Registration Closes Today for the Webinar on Signal Integrity and Precision Design in Digital Systems (read
GBC Session at EMPC 2009 (European Microelectronics and Packaging Conference) (read
Call for Abstracts - ATW and Tabletop Exhibition on Thermal Management (read
Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network (read
Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop (read
listed in chronological order)
This Thursday: San Diego Chapters To Present at Del Mar Electronics Show (read
Central Texas Chapter May 12 Dinner Meeting (read
Registration Closes Monday for the Chesapeake May 13 Dinner Meeting (read
EMPC 2009 - European Microelectronics and Packaging Conference (read
Announcing Nordic Chapter 2009 Conference - Abstracts Due May 15 (read
Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) (read
Germany Chapter's 2009 Conference (read
Have You Read A Recent Journal
of Microelectronics and Electronic Packaging On-line? (read
Get Published With IMAPS (read
full Web Calendar)
Registration Closes Today for the Webinar on Signal Integrity and Precision Design in Digital Systems ^
This three-session on-line Professional Development Course (PDC) webinar will be held:
Wednesdays, May 6, 13, and 20, 2009
All webinars will be held 12:00 noon - 1:00 pm EST
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500
Registration Deadlines: Today, May 5
Signal integrity, precision design, digital system, interconnect, electrical performance, bandwidth, modeling, simulation, measurement, characterization, verification, loss, reflection, crosstalk, eye-diagram, S-parameter, skew, jitter
Signal integrity margin keeps shrinking as electrical interconnect bandwidth increases. Accurate modeling and design trade-offs are required to achieve product electrical specifications and maintain system cost-effectiveness.
This professional development course provides the knowledge and skills required for the precision design of electrical interconnections. The course starts with a review of fundamental concepts of signal integrity in digital systems, followed by signal propagation along transmission lines and various discontinuities. Packaging structures which degrade signal integrity will be discussed, including their contribution to insertion loss, reflective ringing, and crosstalk.
Signal integrity analysis techniques will also be covered. With some example cases, the definition and interpretation of frequency domain S-parameters are introduced then correlated to time-domain eye-diagrams and impulse responses for “eye” quality, skew and jitter analysis. The power spectral density of signals as a function of data-rate, pattern, and waveform shape will also be discussed.
Modeling strategies designed to analyze signal integrity of system-level links will be presented with examples employing commercial modeling software. The criteria of model segmentation and setup are described as well as the importance of verifying models by correlating them with measurements. Both frequency-domain and time-domain link-level simulations will be demonstrated, followed by comparisons of different signaling schemes (S.E. vs. Differential) and effects of various equalization choices.
Hardware characterization is often a difficult task at high frequencies due to the parasitics of accessing the device under test (through vias or connectors not part of the desired structure). Measurements, calibration and structural de-embedding will be discussed for commonly used equipment such as vector network analyzers, time-domain reflectometers, and oscilloscopes.
Finally, the effects of design and manufacturing tolerance will be discussed, including perforations on reference planes, high-density buses, power/ground mixed-referencing, layer misalignment, and material/geometry variations.
These 2 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest. Below is a course outline for each session. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.
Session 1 of 3: Wednesday, May 6 -- 12:00-1:00 PM EST
- Introduction of signal integrity in digital systems
- Signal propagation along transmission lines and various discontinuities
- Packaging structures and their electrical characteristics
- Electrical analysis: frequency domain
- Insertion loss, reflection, crosstalk
Session 2 of 3: Wednesday, May 13 -- 12:00-1:00 PM EST
- Electrical analysis: time domain
- Impulse response, delay
- Eye-diagram, skew, jitter
- Power spectral density of digital signal
- Data-rate, rise/fall time, pattern
- Correlations: frequency-domain vs. time-domain
- Mixed-referencing and system-level modeling strategies
- Approaching to system-level designs
- Effects of non-ideal return paths and power noise
- Criteria of model segmentation and setup
- 2D vs. 3D
- Model dimensions
- Ports and boundary condition
Session 3 of 3: Wednesday, May 20 -- 12:00-1:00 PM EST
- Signaling scheme and equalization choices
- Single Ended vs. Differential
- Equalization choices
- Measurement and calibration techniques
- Calibration, de-embedding
- VNA, TDR/TDT, BERT
- Design and manufacturing tolerance
- Design trade-offs
- Manufacturing tolerance and the effects
Who Should Attend?
The course covers both fundamental knowledge and advanced analysis/characterization skills. Therefore, it is not only suitable for electrical engineers/managers, but also system designers who need to balance chip/packaging or electrical/mechanical trade-offs. Newcomers may also take it to jump start their careers.
Lei Shan received his MS in Electrical Engineering and Ph.D. in Mechanical Engineering from Georgia Institute of Technology in 2000. In 2001, he joined IBM T.J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member, where he works on high speed electronics/optoelectronics packaging designs and multi-physics modeling/simulations. He designed and demonstrated high speed packages on both connectorized format and BGA joints for 50Gbps multiplexer and demultiplexer based on IBM SiGe BiCMOS technology. He led the packaging development for 10G Ethernet and Terabus optical links on printed circuit board. His recent research interest is on precision designs and signal/power integrity in high-performance computing systems and the fundamental electrical limits. Shan has authored over 40 publications with three Best Paper Awards and owns over 20 US patents.
Register On-line For This Webinar
GBC Session at EMPC 2009 (European Microelectronics and Packaging Conference) ^
The GBC is pleased to announce a European Session to be held June 18, 2009, at 2pm during the European Microelectronics and Packaging Conference (EMPC 2009). The Conference will be held June 15-18, 2009 in Rimini, Italy. More information on EMPC 2009 can be found at: www.empc2009.org.
1) "APOLLON: the Large Integrated European Project of FP7 on Concentrating Photovoltaic, target objectives on technology and cost"
Presented by Gianluca Timo
Via Rubattino, 54 Via Nino Bixio, 39
20134, Milan, Italy 29100 Piacenza, Italy
tel: +39 02 3992 5499 tel: +39 0523 434369
Dr. Gianluca Timò received the degree of doctor in physics from the University of Milan, Italy, in 1988 and a diploma from a post-graduate school in Science and Technology of Materials in 1990. He has been involved since 1989 in R&D activities concerning III-V based solar cells for space application. He has participated in numerous ESA projects working in CISE, ENEL RICERCA and CESI, where he leaded activities on the growth and characterisation of Single Junction and Multi Junction III-V based solar cells by using different kind of MOCVD epitaxial reactors (AIX 200, AIX 2400, AIX 2600, Veeco 450) gaining a unique experience in Europe. From year 2000 he has been involved in the development of concentrating system; in 2006 he has joined CESI RICERCA as responsible of the R&D activity on concentrating photovoltaic (CPV) and from 2009 his research group has been involved in the development of light emitting diodes. From July 2008 Gianluca Timò has been coordinating the 5 years large integrated European project APOLLON on CPV, in the frame of the Seventh Framework Program.
2) "Experience in III-V triple junction photovoltaic cells packaging for solar terrestrial concentrators."
Ricard Pardell, Sol3G,
Abstract -- High concentration terrestrial photovoltaics using triple junction cells is a most challenging application from the point of view of reliability under harsh conditions for microelectronic devices. This united to a very low cost requirement make things very difficult for the microelectronics assembly designer. In this paper we review the current state of the art in this subject matter.
Ricard Pardell studied “Telecommunications Engineering (EUETT)” in La Salle Bonanova, and “Economics and Business Administration” at the UAB (Universitat Autònoma de Barcelona). In July 2004 he founded Sol3g, one of the first companies worldwide in commercializing and research of HCPV systems. Currently Ricard Pardell, also President and CEO of the company, shares the Sol3g capital with the multinational Abengoa Solar. Ricard Pardell has been driving the company through a very fast development. Last results highlighted were the inauguration of a new 800 m2 factory able to produce 10Mw annually, the completing of the world’s biggest high concentration photovoltaic installation using triple junction cell based modules, and the launch at the market of the first system, based on HCPV technology, designed for flat roofs. In addition he is a senior partner and president of Valldoreix Consulting, CRM and information system consulting company, founded in 2001, being in his professional career always managing projects related with new technologies (Information systems, CRM systems).
3) “Crystalline Si Solar Cells: Markets and Technology”
Andy London, Hereaus
Abstract -- The Solar Cell market has grown by an ACGR of over 40%. After a 77% growth rate in 2008, the recession of 2009 will reduce this year’s growth to between 5-10%, with resumption of previous growth by 2010 and beyond. Crystalline Si represents 90% of the market. This paper reviews market sizes and trends, regional comparisons of cell manufacturing to installations, materials growth rates and analysis of silver pricing and affects of this market on silver usage. Also discussed are the technology trends that will drive the crystalline Si solar cell market in the future.
Andy London has worked at Heraeus for 38 years in the Thick Film Division. He is currently Vice President of Heraeus Materials Technology, LLC and Global Business Unit Manager for Photovoltaics. He has served as IMAPS President in 1992 and was instrumental in the formation of the MMRC which has become the Global Business Council.
4) "Photovoltaic Present and Future – The Si potentialities"
by Sartore Domenico
Abstract -- The current PV market is dominated by the c-Si panels. The industrial developments on the established technologies are continuously reducing the cost of the c-Si PV, which appears to be the dominant technology at least for the next few years. The most critical point of the supply chain is the silicon availability. New companies, like Estelux, in Italy, are going to produce silicon of the highest grade of purity for PV use. With the possibility to concentrate the light onto small area of silicon cells, the semiconductor produced by a single plant like Estelux can deliver a power production of about the 10% of the Italian installed electrical power. Cpower srl has developed a new technology of photovoltaic concentrator using Si solar cells able to achieve this ambitious result.
Mr. Domenico Sartore has been involved in PV field since the '80s and he's a pioneer of the PV activity in Italy.
1986-1993: plant manager in a renewable energy company
1993 -1994: technical consultant for many companies in the photovoltaic sector as “Eurosolare” S.p.A. and “BP Solar”.
In the 1994 he founded the Company S.E. Project (now Solon Spa) which has as mission the production of PV modules and the promotion of renewable energies plants
He currently is the CEO of Estelux S.p.a. and Administrator or member of the Board of:
- Solon S.p.a.
- Green Utility
- Cpower srl
More information on EMPC 2009 can be found at: www.empc2009.org.
Call for Abstracts - ATW and Tabletop Exhibition on Thermal Management ^
IMAPS is now accepting abstracts for the Advanced Technology Workshop and Tabletop Exhibition on Thermal Management. This year's workshop will be held at Dinah's Garden Hotel in Palo Alto, California, from October 5 - 8. Full workshop details are available at www.imaps.org/thermal.
This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing and telcom systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.
This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. The 2008 Workshop featured 42 technical presentations, eight of which were competition-selected presentations from university engineering graduate students.
Speakers are asked to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers pay a reduced registration fee.
ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:
Market Drivers: Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
Thermal Interface Materials and Testing: Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing. Metallic, polymer matrix, CNT, thermal adhesives, and other materials.
High Conductivity Materials: Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
Liquid, Phase-Change, and Refrigeration Cooling: Advances in alternative solutions as well as reliability, serviceability, and availability.
System Cooling: Component- and system-level thermal management solutions for high-performance computing systems.
Data Center Cooling: Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.
Military and Aerospace Apps: Thermal management of legacy, emerging, and future military and airborne components and platforms.
Telecommunications Systems: Component- and system-level thermal solutions for high-performance telecommunications systems.
Consumer Electronics: Component- and system-level thermal management solutions for stationary and mobile systems, including displays, desktop and notebook computers, and handheld devices.
PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 24, 2009. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, September 4, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.
Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.
Questions: Jackki Morris-Joyner, Technical Programs Manager. Email: email@example.com or 305-382-8433.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
Announcing the IMAPS HiTEN Conference - High Temperature Electronics Network ^
IMAPS is now managing the International Conference on High Temperature Electronics Network (HiTEN). HiTEN 2009 will be held September 13-16, 2009, in Oxford, United Kingdom. Full conference details are available at www.imaps.org/hiten.
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI). Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
Abstracts are being requested in the following areas:
- Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
- Devices and applications
- Novel devices
- ASICs for high temperature applications
- Passive components
- Power devices
- Semiconductor materials
- Contacts and metallizations
- Packaging and inter connects
- Sealants, adhesives, solders
- Reliability and failure mechanisms
- Lifetime predictions
- Accelerated life testing
- Testing at high temperatures
Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later May 15, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due July 24, 2009, for all accepted abstract.
Please contact Jackki Morris-Joyner by email at firstname.lastname@example.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees.
Call for Abstracts - 2nd Annual RF and Microwave Packaging Workshop ^
IMAPS 2nd Annual Advanced Technology Workshop on RF and Microwave Packaging will be held September 22-24, 2009, at the Crowne Plaza in San Diego. The IMAPS SoCal Golf Tournament will be held the morning of September 22. Full workshop details are available at www.imaps.org/rf.
The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.
Abstracts are being requested in the following areas:
- 60 GHz Personal Area Network (PAN)
- Short wave IR packaging
- 3D RF/MW
- New and disruptive technology
- EMI shielding for RF/MW packaging
- New power amplifier design beyond LDMOS
- Thermal management
- New IR sensors without cooling
- Plastic RF/MW packaging
- Lead free
- RF MEMS
- Military / Space
- Optoelectronics (night vision, thermal weapon sight, etc.)
- High Power Electronics
- Space/Extreme Environments
Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.
Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later May 22, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm.
Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than August 7, 2009. All abstracts submitted must represent original, previously unpublished work. The abstracts should highlight the substrate advancements, materials processing/reliability, design, packaging issues and application. The submission section will aid in grouping the work within these three areas.
Please contact Jackki Morris-Joyner by email at email@example.com or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees. All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.
listed in chronological order)
This Thursday: San Diego Chapters To Present at Del Mar Electronics Show ^
Please join the IMAPS – ACerS – IEEE CPMT San Diego Joint Chapters this Thursday, May 7 at 12:00pm for lunch and presentations at the Del Mar Electronics Show.
A presentation by Nick Wolfe, from Ajilon Professional Staffing,will address strategies for job hunting in the San Diego area. The current economy has challenged even the most robust businesses and employees within. Students graduating will face an over crowed job hunting market. Collecting advice from a professional who knows the San Diego market will help any job search. Everyone needs to be prepared for change. The speaker has 15 years recruiting in the San Diego area. He has developed partnerships with premier companies in the San Diego market including Viasat, Qualcomm, Sempra, Sony, and Solar Turbines.
A presentation by Jeffery Harding, from Recycle San Diego, addresses end of life for electronics products. The electronics industry is driven by the beginning of product life. Smaller, Faster, Less expensive is the mantra that drives design. The future will depend on a new way of thinking to include design for end of life and recycling of all materials used in electronics products. New laws will affect design of future products. Our speaker from Recycle San Diego will address the challenges of end of life products that are designed and manufactured in a global market. The speaker has been in the E-waste business for 6 years and has started two recycling companies. Recycle San Diego was founded in 2006.
Logistics and Registration:
Del Mar Fairgrounds, Paddock Lounge - Admission to the Del Mar Electronics Show is Free and Parking is Free
Use the link here to locate the Paddock Lounge www.sdfair.com
Thursday May 7, 2009 (Register deadline is Tomorrow, Wednesday, May 6 )
12:00 PM Lunch Social and Registration, 12:15 PM Presentations
Cost: $5.00 for IMAPS Members. $ 10.00 Others.
Complimentary for students who RSVP with ID
To register, please contact Dave Virissimo of Semiconductor Packaging Materials at firstname.lastname@example.org or 619-464-5430.
Central Texas Chapter May 12 Dinner Meeting ^
||May 12, 2009
7700 W. Parmer Lane., Austin, Texas 78729
Building “A” Auditorium
Registration starts: 3:00
3:30 Chris, Welcome, Andrew Introduce speakers
Speakers have 25 Min. plus 10 min. Q&A time
3:35 - 4:00 First speaker, Graig Boswell
"Design for Recyclability", Craig Boswell, Hobi International”
4:00 - Q&A 10 min. 4:10
4:10 – 4:35 Second speaker, Brian O’Lear
"Seven Ways to Profile to Profitability", Brian O'Leary, KIC”
4:35 - Q&A 10 min. 4:45
4:45 – 4:55 Break
4:55 – 5:20 Third speaker, Pat Goodwin
"Preparing Yourself for the Job Search", Pat Goodwin, Pat Goodwin Assoc”
5:20 - Q&A 10 min. 5:30
5:30 – 5:55 Fourth speaker, Stephen Schoppe
"Detecting Counterfeit Electronic Components", Stephen Schoppe, Process Sciences
5:55 – Q&A 15 min. 6:10
Food (TBD): 6:15 Food served, SMTA Anniversary Talk and Cake
Clean up: 6:45
Meeting ends: 7:00
Registration Closes Monday for the Chesapeake May 13 Dinner Meeting ^
5:15 Welcome and networking
5:45 Dinner served
6:00 Greg Caswell, Vice President of Engineering, Reactive Nano Technologies
“NanoBond® Assembly; Room Temperature Component Mount Soldering Technology.”
6:30 William McKinzie, WEMTEC, Inc.
“Electromagnetic Bandgap Structures for Microwave and Millimeterwave Applications in Multi-Layered Packages.”
Discuss date, location, and program of next event. Discuss interest on chapter leadership.
7:15 Optional self-guided tour of the electronics museum.
EMPC 2009 - European Microelectronics and Packaging Conference ^
EMPC is Europe’s premier conference planned every two years in a different European country by the local IMAPS chapter, bringing together specialists from industry and academia. The European Microelectronics and Packaging Conference & Exhibition, EMPC 2009, will be held in Rimini, Italy on June 15-18, 2009. EMPC 2009 addresses “everything in electronics between the chip and the system”.
EMPC 2009 will feature technical sessions, an exhibition, professional development courses, a GBC Session, and poster sessions. You can view the full technical program, social activities and conference details on-line at: www.empc2009.org.
Announcing Nordic Chapter 2009 Conference - Abstracts Due May 15 ^
IMAPS Nordic is proud to announce this year’s conference in Norway.
The conference will take place in the center of the “Electronic Coast” of Norway hosting a range of high tech companies. Tønsberg is only 30 minutes from the Oslo-Torp airport (TRP) and 1 hour south of Oslo.
You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2009. The abstract must be non-commercial and submitted in electronic form to email@example.com no later than May 15. Speakers will be notified of paper acceptance by email by May 31. The deadline for the final paper is July 10.
Proposed topics include:
Tutorial suggestions are also welcome to firstname.lastname@example.org.
- 3D Advanced interconnect, Advanced packaging
- Harsh environment,
- Ceramics: thickfilm, copper plated, DBC, LTCC
- Chip thinning & stacking, 3D-packaging, embedding
- CSP, flip chips, area array
- Future electronics, trends & strategies
- High frequency packaging
- Integrated passive devices (IPD) & System in Package (SiP)
- Manufacturing management & outsourcing
- MEMS, MOEMS, sensor integration & applications
- High temperature electronics
- Microvia, HDI laminates, flex, embedded passives
- Pb and halogen free electronics, methods and consequences
- Reliability assessment, SPC
- SMT and board assembly
- System cost assessment
- Unique materials, PTF, underfills and ACF, encapsulation
- Wirebonding, COB
For the latest information about the conference and the exhibition, visit our homepage at http://www.imapsnordic.org or send email to email@example.com or to the Exhibition Host at firstname.lastname@example.org.
Call for Papers - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) ^
Taiwan has kept the key technology and position in the world’s IC packaging, testing, thermal and PCB areas. For promoting the competition of Taiwan electronic industry, IEEE CPMT-Taipei, I-SHOU, ITRI, TPCA, IMAPS-Taiwan and SMTA cooperate again to hold the 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009). Organizers expect the theme of IMPACT 2009, “IMPACT Your Future: Integration, Efficiency & Eco-Friendly”, will bring the concept of combination, high-efficiency and green tech. For this reason, organizers hope it would result in knowledgeable discussion and profound impact. This year, TTMA (Taiwan Thermal Management Association) join this Conference, which could attract papers from thermal management, cooling technology and energy saving. Besides, IMPACT 2009 will be held simultaneously with TPCA Show at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. Attendees not only could attend Conference, but also could enjoy this important Show.
Taiwan, Silicon Island acts as a crucial position among worldwide electronic industry with over 50% revenue on IC packaging, testing and thermal in the world. And Taiwan PCB industry also have 25% market share in the world. Taiwan plays an important role in high-tech industry because of these remarkable performances. Organizers hope this conference could provide an international platform for all foreign and domestic contributors to show their researches. Besides, it also could let overseas scholars and engineers understand the Taiwan technologic industrious development and achievement.
Last year, because 6 organizers cooperated together, there had 200 papers solicited and 600 foreign and domestic attendees joining in IMPACT. Meanwhile, organizers also arranged varied activities such as industrious sessions and “Best Student & Outstanding paper Award” ceremony. Moreover, those accepted papers would be embodied in IEEE Xplore. Therefore, the organizers expect this year will attract much more foreign scholars and R&D Researchers attending this important event to share experience and communicate with each other.
Contributions are very welcome from industry participants and academic researchers. The paper should be written and presented in English and the abstract should be submitted by June 7. Welcome to submit your paper by on-line registration. If you want to get more information, please feel free to contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402, Email: email@example.com. More information, please check IMPACT 2009 website: http://www.impact.org.tw.
Germany Chapter's 2009 Conference ^
||October 27-28, 2009
Hochschule of Munich (near Central Station)
The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. You are welcome to submit a paper (approx. 20 min.) covering one of the following topics of microelectronics, packaging or interconnection technology:
- Industrial Electronics
- Design Software
- Design for Manufacturability
- Design for Testability
- Simulations, RF/Microwave Simulation
System Aspects / Problem Solutions
- Reliability & Live Cycle
- Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
- Fluid Systems
- Mechatronics Systems
- High Temperature Electronics
- Power Electronics
- High Frequency Electronics
- Test Systems
Processes und Materials
- Wafer Level Processes
- Ceramic und Organic Circuits
- Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
- (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
- Assembly- and Connection Technology
- FlipChip, Wirebonding, SMT …
- Process Control
Please send your abstract (approx. 200 words) until June 1, 2009 to:
Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
A BEST PAPER price will be awarded ! !
You can also use the online service at: http://www.imaps.de!
|Products and Publications
Have You Read A Recent Journal of Microelectronics and Electronic Packaging On-line? ^
The Fourth Quarter 2008 issue of the Journal of Microelectronics and Electronic Packaging is available on-line, along with all past issues of JMEP. The first quarter of 2009 is still in production as the issue is much larger than anticipated (15+ papers) and just a few weeks behind in production. Look for the first issue of 2009 in the weeks ahead. Access the Journal papers on-line .
This last issue of 2008 contains the following papers:
- Foreword - Fred D. Barlow III, Editor-in-Chief
- Systematic Characterization of Embossing Processes for LTCC Tapes
H.B. de Torres, R. Gade, A. Albrecht and M. Hoffmann, Institute for Micro- and Nanotechnologies
- Thick Film Accelerometers in LTCC Technology - Design Optimization, Fabrication, and Characterization
H. Neubert, Technische Universitat Dresden; Uwe Partsch, Fraunhofer-Institute Ceramic Technologies and Systems; D. Fleischer, M. Gruchow, A. Kamusella, Technische Universitat Dresden; T-Q. Pham, OptiY e.K. Aschaffenburg
- High Layer Count in LTCC Dual Band Antenna for Galileo GNSS
A.D. P. Uhlig, IMST GmbH; D. Manteuffel, Christian-Albrechts-University of Kiel; S. Malkmus, W. C. Heraeus GmbH
- Power Inductors in Ceramic Multilayer Circuit Boards
R. Matz, D. Gotsch, Siemens Corporate Technology; T. Goßner, Walther Meissner Institute; R. Karmazin, R. Manner, and B. Siessegger, Siemens Corporate Technology
- Morphological and Electrical Properties of Silver Thin Films Sputter Deposited on LTCC Substrates
A. Bittner, T. Bohnenberger, R. Engel, H. Seidel, Saarland University; U. Schmid, Vienna University of Technology
- Predicting the Thermal Conductivity of Low Temperature Co-fired Ceramic with Embedded Thermal via Arrays using the Rule-of-Mixtures and Interface Area Analytical Methods
T.S. Vincent, Worcester Polytechnic Institute
- Second- and Third-Level BGA Solder Joint Reliability of High-End Flip Chip System in Package (FCSiP)
S.H. Kim, NEC Electronics America; C. Kakegawa, H. Tabuchi, NEC Electronics Corporation; H. Park, NEC Electronics America
The International Microelectronics and Packaging Society (IMAPS) is committed to the publication of the archival Journal of Microelectronics and Electronic Packaging. Today, the Journal draws papers from every corner of the world, and these papers are peer-reviewed by an editorial board composed of thirteen experts from six different countries. As part of that commitment, we are constantly working to strengthen this publication in terms of content and format.
As in the past, this publication is available to all IMAPS members via web access (http://www.imaps.org/jmep/index.htm), and for a nominal fee, members can elect to receive a hardcopy of these issues as well. In addition, previous issues and individual papers are also available online to members through the journal access link noted above, and to non-members through the iKnow Microelectronics™ database (http://www.imaps .org/imapsstore/default.aspx).
Get Published With IMAPS ^
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).
The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.
Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:
• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to firstname.lastname@example.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website. http://www.imaps.org/jmep/copyright.pdf.
Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.
Please send all submissions, comments, or questions to email@example.com or feel free to contact me at the phone/e-mail below.
PDC Webinar Series on Signal Integrity and Precision Design in Digital Systems (3 Sessions)
Session 1: May 6, 2009
Session 2: May 13, 2009
Session 3: May 20, 2009
GBC Session at EMPC 2009
June 18, 2009
TW on Wire Bonding
July 13, 2009
San Francisco, CA
High Temp. Electronics Network - HiTEN 2009
September 13-16, 2009
ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA
ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA
*Exhibitors contact firstname.lastname@example.org
IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA
*Exhibitors contact email@example.com