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November 24, 2009
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Abstracts Due Tomorrow: ATW on Printed Devices and Appilcations (read more...)

Button Abstracts Due Monday: Device Packaging 2010 (read more...)

Button Webinar on Wire Bonding Begins Tuesday (read more...)

Button IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Northern California Chapter December 2 Lunch Meeting on Power LEDs (read more...)

Bullet Metro Chapter December 3 Holiday Party (read more...)

Bullet Arizona Chapter December 3 Lunch Meeting on Thin Wafer Processing (read more...)

Bullet Keystone Chapter December 5 Holiday Party (read more...)

Bullet IMAPS New England, 37th Symposium & Expo - Abstracts Due December 31 (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Abstracts Due Tomorrow: ATW on Printed Devices and Appilcations    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are due by November 25, 2009. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/printed.

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Abstracts Due Monday: Device Packaging 2010    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2010 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2009.

Webinar on Wire Bonding Begins Tuesday    ^ Top
This three-session on-line Professional Development Course (PDC) webinar will be held
Tuesdays, December 1, 8 and 15, 2009, at 12:00 pm - 1:00 pm EST.

Registration:
IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: November 30, 2009

Register On-line

Key Words

Wire bond, intermetallic, ultrasonic welding, semiconductor packaging, BGA. 3D packaging, SOP

Program Description

In 2008 more than 10^13 semiconductor interconnects were produced. Of this quantity, more than 90% were wire bonds.  Wire bonding is a high speed, ultrasonic welding process. In the most commonly used process, ball bonding, fine diameter (average diameter is now < 25µm) gold or copper wire is welded to a thin (1µm) Al-1%Si-0.5%Cu bond pad on the semiconductor device. Typical bond pads are now less than 75µm square and devices like graphic processors may have more than 1000 on a single device. State-of-the-art bonders now operate at rates > 16 wires/second (32 welds with high speed motions between the two welds that define the ends of each wire). Placement accuracy must be better than ±2.5µm.  It is not unusual for factories with well characterized and controlled materials and manufacturing to experience bond defect rates less than 10 ppm.

These 3 one-hour PDC lectures can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 3: Tuesday, December 1 -- 12:00-1:00 PM EDT

In Session 1 we will focus on:

  • The Ball Bond Process: Step by Step Wire Bonding
  • Welding
  • The effect of ultrasonics on weld formation and materials properties
  • Metallurgy and Intermetallics
  • A comparison of the welds associated with Au-Al and Al-Cu bonding
  • Au-Al failure mechanisms in ultra-fine pitch bonding
  • The effect of wire alloying on ultra-fine pitch reliability

Session 2 of 3: Tuesday, December 8 -- 12:00-1:00 PM EDT

In Session 2 we will focus on:

  • Wire properties, testing and chemistry
  • Pull and shear testing wire bonds
  • Long term accelerated testing of wire bonds
  • Understanding wire stiffness and the effect on looping
  • Wire bond loop shapes

Session 3 of 3: Tuesday, December 15 -- 12:00-1:00 PM EDT

In Session 3 we will focus on:

  • The second bond
  • Diffusion
  • The principal bonding variables
  • Capillary design and selection for optimized processes
  • Simple bond screening designed experiments
  • How to optimize the bonding process
Thomas Green

Presenter

Lee is a consultant for Process Solutions Consulting where he provides process engineering consultation and SEM/EDS analysis. Lee’s previous experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. He has been awarded 4 patents, published more than 50 technical papers, and in 1999 won the John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society (IMAPs). Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding semiconductor assembly processes. He is an IMAPs Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS. In addition he is a senior member of IEEE.

Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

Register On-line

IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan    ^ Top
The Sixth Annual CICMT Conference will be held in Chiba, Japan, on April 18-21, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS) and co-sponsored by the American Ceramics Society (ACerS), IMAPS Japan, Ceramics Society of Japan, Ferroelectric Committee of Japan (FMA), Japan Society of Applied Physics, MRS-Japan, and AIST .
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.cicmt.org.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both topical areas, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems topics of the CICMT conference target new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Sessions Include:

Session 1) Organized by IMAPs Japan

Dr. Kishio Yokouchi (Fujitu Interconnect Tech.)

Dr. Shinichi Nishi (Konicaminolta IJ Technologies, Inc.)

Session 2) Multilayer Ceramic Microsystems

Amy Moll, Boise State University

Leszek Golonka,Wroclaw University

Keisuke Kageyama, Murata Manu. 

Session 3) Electromagnetic Properties

Dr.-Ing. Jens Mueller, Technical University Ilmanau

Mike Janezic, NIST Boulder

Dr. Soshu Kirihara, Osaka Univ., Japan

Session 4) Direct Write Technology

Jun Akedo, Ntnl Inst of Advanced Industrial Sci.and Tech, Japan

Chris Apblett, Sandia National Laboratory

Session 5) Piezoelectric applications including MEMS

Yuji Noguchi, Tokyo Univ., Japan

Richard Eitel, University of Kentucky

Wei Ren, Xian Jiaotong University

Session 6) Ceramics in Energy Systems

Dr. Masanobu Awano, AIST., Japan

Nigel Sammes, Colorado School of Mines

Session 7) Novel Processing Techniques

Dr. Minoru Osada (NIMS., Japan)

Session 8) Dielectric and Ferroelectric Materials and Components

 Dr. Hyotae Kim (KICET)

Yong Cho (Yonsei University)

Session 9) Poster Session

Dr. Hiroaki Takeda (Tokyo Tech., Japan)

Abstract Cut-off Date: December 11, 2009
Notice of Acceptance: January 8, 2010
Final Manuscripts Due: February 19, 2010

Please send your 250-300 word abstract electronically only by December 11, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

 

  Chapter Activities (events listed in chronological order)
 

Northern California Chapter December 2 Lunch Meeting on Power LEDs    ^ Top

Dates: Wednesday, December 2
Schedule: 11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation
Location:

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054
408-986-1666

Registration:

IMAPS Members $20.00;
General $25.00;
Students (with ID) $10.00

Price includes lunch and program. Please email Gina Love at glove@cctlaser.com to reserve your space today. SPACE IS LIMITED! Registrations will be confirmed via email. We may accept cash and checks at the door.

POWER LEDs–Where We Were, Where We Are Going
Speaker: Franklin Wall, Senior Development Engineer
Philips Lumileds Lighting Company

Abstract: The breadth of high power LED applications has exploded!  There are seemingly unending possibilities for those who can package LEDs into products, such as finished luminaires, at a reasonable cost, have a good quality of light, and at the highest efficiency.  During his talk, Frank will touch on the challenges associated with designing LEDs into products, how this affects IMAPS members & companies, and briefly on the global market perspective for LEDs.

Speaker Bio: Frank Wall has 30+ years in packaging experience at notable companies, some of which are Leach Corporation, General Ceramics, Hermetic Devices, SSDI, Curamik Electronics, and others.  Frank has been with Philips Lumileds Lighting in San Jose for the last 7 years, working as a Sr. Product Development Engineer in R & D.  He was instrumental in developing the worlds first ceramic-based, high-power LED platforms, which are used in LUXEON Flash & Rebel products, and more recently LUXEON Altilon, an LED module designed specifically for automotive headlights.  Frank holds 6 U.S. Patents in power packaging.

Metro Chapter December 3 Holiday Party    ^ Top

Dates: Thursday, December 3
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation
Location:

Holiday Inn Ronkonkoma – Click here for Directions

Registration:

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Guest 30.00

30.00 to IMAPS Members that has not attended a Metro event in the past 18 months

60.00 to all others

If you would like to make a reservation send an email to: metroimaps@optonline.net
Please include your IMAPS Membership Number.

If you would like to contribute a door prize, please contact Steve Lehnert (631) 379-8239 or email metroimaps@optonline.net    

Come out and socialize with all your friends

Not a member? Join or renew prior to November 30, 2009 and receive the member price. Want to bring a guest? Only 30.00

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Dinner buffet

Prize drawings

50/50 Drawing

4 hours open bar

First come first served

Arizona Chapter December 3 Lunch Meeting on Thin Wafer Processing    ^ Top

Dates: Thursday, December 3
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location:

SPECIAL ONSITE LOCATION!
EV Group Inc.
7700 South River Parkway
Tempe, AZ 85284

Registration:

Luncheon and presentation - $5.00 in advance / $10.00 at the door
Vendor display tables available for $15.00

RSVP by 1 Dec 2009 online or via e-mail http://www.imaps.org/registration/az2009dec.htm / greg.clemons@live.com

Thin Wafer Processing: Trends, Achievements and Challenges

Presented by:
Bioh Kim, Global Business Development Manager
EV Group Inc.

Through-silicon via (TSV) represents system-level integration of planar devices that are interconnected in the z-direction. Making reliable TSV interconnects requires a significant reduction in wafer thickness. A thinned die/wafer enhances IC performance and enables various innovative packages However, when combined with a large diameter wafer, making reliable TSV interconnects necessitates new wafer handling mechanisms. One such handling solution for thin wafers is temporary bonding and de-bonding utilizing a carrier wafer that provides mechanical stability during backside processing and protects the sharp edge of the device wafer. The choice of the proper intermediate bonding material, such as laminated tapes or spin-on coated adhesives, depends on several factors. Spin-on coated adhesives become preferred over laminated tapes due to several factors. Fully-automated thin wafer handling solutions provide many benefits and successful process stability and electrical performances have been demonstrated. In the IC manufacturing and packaging industry, there still exist several challenges with temporarily bonded wafers. All the details on trends, achievements and challenges with thin wafer handling and processing will be discussed during the presentation.

Keystone Chapter December 5 Holiday Party    ^ Top

Dates: Saturday, December 5
Schedule: 7:00 PM Start
Location:

Lee Levine's Home (Process Solutions Consulting)
8009 George Rd, New Tripoli, PA

Registration:

RSVP to levilr@ptd.net Or call 610-248-2002

Join Us for an evening of food and fun with your IMAPS friends & spouses

IMAPS New England, 37th Symposium & Expo - Abstracts Due December 31    ^ Top

Dates: May 4, 2010
Schedule: Deadline for Abstract Submission – December 31, 2009
Location:

Holiday Inn – Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to weihan.vivian@gmail.com or visit us at - www.imapsne.org – for details

Symposium Technical Chair:
Wei Han, Ph.D
Gillette/P&G, Boston, MA

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal  Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Emerging Technologies

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic Packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green Packaging / Compliance with RoHS
  • Flip-Chip and Bumping: Processes, Reliability
  • Wirebonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Visit us at - www.imapsne.org – for details.

  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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