IMAPS Home | Join/Renew | Industry Guide | Edit Member Record
May 12, 2009

TJ Green Associates, LLC

   IMAPS EVENTS
Button Abstracts Due Friday for IMAPS HiTEN Conference - High Temperature Electronics Network (read more...)

Button Abstracts Due Next Friday, May 22 for 2nd Annual RF and Microwave Packaging Workshop (read more...)

Button Register for IMAPS/SEMI 2nd Annual Workshop on Wire Bonding (read more...)

Button Upcoming IMAPS PDC Webinars (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Chesapeake May 13 Dinner Meeting (read more...)

Bullet Arizona Chapter May 21 Lunch Meeting on Thermal Management of Advanced Microelectronics (read more...)

Bullet EMPC 2009 - European Microelectronics and Packaging Conference - Now Featuring a GBC Session on Solar Cells (read more...)

Bullet Announcing Nordic Chapter 2009 Conference - Abstracts Due May 15 (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

   PRODUCTS AND PUBLICATIONS
Have You Read A Recent Journal of Microelectronics and Electronic Packaging On-line? (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

IMAPS Events (view full Web Calendar)

Abstracts Due Friday for IMAPS HiTEN Conference - High Temperature Electronics Network    ^ Top
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full conference details are available at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later May 15, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due July 24, 2009, for all accepted abstract.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. 

Abstracts Due Next Friday, May 22 for 2nd Annual RF and Microwave Packaging Workshop    ^ Top
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New IR sensors without cooling
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • SIP

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 22, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Register for IMAPS/SEMI 2nd Annual Workshop on Wire Bonding    ^ Top
IMAPS and SEMI proudly announce the 2nd Annual Topical Workshop on Wire Bonding. This workship will be held Monday, July 13, 2009, at the San Francisco Marriott Hotel in San Francisco, CA. This event will run prior to SEMICON West 2009 – July 14-16. The Early Registration Deadline is June 19. The Hotel Deadline is June 29. Full workshop details are on-line at www.imaps.org/wirebonding.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Monday, July 13, 2009

Registration: 8:30 am – 4:30 pm

Continental Breakfast: 8:30 am – 9:15 am

Opening Remarks: 9:15 am – 9:30 am

Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PM

Nickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech GmbH

Wirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC

HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, Oerlikon ESEC USA Inc.

Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PM

The Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSD

Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH

Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College


Break: 11:00 am – 11:15 am


Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting

Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc.

Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics

Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH

LUNCH: 12:15 pm – 1:15 pm

Session 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PM

Odd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.

Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.

Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbH

Break: 2:45 pm – 3:15 pm

Copper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.

Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software

Closing Remarks: 4:15 pm

Register On-line for Wire Bonding

Upcoming IMAPS PDC Webinars    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s). Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

The following webinars have been scheduled:

IMAPS PDC Webinar Series on
4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems
Presented by: Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, June 9, 16, 23, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Lead-Free Soldering
Presented by: Dr. Jianbiao (John) Pan, Cal Poly State University
This two-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, June 18, 25, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Precious Metal Powder/Flakes and their Application in Microelectronic Packaging
Presented by: Dr. Guixiang Yang and Gary Hemphill, Technic, Inc.
This two-session on-line Professional Development Course (PDC) webinar will be held: Mondays, June 22, 29, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS PDC Webinar Series on
Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Presented by: Dr. Ivan Ndip, Fraunhofer-Institute for Reliability and Microintegration (IZM); and Professor Ege Engin, San Diego State University
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, August 4, 11, 2009. All webinars will be held 10:00 am - 11:00 am EDT

IMAPS PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip (Details Available Soon)
Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, September 22, 29, 2009. All webinars will be held 12:00 noon - 1:00 pm EDT

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

Chapter Activities (events listed in chronological order)

TOMORROW: Chesapeake May 13 Dinner Meeting    ^ Top

Date: May 13, 2009
Location:

National Electronics Museum (Click here for directions)
1745 West Nursery Road  
Linthicum, Maryland 21090-2906
Phone: 410-765-0230

Registration:

Cost:
IMAPS members - $ 10.00.
Non-members - $ 20.00.
Students – $ 5.00

You must register on-site

Program:

5:15 Welcome and networking

5:45 Dinner served

6:00 Greg Caswell, Vice President of Engineering, Reactive Nano Technologies
“NanoBond® Assembly; Room Temperature Component Mount Soldering Technology.”

6:30 William McKinzie, WEMTEC, Inc.
“Electromagnetic Bandgap Structures for Microwave and Millimeterwave Applications in Multi-Layered Packages.”

7:00 Wrap-up.
Discuss date, location, and program of next event. Discuss interest on chapter leadership.

7:15 Optional self-guided tour of the electronics museum

Arizona Chapter May 21 Lunch Meeting on Thermal Management of Advanced Microelectronics    ^ Top

Date: May 21, 2009
Location:

Dobson Ranch Library
2425 South Dobson Road
Mesa, AZ 85202
Tel: 480-644-3441

Schedule:

Registration and Lunch at 11:30 – 12:00
Presentation at 12:00 – 1:00

Registration:

Luncheon and presentation - $10.00
Special - No Charge for pre-registered attendees
RSVP by May 14 on our website or by e-mail: http://www.imaps.org/chapters/freepass.asp / greg.clemons@live.com

Vendor display tables available for $15.00
Reserve tables on-line: http://www.imaps.org/registration/az2009may.htm

Thermal Management of Advanced Microelectronics
Dr. Victor Chiriac, Principal Staff Member at Freescale Semiconductor

Developing electronic packaging assemblies with acceptable thermal performance is often very challenging due to several reasons including the physically small sizes of the microelectronic devices and the various levels of interconnections, together with the fairly high power densities and heat dissipation in the components, while exposed to harsh environments such as high and low temperatures, thermal cycling, humidity, vibration, etc.  The presentation will focus on various thermal challenges encountered by the industry, ranging from the wireless (cell phone) applications to automotive and consumer markets, and provide an insight into future trends in the microelectronics cooling.

Dr. Victor A. Chiriac received the PhD degree in Aerospace and Mechanical Engineering from University of Arizona, Tucson AZ in 1999.  He is currently a Principal Engineer with the Technology Solutions Organization of Freescale Semiconductor, specializing in the state-of-the-art CFD and thermal analysis and experimental characterization of various novel packages/components, focusing as well on new cooling technologies involving liquid cooling, phase-change and refrigeration.  He holds 3 US patents, with 7 others pending.  Dr. Chiriac has co-authored over 85 journal and conference papers.

EMPC 2009 - European Microelectronics and Packaging Conference - Now Featuring a GBC Session on Solar Cells    ^ Top
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”.

EMPC 2009 will feature technical sessions, an exhibition, professional development courses, a GBC Session, and poster sessions. You can view the full technical program, social activities and conference details on-line at: www.empc2009.org.

The GBC is pleased to announce a European Session to be held June 18, 2009, at 2pm during the European Microelectronics and Packaging Conference (EMPC 2009). The Conference will be held June 15-18, 2009 in Rimini, Italy. More information on EMPC 2009 can be found at: www.empc2009.org.  


1) "APOLLON: the Large Integrated European Project of FP7 on Concentrating Photovoltaic, target objectives on technology and cost
Presented by Gianluca Timo

CESI RICERCA
Via Rubattino, 54                  Via Nino Bixio, 39
20134, Milan, Italy                29100 Piacenza, Italy
tel: +39 02 3992 5499              tel: +39 0523 434369
mobile: 335374891
gianluca.timo@cesiricerca.it 

Dr. Gianluca Timò received the degree of doctor in physics from the University of Milan, Italy, in 1988 and a diploma from a post-graduate school in Science and Technology of Materials in 1990. He has been involved since 1989 in R&D activities concerning III-V based solar cells for space application. He has participated in numerous ESA projects working in CISE, ENEL RICERCA and CESI, where he leaded activities on the growth and characterisation of Single Junction and Multi Junction III-V based solar cells by using different kind of MOCVD epitaxial reactors (AIX 200, AIX 2400, AIX 2600, Veeco 450) gaining a unique experience in Europe. From year 2000 he has been involved in the development of concentrating system; in 2006 he has joined CESI RICERCA as responsible of the R&D activity on concentrating photovoltaic (CPV) and from 2009 his research group has been involved in the development of light emitting diodes. From July 2008 Gianluca Timò has been coordinating the 5 years large integrated European project APOLLON on CPV, in the frame of the Seventh Framework Program.

2) "Experience in III-V triple junction photovoltaic cells packaging for solar terrestrial concentrators."       
Presented by Ricard Pardell, Sol3G
,

Abstract -- High concentration terrestrial photovoltaics using triple junction cells is a most challenging application from the point of view of reliability under harsh conditions for  microelectronic devices. This united to a very low cost requirement make things very difficult for the microelectronics assembly designer. In this paper we review the current state of the art in this subject matter.

Ricard Pardell studied “Telecommunications Engineering (EUETT)” in La Salle Bonanova, and “Economics and Business Administration” at the UAB (Universitat Autònoma de Barcelona).  In July 2004 he founded Sol3g, one of the first companies worldwide in commercializing and research of HCPV systems. Currently Ricard Pardell, also President and CEO of the company, shares the Sol3g capital with the multinational Abengoa Solar.  Ricard Pardell has been driving the company through a very fast development.  Last results highlighted were the inauguration of a new 800 m2 factory able to  produce 10Mw annually, the completing of the world’s biggest high concentration photovoltaic installation using triple junction cell based modules, and the launch at the market of the first system, based on HCPV technology, designed for flat roofs.  In addition he is a senior partner and president of Valldoreix Consulting, CRM and information system consulting company, founded in 2001, being in his professional career always managing projects related with new technologies (Information systems, CRM systems). 

3) “Crystalline Si Solar Cells:  Markets and Technology” 
Presented by Andy London, Hereaus

Abstract -- The Solar Cell market has grown by an ACGR of over 40%.  After a 77% growth rate in 2008, the recession of 2009 will reduce this year’s growth to between 5-10%, with resumption of previous growth by 2010 and beyond.  Crystalline Si represents 90% of the market.  This paper reviews market sizes and trends, regional comparisons of cell manufacturing to installations, materials growth rates and analysis of silver pricing and affects of this market on silver usage.  Also discussed are the technology trends that will drive the crystalline Si solar cell market in the future.

Andy London has worked at Heraeus for 38 years in the Thick Film Division.  He is currently Vice President of Heraeus Materials Technology, LLC and Global Business Unit Manager for Photovoltaics.  He has served as IMAPS President in 1992 and was instrumental in the formation of the MMRC which has become the Global Business Council.

4) "Photovoltaic Present and Future – The Si potentialities"
Presented by Sartore Domenico

Abstract -- The current PV market is dominated by the c-Si panels. The industrial developments on the established technologies are continuously reducing the cost of the c-Si PV, which appears to be the dominant technology at least for the next few years. The most critical point of the supply chain is the silicon availability. New companies, like Estelux, in Italy, are going to produce silicon of the highest grade of purity for PV use. With the possibility to concentrate the light onto small area of silicon cells, the semiconductor produced by a single plant like Estelux can deliver a power production of about the 10% of the Italian installed electrical power. Cpower srl has developed a new technology of photovoltaic concentrator using Si solar cells able to achieve this ambitious result.

Mr. Domenico Sartore has been involved in PV field since the '80s and he's a pioneer of the PV activity in Italy.

1986-1993:  plant manager in a renewable energy company
1993 -1994:  technical consultant for many companies in the photovoltaic sector as “Eurosolare” S.p.A. and “BP Solar”.

In the 1994  he founded the Company S.E. Project (now Solon Spa) which has as mission the production of PV modules and the promotion of renewable energies plants

He currently is the CEO of Estelux S.p.a. and  Administrator or member of the Board of:
- Solon S.p.a.
- Green Utility
- Ecoprogetti
- Cpower srl

More information on EMPC 2009 can be found at: www.empc2009.org.  

Announcing Nordic Chapter 2009 Conference - Abstracts Due May 15    ^ Top

Dates: September 13-15, 2009
Location:

Quality Hotel, Tønsberg, Norway

On-line Info:

IMAPS Nordic is proud to announce this year’s conference in Norway. The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
 
You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2009. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than May 15. Speakers will be notified of paper acceptance by email by May 31.
The deadline for the final paper is July 10. 

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • Harsh environment,
  • Ceramics: thickfilm, copper plated, DBC, LTCC
  • Chip thinning & stacking, 3D-packaging, embedding
  • CSP, flip chips, area array
  • Future electronics, trends & strategies
  • High frequency packaging
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Manufacturing management & outsourcing
  • MEMS, MOEMS, sensor integration & applications
  • High temperature electronics
  • Microvia, HDI laminates, flex, embedded passives
  • Pb and halogen free electronics, methods and consequences
  • Reliability assessment, SPC
  • SMT and board assembly
  • System cost assessment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
Tutorial suggestions are also welcome to conference@imapsnordic.org.
For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
Last chance! Abstract due date June 7!
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”. The abstract deadline is June 7 and those accepted papers would be embodied in IEEE Xplore. Therefore, please grasp this last chance to enter international technology stage.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. You are welcome to submit a paper (approx. 20 min.) covering one of the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Please send your abstract (approx. 200 words) until June 1, 2009 to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

A BEST PAPER price will be awarded ! !
You can also use the online service at: http://www.imaps.de!


Products and Publications

Have You Read A Recent Journal of Microelectronics and Electronic Packaging On-line?   ^ Top
The Fourth Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line, along with all past issues of JMEP. The first quarter of 2009 is still in production as the issue is much larger than anticipated (15+ papers) and just a few weeks behind in production. Look for the first issue of 2009 in the weeks ahead.
Access the Journal papers on-line .

This last issue of 2008 contains the following papers:

The International Microelectronics and Packaging Society (IMAPS) is committed to the publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.

As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

 

 
 

Lorac - Furnace Experts

PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 2-3: May 20, 2009

GBC Session at EMPC 2009
June 18, 2009
Rimini, Italy

TW on Wire Bonding
July 13, 2009
San Francisco, CA

High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
Oxford, UK

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact abell@imaps.org

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives