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October 7, 2009

TJ Green Associates, LLC

Button IMAPS 2009 PDCs Filling Up Fast (read more...)

Button Electrical Modeling Webinar Begins Tuesday (read more...)

Button IMAPS 2009 Speaker Dr. Thorsten Matthias, EV Group, Holding Interactive Forum Discussion on 3D Integration Next Week (read more...)

Button Device Packaging 2010 - Now Available On-line (read more...)

Button ATW on Printed Devices and Appilcations - Now Accepting Abstracts and Tabletop Booths (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Chicago/Milwaukee Fall Technical Symposium on October 20 (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

Bullet Metro Chapter Dinner Presentation on October 28 (read more...)

Bullet Chesapeake Chapter Fall Technical Symposium on October 28 (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

IMAPS 2009 PDCs Filling Up Fast   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.
Learn more about IMAPS 2009 and register on-line at

All PDCs run 9:00 am - 5:00 pm, unless otherwise noted

Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community.  So please be sure to choose from the 15 in-depth Professional Development Courses taught by recognized industry experts.  You will discover the following key ways that will benefit you.

Better understand the skills and knowledge necessary in today’s industry.
  • Be exposed to the rapidly expanding developments in new materials and technologies.
  • Consult with renowned authorities about your current R&D or manufacturing problems and challenges.
  • Learn new ways to identify, think about, and address your problems and opportunities.
  • Great opportunities to interact with industry experts and other course attendees.
  • Certificate of Attendance and much more…

Your PDC Registration Fee Includes:

  • Lunch on the day of your course
  • Refreshment breaks
  • All course materials
  • PDC Reception on Sunday evening (for Attendees & Instructors only)
  • Certificate of Attendance
Sunday, November 1
Monday, November 2

S1: RF/Microwave Hybrids:
Basics, Materials and Processes

S2: Advanced Packaging for Power and Energy

S3: Hybrid Visual Inspection per Mil-STD-883

S4: Design and Analysis of Experiments

S5: Plating Processes for High Reliability Microelectronic Devices

S6: Multilayer Co-fired Ceramics

S7 - ½ day: 9 am - Noon
Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

S8 - ½ day: 1 pm - 5 pm
Reliability of Lead-Free System - How to Alleviate Failures - Practical Issues

M1: Wire Bonding in

M2: High-Performance Thermal
Management Materials

M3: Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts

M4: Introduction to Microelectronics Packaging Technology
M5: Technology of Screen Printing

M6: TSV and Other Enabling Technologies for 3D IC Integration and WLP

M7: Electronics, Energy, and the Environment
Register on-line at

Electrical Modeling Webinar Begins Tuesday    ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held
Tuesdays, October 13 and 20, 2009.
All webinars will be held 10:00 am - 11:00 am EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadline: October 12, 2009 Register On-line

Program Description

Successful and low-cost design of electronic packages and boards requires (in addition to thermal and thermo-mechanical issues), a good understanding of the root causes of signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) issues, as well as methods to analyze, prevent or solve them.

The objective of this course is to provide methods for accurate and efficient electrical modeling, measurement and analysis of packages and PCBs, under consideration of SI, PI and EMI/EMC issues. Techniques for characterizing dielectric materials in dependent on frequency and temperature will also be discussed. Finally, guidelines for optimizing the electrical performance of high-speed packages and PCBs will be provided.

Outline of Sessions:

  • Root causes of SI, PI and EMI/EMC problems, and how they affect system performance.
  • Methods for electrical modeling, simulation and measurement of packaging structures under consideration of SI, PI and EMI/EMC issues.
  • Examples of packaging structures that will be considered include: Transmission lines, layer stack-up with power-ground plane pairs, decoupling capacitors, vias and solder balls.
  • Methods for extracting the relative dielectric constant and loss tangent of dielectric materials in dependent on temperature and frequency.
  • Guidelines for optimizing the electrical performance of high-speed packages and PCBs.

Who Should Attend?

Engineers, scientists, researchers, designers and managers involved in the process of electrical modeling, layouts and/or design of single-chip packages, system packages (e.g., SiPs, SoPs, MCMs), PCBs and their interconnections.


Dr. Ivan Ndip - Ivan Ndip obtained his M.Sc. and Ph.D. with the highest distinction (Summa Cum Laude) in electrical engineering from the Technische Universitaet Berlin, Germany. In 2002, he joined the Fraunhofer-Institute for Reliability and Microintegration (IZM) Berlin as a research engineer and in 2005 he was appointed Group Manager. Since then, he has been responsible for developing and leading research projects at IZM that focus on modeling, simulation, measurement, design and optimization of RF/high-speed packages and PCBs, integrated antennas and passive RF front-end components.

In addition to his research at IZM, Dr. Ndip also teaches graduate courses on Electromagnetic Reliability (EMR) of Microsystems at the Technische Universitaet Berlin.

He has won 4 best paper awards at leading international conferences. He is also a recipient of the Tiburtius-Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin.

Prof. Ege Engin - Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. He received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany in 2004.

Dr. Engin has worked as a research engineer with the Fraunhofer-Institute for Reliability and Microintegration in Berlin, Germany and at Georgia Tech. He is currently an Assistant Professor in the Electrical and Computer Engineering Department of San Diego State University. He has more than 60 publications in the areas of signal and power integrity modeling and simulation and 4 patent applications. He has co-authored the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007. Register On-line

IMAPS 2009 Speaker Dr. Thorsten Matthias, EV Group, Holding Interactive Forum Discussion on 3D Integration Next Week    ^ Top
Join 3D InCItes Monday, Oct. 12 – Friday, Oct. 16 for an interactive forum discussion about the advances of lithography and wafer bonding solutions for 3D integration with Dr. Thorsten Matthias, Director of Technology, EVG North America.

As the feasibility of TSVs has been well established in the semiconductor industry, the focus has now shifted to the manufacturability and integration of all the different building blocks for TSVs and 3D Interconnects. Dr. Matthias will give a sneak preview of what attendees will learn at IMAPS 2009, the 42nd International Symposium on Microelectronics which will take place in San Jose from November 1-5, 2009, and give an opportunity to pose questions prior to the event. At the event itself Dr. Matthias will present a paper in the Advanced Technologies conference track.

Thorsten Matthias is director of technology of EV Group North America in Tempe, AZ. In 2002 he received his PhD from Vienna University of Technology with a thesis in solid-state physics. He started working at EV Group in October 2002. In his current position he works in lithography, thin wafer processing, permanent and temporary wafer bonding in MEMS, advanced packaging, 3-D integration, compound semiconductors and nanotechnology.

Program and registration for IMAPS 2009 on-line at

Device Packaging 2010 - Now Available On-line    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2010 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2009, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than November 30, 2009.

ATW on Printed Devices and Appilcations - Now Accepting Abstracts and Tabletop Booths    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held February 23 - 25, 2010, at the International Plaza Resort in Orlando, Florida. Abstracts are due by November 25, 2009. The call for abstracts, exhibit reservation details and full event information can be found on-line at

Printed Devices & Applications Workshop Focus:

The objective of the Printed Devices Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics as an emerging packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Antennas
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present a paper at the Printed Devices & Applications Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 25, 2009, using the on-line submittal form at: Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 22, 2010.

Please contact Jackki Morris-Joyner by email at or by phone at 202-548-4001 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.


  Chapter Activities (events listed in chronological order)

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Chicago/Milwaukee Fall Technical Symposium on October 20    ^ Top

Dates: Tuesday, October 20
Schedule: 11:30 AM Start - Registration, Networking and Lunch

TDK Corporation of America
1221 Business Center Drive
Mt. Prospect, IL 60056
Tel: 972-409-4519 (Sara Reynoso)
Click here for MapQuest


IMAPS Members-$15, non-members-$25, and students - $ 5. 
Pre-registered, job-displaced IMAPS members $5.00. 
Click here for on-line registration.  ( Space may be limited for on-site registration ! )   


11:30 Registration and Networking

12:00 Lunch

12:45  Welcome and Introductions

1:00  Gene Dunn of Panasonic
           “Atmospheric Plasma Cleaning Technology for Microelectronics and Packaging."

1:30 Gordon Smith of GSI Technologies  
           “Manufacturing of Electro-chromic Displays Utilizing Fully Additive Methods.” 

2:00 Refreshment Break

2:15 Victor Zaderej of Molex
           “The Future of Solid State Lighting."   

2:45 Iris Labadie of Kyocera America
             “Material Trade-offs in Designing Ceramic Packages.”

3:15 Phil Couts of TDK
        “Advances in Thermosonic Flip Chip Gold-to-Gold Interconnect for CMOS Assembly."

3:45  Optional – Tables and Poster Presentations of Presenters and NIU students.


Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:


  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors


  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004

More information is on-line at:

Metro Chapter Dinner Presentation on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 5:30 PM Start - Registration, Networking and Dinner

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779


Members: $25.00 if Pre-Registered by October 26, 2009.
$50.00 after October 26, 2009

Non-Members: $50.00 if Pre-Registered by October 26, 2009.
$75.00 After October 26, 2009

Student Members: Free if Pre-Registered by October 26, 2009.
$25.00 after October 26, 2009

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering.

Pre Registration Email:
Phone: Steve Lehnert (631) 379-8239  

Leverage Your ERP System & Lean Manufacturing Strategies to Cut Inventory Costs

Are you being squeezed on costs from your customers and global competition? Find out how you can leverage your ERP system to shrink inventory costs, free up manpower and accelerate your lean manufacturing results.  This presentation will present a step by step methodology to implementing true demand based pull throughout your extended supply chain using Kanban. 
What you”ll Learn:

  • How to determine if your business is a good candidate for Pull/Kanban
  • Establishing the critical few parts to get the most benefit
  • How to enable an extended supply chain pull system
  • How to simplify inventory control

Who should attend?
If you are an operations professional, materials or purchasing manager or business owner and are constantly struggling with part shortages, supplier issues or demand fluctuations you should attend.


Ronald E. Loveland
Ron Loveland, partner at Summit Business Solutions is an expert lean trainer and practitioner.  He is a certified Lean Practitioner by NIST and a graduate of Toyota University.  Ron Loveland has over 25 years of manufacturing, leadership, general management, business development, and operations experience. As a Black Hawk Program Manager at United Technologies’ Sikorsky Aircraft division, Ron was responsible for all phases of design, development, production, financial management, business development and after market support domestically and internationally for this state-of-the-art complex aircraft. Ron’s diverse assignments include General Manager of a heating & air conditioning dealership, Strategic Business Unit manager of an engineering & test laboratory, and Regional Manager for Northeast Sales for an international industrial automation manufacturer, where he led a team of direct sales people and distributors. As a process improvement consultant he helps business reduce cost and improve customer satisfaction.  Ron holds an engineering degree from West Point and an MBA from Rensselaer Polytechnic Institute.

About Summit Business Solutions:
Summit is a consulting and training firm that specializes in Lean Six Sigma, Supply Chain Management and Quality Management Systems.  Among its many deliverables Summit offers on site IPC Solder Certification Training and ISO compliance programs.  To learn more email or visit summit at

Chesapeake Chapter Fall Technical Symposium on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 3:00 pm Start

Applied Physics Laboratory of Johns Hopkins University
       11100 Johns Hopkins Road, Laurel, MD  20723
        Click here for map and directions
        Enter in the area marked Lobby 1 and check-in Bruce Romenesko


IMAPS Members-$20, non-members-$30, and students-$5.00. 
        On-line registration by credit card.  Checks/cash only on-site.
        Please register on-line by Friday, October 23.
        Click here to register


3:00  Networking, opening remarks, and introductions. 

3:30  Alain Briancon of NTERA
           “Printed Electro-chromic Displays: Technology and Applications.”

4:00 Diganta Das of the University of Maryland
           “"Counterfeit Electronics - It is not Only a Components Issue"

4:30 Break

4:45 Dimos Katsis of Athena Energy, LLC
            “Power electronic inverter packaging.”

5:15  Susheel Dharia of Kyocera America
             "Material Trade-offs in Designing Ceramic Packages."

5:45 Dinner (teriyaki chicken), Closing Remarks, and Chapter Business (elections)
6:15 Optional Tour
The tour will cover a small volume, prototyping microcircuit facility with substrate fabrication and microelectronics assembly clean rooms ranging from 100,000 to 1,000 ppm classification.  The substrate fabrication capabilities include a number of common supporting technologies including thin film deposition and etching, surface and bulk micromachining, micro plating, fine-line photolithography, laser machining and diamond saw dicing.  MEMS fabrication and post-processing capabilities have recently been expanded.  The microelectronic assembly capabilities include die attach, wire bonding, flip chip bonding for area array packaging, package sealing and specialized test and probing equipment. 

  Membership, Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to or feel free to contact me at the phone/e-mail below.



Lorac - Furnace Experts

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: Oct 13, 2009
Session 2: Oct 20, 2009

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact

^ Top

Compex Corp

Oneida Research Services


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