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November 11, 2009
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Next Tuesday -- Webinar on Near Hermetic Packaging Concepts for Military and Medical Devices (read more...)

Button Device Packaging 2010 - Abstracts Due November 30 (read more...)

Button ATW on Printed Devices and Appilcations - Abstracts Due November 25 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Cleveland/Pittsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute (read more...)

Bullet New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces (read more...)

Bullet Metro Chapter December 3 Holiday Party (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Next Tuesday -- Webinar on Near Hermetic Packaging Concepts for Military and Medical Devices    ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, November 17 and 24, 2009.
All webinars will be held 12:00 noon - 1:00 pm EST

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375 (includes one-year complimentary individual membership in IMAPS)

Registration Deadline: November 16, 2009

Register On-line

Key Words: Hermeticity, Near Hermetic, moisture diffusion, TM 1014, TM 1018, Fick’s law

Program Description: Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a hermeticity testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces, which is different that water vapor permeating a crack in a glass to metal interface. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented along with a discussion of the pitfalls and issues of TM 1014 and TM 1018 as applied to a “near hermetic package”. Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Tuesday, November 17, 12:00-1:00 PM EST

Cavity style packages made from polymeric materials such as LCP or Teflon or other types of packages that are coated with a polymer as opposed to traditional hermetic seals require a different approach from a leak testing standpoint. The problem is now one of moisture diffusion through the polymer or barrier.  

  • Military and Medical Market Drivers
  • “Near Hermetic” cavity package defined
  • The “Hermeticity Myth”
  • MIL-STD-883 TM 1014 and TM 1018 Do they apply?

Tuesday, November 24, 12:00-1:00 PM EST

A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented along with the fundamental theory.

  • Fick’s Law of Moisture Diffusion
  • WVTR, TGA and moisture diffusion coefficients
  • Moisture Sensing (wired and wireless sensors)
  • How to qualify a “near hermetic “ package

Who Should Attend? This PDC is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.

Thomas Green

Presenter

Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran owned small business. He has over twenty-five years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits for military and commercial communication satellites. Tom has demonstrated expertise in seam sealing and leak testing processes. He has conducted experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. He has experience with OLT (Optical Leak Technology) and CHLD (Cumulative Helium Leak Detection). Tom is a Fellow of IMAPS and has a B.S. in Materials Engineering for Lehigh University and a Masters from the University of Utah.

Register On-line

Device Packaging 2010 - Abstracts Due November 30    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2010 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2009.

ATW on Printed Devices and Appilcations - Now Accepting Abstracts and Tabletop Booths    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are due by November 25, 2009. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/printed.

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

  Chapter Activities (events listed in chronological order)
 

Cleveland/Pittsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute    ^ Top

Dates: Monday, November 16
Schedule: 12 noon start - registration, networking, lunch
Location:

Ohio Aerospace Institute
22800 Cedar Point Road,  Cleveland, Ohio 44142
PH 440-962-3000,  FAX 440-962-3200, Email: JoyceRobertson@oai.org
Directions and Maps

Registration:

Please RSVP before Friday, November 12 at 5:00 pm EST
IMAPS members - $ 15.00.  Non-members - $ 25.00.  Students – $ 5.00
On-line Registration

12:00   Welcome and Introductions
             Liangyu Chen, OAI, and Brian Schieman, IMAPS 

12:15   Lunch and Networking

1:00    “Advanced TPG Materials for Thermal Management of Electronics.”
            Xiang Liu, Application Development Engineer of  Momentive Performance Materials

1:30   “IC Attachment Options, Application Dependence.”
           Ralph Klouda, Senior Product Engineer of HANA Microdisplay Technologies

2:00    “Integrated Circuitry Approaches and Options.”
            
Chandra Raj, Product Line Manager of ViaSat

2:30    “Competing in a Global Market: Manufacturing Miniaturized medical Devices and Sensors.”
             
Donald Styblo, VP of Technology of Valtronic Technologies (USA), Inc.

3:00    Wrap-up, future events, and chapter leadership

New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces    ^ Top

Dates: Tuesday, November 17
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation
Location:

Holiday Inn Boxborough Woods
Route I-495 exit 28 [Route 111] in Boxborough, Mass.
After exiting highway, proceed 300 yards east, turn right onto Adams Place. Holiday Inn is 1/8 mile on left.
Phone (978) 263-8701

Registration:

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Dinner $30.00 (Non-member) $25.00 (Member) $20.00 (Retired) $5.00 (Student) - At-door registration is an additional $5.00.

Send Registrations to: Susan Munyon 96 Grant Way, Lancaster, MA 01523-3112 e-mail SusanMunyon@comcast.net or phone 978-466-1877 www.imapsne.org/meeting.html

Copper Cold Spray Thermal Management and Solderable Surfaces
Mr. Victor Champagne - Advanced Materials and Processes Team Technical Leader
US Army Research Laboratory (ARL)

Abstract:
This presentation will provide a basic understanding of an emerging technology, referred to as ‘Cold Spray’, which has evolved from a laboratory curiosity to a production viable process. Cold Spray is a materials deposition process whereby combinations of metallic and non-metallic particles are consolidated to form a coating or freestanding structure by means of ballistic impingement upon a suitable substrate. Cold spray is often compared with traditional thermal spray processes and although there are certain similarities, it is important to recognize the fundamental differences between them in order to determine which technique are best suited for electronic applications. There is substantial data to suggest that cold spray has a niche in the marketplace; however, it must also be realized that cold spray does have limitations that should be acknowledged in order to prevent misuse of the technology.

Biography:
Mr. Champagne is a research materials engineer who has worked for the US Army Research Laboratory (ARL) and its predecessor organizations for over 24 years. He has been the technical leader for the Advanced Materials and Processes Team since 1986, where he conducts research and development programs in coatings and advanced materials and processing technologies. His research efforts have focused on the development of emerging technologies, which can be implemented into production and the field. He is internationally recognized as an expert in Cold Spray Technology and has established the ARL Cold Spray Center located in Aberdeen, MD whose focus is the development of cold spray applications for DOD and Industry. Over the past year he was awarded the prestigious U.S. Army Research and Development Achievement Award and also the Defense Manufacturing Excellence Award for his Research in Cold Spray. He was the editor of the first comprehensive reference book on cold spray for The Institute of Materials, Minerals and Mining (IoM3) published by Woodhead Publishing. He also serves as a Research Associate at Worcester Polytechnic Institute and as a liaison to Natick Laboratories, both located in MA. He is also a Thesis Advisor for graduate students at several universities including the Pennsylvania State University and manages over $23M in projects and programs for ARL.

Metro Chapter December 3 Holiday Party    ^ Top

Dates: Thursday, December 3
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation
Location:

6-10 PM

Registration:

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Guest 30.00

30.00 to IMAPS Members that has not attended a Metro event in the past 18 months

60.00 to all others

If you would like to make a reservation send an email to: metroimaps@optonline.net
Please include your IMAPS Membership Number.

If you would like to contribute a door prize, please contact Steve Lehnert (631) 379-8239 or email metroimaps@optonline.net    

Come out and socialize with all your friends

Not a member? Join or renew prior to November 30, 2009 and receive the member price. Want to bring a guest? Only 30.00

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Dinner buffet

Prize drawings

50/50 Drawing

4 hours open bar

First come first served

  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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