Abstracts Due This Friday, May 22 for 2nd Annual RF and Microwave Packaging Workshop (read
PDC Webinar Series on 4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems (read
Register for IMAPS/SEMI 2nd Annual Workshop on Wire Bonding (read
listed in chronological order)
This Thursday: Arizona Chapter May 21 Lunch Meeting on Thermal Management of Advanced Microelectronics (read
Empire Chapter June 3 Summer Technical Symposium in Syracuse, NY (read
Northern California Chapter June 3 Lunch Meeting on Disruptive Package Technologies ... Disruptive for Whom? (read
Chicago/Milwaukee Chapter June 11 Lunch Meeting at Connor-Winfield (read
EMPC 2009 - European Microelectronics and Packaging Conference - Now Featuring a GBC Session on Solar Cells (read
Announcing Nordic Chapter 2009 Conference (read
IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read
Germany Chapter's 2009 Conference (read
Advancing Microelectronics May/June 2009 On-line Magazine is Available (read
Have You Read A Recent Journal
of Microelectronics and Electronic Packaging On-line? (read
full Web Calendar)
Abstracts Due This Friday, May 22 for 2nd Annual RF and Microwave Packaging Workshop ^
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Abstracts are being requested in the following areas:
- 60 GHz Personal Area Network (PAN)
- Short wave IR packaging
- 3D RF/MW
- New and disruptive technology
- EMI shielding for RF/MW packaging
- New power amplifier design beyond LDMOS
- Thermal management
- New IR sensors without cooling
- Plastic RF/MW packaging
- Lead free
- RF MEMS
- Military / Space
- Optoelectronics (night vision, thermal weapon sight, etc.)
- High Power Electronics
- Space/Extreme Environments
Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.
Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 22, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.
Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.
Please contact Jackki Morris-Joyner by email at firstname.lastname@example.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.
PDC Webinar Series on 4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems ^
This three-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, June 9, 16 and 23, 2009
All webinars will be held 12:00 noon - 1:00 pm EDT
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500
Registration Deadlines: June 8, 2009
- Passive and Active SMT and BTCs
- Why Conversion to Lead-free Solders is Necessary and its Impact on Materials and Assembly Processes
- Principles and Practice of Manufacturing Processes such as Reflow, Selective Soldering, Flux and Cleaning and No Clean and Repair
- Key strategies in Design and Manufacturing processes to prevent field returns
There is no doubt that lead free has impacted on almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronics products and equipment including the military and medical industry.
The lead free train has been moving fast, even if you work in a currently exempt industry you need to get onboard or risk losing market share to competitors particularly when the leaded products and components you are using become only available in lead free.
Learn how to resolve issues for an effective implementation of SMT including Bottom Terminations surface mount components such as QFN, DFN and MLF in a lead free world at a lower cost and higher yield.
Designing for SMT and BTC can involve trial and error and lot of frustration. Additional frustration is caused by fast-paced changes in packaging technologies and the advent of Lead Free has compounded the designer’s task.
The objective of this course is to identify the design and process issues in SMT, BGA, BTCs, fine pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronics products for both tin lead and lead free.
This is not a theoretical course it is based on Mr. Prasad's over two decades of experience at Boeing, Intel and numerous clients, this course deals with "real-world" problems in lead free implementation.
Session 1 of 3: Tuesday, June 9 -- 12:00-1:00 PM EDT
- Passive and Active SMT and BTCs
- Why Conversion to Lead-free Solders is Necessary and its Impact on Materials and Assembly Processes
Session 2 of 3: Tuesday, June 16 -- 12:00-1:00 PM EDT
- Design Issues for Lead Free: Laminates for Lead Free, Lead Free Surface Finishes and Component Considerations
- Principles and Practice of Manufacturing Processes such as Wave, Reflow and Selective Soldering
Session 3 of 3: Tuesday, June 23 -- 12:00-1:00 PM EDT
- Flux and Cleaning and No Clean and Repair
- Key strategies in Design and Manufacturing processes to prevent field returns
How You Will Benefit
After completing this course you will be able to:
- Get an overview of BGA, CSP and emerging technologies such as BTCs (QFN, MLF)
- Troubleshoot SMT and Lead free problems in manufacturing
- Determine best way to deal with backward and forward compatibility situations (Lead Free and tin-lead components on the same board).
- Understand metallurgy of lead free solder to enable selection of appropriate lead free solder alloys, soldering and rework processes and equipment.
Who Should Attend?
Anyone in process, quality, manufacturing, design, purchasing and management who wants to get a good understanding of design and manufacturing issues in SMT, BTCs (QFN, MLF), fine pitch, and BGA for building assemblies in-house or at a subcontractor will benefit from this course.
Ray Prasad is the founder of Ray Prasad Consultancy Group. Before starting his consulting practice in 1994, Mr. Prasad held key technology positions at Boeing and Intel for 15 years. He was the SMT Program Manager at Intel responsible for developing and implementing SMT for the system products. He also developed and taught DFM and SMT manufacturing courses to Intel engineers. For establishing the SMT infrastructure at Intel he was recognized by Intel CEO Andy Grove. He also managed the Intel PentiumProTM package program for Intel and introducing SMT into Boeing airplanes when he served as a lead engineer at that company.
Author of the text book Surface Mount Technology: Principles and Practice published by Walter Kluwer Academic Publishers and over 100 papers, Mr. Prasad holds two patents in BGA and is a popular workshop leader for in depth SMT, BGA/CSP and Lead free professional courses at national and international conferences and in major OEM and EMS companies.
A long time member of IPC, he is currently the chairman of BGA committee IPC-7095 “Design and Assembly Process Implementation for BGA” and Co-Chairman of recently created IPC-7093 “Design and Assembly Process Implementation for Bottom Terminations surface mount Components (BTCs) such as QFN, DFN and MLF .
He is the past chairman of the Surface Mount Land Pattern (IPC-SM-782) and Package Cracking (J-STD-020) committees.
Mr. Prasad is the recipient of SMTA’s Member of Distinction Award and IPC President's award for his contribution to the advancement of electronics industry and recipient of Intel’s highest award – Intel Achievement Award. He is a columnist for the SMT magazine and also serves on its advisory board.
Mr. Prasad received his BS in Metallurgical Engineering from the Regional Institute of Technology, Jamshedpur in India and MS in Materials Science and Engineering and MBA from the University of California at Berkeley, USA. He is a registered Professional Metallurgical Engineer.
Register for IMAPS/SEMI 2nd Annual Workshop on Wire Bonding ^
IMAPS and SEMI proudly announce the 2nd Annual Topical Workshop on Wire Bonding. This workship will be held Monday, July 13, 2009, at the San Francisco Marriott Hotel in San Francisco, CA. This event will run prior to SEMICON West 2009 – July 14-16. The Early Registration Deadline is June 19. The Hotel Deadline is June 29. Full workshop details are on-line at www.imaps.org/wirebonding.The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.Monday, July 13, 2009Registration: 8:30 am – 4:30 pmContinental Breakfast: 8:30 am – 9:15 am
Opening Remarks: 9:15 am – 9:30 am
Session 1: Copper and Gold Ball Bonding
Session Chairs: Daniel D. Evans, Jr., Palomar Technologies, Inc.; Joe Bubel, Hesse & Knipps
9:30 AM - 12:15 PMNickel-Palladium Bond Pads for Copper and Gold Wire Bonding
Horst Clauberg, Asaf Hashmonai, Jamin Ling, Bob Chylak, Kulicke and Soffa Industries Inc.; Tom Thieme, Atotech GmbHWirebonded Gold Inductor on Top of ICs
James J. Wang, Power Gold LLC
HAZ-Free Ultra-Low Loop Method for Multi-Chip Stacked Die Applications
Jovy Michael G. Sena, Marcelino BuenaflorIreneo, Villavert Marit Seidel, Oerlikon ESEC USA Inc.
Session 2: Wire / Ribbon Bonding & Materials
Session Chairs: Keith Easton, Oerlikon ESEC USA Inc.; Mike McKeown, Orthodyne Electronics Corporation
9:30 AM - 12:15 PMThe Stressful World of RF Ribbon Bonding
Joseph J. Kreuzpaintner, Karen Wooldridge, Donna Gerrity, Tom Shenton, Steve Wilson, Jeff Jennings, Harris GCSDCharacterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Mike Kölling, F&K Physiktechnik GmbH
Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates
Barry Njoes, David Williams, Paula Goldstein, Technical Materials Inc.; Mike McKeown, Orthodyne Electronics; Steve Lopez, Farmingdale State College
Break: 11:00 am – 11:15 am
Wire Bonding Semiconductor Devices for Metallurgists
Lee R. Levine, Process Solutions Consulting
Inert Environment Requirements for Copper Ball Bonding
Bob Chylak, Shai Friedman, John Foley, Gary Gillotti, Gary Schulze, Kulicke and Soffa Industries Inc.
Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Richard Elliott, Orthodyne Electronics
Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds
Josef Sedlmair, F&K Delvotec Bondtechnik GmbH
LUNCH: 12:15 pm – 1:15 pmSession 3: Copper and Gold Bonding & Materials
Session Chairs: Lee Levine, Process Solutions Consulting; Keith Easton, Oerlikon ESEC USA Inc.
1:15 PM - 4:15 PMOdd Form Factor Package Wire Bonding Case Studies
Daniel D. Evans, Jr., Palomar Technologies, Inc.Advanced Looping in Copper Wire Bonding
O Dal Kwon, Bob Chylak, Oranna Yauw, Samuel III Capistrano, Kulicke & Soffa Industries Inc.Overview of Actual Bonding Wire Technologies and Possible Solutions Based on Different Interconnection Materials
Tobias Mueller, Eugen Milke, Ping Ha Yeung, W. C. Heraeus GmbHBreak: 2:45 pm – 3:15 pmCopper Wirebonding without the Plasma
Terence Q. Collier, CV Inc.Bond Wire Yield Rate Optimization on SiP in a 3D Design Environment
John Sovinsky, Gordon Jensen, CAD Design Software
Closing Remarks: 4:15 pm
Register On-line for Wire Bonding
listed in chronological order)
This Thursday: Arizona Chapter May 21 Lunch Meeting on Thermal Management of Advanced Microelectronics ^
Thermal Management of Advanced Microelectronics
Dr. Victor Chiriac, Principal Staff Member at Freescale Semiconductor
Developing electronic packaging assemblies with acceptable thermal performance is often very challenging due to several reasons including the physically small sizes of the microelectronic devices and the various levels of interconnections, together with the fairly high power densities and heat dissipation in the components, while exposed to harsh environments such as high and low temperatures, thermal cycling, humidity, vibration, etc. The presentation will focus on various thermal challenges encountered by the industry, ranging from the wireless (cell phone) applications to automotive and consumer markets, and provide an insight into future trends in the microelectronics cooling.
Dr. Victor A. Chiriac received the PhD degree in Aerospace and Mechanical Engineering from University of Arizona, Tucson AZ in 1999. He is currently a Principal Engineer with the Technology Solutions Organization of Freescale Semiconductor, specializing in the state-of-the-art CFD and thermal analysis and experimental characterization of various novel packages/components, focusing as well on new cooling technologies involving liquid cooling, phase-change and refrigeration. He holds 3 US patents, with 7 others pending. Dr. Chiriac has co-authored over 85 journal and conference papers.
Empire Chapter June 3 Summer Technical Symposium in Syracuse, NY ^
||June 3, 2009
Holiday Inn, Syracuse – Liverpool (Turnpike Exit 37)
441 Electronics Parkway, Liverpool, NY 13088
$20.00 IMAPS members
$ 25.00 non-member
Register On-line: http://www.imaps.org/programs/empire09june.htm
Registration closes Monday, June 1 at 5pm EDT
Covers lunch, refreshments, and conference room rental
Tabletop space is available for four organizations for $50.00. Please contact Steve Greene soon at 202-548-8711 to reserve a spot, first-paid is first served.
Program Chair - Mike Laing of Avid Associates
10:00 Registration and Sign-in
10:30 Welcome, Self-introductions, and Opening Remarks
10:45 Don Hazelmyer, President of Dynamic Hybrids, Inc.
“High reliability and high power packaging.”
11:15 Frank Egitto, Senior Advisory Technologist at Endicott Interconnect
“Thin Film, Flexible Intravascular Ultrasound Catheter Device with Fine-Pitch Soldered Flip Chip Interconnect ”
12:30 Patrick O’Gorman, Senior Director at MRI Network
“Market Overview and Employment Trends.”
1:00 Charles Woychik, Senior Scientist at GE Global Research
“An Update of Packaging Cd-Zn-Te (CZT) Detectors.”
1:30 Closing Remarks
Event wrap-up, Next event in Buffalo, Chapter leadership. . .
Northern California Chapter June 3 Lunch Meeting on Disruptive Package Technologies ... Disruptive for Whom? ^
The Northern California Chapter is holding its next meeting on June 3, 2009. This Lunch Meeting which will be held at The Lookout, 605 Macara Avenue, Sunnyvale, CA 94086.
The speaker is Mr. Rich Rice, Senior Vice-President, Sales, ASE US, Inc. His presentation on "Disruptive Package Technologies ... Disruptive for Whom?" will be another thought-provoking and informative talk, in keeping with the tradition of IMAPS. The abstract of the technical presentation and speaker biography will be emailed early next week. In the meantime, we would appreciate your saving the date, and also forwarding this announcement to any of your colleagues and friends who you think might be interested in, and/or could benefit from, it.
Please respond to Gina Love at email@example.com for more information and to make your lunch reservations.
Chicago/Milwaukee Chapter June 11 Lunch Meeting at Connor-Winfield ^
||June 11, 2009
2359 Diehl Road Aurora, Illinois 60502
12:00 Lunch and Registration
1:00 Opening Remarks by Rich Epich, Sales Manager at Connor-Winfield.
1:15 Greg Ballard, Senior Thickfilm Engineer at Connor-Winfield
“Printing of Silicon Wafers.”
1:45 Neil Kane, President of Advanced Diamond Technologies
“Machines Made of Diamond.”
2:15 Joe McCabe-Vice President & Rob Lindsey-Service Manager from Epoxy Technology.
“An Overview of Electrically and Thermally Conductive Adhesives.”
2:45 Event wrap-up.
Program for next event.
Propose Chapter Leadership
3:00 Optional Tour and Hybrid Circuit Works Overview by Rich Epich
Tours of an 85,000 S.F. Printed Circuit and Hybrid Assembly and/or a 35,000 S.F. Thick Film Facility will be offered. Printed Circuit and Hybrid Assembly facility includes wafer sawing, die attachment, wire bonding, Surface Mount Technology, and device packaging.
EMPC 2009 - European Microelectronics and Packaging Conference - Now Featuring a GBC Session on Solar Cells ^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”.
EMPC 2009 will feature technical sessions, an exhibition, professional development courses, a GBC Session, and poster sessions. You can view the full technical program, social activities and conference details on-line at: www.empc2009.org.
The GBC is pleased to announce a European Session to be held June 18, 2009, at 2pm during the European Microelectronics and Packaging Conference (EMPC 2009). The Conference will be held June 15-18, 2009 in Rimini, Italy. More information on EMPC 2009 can be found at: www.empc2009.org.
1) "APOLLON: the Large Integrated European Project of FP7 on Concentrating Photovoltaic, target objectives on technology and cost"
Presented by Gianluca Timo
Via Rubattino, 54 Via Nino Bixio, 39
20134, Milan, Italy 29100 Piacenza, Italy
tel: +39 02 3992 5499 tel: +39 0523 434369
Dr. Gianluca Timò received the degree of doctor in physics from the University of Milan, Italy, in 1988 and a diploma from a post-graduate school in Science and Technology of Materials in 1990. He has been involved since 1989 in R&D activities concerning III-V based solar cells for space application. He has participated in numerous ESA projects working in CISE, ENEL RICERCA and CESI, where he leaded activities on the growth and characterisation of Single Junction and Multi Junction III-V based solar cells by using different kind of MOCVD epitaxial reactors (AIX 200, AIX 2400, AIX 2600, Veeco 450) gaining a unique experience in Europe. From year 2000 he has been involved in the development of concentrating system; in 2006 he has joined CESI RICERCA as responsible of the R&D activity on concentrating photovoltaic (CPV) and from 2009 his research group has been involved in the development of light emitting diodes. From July 2008 Gianluca Timò has been coordinating the 5 years large integrated European project APOLLON on CPV, in the frame of the Seventh Framework Program.
2) "Experience in III-V triple junction photovoltaic cells packaging for solar terrestrial concentrators."
Ricard Pardell, Sol3G,
Abstract -- High concentration terrestrial photovoltaics using triple junction cells is a most challenging application from the point of view of reliability under harsh conditions for microelectronic devices. This united to a very low cost requirement make things very difficult for the microelectronics assembly designer. In this paper we review the current state of the art in this subject matter.
Ricard Pardell studied “Telecommunications Engineering (EUETT)” in La Salle Bonanova, and “Economics and Business Administration” at the UAB (Universitat Autònoma de Barcelona). In July 2004 he founded Sol3g, one of the first companies worldwide in commercializing and research of HCPV systems. Currently Ricard Pardell, also President and CEO of the company, shares the Sol3g capital with the multinational Abengoa Solar. Ricard Pardell has been driving the company through a very fast development. Last results highlighted were the inauguration of a new 800 m2 factory able to produce 10Mw annually, the completing of the world’s biggest high concentration photovoltaic installation using triple junction cell based modules, and the launch at the market of the first system, based on HCPV technology, designed for flat roofs. In addition he is a senior partner and president of Valldoreix Consulting, CRM and information system consulting company, founded in 2001, being in his professional career always managing projects related with new technologies (Information systems, CRM systems).
3) “Crystalline Si Solar Cells: Markets and Technology”
Andy London, Hereaus
Abstract -- The Solar Cell market has grown by an ACGR of over 40%. After a 77% growth rate in 2008, the recession of 2009 will reduce this year’s growth to between 5-10%, with resumption of previous growth by 2010 and beyond. Crystalline Si represents 90% of the market. This paper reviews market sizes and trends, regional comparisons of cell manufacturing to installations, materials growth rates and analysis of silver pricing and affects of this market on silver usage. Also discussed are the technology trends that will drive the crystalline Si solar cell market in the future.
Andy London has worked at Heraeus for 38 years in the Thick Film Division. He is currently Vice President of Heraeus Materials Technology, LLC and Global Business Unit Manager for Photovoltaics. He has served as IMAPS President in 1992 and was instrumental in the formation of the MMRC which has become the Global Business Council.
4) "Photovoltaic Present and Future – The Si potentialities"
by Sartore Domenico
Abstract -- The current PV market is dominated by the c-Si panels. The industrial developments on the established technologies are continuously reducing the cost of the c-Si PV, which appears to be the dominant technology at least for the next few years. The most critical point of the supply chain is the silicon availability. New companies, like Estelux, in Italy, are going to produce silicon of the highest grade of purity for PV use. With the possibility to concentrate the light onto small area of silicon cells, the semiconductor produced by a single plant like Estelux can deliver a power production of about the 10% of the Italian installed electrical power. Cpower srl has developed a new technology of photovoltaic concentrator using Si solar cells able to achieve this ambitious result.
Mr. Domenico Sartore has been involved in PV field since the '80s and he's a pioneer of the PV activity in Italy.
1986-1993: plant manager in a renewable energy company
1993 -1994: technical consultant for many companies in the photovoltaic sector as “Eurosolare” S.p.A. and “BP Solar”.
In the 1994 he founded the Company S.E. Project (now Solon Spa) which has as mission the production of PV modules and the promotion of renewable energies plants
He currently is the CEO of Estelux S.p.a. and Administrator or member of the Board of:
- Solon S.p.a.
- Green Utility
- Cpower srl
More information on EMPC 2009 can be found at: www.empc2009.org.
Announcing Nordic Chapter 2009 Conference ^
IMAPS Nordic is proud to announce this year’s conference in Norway.
The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2009. The abstract must be non-commercial and submitted in electronic form to firstname.lastname@example.org no later than May 15. Speakers will be notified of paper acceptance by email by May 31. The deadline for the final paper is July 10.
Proposed topics include:
Tutorial suggestions are also welcome to email@example.com.
- 3D Advanced interconnect, Advanced packaging
- Harsh environment,
- Ceramics: thickfilm, copper plated, DBC, LTCC
- Chip thinning & stacking, 3D-packaging, embedding
- CSP, flip chips, area array
- Future electronics, trends & strategies
- High frequency packaging
- Integrated passive devices (IPD) & System in Package (SiP)
- Manufacturing management & outsourcing
- MEMS, MOEMS, sensor integration & applications
- High temperature electronics
- Microvia, HDI laminates, flex, embedded passives
- Pb and halogen free electronics, methods and consequences
- Reliability assessment, SPC
- SMT and board assembly
- System cost assessment
- Unique materials, PTF, underfills and ACF, encapsulation
- Wirebonding, COB
For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to firstname.lastname@example.org or to the Exhibition Host at email@example.com.
IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ^
Last chance! Abstract due date June 7!
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”. The abstract deadline is June 7 and those accepted papers would be embodied in IEEE Xplore. Therefore, please grasp this last chance to enter international technology stage.
Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.
IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.
Germany Chapter's 2009 Conference ^
||October 27-28, 2009
Hochschule of Munich (near Central Station)
The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. You are welcome to submit a paper (approx. 20 min.) covering one of the following topics of microelectronics, packaging or interconnection technology:
- Industrial Electronics
- Design Software
- Design for Manufacturability
- Design for Testability
- Simulations, RF/Microwave Simulation
System Aspects / Problem Solutions
- Reliability & Live Cycle
- Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
- Fluid Systems
- Mechatronics Systems
- High Temperature Electronics
- Power Electronics
- High Frequency Electronics
- Test Systems
Processes und Materials
- Wafer Level Processes
- Ceramic und Organic Circuits
- Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
- (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
- Assembly- and Connection Technology
- FlipChip, Wirebonding, SMT …
- Process Control
Please send your abstract (approx. 200 words) until June 1, 2009 to:
Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
A BEST PAPER price will be awarded ! !
You can also use the online service at: http://www.imaps.de!
|Products and Publications
Advancing Microelectronics May/June
2009 On-line Magazine is Available ^
The May/June 2009 issue features four technical articles on: Low Modulus Conductive Adhesives Based on Metallized Polymer Spheres; An Overview of Flip Chip Joining Technologies and the Materials Involved; Wire Bonding – A Reliable Interconnect Technology; and Polymer Nanocomposites for Electronic Packaging.
View the May/June 2009 issue on-line today.
Microelectronics is published bi-monthly and offered to
all members in print and electronically via the IMAPS Website. Non-members of IMAPS may also view the archived issues on-line. Non-members must join IMAPS or pay a download fee of $15 to access the current issue on-line.
Have You Read A Recent Journal of Microelectronics and Electronic Packaging On-line? ^
The Fourth Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line, along with all past issues of JMEP. The first quarter of 2009 is still in production as the issue is much larger than anticipated (15+ papers) and just a few weeks behind in production. Look for the first issue of 2009 in the weeks ahead. Access the Journal papers on-line .
This last issue of 2008 contains the following papers:
- Foreword - Fred D. Barlow III, Editor-in-Chief
- Systematic Characterization of Embossing Processes for LTCC Tapes
H.B. de Torres, R. Gade, A. Albrecht and M. Hoffmann, Institute for Micro- and Nanotechnologies
- Thick Film Accelerometers in LTCC Technology - Design Optimization, Fabrication, and Characterization
H. Neubert, Technische Universitat Dresden; Uwe Partsch, Fraunhofer-Institute Ceramic Technologies and Systems; D. Fleischer, M. Gruchow, A. Kamusella, Technische Universitat Dresden; T-Q. Pham, OptiY e.K. Aschaffenburg
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSS
A.D. P. Uhlig, IMST GmbH; D. Manteuffel, Christian-Albrechts-University of Kiel; S. Malkmus, W. C. Heraeus GmbH
- Power Inductors in Ceramic Multilayer Circuit Boards
R. Matz, D. Gotsch, Siemens Corporate Technology; T. Goßner, Walther Meissner Institute; R. Karmazin, R. Manner, and B. Siessegger, Siemens Corporate Technology
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates
A. Bittner, T. Bohnenberger, R. Engel, H. Seidel, Saarland University; U. Schmid, Vienna University of Technology
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
T.S. Vincent, Worcester Polytechnic Institute
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
S.H. Kim, NEC Electronics America; C. Kakegawa, H. Tabuchi, NEC Electronics Corporation; H. Park, NEC Electronics America
The International Microelectronics and Packaging Society (IMAPS) is committed to the publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).
PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 2-3: May 20, 2009
PDC Webinar Series on 4 Ps of Design and Manufacturing of SMT and Bottom Terminations Components such as QFN, MLF in a Lead Free World - Principles, Practice, Promises and Problems (3 Sessions)
Session 1: June 9, 2009
Session 2: June 16, 2009
Session 3: June 23, 2009
GBC Session at EMPC 2009
June 18, 2009
PDC Webinar Series on Lead-Free Soldering (2 Sessions)
Session 1: June 18, 2009
Session 2: June 25, 2009
PDC Webinar Series on Precious Metal Powder/Flakes and their Application in Microelectronic Packaging (2 Sessions)
Session 1: June 22, 2009
Session 2: June 29, 2009
TW on Wire Bonding
July 13, 2009
San Francisco, CA
High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA
ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA
*Exhibitors contact firstname.lastname@example.org
IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA
*Exhibitors contact email@example.com