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March 24, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS 2009, San Jose - Abstracts Due This Friday, March 27 (read more...)

Button Hotel Cut-off THIS FRIDAY for CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet THIS THURSDAY: Keystone Chapter March 26 Dinner Meeting (read more...)

Bullet Next Tuesday: Rocky Mountain Chapter Technical Dinner Meeting March 31 (read more...)

Bullet Next Wednesday: Northern California Chapter April 1 Lunch Meeting on Conductive Polymer Interconnects for Low Cost Chip Scale Packages (read more...)

Bullet Garden State Chapter April 7 Dinner Meeting and Tour of R&D CIrcuits (read more...)

Bullet Don't Miss INTERCONEX 2009 (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference (read more...)

Bullet Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) (read more...)

   PRODUCTS AND PUBLICATIONS
Order IMAPS Apparel On-line (read more...)

Advancing Microelectronics March/April 2009 On-line Magazine is Available (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

IMAPS 2009, San Jose - Abstracts Due This Friday, March 27   ^ Top
The 42nd International Symposium on Microelectronics will be held at the San Jose Convention Center, San Jose, California, USA, from November 1-5, 2009. The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining microelectronics “between the chip and the system.” The 42nd Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Abstracts should highlight the major contributions of the work in each these four areas of concentration. All abstracts submitted must represent original, previously unpublished work.

Planned Sessions Include:

Industry “Focused”

• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming

• Automotive and Industrial

• Solar and Alternative Energy

Systems & Applications

• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices

Translated
(Invited Speakers Only)

• Japanese (Japanese to English translation)

Design

• Signal Integrity
• Power Integrity
• Electrical Modeling
• High Performance Interconnects and Boards
• 3D Packaging Approaches
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials

Materials and Process

• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics

Interactive Poster Session

Outstanding papers that do not fit in planned or created sessions will be considered for this interactive session.

Please send your 250-300 word abstract electronically only on/before Friday, March 27, 2009, using the On-line submittal form at: www.imaps.org/abstracts.htm. For more information about IMAPS 2009, visit www.imaps2009.org.

All Speakers are required to pay a reduced registration fee. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 305-382-8433

Hotel Cut-off THIS FRIDAY CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies   ^ Top
The 5th CICMT Conference is being held April 20-23, 2009, at The Curtis Hotel in Denver, Colorado. The hotel cut-off is this Friday, March 27. Hotel availability and pricing will not be guaranteed after this date. For more information, visit www.cicmt.org.

The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

CICMT 2009 will again feature a focused exhibition with a limited number of tabletops for suppliers who support the use of the technologies. To view information about this exhibition, or to reserve your booth(s), visit www.cicmt.org. You may also contact Ann Bell at abell@imaps.org or 202-548-8717 for information about Tabletop exhibits.

Chapter Activities (events listed in chronological order)

THIS THURSDAY: Keystone Chapter March 26 Dinner Meeting    ^ Top

Date: March 26, 2009
Time: 4:30 - 8:15 pm
Location:

Holiday Inn and Conference Center
432 Pennsylvania Avenue
Ft. Washington, PA 19034

Directions: http://www.fwholiday.com/location.php

Registration:

These valuable presentations and dinner are complimentary by registering by March 20 with Greg Chesmar at GregChes@aol.com or 215-822-0510.

Program:

4:30    Keystone Chapter Leadership Meeting
            Please attend if you would like to benefit by organizing & presenting at future events.

5:30    Happy Hour – Cash Bar
            Build connections with local peers.

6:15    Buffet Dinner 
            A brief chapter business meeting will be held during the dinner hour.

7:15    First Speaker:  Daniel Quain
           Director, Mission Success and Product Assurance, Cobham Defense Systems
            “Manufacturing Trends for Low Volume, High Complexity Microelectronic                              Assemblies and Subsystems”

(Abstract: A discussion of industry trends in the manufacturing and packaging of microelectronic assemblies for high reliability defense applications.)

7:45    Second Speaker:   Matthew Gruber  
           Manager, Cabinets & Electronics Packaging, Lockheed Martin – MS2
           “Non-Hermetic Packaging of RF Multi-Chip Modules”

(Abstract: The packaging of RF multi-chip modules for military applications traditionally employs the use of hermetic, ceramic-based substrates. Although these packaging schemes have proven to be highly robust in a variety of environments, they also carry a significantly higher cost than non-hermetic alternatives. In order to take advantage of the significant cost opportunities available, a multi-chip module was developed using Monolithic Microwave Integrated Circuits (MMICs) in plastic over-molded QFN packages. The completed assembly was tested and performed almost as well as a ceramic chip and wire module using the same chipset, for less than 25% of the packaging cost.).

NEXT TUESDAY: Rocky Mountain Chapter Technical Dinner Meeting March 31    ^ Top
Tuesday, March 31

Fusion Restaurant  (at the Radisson Hotel & Conference Center)
1900 Ken Pratt Blvd.,
Longmont CO 80501

Map and Directions to Hotel

Please join us for dinner and technical presentations.

Event Program:

5:00  Registration, Welcome, and Introductions

5:30  Dinner

6:00 “Electro-deposition of TSV features (3-D focus).”
                     Stan Wright, Account Manager, Enthone Inc.

6:30 “Using FEM/FEA to Understand the Mechanics of Solder Fatigue in Flip Chip, CSP, and BGA Interconnects”.   
               Scott Popelar, Principal R&D Package Engineer, Aeroflex COS
                         
7:00  Closing remarks.  Planning the next event (at the Ceramics Conference - CICMT) 

Registration:

On-line Registration
On-line registration ends Friday, March 27

Registration fees:  Industry professionals; $25.00 members, Students - $ 10.00

Please contact Mr. Tim LeClair at tleclair@yahoo.com or at Avago Technologies (970-288-9163) for more information.

NEXT WEDNESDAY: Northern California Chapter April 1 Lunch Meeting on Conductive Polymer Interconnects for Low Cost Chip Scale Packages    ^ Top

Date: April 1, 2009
Time: 11:30 am - 1:00 pm
Location:

The Lookout
605 Macara Avenue
Sunnyvale, CA 94086

Registration:

Members/General $20.00
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at glove@cctlaser.com to reserve your space today! Registrations will be confirmed via email. We accept cash and checks at the door.

Program:

Conductive Polymer Interconnects for Low Cost Chip Scale Packages
Speaker: Marc Robinson, CTO, Vertical Circuits, Inc.

11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation

Abstract:

Driven by the proliferation of high volume, small, portable consumer applications, package development efforts throughout the industry have focused on reducing footprint and reducing package thickness to maximize silicon functionality in a given area and/or given volume. To meet aggressive and competitive end product needs there has been much focus on chip scale packaging, wafer level processing, and stacking of ultra thin die. However, wirebonding to extremely thin die presents a number of problems, including breakage and yield. Vertical Circuits, Inc. (VCI) has pioneered the use of conductive polymers for electrical interconnect of die stacks and stacked packages to reduce the forces applied to the die, increase yield, lower cost, and reduce package size. The presentation will review the characteristics of conductive polymers used for chip and package interconnections and the near-TSV package assemblies that can be built without wire bonds.

Speaker Bio:

Marc Robinson is the CTO of Vertical Circuits Inc. and currently focuses on intellectual property strategy and analysis for VCI. Marc joined VCI, in 1996, as Vice President of Engineering and Operations, taking his current role as VCI’s CTO in 2001. Before joining VCI, he served as Vice President, Technology Development and Quality, for Sierra Semiconductor. Prior to Sierra, Marc was Vice President of Engineering, and Vice President of TQM and Quality at GEC Plessey Semiconductors, where he focused on product development and design quality and prior to GEC Plessey, he served as a Business Unit Director at International Microelectronics Products (IMP). Marc holds a BS in Physics from The Cooper Union, and an MS in Physics from Franklin & Marshall. He is a member of IEEE and IMAPS.

Garden State Chapter April 7 Dinner Meeting and Tour of R&D CIrcuits    ^ Top

Date: April 7, 2009
Time: 3:30 pm - 8:00 pm
Location:

Holiday Inn – South Plainfield-Piscataway
4701 Stelton Road
South Plainfield, NJ 07080
Map and Directions to Holiday Inn –Click here 

Registration:

Registration fees:
Dinner and presentations: Industry - $25 IMAPS members, $ 35 non-members. Students - $ 10.00 Tour only, no charge but you must RSVP!

Program:

3:30   Registration, Networking, and Opening Remarks

4:30   “Thermomechanical Finite Element Techniques in LTCC Package Design."  
                    Mark Eblen, R&D Program Manager of Kyocera America, Inc.”
                         
5:00    “Injection Molded Soldering (IMS) for Fine-pitch Substrate Bumping."
                    Jae-Woong Nah,  Research Staff Member, IBM

5:30   “Alternatives to Solder Attach in Micro-electronics using Epoxies and Ribbon Bonding"
                    James Yunan, Senior Process Engineer at Aeroflex KDI.

6:00  Dinner and Closing Remarks (planning the next event, recruiting chapter officers).

7:00 One-hour tour at R & D Circuits, Inc. 
          (Hybrid circuit board with organic materials.  And possibly circuit miniaturization.)

          Tour Information:
          Tom Bresnan, Sales Manager
          R & D Circuits, Inc. 3601 S. Clinton Ave. South Plainfield, NJ 07080

Don't Miss INTERCONEX 2009    ^ Top

Date: April 7-8, 2009
Location:

Congress Centre of La Villette
Paris, France

Within INTERCONEX 2009, the technical committee is organizing the technical program on the following topics:

KEYNOTE PAPERS:

  • Packaging & Application of Power LED Devices
  • Packaging and reliability challenges of high pin count circuits

A one day technical workshop on:

  • Microelectronics and packaging for medical and healthcare applications

Technical conferences on the following subjects:

  • Materials improvement (solder, underfill, die attach, thermal interface, ...) and processes (assembly, stacking, packaging,…)
  • Flip-chip (substrates and board technologies),
  • Reliability, thermal management,
  • Advanced Technologies (3 D integration, embedded die, reconstructed wafer, flex,...)
  • Emerging topics (carbon nanotubes, packaging innovation, alternative source integration,…)
  • Modelling, simulation & design, ….
  • Characterization & test,
  • Packaging applications (avionic, telecom, automotive, biomedical, domotic, military,..), and
  • Systems (optic, photonic, harsh environment, …)

The deadline for abstracts has passed and the organizers are now creating the technical program. For more information, visit www.imapsfrance.org or contact Florence Vireton at +33 (0) 1 39 67 17 73.

EMPC 2009 - European Microelectronics and Packaging Conference    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”. The Technical Program Committee of EMPC 2009 invites you to send abstracts of original work describing recent developments in microelettronics technologies.  The Call for Papers, exhibitors details and other information are available at www.empc2009.org.

Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009)    ^ Top
Taiwan has kept the key technology and position in the world’s IC packaging, testing, thermal and PCB areas. For promoting the competition of Taiwan electronic industry, IEEE CPMT-Taipei, I-SHOU, ITRI, TPCA, IMPAS-Taiwan and SMTA cooperate again to hold the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009). Organizers expect the theme of IMPACT 2009, “IMPACT Your Future: Integration, Efficiency & Eco-Friendly”, will bring the concept of combination, high-efficiency and green tech. For this reason, organizers hope it would result in knowledgeable discussion and profound impact. This year, TTMA (Taiwan Thermal Management Association) join this Conference, which could attract papers from thermal management, cooling technology and energy saving. Besides, IMPACT 2009 will be held simultaneously with TPCA Show at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. Attendees not only could attend Conference, but also could enjoy this important Show.

Taiwan, Silicon Island acts as a crucial position among worldwide electronic industry with over 50% revenue on IC packaging, testing and thermal in the world. And Taiwan PCB industry also have 25% market share in the world. Taiwan plays an important role in high-tech industry because of these remarkable performances. Organizers hope this conference could provide an international platform for all foreign and domestic contributors to show their researches. Besides, it also could let overseas scholars and engineers understand the Taiwan technologic industrious development and achievement.

Last year, because 6 organizers cooperated together, there had 200 papers solicited and 600 foreign and domestic attendees joining in IMPACT. Meanwhile, organizers also arranged varied activities such as industrious sessions and “Best Student & Outstanding paper Award” ceremony. Moreover, those accepted papers would be embodied in IEEE Xplore. Therefore, the organizers expect this year will attract much more foreign scholars and R&D Researchers attending this important event to share experience and communicate with each other.

Contributions are very welcome from industry participants and academic researchers. The paper should be written and presented in English and the abstract should be submitted by June 7. Welcome to submit your paper by on-line registration. If you want to get more information, please feel free to contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402, Email: service@impact.org.tw. More information, please check IMPACT 2009 website: http://www.impact.org.tw.

Products and Publications

Order IMAPS Apparel On-line    ^ Top

Thanks to the IMAPS Viking Chapter, all members of IMAPS can now purchase a variety of polos and button down shirts with embroidered IMAPS logos on-line. You can purchase shirts for yourself, friends, colleagues or chapter at the click of a mouse. Orders are processed and the shirts are typically shipped within one week.

Order on-line at the Abadus Embroidery website: http://www.abadus.com/imaps/.

Thank you Viking Chapter!

Advancing Microelectronics March/April 2009 On-line Magazine is Available   ^ Top
The March/April 2009 of Advancing Microelectronics is now available on-line.
This issue features four technical articles on: 2008 Industry Report Focus on MEMS Packaging Executive Summary; Texas Instruments: The Evolution to a Lower Cost DMD; New Technology Platform for Micro-Electromechanical Devices; and Managing Wafer Size Migration: A Case Study of the Shellcase Wafer-Scale Package Technology.

View the March/April 2009 issue on-line today.

Advancing Microelectronics is published bi-monthly and offered to all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.

 

 
 

CAD Design Software

RGL Enterprises LLC

PDC Webinar Series on Introduction to Multilayer Ceramics (3 Sessions)
Session 1: April 1, 2009

Session 2: April 8, 2009
Session 3: April 15, 2009

CICMT 2009 - IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies
April 20-23, 2009
Denver, CO

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 1: May 6, 2009

Session 2: May 13, 2009
Session 3: May 20, 2009

TW on Wire Bonding
July 13, 2009
San Francisco, CA

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

TW and Tabletop Exhibition on Intelligent Uses of Precious Metals in Microelectronics
November 5-6, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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