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November 17, 2009
 

TJ Green Associates, LLC

   IMAPS EVENTS
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Abstracts Due This Friday for Workshop on Automotive Microelectronics and Packaging (read more...)

Button Device Packaging 2010 - Abstracts Due November 30 (read more...)

Button ATW on Printed Devices and Appilcations - Abstracts Due November 25 (read more...)

Button Webinar on Wire Bonding (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces (read more...)

Bullet Northern California Chapter December 2 Lunch Meeting on Power LEDs (read more...)

Bullet Metro Chapter December 3 Holiday Party (read more...)

Bullet Keystone Chapter December 5 Holiday Party (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Abstracts Due This Friday for Workshop on Automotive Microelectronics and Packaging    ^ Top
The Second Advanced Technology Workshop on Automotive Microelectronics and Packaging will be held in Dearborn, Michigan on April 28-30, 2010.
The call for abstracts and full workshop information can be found on-line at www.imaps.org/automotive.

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Planned Sessions Include:

Industry

  • Automotive

Systems & Applications

  • Power/Hybrid Modules
  • Powertrain Control
  • Collision Avoidance and Safety
  • X-by-Wire
  • Driver Comfort/Information/Audio Systems
  • Telematics

Design

  • Thermal and Power Management
  • RF/Wireless/mmWave/RADAR/LIDAR/IR
  • Harsh Environment
  • MEMS and Sensors
  • High Performance Interconnects
  • Systems on Chip

Materials & Process

  • Thermal and Power Packaging
  • Sensor and MEMS Packaging
  • Advanced Interconnects, Connectors and Wirebonding
  • Ceramic Substrates and Ceramic Technologies
  • High Density and High Performance Organic Substrates
  • Underfill/Encapsulants and Adhesives
  • Solder Materials, Processes, and Reliability
  • Flip-Chip and Bumping: Processes, Reliability 
  • LED Packaging
  • Embedded and Integrated Passives
  • Green Packaging/Compliance with RoHS

Those wishing to make a presentation at the Automotive Workshop, please submit a 250-300 word abstract electronically by November 20, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent advanced technology and can be unpublished work. The abstracts should highlight the application area, design, and process or material covered within the automotive industry. Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on March 19, 2010. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner at: jmorris@imaps.org or call 305-382-8433.

Device Packaging 2010 - Abstracts Due November 30    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2010 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2009.

ATW on Printed Devices and Appilcations - Abstracts Due November 25    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are due by November 25, 2009. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/printed.

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Webinar on Wire Bonding    ^ Top
This three-session on-line Professional Development Course (PDC) webinar will be held
Tuesdays, December 1, 8 and 15, 2009, at 12:00 pm - 1:00 pm EST.

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: November 30, 2009

Register On-line

Key Words

Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA. 3D packaging, SOP

Program Description

In 2008 more than 10^13 semiconductor interconnects were produced. Of this quantity, more than 90% were wire bonds.  Wire bonding is a high speed, ultrasonic welding process. In the most commonly used process, ball bonding, fine diameter (average diameter is now < 25µm) gold or copper wire is welded to a thin (1µm) Al-1%Si-0.5%Cu bond pad on the semiconductor device. Typical bond pads are now less than 75µm square and devices like graphic processors may have more than 1000 on a single device. State-of-the-art bonders now operate at rates > 16 wires/second (32 welds with high speed motions between the two welds that define the ends of each wire). Placement accuracy must be better than ±2.5µm.  It is not unusual for factories with well characterized and controlled materials and manufacturing to experience bond defect rates less than 10 ppm.

These 3 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 3: Tuesday, December 1 -- 12:00-1:00 PM EDT

In Session 1 we will focus on:

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability

Session 2 of 3: Tuesday, December 8 -- 12:00-1:00 PM EDT

In Session 2 we will focus on:

  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes

Session 3 of 3: Tuesday, December 15 -- 12:00-1:00 PM EDT

In Session 3 we will focus on:

  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process
Thomas Green

Presenter

Lee is a consultant for Process Solutions Consulting where he provides process engineering consultation and SEM/EDS analysis. Lee’s previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He has been awarded 4 patents, published more than 50 technical papers, and in 1999 won the John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society (IMAPs). Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding semiconductor assembly processes. He is an IMAPs Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS. In addition he is a senior member of IEEE.

Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

Register On-line

  Chapter Activities (events listed in chronological order)
 

TODAY: New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces    ^ Top

Dates: Tuesday, November 17
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation
Location:

Holiday Inn Boxborough Woods
Route I-495 exit 28 [Route 111] in Boxborough, Mass.
After exiting highway, proceed 300 yards east, turn right onto Adams Place. Holiday Inn is 1/8 mile on left.
Phone (978) 263-8701

Registration:

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Dinner $30.00 (Non-member) $25.00 (Member) $20.00 (Retired) $5.00 (Student) - At-door registration is an additional $5.00.

Send Registrations to: Susan Munyon 96 Grant Way, Lancaster, MA 01523-3112 e-mail SusanMunyon@comcast.net or phone 978-466-1877 www.imapsne.org/meeting.html

Copper Cold Spray Thermal Management and Solderable Surfaces
Mr. Victor Champagne - Advanced Materials and Processes Team Technical Leader
US Army Research Laboratory (ARL)

Abstract:
This presentation will provide a basic understanding of an emerging technology, referred to as ‘Cold Spray’, which has evolved from a laboratory curiosity to a production viable process. Cold Spray is a materials deposition process whereby combinations of metallic and non-metallic particles are consolidated to form a coating or freestanding structure by means of ballistic impingement upon a suitable substrate. Cold spray is often compared with traditional thermal spray processes and although there are certain similarities, it is important to recognize the fundamental differences between them in order to determine which technique are best suited for electronic applications. There is substantial data to suggest that cold spray has a niche in the marketplace; however, it must also be realized that cold spray does have limitations that should be acknowledged in order to prevent misuse of the technology.

Biography:
Mr. Champagne is a research materials engineer who has worked for the US Army Research Laboratory (ARL) and its predecessor organizations for over 24 years. He has been the technical leader for the Advanced Materials and Processes Team since 1986, where he conducts research and development programs in coatings and advanced materials and processing technologies. His research efforts have focused on the development of emerging technologies, which can be implemented into production and the field. He is internationally recognized as an expert in Cold Spray Technology and has established the ARL Cold Spray Center located in Aberdeen, MD whose focus is the development of cold spray applications for DOD and Industry. Over the past year he was awarded the prestigious U.S. Army Research and Development Achievement Award and also the Defense Manufacturing Excellence Award for his Research in Cold Spray. He was the editor of the first comprehensive reference book on cold spray for The Institute of Materials, Minerals and Mining (IoM3) published by Woodhead Publishing. He also serves as a Research Associate at Worcester Polytechnic Institute and as a liaison to Natick Laboratories, both located in MA. He is also a Thesis Advisor for graduate students at several universities including the Pennsylvania State University and manages over $23M in projects and programs for ARL.

Northern California Chapter December 2 Lunch Meeting on Power LEDs    ^ Top

Dates: Wednesday, December 2
Schedule: 11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation
Location:

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054
408-986-1666

Registration:

IMAPS Members $20.00;
General $25.00;
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at glove@cctlaser.com to reserve your space today. SPACE IS LIMITED! Registrations will be confirmed via email. We may accept cash and checks at the door.

POWER LEDs–Where We Were, Where We Are Going
Speaker: Franklin Wall, Senior Development Engineer
Philips Lumileds Lighting Company

Abstract: The breadth of high power LED applications has exploded!  There are seemingly unending possibilities for those who can package LEDs into products, such as finished luminaires, at a reasonable cost, have a good quality of light, and at the highest efficiency.  During his talk, Frank will touch on the challenges associated with designing LEDs into products, how this affects IMAPS members & companies, and briefly on the global market perspective for LEDs.

Speaker Bio: Frank Wall has 30+ years in packaging experience at notable companies, some of which are Leach Corporation, General Ceramics, Hermetic Devices, SSDI, Curamik Electronics, and others.  Frank has been with Philips Lumileds Lighting in San Jose for the last 7 years, working as a Sr. Product Development Engineer in R & D.  He was instrumental in developing the worlds first ceramic-based, high-power LED platforms, which are used in LUXEON Flash & Rebel products, and more recently LUXEON Altilon, an LED module designed specifically for automotive headlights.  Frank holds 6 U.S. Patents in power packaging.

Metro Chapter December 3 Holiday Party    ^ Top

Dates: Thursday, December 3
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation
Location:

Holiday Inn Ronkonkoma – Click here for Directions

Registration:

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Guest 30.00

30.00 to IMAPS Members that has not attended a Metro event in the past 18 months

60.00 to all others

If you would like to make a reservation send an email to: metroimaps@optonline.net
Please include your IMAPS Membership Number.

If you would like to contribute a door prize, please contact Steve Lehnert (631) 379-8239 or email metroimaps@optonline.net    

Come out and socialize with all your friends

Not a member? Join or renew prior to November 30, 2009 and receive the member price. Want to bring a guest? Only 30.00

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Dinner buffet

Prize drawings

50/50 Drawing

4 hours open bar

First come first served

Keystone Chapter December 5 Holiday Party    ^ Top

Dates: Saturday, December 5
Schedule: 7:00 PM Start
Location:

Lee Levine's Home (Process Solutions Consulting)
8009 George Rd, New Tripoli, PA

Registration:

RSVP to levilr@ptd.net Or call 610-248-2002

Join Us for an evening of food and fun with your IMAPS friends & spouses

 

  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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