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October 20, 2009
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS 2009 - On-line Registration Closes Next Week (read more...)

Button GBC Marketing Forum - Recovery of the Semiconductor Market (read more...)

Button IMAPS 2009 - Announcing Complimentary Tutorial on Electronics, Energy, and the Environment (read more...)

Button Device Packaging 2010 - Reserve Your Spot in the Sessions, Submit An Abstract (read more...)

Button ATW on Printed Devices and Appilcations - Now Accepting Abstracts and Tabletop Booths (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet THIS THURSDAY: Florida Chapter October 22 Dinner Meeting Discussing MEMS (read more...)

Bullet THIS THURSDAY: Keystone Chapter October 29 Dinner Meeting Featuring Technical Presentations and Student Posters (read more...)

Bullet THIS THURSDAY: Central Texas Chapter October 29 Electronics Design & Manufacturing Symposium & Vendor Show (read more...)

Bullet NEXT WEEK: Germany Chapter's 2009 Conference (read more...)

Bullet NEXT WEDNESDAY: Metro Chapter Dinner Presentation on October 28 (read more...)

Bullet NEXT WEDNESDAY: Chesapeake Chapter Fall Technical Symposium on October 28 (read more...)

Bullet NEXT WEEK: Arizona Chapter October 29 Lunch Meeting Discussing Implantable Medical Devices (read more...)

Bullet Cleveland/PIttsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

IMAPS 2009 - On-line Registration Closes Next Week   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.

On-line Registration closes next Wednesday, October 28. Register before next week to avoid the long lines in San Jose. Learn more about IMAPS 2009 and register on-line at www.imaps2009.org.

GBC Marketing Forum - Recovery of the Semiconductor Market   ^ Top
The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.
Learn more about the GBC Marketing Forum, IMAPS 2009 and register on-line at www.imaps2009.org.

Wednesday, November 4, 2009
San Jose McEnery Convention Center
5:35 pm - 7:00 pm

INCLUDED WITH YOUR IMAPS 2009 FULL SYMPOSIUM REGISTRATION

2009 Fall Forum Chair:
Dave Seeger, IBM

This GBC-Marketing Forum is a business session for all IMAPS 2009 attendees who wish to participate. A Networking Reception will follow from 7:00 pm to 7:45 pm. Pre-registration is strongly recommended in order to plan the reception. Register on-line at www.imaps2009.org.

Mr. Andrea Lati, VLSI Research

“State of the Semiconductor Industry”

Mr. Andrea Lati, Market Research Analyst of VLSI Research Inc.
Mr. Lati will present the latest forecast and analysis for the semiconductor industry. The presentation focuses on scenarios that will drive the recovery of the semiconductor industry and the supply chain. It will also describe why the semiconductor industry will emerge leaner but stronger from the recent downturn, ready to take advantage of opportunities that lie ahead.

About Mr. Lati:
Andrea Lati is a market research analyst at VLSI Research Inc. Since joining VLSI Research in 2001, Andrea has been focusing on managing and developing forecasting models as well as performing market analysis and research on electronics and semiconductor markets. He is responsible for developing forecasting models that are used to generate the Industry Pulse Pro, Electronics and Macroeconomy Forecast, Semiconductor Forecast, Silicon Demand Forecast, Reticle Demand Forecast, and Packaging Forecast. In addition, Andrea has performed several custom studies for various clients and is a co-author of The Chip Insider ®.

About VLSI:
VLSI Research Inc. is the leading provider of market research and economic analysis on the technical, business, and economic aspects of the high technology chip making industry. The company is known for its unparalleled accuracy, innovation in market research, and its sharply focused insight into the rapidly changing landscape of the chip making business. VLSI Research’s databases on chip making are used throughout the industry, the investment community, and by governments for decisive strategic planning. VLSI Research was founded in 1976 and incorporated in California in 1981. The company’s website is www.vlsiresearch.com.

   
Mr. Shawn DuBravac, Consumer Electronics Association

“The State and Impact of Consumer Technologies on Semiconductors: Key Drivers, Disrupters and Developments”

Mr. Shawn DuBravac, Director of Research of the Consumer Electronics Association
Mr. DuBravac will share CEA’s insights of the technology trends and future economic health of the consumer electronics industry and speak to the impact of various electronics on the semiconductor industry. Highlights of the presentation include: results of the global economic stimulus plans; trends and demand curves for next generation multipurpose electronics; challenges of bridging the gaps within increasingly complex networked environments; and the resulting impact on the semiconductor industry from the evolving consumer performance expectations and overarching market trends.

About Mr. DuBravac:
Shawn DuBravac is Director of Research and Economist for the Consumer Electronics Association (CEA). He directs CEA’s economic analysis, consumer research, and helps oversee the day-to-day operations of CEA’s many research initiatives. He is responsible for handling analyses of the economy as it relates to the CE industry including forecasting future economic activity, econometric studies, examining trade flows, and ascertaining relative health of the industry. DuBravac also provides research into the technology trends underpinning the industry and quantitative support for CEA’s legislative initiatives. He is a Chartered Financial Analyst.

About the Consumer Electronics Association (CEA):
The Consumer Electronics Association (CEA) unites 2,200 companies within the consumer technology industry. CEA is its industry’s authority on market research and forecasts, consumer surveys, regulatory news, and engineering standards. For more information on CEA market analysis, please see www.ce.org/research/default.asp.

   

IMAPS 2009 - Announcing Complimentary Tutorial on Electronics, Energy, and the Environment    ^ Top
Instructor:
Harry K. Charles, Jr. Ph. D.

Wednesday, November 4, 2009 – 1:35pm-5:25pm
McEnery Convention Center, Room A7

Registration is complimentary for all attendees. Reserve your seat today:
http://www.imaps.org/registration/imaps2009.htm and follow the link to "complimentary exhibit passes". Or email Brian Schieman, bschieman@imaps.org, to reserve your seat.

Description:

Energy availability and its cost are major concerns to every person.  Fossil fuels in general and oil in particular, are limited and the world’s reserves are depleting. In addition, the proliferation of electronic products and their manufacture now pose additional threats to the fragile balance in the Earth’s eco systems. While posing threats, electronics can be the solution to many of our current and future environmental and energy related problems.   The environmental threats from electronics can be significantly reduced or eliminated through environmentally responsible design manufacture, distribution, usage, and end-of-life disposal. This introductory overview outlines how the electronics industry has been responsive to the environmental challenges as well as providing alternatives to or reductions in fossil fuels and their high carbon footprint. Highlights will include: a discussion of  “green” electronics; the potential impact of the widespread deployment of photovoltaic devices, the case for solid state lighting, improvements in battery technology; and nano-electronics.

Who Should Attend?
Engineers, managers, venture capitalists, and any individual interested in the progress the electronics industry has made in the development of “green” electronics and the potential of electronics technology to make significant impact on reducing fossil fuel usage.

Instructor Bio:
Dr. Charles holds B.S. and Ph.D. degrees in Electrical Engineering from Drexel University and The Johns Hopkins University, respectively. He is Chief Engineer of the Milton S. Eisenhower Research Center at the Johns Hopkins University Applied Physics Laboratory. Dr. Charles has 30 years experience in the microelectronics arena focusing on solid state physics, electronic devices, packaging, and reliability. His latest interests include: ultra-thin modules; advanced interconnect; biomedical instrumentation; nano-scale electronics; and alternative energy. He has published over 200 papers and holds thirteen patents and several pending patent applications. Dr. Charles is a Fellow and former President of IMAPS, a Fellow of IEEE, and a past member of the Board of Governors of the IEEE’s Components Packaging and Manufacturing Technology (CPMT) Society. He has received international recognition for his research, development, and teaching activities. Dr. Charles has taught for over 25 years in the Johns Hopkins University Engineering Programs for Professionals (JHUEPP). He developed 9 new courses and is currently chair of the Applied Physics program in the JHUEPP. He also holds the Office of Naval Research Distinguished Chair for Science and Technology at the US Naval Academy.

Device Packaging 2010 - Reserve Your Spot In Sessions, Submit An Abstract    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2010 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2009.

ATW on Printed Devices and Appilcations - Now Accepting Abstracts and Tabletop Booths    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are due by November 25, 2009. The call for abstracts, exhibit reservation details and full event information can be found on-line at www.imaps.org/printed.

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

  Chapter Activities (events listed in chronological order)
 

TOMORROW: IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: http://www.impact.org.tw or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

THIS THURSDAY: Florida Chapter October 22 Dinner Meeting Discussing MEMS    ^ Top

Dates: Thursday, October 22
Schedule: 6-7 pm Social
7-8 Dinner
7:45 – 8:30 Presentation
Location:

Holiday Innn Select Orlando Airport
5750 T.G. LEE BLVD.
Orlando, FL 32822 US
407.341.3359

Registration:

Members - $25
Nonmembers $30
Students $10
Tabletops available for $150

Contact Tim Davis
407.971.9937 | timdavis1966@att.net

MEMS abstract:
The evolution of MEMS devices and applications since the 1960s has presented challenges to the device packaging industry, especially in the area of RF MEMS. A brief history of MEMS technology will be presented along with their utilization in various markets. Examples of how package simulation & modeling, design for manufacturability, and assembly methods must be aligned during the early stages of the applications engineering process in order to obtain the best performance for RF MEMS devices will also be presented.

Speaker Bio:
Paul Garland received his BS is System Science from the University of California, San Diego and has over 20 years experience in building and designing electronic packages. He has worked at Kyocera since 1984 and has had a variety of responsibilities from manufacturing to R&D. In 1994, he helped begin the High Frequency Department and he is now a part of the New Product Development Department where he specializes in high speed and high frequency packaging. He has several patents related to the packaging field and is currently the Vice Chair of the MTT-12 group.

THIS THURSDAY: Keystone Chapter October 29 Dinner Meeting Featuring Technical Presentations and Student Posters    ^ Top

Dates: Thursday, October 22
Schedule: 6:00 Registration and poster session
6:45 Dinner
7:30 Presentations
Location:

Stabler Observation Tower
Lehigh University
111 Research Drive
Iacocca Hall
Bethlehem PA 18015

Registration:

Advance registration $20.00, on-site $25.00.
Students no charge with advance registration.

Advance registration E-mail Greg Chesmar at gregches@aol.com

Microencapsulation Wafer-level Packaging of Radio-frequency Micro-electromechanical Systems
James C. M. Hwang, Director
Compound Semiconductor Technical Lab, Lehigh University

Abstract
Radio-frequency micro-electromechanical systems (RF MEMS) are attractive because of not only high performance, but also small size, light weight, low power consumption, and potentially low cost. However, the deployment of RF MEMS has been hindered by packaging and reliability concerns. This talk highlights the recent improvement in packaging and reliability of a microencapsulated RF MEMS switch, which is mostly encapsulated under a transparent dome of polymers and silicon nitride. Such a microencapsulation package not only permits visual inspection, but also adds little burden to the performance, size, weight and cost of the switch. Further, the microencapsulation is performed during front-end wafer processing in a cleanroom, which allows the switch to be packaged and tested under controlled ambient as early as possible during fabrication. MEMS devices are sensitive to the ambient and known-good dies are important because they are often assembled with other MEMS and semiconductor devices to yield a multi-chip module. The microencapsulation is not truly hermetic, but it is sufficient for most applications. If necessary, the multi-chip module can then be packaged hermetically. Although additional challenges such as robustness and power handling remain, the overall picture appears bright and RF MEMS are poised for wide applications.

Biography
James C. M. Hwang graduated with a B.S. degree in Physics from National Taiwan University in 1970, and completed M.S. (1973) and Ph.D. (1976) studies in Materials Science at Cornell University. After twelve years of industrial experience at IBM, AT&T, GE, and GAIN, he joined Lehigh University in 1988. His current research interests include micro-electromechanical systems, radio-frequency transistors and integrated circuits, quantum-dot and quantum-dash infrared lasers, and ultraviolet emitters and detectors. He has been a Nanyang Professor at Nanyang Technological University in Singapore and an Advisory Professor at Shanghai Jiaotong University in China. He co-founded GAIN and QED; the latter became a public company (IQE). He has published more than 250 technical papers and has been granted four U. S. patents. He became a Fellow of the Institute of Electrical and Electronic Engineers in 1996 and received the IBM Faculty Award in 2007.

Overview of RF MEMS Packaging
by Iris Labadie, Kyocera

Abstract
The evolution of MEMS devices and applications since the 1960s has presented challenges to the device packaging industry, especially in the area of RF MEMS. A brief history of MEMS technology will be presented along with their utilization in various markets. Examples of how package simulation & modeling, design for manufacturability, and assembly methods must be aligned during the early stages of the applications engineering process in order to obtain the best performance for RF MEMS devices will also be presented.

Biography
Iris Labadie is the Market Development Specialist working in Marketing and New Product Development for Kyocera America, Inc. She has held several engineering positions in the microelectronics industry in both defense and commercial companies. She has an MBA from the University of Redlands. Her current focus is on new semiconductor devices and materials and related future packaging technology and assembly methods.

THIS THURSDAY: Central Texas Chapter October 29 Electronics Design & Manufacturing Symposium & Vendor Show    ^ Top

Dates: Thursday, October 22
Location:

Norris Conference Center at Northcross Mall (backside)
2525 West Anderson Lane
Austin, Texas
Click here for Map and Directions

Registration:

This event is complimentary for IMAPS members and non-members.
Click Here to Register

10:30 – 5:00  Exhibit Hall Hours  

11:10    Cheryl Tulkoff of DfR Solutions
"Manufacturing and Reliability Challenges With QFN"

12:00   Complimentary Lunch

1:20     Kim-Marie Vo of Freescale Semiconductor
                "Intellectual Property Law: What Non-Attorneys Should Know"

2:40     Ray Prasad of Ray Prasad Consultancy Group
               "Troubleshooting SMT Yield Problems in a Tin-Lead and Lead Free World"

3:20      Afternoon refreshments and networking

3:40     Keynote Presentation, Dr. Dan Baldwin of Engent
               "New and Emerging Technologies in Electronics"

 

NEXT WEEK: Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009
Location:

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:

Applications

  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors

Design

  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004
e-mail: gisela.dittmar@imaps.de

More information is on-line at: http://www.imaps.de

NEXT WEDNESDAY: Metro Chapter Dinner Presentation on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 5:30 PM Start - Registration, Networking and Dinner
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Registration:

Members: $25.00 if Pre-Registered by October 26, 2009.
$50.00 after October 26, 2009

Non-Members: $50.00 if Pre-Registered by October 26, 2009.
$75.00 After October 26, 2009

Student Members: Free if Pre-Registered by October 26, 2009.
$25.00 after October 26, 2009

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering.

Pre Registration Email: metroimaps@optonline.net
Phone: Steve Lehnert (631) 379-8239  

Leverage Your ERP System & Lean Manufacturing Strategies to Cut Inventory Costs

Are you being squeezed on costs from your customers and global competition? Find out how you can leverage your ERP system to shrink inventory costs, free up manpower and accelerate your lean manufacturing results.  This presentation will present a step by step methodology to implementing true demand based pull throughout your extended supply chain using Kanban. 
What you”ll Learn:

  • How to determine if your business is a good candidate for Pull/Kanban
  • Establishing the critical few parts to get the most benefit
  • How to enable an extended supply chain pull system
  • How to simplify inventory control

Who should attend?
If you are an operations professional, materials or purchasing manager or business owner and are constantly struggling with part shortages, supplier issues or demand fluctuations you should attend.

Speaker:

Ronald E. Loveland
Ron Loveland, partner at Summit Business Solutions is an expert lean trainer and practitioner.  He is a certified Lean Practitioner by NIST and a graduate of Toyota University.  Ron Loveland has over 25 years of manufacturing, leadership, general management, business development, and operations experience. As a Black Hawk Program Manager at United Technologies’ Sikorsky Aircraft division, Ron was responsible for all phases of design, development, production, financial management, business development and after market support domestically and internationally for this state-of-the-art complex aircraft. Ron’s diverse assignments include General Manager of a heating & air conditioning dealership, Strategic Business Unit manager of an engineering & test laboratory, and Regional Manager for Northeast Sales for an international industrial automation manufacturer, where he led a team of direct sales people and distributors. As a process improvement consultant he helps business reduce cost and improve customer satisfaction.  Ron holds an engineering degree from West Point and an MBA from Rensselaer Polytechnic Institute.

About Summit Business Solutions:
Summit is a consulting and training firm that specializes in Lean Six Sigma, Supply Chain Management and Quality Management Systems.  Among its many deliverables Summit offers on site IPC Solder Certification Training and ISO compliance programs.  To learn more email info@summitbizpro.com or visit summit at www.summitbizpro.com.

NEXT WEDNESDAY: Chesapeake Chapter Fall Technical Symposium on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 3:00 pm Start
Location:

Applied Physics Laboratory of Johns Hopkins University
       11100 Johns Hopkins Road, Laurel, MD  20723
        Click here for map and directions
        Enter in the area marked Lobby 1 and check-in Bruce Romenesko

Registration:

IMAPS Members-$20, non-members-$30, and students-$5.00. 
        On-line registration by credit card.  Checks/cash only on-site.
        Please register on-line by Friday, October 23.
        Click here to register
 

Program:

3:00  Networking, opening remarks, and introductions. 

3:30  Alain Briancon of NTERA
           “Printed Electro-chromic Displays: Technology and Applications.”

4:00 Diganta Das of the University of Maryland
           “"Counterfeit Electronics - It is not Only a Components Issue"

4:30 Break

4:45 Dimos Katsis of Athena Energy, LLC
            “Power electronic inverter packaging.”

5:15  Susheel Dharia of Kyocera America
             "Material Trade-offs in Designing Ceramic Packages."

5:45 Dinner (teriyaki chicken), Closing Remarks, and Chapter Business (elections)
 
6:15 Optional Tour
The tour will cover a small volume, prototyping microcircuit facility with substrate fabrication and microelectronics assembly clean rooms ranging from 100,000 to 1,000 ppm classification.  The substrate fabrication capabilities include a number of common supporting technologies including thin film deposition and etching, surface and bulk micromachining, micro plating, fine-line photolithography, laser machining and diamond saw dicing.  MEMS fabrication and post-processing capabilities have recently been expanded.  The microelectronic assembly capabilities include die attach, wire bonding, flip chip bonding for area array packaging, package sealing and specialized test and probing equipment. 

NEXT WEEK: Arizona Chapter October 29 Lunch Meeting Discussing Implantable Medical Devices    ^ Top

Dates: Thursday, October 29
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00 – 1:00
Location:

Dobson Ranch Library
2425 South Dobson Road
Mesa, AZ 85202
Tel: 480-644-3441

Registration:

Attendees - $5
Tabletops available for $15

http://www.imaps.org/registration/az2009oct.htm

greg.clemons@live.com 

Implantable Medical Devices Past Successes; Current Status; Future Possibilities and Challenges

Peter Tortorici, PhD
Medtronic

Medical devices have been instrumental in successfully treating chronic diseases with fifty years of success treating chronic heart conditions via implantable pacemakers and about twenty years of similar success treating sudden cardiac death via implantable cardio defibrillators. Device therapy has since migrated beyond traditional cardiac care into treating diseases such as Parkinson’s, diabetes, and chronic pain. Information on the latest advancements in the electronics industry to drive size, reliability improvement, and cost (all while increasing functionality), along with the need to adapt to the ever-changing market and regulatory dynamics will be presented. A review of implantable medical devices for cardiac care will be shown with examples of how the therapies have migrated to treat a variety of illnesses. Examples of technology innovations and final thoughts on future innovation and challenges will be shared.

Cleveland/PIttsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute    ^ Top

Dates: Monday, November 16
Schedule: 12 noon start - registration, networking, lunch
Location:

Ohio Aerospace Institute
22800 Cedar Point Road,  Cleveland, Ohio 44142
PH 440-962-3000,  FAX 440-962-3200, Email: JoyceRobertson@oai.org
Directions and Maps

Registration:

Please RSVP before Friday, November 12 at 5:00 pm EST
IMAPS members - $ 15.00.  Non-members - $ 25.00.  Students – $ 5.00
On-line Registration

12:00   Welcome and Introductions
             Liangyu Chen, OAI, and Brian Schieman, IMAPS 

12:15   Lunch and Networking

1:00    “Advanced TPG Materials for Thermal Management of Electronics.”
            Xiang Liu, Application Development Engineer of  Momentive Performance Materials

1:30   “IC Attachment Options, Application Dependence.”
           Ralph Klouda, Senior Product Engineer of HANA Microdisplay Technologies

2:00    “Integrated Circuitry Approaches and Options.”
            
Chandra Raj, Product Line Manager, and Mark Kohoot, Senior Director of ViaSat

2:30    “Competing in a Global Market: Manufacturing Miniaturized medical Devices and Sensors.”
             
Donald Styblo, VP of Technology of Valtronic Technologies (USA), Inc.

3:00    Wrap-up, future events, and chapter leadership


  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

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Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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