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October 27, 2009

TJ Green Associates, LLC

Button IMAPS 2009 - On-line Registration Closes Tomorrow - Wednesday (read more...)

Button Read all IMAPS 2009 Abstracts and Get Ready for Next Week's Symposium Using the Program-at-a-Glance (read more...)

Button Be Sure To Visit These Companies While Attending IMAPS 2009 Next Week (read more...)

Button GBC Marketing Forum - Recovery of the Semiconductor Market (read more...)

Button IMAPS 2009 - Announcing Complimentary Tutorial on Electronics, Energy, and the Environment (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Metro Chapter Dinner Presentation on October 28 (read more...)

Bullet TOMORROW: Chesapeake Chapter Fall Technical Symposium on October 28 (read more...)

Bullet THIS THURSDAY: Arizona Chapter October 29 Lunch Meeting Discussing Implantable Medical Devices (read more...)

Bullet Cleveland/PIttsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute (read more...)

Bullet New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

IMAPS 2009 - On-line Registration Closes Tomorrow - Wednesday   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.

On-line Registration closes tomorrow, Wednesday, October 28. Register today to avoid the long lines in San Jose. Learn more about IMAPS 2009 and register on-line at

Read all IMAPS 2009 Abstracts and Get Ready for Next Week's Symposium Using the Program-at-a-Glance   ^ Top
The 2009 symposium returns to Northern California next week from November 1-5 at the McEnery Convention Center in San Jose, California.
On-line Registration closes tomorrow, Wednesday, October 28. Register today to avoid the long lines in San Jose. Use the program-at-a-glance below to read all of the abstracts and link to the full conference details. Or go on-line at

Sunday, November 1
9:00 am -
5:00 pm
5:00 pm -
6:00 pm
Professional Development Course Reception (Registrants and Instructors Only)
Sponsored by Hesse & Knipps
Monday, November 2
9:00 am -
5:00 pm
5:00 pm -
7:30 pm
Welcome Reception (All are invited)
Focused Sessions Track
Materials Track
Reliability Track
Advanced Technologies Track
Emerging Technology Track
Tuesday, November 3
8:00 am -
11:10 am
11:00 am -
5:30 pm
11:25 am -
11:40 am
11:40 am -
12:00 pm
12:00 pm -
12:45 pm
Keynote Presentation
Dr. Bradley McCredie, IBM
12:50 pm -
1:50 pm
Lunch Kiosks (Food not provided by IMAPS)
Focused Sessions Track
Materials Track
Reliability Track
Advanced Technologies Track
Emerging Technology Track
1:55 pm -
5:40 pm
Wednesday, November 4
8:00 am -
11:40 am
Emerging Technologies
9:00 am -
5:30 pm
11:45 am -
12:30 pm
Keynote Presentation
Dr. Paul Franzon
12:30 pm -
1:30 pm
Lunch in the Exhibit Hall (Provided by IMAPS)
Focused Sessions Track
Materials Track
Reliability Track
Advanced Technologies Track
Interactive Track
1:35 pm -
5:25 pm
5:35 pm -
7:00 pm
Global Business Council (GBC) Marketing Forum
7:00 pm -
7:45 pm
Thursday, November 5
Focused Sessions Track
Materials Track
Reliability Track
Advanced Technologies Track
Emerging Technology Track
8:00 am -
12:00 pm
9:00 am -
12:00 pm
9:00 am -
12:00 pm
IMAPS 2010 Booth Selection in the Exhibit Hall

Be Sure To Visit These Companies While Attending IMAPS 2009 Next Week   ^ Top
The 2009 symposium returns to Northern California next week from November 1-5 at the McEnery Convention Center in San Jose, California.
On-line Registration closes tomorrow, Wednesday, October 28. Register today to avoid the long lines in San Jose.

Be sure to visit the exhibiting companies at the booths listed below to learn more about how their innovative products and services can help your bottom line! Go on-line at for more details.



Accumet Engineering Corp.


Accu-Tech Laser Processing, Inc.


AdTech Ceramics


AI Technology, Inc.


Air-Vac Engineering Company


All Flex Flexible Circuits




Amtech Microelectronics, Inc.


Asahi Glass Company


ASM Pacific Technology, Ltd.


Azimuth Electronics, Inc.


BE Semiconductor Industries NV


Blue Oceans LLC


CAD Design Software, Inc.


Chip Supply, Inc.


Coining, Inc.


Co-Planar, Inc.


CPS Technologies Corporation


Crane Interpoint Corporation


Cyber Technologies USA


Dage Precision Industries, Inc.


Deweyl Tool Company, Inc.


DPA Components International


DuPont Electronic Technologies


EFD, Inc.


Epoxy Technology, Inc.


ES Components, Inc.


ESL ElectroScience


F & K Delvotec, Inc.


Ferro Electronic Material Systems


Finetech, Inc.


Flex Interconnect Technologies


FRT of America, LLC


Geib Refining Corporation




Haiku Tech, Inc.


Harrop Industries, Inc.


Henkel Corporation


Heraeus Thick Film Division




Hesse & Knipps GmbH


Hi-Rel Laboratories


Indium Corporation of America


Infinite Graphics, Inc.


INTA Technologies


Integra Technologies


Interconnect Systems, Inc.


Interplex Engineered Products, Inc.


Kyocera America, Inc.


Kyzen Corporation


Laser Tech, Inc.


LINTEC Corporation


MAIREC Edelmetallgesellschaft GmbH




Metallix Refining, Inc.


MicroConnex Systems, Inc.


Micropac Industires, Inc.


MicroScreen LLC


Micross Components Corp.


Minco Technology Labs, Inc.


Mini-Systems, Inc.


Multek, Inc.


Mundt & Associates, Inc.


NAMICS Corporation




nanosystec, GmbH


Natel Engineering Co., Inc.


Newport Corporation


NorCom Systems, Inc.


NTK Technologies, Inc.


NuSil Technology, Inc.


Orthodyne Electronics


Pac Tech Packaging Technologies USA


Pacific Aerospace & Electronics


Palomar Technologies, Inc.


Panasonic Factory Solutions Company of America


Perfection Products, Inc.


Photochemie AG


Precision Ferrites and Ceramic, Inc. (PFC)


Reinhardt Microtech GmbH


Reldan Metals, Inc.


Riv, Inc.


Rogers Corporation


Royce Instruments, Inc.


SEFAR Printing Solutions, Inc.


Semi Dice, Inc.


Semiconductor Equipment Corporation


Sierra Circuits, Inc.


Sikama International, Inc.


Smart Equipment Technology (S.E.T.)


SMT/ Advanced Packaging Magazine


Sonoscan, Inc.


SST International


Stellar Industries Corp.


Stellar Microelectronics Inc.




Tango Systems, Inc.


TDK Corporation


Technic, Inc.


Teledyne Microelectronic Technologies, Inc.


Toray Engineering Co., Ltd.


Torrey Hills Technologies, LLC


Towa Corporation


Trebor Instrument Corp.


Tresky Corporation


Unichem Industries, Inc.


VIOX Corporation


West-Bond, Inc.


Williams Advanced Materials


YESTech, Inc.


YXLON International, Inc.



GBC Marketing Forum - Recovery of the Semiconductor Market   ^ Top
The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.
Learn more about the GBC Marketing Forum, IMAPS 2009 and register on-line at

Wednesday, November 4, 2009
San Jose McEnery Convention Center
5:35 pm - 7:00 pm


2009 Fall Forum Chair:
Dave Seeger, IBM

This GBC-Marketing Forum is a business session for all IMAPS 2009 attendees who wish to participate. A Networking Reception will follow from 7:00 pm to 7:45 pm. Pre-registration is strongly recommended in order to plan the reception. Register on-line at

Mr. Andrea Lati, VLSI Research

“State of the Semiconductor Industry”

Mr. Andrea Lati, Market Research Analyst of VLSI Research Inc.
Mr. Lati will present the latest forecast and analysis for the semiconductor industry. The presentation focuses on scenarios that will drive the recovery of the semiconductor industry and the supply chain. It will also describe why the semiconductor industry will emerge leaner but stronger from the recent downturn, ready to take advantage of opportunities that lie ahead.

About Mr. Lati:
Andrea Lati is a market research analyst at VLSI Research Inc. Since joining VLSI Research in 2001, Andrea has been focusing on managing and developing forecasting models as well as performing market analysis and research on electronics and semiconductor markets. He is responsible for developing forecasting models that are used to generate the Industry Pulse Pro, Electronics and Macroeconomy Forecast, Semiconductor Forecast, Silicon Demand Forecast, Reticle Demand Forecast, and Packaging Forecast. In addition, Andrea has performed several custom studies for various clients and is a co-author of The Chip Insider ®.

About VLSI:
VLSI Research Inc. is the leading provider of market research and economic analysis on the technical, business, and economic aspects of the high technology chip making industry. The company is known for its unparalleled accuracy, innovation in market research, and its sharply focused insight into the rapidly changing landscape of the chip making business. VLSI Research’s databases on chip making are used throughout the industry, the investment community, and by governments for decisive strategic planning. VLSI Research was founded in 1976 and incorporated in California in 1981. The company’s website is

Mr. Shawn DuBravac, Consumer Electronics Association

“The State and Impact of Consumer Technologies on Semiconductors: Key Drivers, Disrupters and Developments”

Mr. Shawn DuBravac, Director of Research of the Consumer Electronics Association
Mr. DuBravac will share CEA’s insights of the technology trends and future economic health of the consumer electronics industry and speak to the impact of various electronics on the semiconductor industry. Highlights of the presentation include: results of the global economic stimulus plans; trends and demand curves for next generation multipurpose electronics; challenges of bridging the gaps within increasingly complex networked environments; and the resulting impact on the semiconductor industry from the evolving consumer performance expectations and overarching market trends.

About Mr. DuBravac:
Shawn DuBravac is Director of Research and Economist for the Consumer Electronics Association (CEA). He directs CEA’s economic analysis, consumer research, and helps oversee the day-to-day operations of CEA’s many research initiatives. He is responsible for handling analyses of the economy as it relates to the CE industry including forecasting future economic activity, econometric studies, examining trade flows, and ascertaining relative health of the industry. DuBravac also provides research into the technology trends underpinning the industry and quantitative support for CEA’s legislative initiatives. He is a Chartered Financial Analyst.

About the Consumer Electronics Association (CEA):
The Consumer Electronics Association (CEA) unites 2,200 companies within the consumer technology industry. CEA is its industry’s authority on market research and forecasts, consumer surveys, regulatory news, and engineering standards. For more information on CEA market analysis, please see


IMAPS 2009 - Announcing Complimentary Tutorial on Electronics, Energy, and the Environment    ^ Top
Harry K. Charles, Jr. Ph. D.

Wednesday, November 4, 2009 – 1:35pm-5:25pm
McEnery Convention Center, Room A7

Registration is complimentary for all attendees. Reserve your seat today: and follow the link to "complimentary exhibit passes". Or email Brian Schieman,, to reserve your seat.


Energy availability and its cost are major concerns to every person.  Fossil fuels in general and oil in particular, are limited and the world’s reserves are depleting. In addition, the proliferation of electronic products and their manufacture now pose additional threats to the fragile balance in the Earth’s eco systems. While posing threats, electronics can be the solution to many of our current and future environmental and energy related problems.   The environmental threats from electronics can be significantly reduced or eliminated through environmentally responsible design manufacture, distribution, usage, and end-of-life disposal. This introductory overview outlines how the electronics industry has been responsive to the environmental challenges as well as providing alternatives to or reductions in fossil fuels and their high carbon footprint. Highlights will include: a discussion of  “green” electronics; the potential impact of the widespread deployment of photovoltaic devices, the case for solid state lighting, improvements in battery technology; and nano-electronics.

Who Should Attend?
Engineers, managers, venture capitalists, and any individual interested in the progress the electronics industry has made in the development of “green” electronics and the potential of electronics technology to make significant impact on reducing fossil fuel usage.

Instructor Bio:
Dr. Charles holds B.S. and Ph.D. degrees in Electrical Engineering from Drexel University and The Johns Hopkins University, respectively. He is Chief Engineer of the Milton S. Eisenhower Research Center at the Johns Hopkins University Applied Physics Laboratory. Dr. Charles has 30 years experience in the microelectronics arena focusing on solid state physics, electronic devices, packaging, and reliability. His latest interests include: ultra-thin modules; advanced interconnect; biomedical instrumentation; nano-scale electronics; and alternative energy. He has published over 200 papers and holds thirteen patents and several pending patent applications. Dr. Charles is a Fellow and former President of IMAPS, a Fellow of IEEE, and a past member of the Board of Governors of the IEEE’s Components Packaging and Manufacturing Technology (CPMT) Society. He has received international recognition for his research, development, and teaching activities. Dr. Charles has taught for over 25 years in the Johns Hopkins University Engineering Programs for Professionals (JHUEPP). He developed 9 new courses and is currently chair of the Applied Physics program in the JHUEPP. He also holds the Office of Naval Research Distinguished Chair for Science and Technology at the US Naval Academy.

  Chapter Activities (events listed in chronological order)

TOMORROW: Metro Chapter Dinner Presentation on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 5:30 PM Start - Registration, Networking and Dinner

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779


Members: $25.00 if Pre-Registered by October 26, 2009.
$50.00 after October 26, 2009

Non-Members: $50.00 if Pre-Registered by October 26, 2009.
$75.00 After October 26, 2009

Student Members: Free if Pre-Registered by October 26, 2009.
$25.00 after October 26, 2009

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering.

Pre Registration Email:
Phone: Steve Lehnert (631) 379-8239  

Leverage Your ERP System & Lean Manufacturing Strategies to Cut Inventory Costs

Are you being squeezed on costs from your customers and global competition? Find out how you can leverage your ERP system to shrink inventory costs, free up manpower and accelerate your lean manufacturing results.  This presentation will present a step by step methodology to implementing true demand based pull throughout your extended supply chain using Kanban. 
What you”ll Learn:

  • How to determine if your business is a good candidate for Pull/Kanban
  • Establishing the critical few parts to get the most benefit
  • How to enable an extended supply chain pull system
  • How to simplify inventory control

Who should attend?
If you are an operations professional, materials or purchasing manager or business owner and are constantly struggling with part shortages, supplier issues or demand fluctuations you should attend.


Ronald E. Loveland
Ron Loveland, partner at Summit Business Solutions is an expert lean trainer and practitioner.  He is a certified Lean Practitioner by NIST and a graduate of Toyota University.  Ron Loveland has over 25 years of manufacturing, leadership, general management, business development, and operations experience. As a Black Hawk Program Manager at United Technologies’ Sikorsky Aircraft division, Ron was responsible for all phases of design, development, production, financial management, business development and after market support domestically and internationally for this state-of-the-art complex aircraft. Ron’s diverse assignments include General Manager of a heating & air conditioning dealership, Strategic Business Unit manager of an engineering & test laboratory, and Regional Manager for Northeast Sales for an international industrial automation manufacturer, where he led a team of direct sales people and distributors. As a process improvement consultant he helps business reduce cost and improve customer satisfaction.  Ron holds an engineering degree from West Point and an MBA from Rensselaer Polytechnic Institute.

About Summit Business Solutions:
Summit is a consulting and training firm that specializes in Lean Six Sigma, Supply Chain Management and Quality Management Systems.  Among its many deliverables Summit offers on site IPC Solder Certification Training and ISO compliance programs.  To learn more email or visit summit at

TOMORROW: Chesapeake Chapter Fall Technical Symposium on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 3:00 pm Start

Applied Physics Laboratory of Johns Hopkins University
       11100 Johns Hopkins Road, Laurel, MD  20723
        Click here for map and directions
        Enter in the area marked Lobby 1 and check-in Bruce Romenesko


IMAPS Members-$20, non-members-$30, and students-$5.00. 
        Registration at the door.  Checks/cash only on-site.


3:00  Networking, opening remarks, and introductions. 

3:30  Alain Briancon of NTERA
           “Printed Electro-chromic Displays: Technology and Applications.”

4:00 Diganta Das of the University of Maryland
           “"Counterfeit Electronics - It is not Only a Components Issue"

4:30 Break

4:45 Dimos Katsis of Athena Energy, LLC
            “Power electronic inverter packaging.”

5:15  Susheel Dharia of Kyocera America
             "Material Trade-offs in Designing Ceramic Packages."

5:45 Dinner (teriyaki chicken), Closing Remarks, and Chapter Business (elections)
6:15 Optional Tour
The tour will cover a small volume, prototyping microcircuit facility with substrate fabrication and microelectronics assembly clean rooms ranging from 100,000 to 1,000 ppm classification.  The substrate fabrication capabilities include a number of common supporting technologies including thin film deposition and etching, surface and bulk micromachining, micro plating, fine-line photolithography, laser machining and diamond saw dicing.  MEMS fabrication and post-processing capabilities have recently been expanded.  The microelectronic assembly capabilities include die attach, wire bonding, flip chip bonding for area array packaging, package sealing and specialized test and probing equipment. 

THIS THURSDAY: Arizona Chapter October 29 Lunch Meeting Discussing Implantable Medical Devices    ^ Top

Dates: Thursday, October 29
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00 – 1:00

Dobson Ranch Library
2425 South Dobson Road
Mesa, AZ 85202
Tel: 480-644-3441


Attendees - $5
Tabletops available for $15 - on-line registration closes today 

Implantable Medical Devices Past Successes; Current Status; Future Possibilities and Challenges

Peter Tortorici, PhD

Medical devices have been instrumental in successfully treating chronic diseases with fifty years of success treating chronic heart conditions via implantable pacemakers and about twenty years of similar success treating sudden cardiac death via implantable cardio defibrillators. Device therapy has since migrated beyond traditional cardiac care into treating diseases such as Parkinson’s, diabetes, and chronic pain. Information on the latest advancements in the electronics industry to drive size, reliability improvement, and cost (all while increasing functionality), along with the need to adapt to the ever-changing market and regulatory dynamics will be presented. A review of implantable medical devices for cardiac care will be shown with examples of how the therapies have migrated to treat a variety of illnesses. Examples of technology innovations and final thoughts on future innovation and challenges will be shared.

Cleveland/PIttsburgh Chapter November 16 Lunch Meeting at Ohio Aerospace Institute    ^ Top

Dates: Monday, November 16
Schedule: 12 noon start - registration, networking, lunch

Ohio Aerospace Institute
22800 Cedar Point Road,  Cleveland, Ohio 44142
PH 440-962-3000,  FAX 440-962-3200, Email:
Directions and Maps


Please RSVP before Friday, November 12 at 5:00 pm EST
IMAPS members - $ 15.00.  Non-members - $ 25.00.  Students – $ 5.00
On-line Registration

12:00   Welcome and Introductions
             Liangyu Chen, OAI, and Brian Schieman, IMAPS 

12:15   Lunch and Networking

1:00    “Advanced TPG Materials for Thermal Management of Electronics.”
            Xiang Liu, Application Development Engineer of  Momentive Performance Materials

1:30   “IC Attachment Options, Application Dependence.”
           Ralph Klouda, Senior Product Engineer of HANA Microdisplay Technologies

2:00    “Integrated Circuitry Approaches and Options.”
Chandra Raj, Product Line Manager of ViaSat

2:30    “Competing in a Global Market: Manufacturing Miniaturized medical Devices and Sensors.”
Donald Styblo, VP of Technology of Valtronic Technologies (USA), Inc.

3:00    Wrap-up, future events, and chapter leadership

New England Chapter November 17 Dinner Meeting on Copper Cold Spray Thermal Management and Solderable Surfaces    ^ Top

Dates: Tuesday, November 17
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:30 PM Technical Presentation

Holiday Inn Boxborough Woods
Route I-495 exit 28 [Route 111] in Boxborough, Mass.
After exiting highway, proceed 300 yards east, turn right onto Adams Place. Holiday Inn is 1/8 mile on left.
Phone (978) 263-8701


There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Dinner $30.00 (Non-member) $25.00 (Member) $20.00 (Retired) $5.00 (Student) - At-door registration is an additional $5.00.

Send Registrations to: Susan Munyon 96 Grant Way, Lancaster, MA 01523-3112 e-mail or phone 978-466-1877

Copper Cold Spray Thermal Management and Solderable Surfaces
Mr. Victor Champagne - Advanced Materials and Processes Team Technical Leader
US Army Research Laboratory (ARL)

This presentation will provide a basic understanding of an emerging technology, referred to as ‘Cold Spray’, which has evolved from a laboratory curiosity to a production viable process. Cold Spray is a materials deposition process whereby combinations of metallic and non-metallic particles are consolidated to form a coating or freestanding structure by means of ballistic impingement upon a suitable substrate. Cold spray is often compared with traditional thermal spray processes and although there are certain similarities, it is important to recognize the fundamental differences between them in order to determine which technique are best suited for electronic applications. There is substantial data to suggest that cold spray has a niche in the marketplace; however, it must also be realized that cold spray does have limitations that should be acknowledged in order to prevent misuse of the technology.

Mr. Champagne is a research materials engineer who has worked for the US Army Research Laboratory (ARL) and its predecessor organizations for over 24 years. He has been the technical leader for the Advanced Materials and Processes Team since 1986, where he conducts research and development programs in coatings and advanced materials and processing technologies. His research efforts have focused on the development of emerging technologies, which can be implemented into production and the field. He is internationally recognized as an expert in Cold Spray Technology and has established the ARL Cold Spray Center located in Aberdeen, MD whose focus is the development of cold spray applications for DOD and Industry. Over the past year he was awarded the prestigious U.S. Army Research and Development Achievement Award and also the Defense Manufacturing Excellence Award for his Research in Cold Spray. He was the editor of the first comprehensive reference book on cold spray for The Institute of Materials, Minerals and Mining (IoM3) published by Woodhead Publishing. He also serves as a Research Associate at Worcester Polytechnic Institute and as a liaison to Natick Laboratories, both located in MA. He is also a Thesis Advisor for graduate students at several universities including the Pennsylvania State University and manages over $23M in projects and programs for ARL.

  Membership, Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to or feel free to contact me at the phone/e-mail below.



Lorac - Furnace Experts

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact

^ Top

Compex Corp

Oneida Research Services


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