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July 7, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - On-line Registration Closes This Friday (read more...)

Button PDC Webinar Series on Polymers for Semiconductor Packaging Begins Thursday - Registration Ends Tomorrow (read more...)

Button Program and Registration Now Available for IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button Abstracts Still Being Accepted for 2nd Annual RF and Microwave Packaging Workshop (read more...)

Button Abstracts Due July 10 for the Emerging Technology Workshop on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Advancing Microelectronics July/August 2009 On-line Magazine is Available (read more...)

JMEP Special Issue on Microactuators for Fluidic Applications  (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

IMAPS/SEMI 2nd Annual Workshop on Wire Bonding - On-line Registration Closes This Friday   ^ Top
IMAPS and SEMI proudly announce the 2nd Annual Topical Workshop on Wire Bonding. This workship will be held Monday, July 13, 2009, at the San Francisco Marriott Hotel in San Francisco, CA. This event will run prior to SEMICON West 2009 – July 14-16. Full workshop details are on-line at www.imaps.org/wirebonding.The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Monday, July 13, 2009
Registration: 8:30 am – 4:30 pm
Continental Breakfast: 8:30 am – 9:15 am

Opening Remarks: 9:15 am – 9:30 am

Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM

Nickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech Gmb

Wirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC

HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, Oerlikon ESEC USA Inc.

Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM

The Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSD

Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH

Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College


Break: 11:00 am – 11:15 am


Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting

Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc.

Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics

Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH

LUNCH: 12:15 pm – 1:15 pm

Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PM

Odd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.

Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.

Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbH

Break: 2:45 pm – 3:15 pm

Copper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.

Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software

Closing Remarks: 4:15 pm

Register On-line for Wire Bonding

PDC Webinar Series on Polymers for Semiconductor Packaging Begins Thursday - Registration Ends Tomorrow    ^ Top
This three-session on-line Professional Development Course (PDC) webinar will be held:
Thursdays, July 9, 16, 23, 2009

All webinars will be held 12:00 noon - 1:00 pm EDT

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadline: July 8, 2009

Register On-line

Key Words/Topics

Polymers, thermosets, thermosetting polymers, adhesives, coatings, mold compounds, die attach, mechanical properties of polymers, curing, cure kinetics, epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts, rheology, adhesion

Program Description

These 3 one-hour PDC lectures can be taken in total or separately, but to gain the most benefit it is recommended to attend the whole series in order. Each session is scheduled for 50 minutes of presentation followed by 10 minutes of Questions and Answers. A brief description of each session follows:

Session 1 of 3: Thursday, July 9 -- 12:00-1:00 PM EDT

Overview of Polymers used in Electronic Packaging
This session will provide a broad overview of polymers and the important structure-property-process-performance relationships for electronic packaging.  Topics to be covered:

  • Thermosetting polymers versus thermoplastics
  • Temperature dependence of physical properties
  • Thermosetting polymers; curing, curing mechanisms (heat and light cured), network formation
  • Overview of key chemistries used (epoxies, acrylates, polyimides, bismaleimides, curing agents, and catalysts) 

Session 2 of 3: Thursday, July 16 -- 12:00-1:00 PM EDT

Polymer-based Materials for Semiconductor Packaging
This session will build on the previous webinar and go into more details for specific applications.  We will cover in more depth the chemistries, material properties, and process considerations for:
  • Adhesives (both paste and film)
  • Capillary Underfills
  • Packaging Substrate Materials
  • Encapsulants (mold compounds) and coatings

Session 3 of 3: Thursday, July 23 -- 12:00-1:00 PM ED

Rheological and Adhesion Requirements for Polymers used in Semiconductor Packaging
This session will provide an introduction to two critical areas governing the performance of polymer-based materials used in packaging semiconductors.  In most cases, adhesives, underfills, mold compounds and coatings are applied as a viscous liquid and then cured.  The flow properties of these materials is critical to performance in high volume manufacturing.  Additionally, the adhesive properties are critical for long-term reliability performance.  This session will cover the basics in:

  • Introduction to the rheological properties of adhesives (shear thinning, viscosity, time dependence, rheology changes during curing)
  • Introduction to rheological characterization methods (various types of rheometers, and basic techniques)
  • Introduction to Adhesion Science
  • Polymer chemistries of typical adhesives, bonding mechanisms

Who Should Attend?

Packaging engineers involved in the development, production, and reliability testing of semiconductor packages would benefit from the series. Those interested in gaining a basic understanding of the role of polymers and polymer-based materials used in electronic packaging will also find this series valuable.

Thomas Green

Presenter

Dr. Jeff Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success directing new product development, leading to multi-million dollar revenues. He has global experience developing new products having established a full function R&D and Applications Engineering lab in Shanghai, China for Ablestik Laboratories. Jeff has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies.

Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to speak at prestigious Gordon Research Conferences (Thermosetting Polymers and Composites). He has presented numerous lectures and short courses at national technical conferences.   Jeff was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993.  He taught Six Sigma Black Belt and Green Belt at California State University at Fullerton from 2001-2006, and teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA. 

Jeff is a member of the Product Development and Management Association (PDMA), American Chemical Society (ACS), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), and the International Microelectronics and Packaging Society (IMAPS).

Jeff has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 7 patents pending. 

Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical Engineering/Materials Science from Marquette University.

Register On-line

Program and Registration Now Available for IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full program, lodging and registration details are available at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Sunday, September 13th

Dinner: 7:00 pm – 8:00 pm

Monday, September 14th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Opening Remarks: 8:50 am – 9:00 am
Conference Chairs

Session 1: Capacitors and Connectors
Chair: Colin Johnston, Oxford Applied Technology - UK
9:00 am – 1:00 pm

Architecture Analysis of High Performance Capacitors
Jeffery T. Stricker, Hiroyuki Kosai, Tyler W. Bixel, Seana A. McNeal, James D. Scofield, Jennifer DeCerbo, Biswajit Ray, US Air Force Research Laboratory

Robust BME Class-I Ceramic Capacitors for High Temperature Applications
Xilin Xu, Bill Buchanan, Paul Staubli, Philip Lessner, Abhijit Gurav, KEMET Electronics Corporation

Thermally Robust Polymer Dielectric Systems for Air Force Wide-Temperature Power Electronics Applications
Narayanan Venkat, Victor K. McNier, Zongwu Bai, Marlene D. Houtz, Thuy D. Dang, University of Dayton Research Institute; Jennifer N. DeCerbo, Jeffery T. Stricker, US Air Force Research Laboratory

Break: 10:30 am – 11:00 am

Fabrication and Characterization of High Temperature Film Capacitors
Keith D. Jamison, R. D. Wood, B. G. Zollars, P. Le, Nanohmics, Inc.

Novel Solid Tantalum Capacitor for Demanding Applications up to 200°C
Radovan Faltus, Tomas Zednicek, AVX Czech Republic S.R.O.

Adapting Press-Fit Connection Technology for Electronic Modules in Harsh Environments
Andy Longford, PandA Europe; Joseph Lynch, Interplex Industries Inc., USA

High-Dielectric-Constant Capacitors for High-Temperature Power Inverters in Hybrid Electric Vehicles
U. Balachandran, B. Ma, M. Narayanan, Argonne National Laboratory

Lunch: 1:00 pm – 2:00 pm

Session 2A: Devices
Chairs: Thomas Krebs, CISSOID; Joe Henfling, Sandia National Laboratory
2:00 pm – 5:30 pm

Product Test Results of the HTADC12 12 Bit Analog to Digital Converter at 250°C
Thomas B. Romanko, Mark Larson, Honeywell International Inc.

Performance and Reliability of SiGe Devices and Circuits For High Temperature Applications
Dylan B. Thomas, John D. Cressler, Laleh Najafizadeh, Leora Peltz, Stan Phillips, Ted Wilcox, Georgia Institute of Technology; R. Wayne Johnson, Auburn University

Introduction of Texas Instruments High Temperature Semiconductors
Mont Taylor, Brad Little, Texas Instruments

Break: 3:30 pm – 4:00 pm

SOI Lateral PIN Diodes for Temperature and UV Sensing in Very Harsh Environments
Bertrand Rue, Olivier Bulteel, Denis Flandre, University Catholique de Louvain-la-Neuve; Michelly de Souza,  A. Pavanello, FEI

Quartzdyne ASIC Developments
Shane Rose, Mark Watts, Quartzdyne

Operational and Performance Test Results of the Reconfigurable Processor for Data Acquisition (RPDA) at 250°C
Thomas B. Romanko, Mike Johnson, Honeywell International Inc.

Dinner: 7:00 pm – 8:00 pm

Tuesday, September 15th

Registration: 7:00 am – 5:30 pm

Breakfast: 8:00 am – 8:50 am

Session 2B: Devices continued
Chair: Rene Lerch, Fraunhofer IMS
9:00 am – 11:00 am

Development of the First Commercialised Integrated Circuit Process Operating in the Range of 300°C to 450°C
James A. McGonigal, David T. Clark, Robin F. Thompson, Raytheon Systems Limited

Evaluation of an SOI Operational Amplifier with High Temperature Packaging
Liang-Yu Chen, Richard L. Patterson, Ahmad Hammoud, Michael J. Krasowski, Joseph M. Flatico, Dennis E. Culley, OAI / NASA Glenn Research Center

Performance of a Diode-Based Bandgap Reference Circuit
Paul Moody, Marshall Soares, Monte Johnson, NOV/Intelliserv

Break: 10:30 am – 11:00 am

Development of an Integrated Power Controller Based on HT SOI and SiC
Joseph A. Henfling, Stan Atcitty, Frank Maldonado, Sandia National Laboratories; Trevor Thornton, ASU, Randy Normann, PermaWorks

Session 3: Packaging Materials
Chair: Wayne Johnson, Auburn University
11:30 am – 1:00 pm

Dielectric, Thermal and Structural Characterization of Fluorinated Parylene Films for High Temperature Power Device Surface Insulation
Mireille Bechara, S. Diaham, M. L. Locatelli, S. Zelmat, C. Tenailleau, Université Paul Sabatier

Investigation of Polyimide/Carbon Nanotube Nanocomposites for High Temperature Electronic Packaging Applications
Qing-Yuan Tang, Y. C. Chan, N. B. Wong, City University of Hong Kong

Nanoparticle Enhanced Solders for High Temperature Reliability
Omid Mokhtari, Roya Ashayer, Samjid H. Mannan, Michael P. Clode, Kings College of London

Lunch: 1:00 pm – 2:00 pm

Session 4: Sensors and MEMS
Chairs: Randy Normann, Perma Works; Alison Crossley, University of Oxford
2:00 pm – 5:30 pm

HTNFET Junction Capacitance Measurements, Theoretical Model and Validation for Development of High-Temperature Wireless Sensor Networks
Jonathan Gagnon, François Gagnon, École de Technologie Supérieure

High Temperature SOI CMOS Ultra Low Power Circuits for MEMS Co-Integrated Interfaces
Bertrand Rue, Nicolas Andre, Benoit Olbrechts, Jean-Pierre Raskin, Denis Flandre, University Catholique de Louvain-la-Neuve

High-Temperature SOI CMOS Compatible MEMS Pressure Sensors
Reneé Lerch, Robert Klieber, Norbert Kordas, Holger Kappert, Fraunhofer IMS

Break: 3:30 pm – 4:00 pm

Explosion Metrology: A better bang for your buck?
Greg D. Horler, David McGorman, Instrumentel Ltd.

A Non Volatile MEMS Switch for Harsh Environment Memory Applications
Vikram Joshi, Richard Knipe, Rob VanKampen, Damian Lacey, Toshi Nagata, Dennis Yost, Charles Smith, Cavendish Kinetics, Inc.

High Temperature SiC Wireless Telemetry Systems
John Fraley, Bryon Western, Roberto M. Schupbach, Alexander B. Lostetter, Brice McPherson, Jared Hornberger, Jie Yang, Arkansas Power Electronics International, Inc.

Dinner: 7:00 pm – 8:00 pm

Wednesday, September 16th

Registration: 7:00 am – 6:00 pm

Breakfast: 8:00 am – 8:50 am

Session 5: Packaging
Chairs: Ovidiu Vermesan, SINTEF; Shane Rose, Quartzdyne
9:00 am – 1:00 pm

Nano-Mechanical Analysis of Pb-Free Solders for Reliability Optimisation in High Performance Microelectronics Systems
V.M.F. Marques, C. Johnston, P.S. Grant, University of Oxford

Development of High Temperature Electronics Packaging Technologies for Long Term Operation at 250°C
S. T. Riches, Kevin Cannon, GE Aviation Systems; Colin Johnston, Mica Sousa, Patrick Grant, Oxford University; Jim Gulliver, Sondex Wireline Ltd.; Mark Langley, Vibro-meter UK Ltd.; Robin Pittson, Simona Serban, Denley Baghurst, Gwent Electronics Materials; Mike Firmstone, Thermastrat

Packaging Technology for High Temperature Silicon-on-Insulator Electronics
R. Wayne Johnson, Ping Zheng, Phillip Henson, Auburn University

Break: 10:30 am – 11:00 am

Thermomechanical Reliability Evaluation of Direct Bonded Aluminum (DBA) as a Substrate for High-Temperature Electronics Packaging
Thomas G. Lei, Jesus N. Calata, Khai D. Ngo, Guo-Quan Lu, Virginia Tech

The Development and Application of 225°C Hybrid Microcircuit Technology
Robert Hunt, Chris Andrews, C-MAC MicroTechnology

Hermetic Micro-Packaging with Heat Sinks
Marie Evrard, Nathan Foster, Pacific Aerospace & Electronics, Member of SOURIAU Group

Plastic Packaging for High Temperature Applications
Tanja Braun, K.-F. Becker, J. Bauer, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl, Fraunhofer IZM

Lunch: 1:00 pm – 2:00 pm

Session 6: Power Electronics
Chairs: Sascha Schwarze, Baker Hughes INTEQ; Steve Riches, GE Aviation
2:00 pm – 6:00 pm

250°C Voltage Compliant SOI MESFETs for High Power PWM Drive Circuits
Nicholas Summers, William Lepkowski, Seth Wilk, Trevor Thornton, Randy Normann, Joseph Henfling, Arizona State University

High Temperature DC-DC Buck Converters for Point-of-Load (POL) Applications
Pierre Delatte, V. Dessard, A. Saib, E. Boufous, N. Pequignot, G. Picún, CISSOID S.A.

High Temperature Power Electronics IGBT Modules for Electrical and Hybrid Vehicles
Reiner John, Infineon Technologies; Ovidiu Vermesan, SINTEF

Break: 3:30 pm – 4:00 pm

High Temperature Power Electronic Packaging for Oil Well Applications
Rolf Johannessen, Andreas Larsson, Frøydis Oldervoll, Truls Fallet, SINTEF Information and Communication Technology

High Temperature Nanoelectronics for Electrical and Hybrid Vehicles
Ovidiu Vermesan, SINTEF; Reiner John, Infineon Technologies

A High Temperature 2Amps Power Driver for SMPS and Motor Drive Applications
Pierre Delatte, E. Boufous, V. Dessard, A. Saib, N. Pequignot, G. Picún, CISSOID S.A.

High-Power and High Temperature SiC Power Module Development
Gavin Mitchell, Edgar Cilio, John Garrett, Marcelo Schupbach, Alex Lostetter, Arkansas Power Electronics International

Closing Remarks: 6:00 pm

Abstracts Still Being Accepted for 2nd Annual RF and Microwave Packaging Workshop    ^ Top
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • SIP

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically using the on-line submittal form at: www.imaps.org/abstracts.htm.

Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Abstracts Due July 10 for the Emerging Technology Workshop on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications    ^ Top
IMAPS announces the Emerging Technology Workshop on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications. This workship will be held October 13 - 15, 2009, at the University of Arkansas in Fayetteville, Arkansas. The Abstract Deadline is Friday, July 10. Full workshop details are on-line at www.imaps.org/nano.

Onset of 21st Century is marked with significant nanotechnology breakthroughs to enable new class of designs, materials and processes and nano-integrated systems. Microsystems, including microelectronics packaging, are one of the primary beneficiaries of this revolution. At the foundation of these nano innovations are the fundamental value additions offered due to nano size (<100 nm) enabling high surface to volume ratio, pristine functional characteristics and thus, unique device and material properties, ultra high packaging density, etc. Examples of nanoscale building blocks are nano structured metals like copper, quantum dots of III-V compounds, carbon nanotubes, zinc oxide nanorods, BaTiO3 nanoparticles, etc. These new classes of materials and their unprecedented properties offer opportunities to deliver excellent candidates for next generation of packaging delivering high performance and multifunctions, per dollar. Example beneficiaries are LEDs and OLEDs, z-axis interconnects, anisotropic underfills, thermally conductive epoxies, die attach solders, passive capacitors, etc. This first workshop is an important forum towards building a community of scientists, engineers and businesses working on nano-integrated technologies adding value to traditional products as well as creating new products in electronic, energy, communication, chemical and other sectors of businesses for sustainable economy.

Planned sessions include the following technical areas for keynote and speakers:

  • Session I:  Nano Materials and Properties
  • Session II:  Nanomaterials Integrated Structures:  (substrates, interconnects, underfill, adhesive, etc.) and performance
  • Session III:  Nanofabrication and Assembly Processes and Instrumentation
  • Session IV:  Nano-Integrated Microsystems Packaging Applications and Case Studies
  • Panel:  Quo Vadimus for enabling Nano-integrated Packaging Product Innovations

Those wishing to discuss the findings and developments in the form of a presentation at this workshop, please submit a 200-300 word abstract electronically no later than July 10, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.

No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, August 28, 2009.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Chapter Activities (events listed in chronological order)

Nordic Chapter 2009 Conference - New Keynotes and Nanopackaging Tutorial Announced    ^ Top

Dates: September 13-15, 2009
Location:

Quality Hotel, Tønsberg, Norway

On-line Info:

IMAPS Nordic is proud to announce this year’s conference in Norway. The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
 
The call for abstracts has closed and the technical program is now being organized. Sessions will likely focus on the following topics:

  • 3D Advanced interconnect, Advanced packaging
  • Harsh environment,
  • Ceramics: thickfilm, copper plated, DBC, LTCC
  • Chip thinning & stacking, 3D-packaging, embedding
  • CSP, flip chips, area array
  • Future electronics, trends & strategies
  • High frequency packaging
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Manufacturing management & outsourcing
  • MEMS, MOEMS, sensor integration & applications
  • High temperature electronics
  • Microvia, HDI laminates, flex, embedded passives
  • Pb and halogen free electronics, methods and consequences
  • Reliability assessment, SPC
  • SMT and board assembly
  • System cost assessment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB

In addition to the technical program we have planned the following keynote presentations and a tutorial:

Keynote Presentations (Monday morning (a, b) and Tuesday (c, d) morning):

a) Rita Glenne, REC Solar: “The present and the future of silicon solar cells”

b) Muthu B. J. Wijesundara, Northern California Nanotechnology Center: "Recent Progress in SiC Sensors and Microsystems for Harsh Environments"

c) Peter Ramm, Fraunhofer IZM, "Fabrication of 3D integrated heterogeneous systems"

d) Thomas Brunschwiler, IBM Zurich Research Lab, "Thermal packaging: A holistic view from transistor to datacenter"

Tutorial:

“NANOPACKAGING - An Introduction to Nanotechnologies in Microelectronics Packaging and Modeling Techniques” by Prof. James Morris, Portland State University

For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
Last chance! Abstract due date June 7!
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”. The abstract deadline is June 7 and those accepted papers would be embodied in IEEE Xplore. Therefore, please grasp this last chance to enter international technology stage.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

More information is on-line at: http://www.imaps.de


Membership, Products and Publications

Advancing Microelectronics July/August 2009 On-line Magazine is Available   ^ Top
The July/August 2009 of Advancing Microelectronics is now available on-line.
This issue features three technical articles on: Thermal Management Materials Choices for Power Semiconductors; An Alternative Process for Assembling Electronic Products without Solder; and The Chemistry of Halogen-Free Electronics.

View the July/August 2009 issue on-line today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.

JMEP Special Issue on Microactuators for Fluidic Applications   ^ Top
The Journal of Microelectronics and Electronic Packaging (JMEP) is publishing a special issue on Microactuators for Fluidic Applications. This Special Issue of JMEP is intended to give a comprehensive overview of the current status in respect to cutting-edge concepts and prototypes in this field. Authors are encouraged to submit primarily research papers with a length of at least 6 pages, and details regarding the format and copy right form can be obtained from http://www.imaps.org/ jmep/authors.htm. If the submission of a review article is envisaged, please contact the guest editor in advance.

Guest Editor:
Prof. Dr. Ulrich Schmid
Vienna University of Technology,
Department for Microsystems Technology
Austri
aschmid@isas.tuwien.ac.at

Special Issue Submission Deadline: November 30, 2009

In the recent years, actuators fabricated using MEMS technologies have gained enhanced att enti on both from academia as well as from industry. The specifi c applicati on, however, needs to be carefully selected to exploit their full potenti al due to limitati ons such as low forces or restricted amplitudes which can be provided depending on the actuati on principle. Besides this drawback, micromachined actuators are applied to a broad fi eld of diff erent applicati on scenarios ranging from opti cal, high frequency, bio-medical and fl uidic to those related to sensing and characterizati on in general. For the excitati on of micromachined devices and structures, forces based on electrostati c, piezoelectric, thermo-mechanical and electromagneti c principles are typically applied. In microfl uidics, the ink jet printer head is one of the most prominent representati ve, also from the economical point of view. Besides this success story, innovati ve approaches are reported nowadays in literature for fl uidic fl ow manipulati on and interacti on when targeti ng both liquid and gaseous media.

More Information - www.imaps.org/jmep | Questions? jmep@imaps.org

 
 

Lorac - Furnace Experts

PDC Webinar Series on Polymers for Semiconductor Packaging (3 Sessions)
Session 1: July 9, 2009

Session 2: July 16, 2009
Session 3: July 23, 2009

TW on Wire Bonding
July 13, 2009
San Francisco, CA

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: August 4, 2009

Session 2: August 11, 2009

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact abell@imaps.org

ETW on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications
October 13-15, 2009
Fayetteville, AR

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

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Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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