboratory

Robust BME Class-I Ceramic Capacitors for High Temperature Applications
Xilin Xu, Bill Buchanan, Paul Staubli, Philip Lessner, Abhijit Gurav, KEMET Electronics Corporation

Thermally Robust Polymer Dielectric Systems for Air Force Wide-Temperature Power Electronics Applications
Narayanan Venkat, Victor K. McNier, Zongwu Bai, Marlene D. Houtz, Thuy D. Dang, University of Dayton Research Institute; Jennifer N. DeCerbo, Jeffery T. Stricker, US Air Force Research Laboratory

Break: 10:30 am – 11:00 am

Fabrication and Characterization of High Temperature Film Capacitors
Keith D. Jamison, R. D. Wood, B. G. Zollars, P. Le, Nanohmics, Inc.

Novel Solid Tantalum Capacitor for Demanding Applications up to 200°C
Radovan Faltus, Tomas Zednicek, AVX Czech Republic S.R.O.

Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
Andy Longford, PandA Europe; Joseph Lynch, Interplex Industries Inc., USA

High-Dielectric-Constant Capacitors for High-Temperature Power Inverters in Hybrid Electric Vehicles
U. Balachandran, B. Ma, M. Narayanan, Argonne National Laboratory

Lunch: 1:00 pm – 2:00 pm

Session 2A: Devices
Chairs: Thomas Krebs, CISSOID; Joe Henfling, Sandia National Laboratory
2:00 pm – 5:30 pm

Product Test Results of the HTADC12 12 Bit Analog to Digital Converter at 250°C
Thomas B. Romanko, Mark Larson, Honeywell International Inc.

Performance and Reliability of SiGe Devices and Circuits For High Temperature Applications
Dylan B. Thomas, John D. Cressler, Laleh Najafizadeh, Leora Peltz, Stan Phillips, Ted Wilcox, Georgia Institute of Technology; R. Wayne Johnson, Auburn University

Introduction of Texas Instruments High Temperature Semiconductors
Mont Taylor, Brad Little, Texas Instruments

Break: 3:30 pm – 4:00 pm

SOI Lateral PIN Diodes for Temperature and UV Sensing in Very Harsh Environments
Bertrand Rue, Olivier Bulteel, Denis Flandre, University Catholique de Louvain-la-Neuve; Michelly de Souza,  A. Pavanello, FEI

Quartzdyne ASIC Developments
Shane Rose, Mark Watts, Quartzdyne

Operational and Performance Test Results of the Reconfigurable Processor for Data Acquisition (RPDA) at 250°C
Thomas B. Romanko, Mike Johnson, Honeywell International Inc.

Dinner: 7:00 pm – 8:00 pm

Tuesday, September 15th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Session 2B: Devices continued
Chair: Rene Lerch, Fraunhofer IMS
9:00 am – 11:00 am

Development of the First Commercialised Integrated Circuit Process Operating in the Range of 300°C to 450°C
James A. McGonigal, David T. Clark, Robin F. Thompson, Raytheon Systems Limited

Evaluation of an SOI Operational Amplifier with High Temperature Packaging
Liang-Yu Chen, Richard L. Patterson, Ahmad Hammoud, Michael J. Krasowski, Joseph M. Flatico, Dennis E. Culley, OAI / NASA Glenn Research Center

Performance of a Diode-Based Bandgap Reference Circuit
Paul Moody, Marshall Soares, Monte Johnson, NOV/Intelliserv

Break: 10:30 am – 11:00 am

Development of an Integrated Power Controller Based on HT SOI and SiC
Joseph A. Henfling, Stan Atcitty, Frank Maldonado, Sandia National Laboratories; Trevor Thornton, ASU, Randy Normann, PermaWorks

Session 3: Packaging Materials
Chair: Wayne Johnson, Auburn University
11:30 am – 1:00 pm

Dielectric, Thermal and Structural Characterization of Fluorinated Parylene Films for High Temperature Power Device Surface Insulation
Mireille Bechara, S. Diaham, M. L. Locatelli, S. Zelmat, C. Tenailleau, Université Paul Sabatier

Investigation of Polyimide/Carbon Nanotube Nanocomposites for High Temperature Electronic Packaging Applications
Qing-Yuan Tang, Y. C. Chan, N. B. Wong, City University of Hong Kong

Nanoparticle Enhanced Solders for High Temperature Reliability
Omid Mokhtari, Roya Ashayer, Samjid H. Mannan, Michael P. Clode, Kings College of London

Lunch: 1:00 pm – 2:00 pm

Session 4: Sensors and MEMS
Chairs: Randy Normann, Perma Works; Alison Crossley, University of Oxford
2:00 pm – 5:30 pm

HTNFET Junction Capacitance Measurements, Theoretical Model and Validation for Development of High-Temperature Wireless Sensor Networks
Jonathan Gagnon, François Gagnon, École de Technologie Supérieure

High Temperature SOI CMOS Ultra Low Power Circuits for MEMS Co-Integrated Interfaces
Bertrand Rue, Nicolas Andre, Benoit Olbrechts, Jean-Pierre Raskin, Denis Flandre, University Catholique de Louvain-la-Neuve

High-Temperature SOI CMOS Compatible MEMS Pressure Sensors
Reneé Lerch, Robert Klieber, Norbert Kordas, Holger Kappert, Fraunhofer IMS

Break: 3:30 pm – 4:00 pm

Explosion Metrology: A better bang for your buck?
Greg D. Horler, David McGorman, Instrumentel Ltd.

A Non Volatile MEMS Switch for Harsh Environment Memory Applications
Vikram Joshi, Richard Knipe, Rob VanKampen, Damian Lacey, Toshi Nagata, Dennis Yost, Charles Smith, Cavendish Kinetics, Inc.

High Temperature SiC Wireless Telemetry Systems
John Fraley, Bryon Western, Roberto M. Schupbach, Alexander B. Lostetter, Brice McPherson, Jared Hornberger, Jie Yang, Arkansas Power Electronics International, Inc.

Dinner: 7:00 pm – 8:00 pm

Wednesday, September 16th

Registration: 7:00 am – 6:00 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Packaging
Chairs: Ovidiu Vermesan, SINTEF; Shane Rose, Quartzdyne
9:00 am – 1:00 pm

Nano-Mechanical Analysis of Pb-Free Solders for Reliability Optimisation in High Performance Microelectronics Systems
V.M.F. Marques, C. Johnston, P.S. Grant, University of Oxford

Development of High Temperature Electronics Packaging Technologies for Long Term Operation at 250°C
S. T. Riches, Kevin Cannon, GE Aviation Systems; Colin Johnston, Mica Sousa, Patrick Grant, Oxford University; Jim Gulliver, Sondex Wireline Ltd.; Mark Langley, Vibro-meter UK Ltd.; Robin Pittson, Simona Serban, Denley Baghurst, Gwent Electronics Materials; Mike Firmstone, Thermastrat

Packaging Technology for High Temperature Silicon-on-Insulator Electronics
R. Wayne Johnson, Ping Zheng, Phillip Henson, Auburn University

Break: 10:30 am – 11:00 am

Thermomechanical Reliability Evaluation of Direct Bonded Aluminum (DBA) as a Substrate for High-Temperature Electronics Packaging
Thomas G. Lei, Jesus N. Calata, Khai D. Ngo, Guo-Quan Lu, Virginia Tech

The Development and Application of 225°C Hybrid Microcircuit Technology
Robert Hunt, Chris Andrews, C-MAC MicroTechnology

Hermetic Micro-Packaging with Heat Sinks
Marie Evrard, Nathan Foster, Pacific Aerospace & Electronics, Member of SOURIAU Group

Plastic Packaging for High Temperature Applications
Tanja Braun, K.-F. Becker, J. Bauer, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Fraunhofer IZM

Lunch: 1:00 pm – 2:00 pm

Session 6: Power Electronics
Chairs: Sascha Schwarze, Baker Hughes INTEQ; Steve Riches, GE Aviation
2:00 pm – 6:00 pm

250°C Voltage Compliant SOI MESFETs for High Power PWM Drive Circuits
Nicholas Summers, William Lepkowski, Seth Wilk, Trevor Thornton, Randy Normann, Joseph Henfling, Arizona State University

High Temperature DC-DC Buck Converters for Point-of-Load (POL) Applications
Pierre Delatte, V. Dessard, A. Saib, E. Boufous, N. Pequignot, G. Picún, CISSOID S.A.

High Temperature Power Electronics IGBT Modules for Electrical and Hybrid Vehicles
Reiner John, Infineon Technologies; Ovidiu Vermesan, SINTEF

Break: 3:30 pm – 4:00 pm

High Temperature Power Electronic Packaging for Oil Well Applications
Rolf Johannessen, Andreas Larsson, Frøydis Oldervoll, Truls Fallet, SINTEF Information and Communication Technology

High Temperature Nanoelectronics for Electrical and Hybrid Vehicles
Ovidiu Vermesan, SINTEF; Reiner John, Infineon Technologies

A High Temperature 2Amps Power Driver for SMPS and Motor Drive Applications
Pierre Delatte, E. Boufous, V. Dessard, A. Saib, N. Pequignot, G. Picún, CISSOID S.A.

High-Power and High Temperature SiC Power Module Development
Gavin Mitchell, Edgar Cilio, John Garrett, Marcelo Schupbach, Alex Lostetter, Arkansas Power Electronics International

Closing Remarks: 6:00 pm

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity    ^ Top

This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, August 4 and 11, 2009

All webinars will be held 10:00 am - 11:00 am EDT

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375 (includes one-year complimentary individual membership in IMAPS)

Registration Deadlines: August 3, 2009

Register On-line

Program Description

Successful and low-cost design of electronic packages and boards requires (in addition to thermal and thermo-mechanical issues), a good understanding of the root causes of signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) issues, as well as methods to analyze, prevent or solve them.

The objective of this course is to provide methods for accurate and efficient electrical modeling, measurement and analysis of packages and PCBs, under consideration of SI, PI and EMI/EMC issues. Techniques for characterizing dielectric materials in dependent on frequency and temperature will also be discussed. Finally, guidelines for optimizing the electrical performance of high-speed packages and PCBs will be provided.

Outline of Sessions:

  • Root causes of SI, PI and EMI/EMC problems, and how they affect system performance.
  • Methods for electrical modeling, simulation and measurement of packaging structures under consideration of SI, PI and EMI/EMC issues.
  • Examples of packaging structures that will be considered include: Transmission lines, layer stack-up with power-ground plane pairs, decoupling capacitors, vias and solder balls.
  • Methods for extracting the relative dielectric constant and loss tangent of dielectric materials in dependent on temperature and frequency.
  • Guidelines for optimizing the electrical performance of high-speed packages and PCBs.

Who Should Attend?

Engineers, scientists, researchers, designers and managers involved in the process of electrical modeling, layouts and/or design of single-chip packages, system packages (e.g., SiPs, SoPs, MCMs), PCBs and their interconnections.

Presenters

Dr. Ivan Ndip - Ivan Ndip obtained his M.Sc. and Ph.D. with the highest distinction (Summa Cum Laude) in electrical engineering from the Technische Universitaet Berlin, Germany. In 2002, he joined the Fraunhofer-Institute for Reliability and Microintegration (IZM) Berlin as a research engineer and in 2005 he was appointed Group Manager. Since then, he has been responsible for developing and leading research projects at IZM that focus on modeling, simulation, measurement, design and optimization of RF/high-speed packages and PCBs, integrated antennas and passive RF front-end components.

In addition to his research at IZM, Dr. Ndip also teaches graduate courses on Electromagnetic Reliability (EMR) of Microsystems at the Technische Universitaet Berlin.

He has won 4 best paper awards at leading international conferences. He is also a recipient of the Tiburtius-Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin.

Prof. Ege Engin - Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. He received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany in 2004.

Dr. Engin has worked as a research engineer with the Fraunhofer-Institute for Reliability and Microintegration in Berlin, Germany and at Georgia Tech. He is currently an Assistant Professor in the Electrical and Computer Engineering Department of San Diego State University. He has more than 60 publications in the areas of signal and power integrity modeling and simulation and 4 patent applications. He has co-authored the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007.

Register On-line

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.
Chapter Activities (events listed in chronological order)

Northern California Chapter August 5 Lunch Meeting on Impact of Solar Cell/Panel Interconnects on Long-term Reliability and Economics    ^ Top

Dates: Wednesday, August 5
Schedule: 11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation
Location:

David’s Restaurant
Banquet & Conference Facility    
5151 Stars & Stripes Drive
Santa Clara, CA  95054

Fees:

IMAPS Members $20.00;
General $23.00;
Students (with ID) $10.00

Registration:

Please email Gina Love at glove@cctlaser.com to reserve your space today!  Registrations will be confirmed via email.  We accept cash and checks at the door.

Please join us for a technical presentation and lunch.

Impact of Solar Cell/Panel Interconnects on Long-term Reliability and Economics

Dr. Raghu Chaware, Ph.D., Senior Staff R&D Engineer, Solaria

Event Abstract:

Recent policy changes in Europe, USA and China have created an increasing impetus to maintain the rate of growth for photovoltaics. Crystalline silicon solar cells, since their first introduction in the late 1970s, have held the largest market share, but various thin film technologies such as CdTe, CIGS, a-Si have been developed and deployed within the last decade.

Even though production of solar cells and solar panels utilize well known techniques from semiconductors and other industries, one of the main virtues of photovoltaics is their long lifespan of 20-30 years in outdoor environments. Reliability and durability of these solar panels have a strong impact on energy payback and cost effectiveness. During this talk, Dr. Chaware will discuss some common failures modes in solar panels with a special emphasis on solar cell contacts and interconnections, which are analogous to the failures observed in organic packages and semiconductor devices.

Presenter Bio:

Dr. Raghunandan Chaware has over 8 years of research and development experience in electronics and photovoltaic related packaging materials. Currently, he is developing advanced material and design solutions for Solaria’s low concentration technology. Prior to joining Solaria, Raghunandan managed advanced flip chip packaging materials and process development at Xilinx, where he successfully developed packaging technologies for various new products. He has authored and co-authored 6 publications and has one issued US patent. Raghunandan earned his Ph.D. in Systems Science from State University of New York at Binghamton in 2004.

San Diego Chapter Summer Social on August 19    ^ Top

Dates: Wednesday, August 19
Schedule: 5:00 PM Dinner
Location:

Karl Strauss Brewing Co (Sorrento Mesa)
Upper Patio, above the pond
9675 Scranton Road
San Diego, CA
Phone (858) 587-2739

Fees:

$20.00 per person

Registration:

Space is limited, so do not delay ***RSVP's Required by Thursday, August 13th*** To Register: please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430.

CHOICES OF 3 ENTREES:

Spicy Jambalaya
Shrimp, grilled chicken, and andouille sausage sautéed in a Windansea Wheat Hefeweizen with vegetables, cajun spices and rice

Ginger Crusted Salmon
Sauteed spinach, avocado, steamed broccoli, and firecracker sauce

BBQ Half Rack Ribs
Tender St. Louis-style pork ribs slow-cooked in Red Trolley Ale BBQ sauce

Dessert - New York Cheesecake
Includes soft drinks, coffee, or tea, and one complimentary adult beverage

Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced    ^ Top

Dates: September 13-15, 2009
Location:

Quality Hotel, Tønsberg, Norway

On-line Info:

IMAPS Nordic is proud to announce this year’s conference in Norway. The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
 
The call for abstracts has closed and the technical program is now being organized. Sessions will likely focus on the following topics:

  • 3D Advanced interconnect, Advanced packaging
  • Harsh environment,
  • Ceramics: thickfilm, copper plated, DBC, LTCC
  • Chip thinning & stacking, 3D-packaging, embedding
  • CSP, flip chips, area array
  • Future electronics, trends & strategies
  • High frequency packaging
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Manufacturing management & outsourcing
  • MEMS, MOEMS, sensor integration & applications
  • High temperature electronics
  • Microvia, HDI laminates, flex, embedded passives
  • Pb and halogen free electronics, methods and consequences
  • Reliability assessment, SPC
  • SMT and board assembly
  • System cost assessment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB

In addition to the technical program we have planned the following keynote presentations and a tutorial:

Keynote Presentations (Monday morning (a, b) and Tuesday (c, d) morning):

 

a) Rita Glenne, REC Solar: “The present and the future of silicon solar cells”

b) Muthu B. J. Wijesundara, Northern California Nanotechnology Center: "Recent Progress in SiC Sensors and Microsystems for Harsh Environments"

c) Peter Ramm, Fraunhofer IZM, "Fabrication of 3D integrated heterogeneous systems"

d) Thomas Brunschwiler, IBM Zurich Research Lab, "Thermal packaging: A holistic view from transistor to datacenter"

Tutorial:

“NANOPACKAGING - An Introduction to Nanotechnologies in Microelectronics Packaging and Modeling Techniques” by Prof. James Morris, Portland State University

For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

More information is on-line at: http://www.imaps.de


Membership, Products and Publications

Journal of Microelectronics and Electronic Packaging - Don't Miss First Quarter 2009   ^ Top
The First Quarter 2009 issue of the Journal of Microelectronics and Electronic Packaging is available on-line, along with all past issues of JMEP. The second quarter of 2009 is still in production as the issue is much larger than anticipated and just a few weeks behind in production. Look for the second issue of 2009 in the weeks ahead.
Access the Journal papers on-line .

This first issue of 2009 contains the following papers:

INVITED PAPER:

 

Silicon on Ceramics - A New Integration Concept for Silicon Devices to LTCC
M. Fischer and H. Bartsch de Torres, Institute for Micro- and Nanotechnologies; B. Pawlowski, HITK; R. Gade, Institute for Micro- and Nanotechnologies; S. Barth, HITK; M. Mach, M. Stubenrauch, M. Hoffmann and J. Mu¨ ller, Institute for Micro- and Nanotechnologies

1
Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias
A. Albertsen and K. Koiwai, KOA Europe GmbH; K. Kobayashi, T. Oguchi and K. Aruga, KOA Corporation Monozukuri Initiative
6
Enhancement of Fine Line Print Resolution due to Coating of Screen Fabrics
D. Schwanke and J. Pohlner, Micro Systems Engineering GmbH; A. Wonisch and T. Kraft, Fraunhofer-Institut fur Werkstoffmechanik (IWM); J. Geng, Plasma Electronic GmbH
13
Validation of Alternative RoHS Compliant Au Pastes for the DuPont LTCC 951 System
B. Mussler and D. Schwanke, Micro Systems Engineering GmbH
20
Ceramic Microwave Circuits for Satellite Communication
R. Kulke, G. Mollenbeck, C. Gunner and P. Uhlig, IMST GmbH; K.H. Drue, S. Humbla, J. Muller, R. Stephan, D. Stopel, J.F. Trabert, G. Vogt and M.A. Hein, TU-Ilmenau; A. Molke, T. Baras and A.F. Jacob, TU-Hamburg-Harburg; D. Schwanke and J. Pohlner, MSE GmbH; A. Schwarz and G. Reppe, RHe Microsystems GmbH
27

Hermetic Package for Optical MEMS
F. Seigneur, Y. Fournier, T. Maeder, P. Ryser and J. Jacot, EPFL, IMT, LPM

32
38
Miniaturized Embossed Low Resistance Fine Line Coils in LTCC
R. Perrone, TU Ilmenau Functionalised Peripherics Group; H. Bartsch de Torres and M. Hoffmann, TU Ilmenau Institute for Micro- and Nanotechnologies; M. Mach and J. Mu¨ller, TU Ilmenau Functionalised Peripherics Group
42
LTCC-Modules with Integrated Ferrite Layers - Strategies for Material Development and Co-Sintering
C. Glitzky, T. Rabe, M. Eberstein and W.A. Schiller, Federal Institute for Material Research and Testing (BAM); J. Topfer, University of Applied Sciences Jena; S. Barth, Hermsdorfer Institut fur Technische Keramik e.V.; A. Kipka, W.C. Heraeus GmbH
49
Effects of Silver Paste Application on Embedded Channels in Low Temperature Co-fired Ceramics
D.L. Kellis, A.J. Moll and D.G. Plumlee, Boise State University
54

 

REGULAR CONTRIBUTIONS:

 
59

Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment
P.O. Quintero, University of Puerto Rico; F.P. McCluskey, University of Maryland

66
A Feasibility Study of Lead Free Solders for Level 1 Packaging Applications
V. Chidambaram, J. Hald and J. Hattel, Technical University of Denmark
75

The Impact of Glass-to-Resin Ratio and Sample Construction on the CTE of a High Temperature Laminate
J. Kuczynski, IBM Corporation; S. Bertling, Park Electrochemical Corporation

83
The Effect of Ultrasonic Frequency on Gold Wire Bondability and Reliability
J. Pan and M-N. Le, Cal Poly State University; C.V. Pham, Teledyne Microelectronics
89

The International Microelectronics and Packaging Society (IMAPS) is committed to the publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.

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Lorac - Furnace Experts

PDC Webinar Series on Polymers for Semiconductor Packaging (3 Sessions)
Session 3: July 23, 2009

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: August 4, 2009

Session 2: August 11, 2009

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact abell@imaps.org

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

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