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September 16, 2009

TJ Green Associates, LLC

Early Registration and Hotel Deadlines This Friday for the Workshop and Exhibition on Thermal Management (read more...)

Button RF/Microwave Packaging Workshop Begins Tuesday - Registration Closing (read more...)

Button Guide to Component Chip Attach – Including Flip Chip Webinar Begins Tuesday (read more...)

Button IMAPS 2009, San Jose - 15 Professional Development Courses (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: Tri-Valley Chapter Fall Technical Symposium on September 16 in Santa Clarita (read more...)

Bullet TOMORROW: Carolinas Chapter Fall Technical Symposium on September 17 in Durham (read more...)

Bullet TOMORROW: Northwest Chapter September 17 Lunch Meeting at Crane Interpoint (read more...)

Bullet TOMORROW: Metro Chapter September 17 Dinner Meeting on Copper Plate Up for Enhanced Power Handling and Thermal Conductivity (read more...)

Bullet Keystone Chapter Dinner Presentations on September 24 (read more...)

Bullet IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

Early Registration and Hotel Deadlines This Friday for the ATW and Exhibition on Thermal Management    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. Program and registration details are available on-line at The early registration deadline and hotel cut-off are this Friday, September 18, 2009. Registration rates will increase at that time and IMAPS cannot guarantee hotel pricing or availability after the 18th.

Tuesday, October 6

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: Noon – 5:30 pm

Opening Remarks: 8:25 am – 8:30 am

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:30 am – 11:30 am

Thermal Challenges and Requirements in Designing for Telco/Telcom Equipment in the NEBS Environment
Herman Chu, Cisco Systems, Inc.

Thermal Management Challenges for Hybrid Vehicle Powertrain Drives
David Saums, DS&A LLC

Advanced Module Concepts
Andreas Schletz, M. März, E. Shimaneck, Fraunhofer IISB

Break: 10:00 am – 10:30 am

Thermal Characterization of High Power LEDS - An Introduction to the Issues
Bernie Siegal, Thermal Engineering Associates, Inc.

Pool-Boiling Based Heat Sink Solutions
Jesse Kim, S.M. You, Joo H. Kim, Vapro Inc.

Session 2:  Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm


Chronicles from the Frequency Domain: Benefits and Applications of AC Thermal Modeling, Simulation and Measurement
Bjorn Vermeersch, Gilbert De Mey, Jedrzej Banaszczyk, Ali Shakouri, Kofi Makinwa, Ghent University

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)


Multi Objective Optimization of Force Fed Microchannel Heat Sinks
Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi, University of Maryland

Thermal Management Requirements of Photonic Nanohole Array Sensors
Mehmet Sen, Gregory J. Kowalski, Dale Larson, Northeastern University

Characterization of Single-Phase Heat Transfer and Hydraulic Performance in Non-Uniformly Heated Microgap Channels
Ihab Andre Ali, Avram Bar-Cohen, University of Maryland; Ceferino Sanchez, William Maltz, Electronic Cooling Solutions Inc.

Break: 3:00 pm – 3:30 pm

Session 3: Liquid Cooling
Chair: John Peeples, The Citadel
3:30 pm – 5:30 pm


System Package Embedded Active Liquid Cooling using 3D-MID Technology (Molded Interconnect Devices)
Thomas Leneke, Sören Hirsch, TEPROSA - Otto-von-Guericke-University Magdeburg

Cooling for IGBTs in Small Channels Based on Velocity and Length Using Common Cooling Liquid
Christopher A. Soule, Thermshield LLC

Development of Heat Pipe Loop Technology for Electronics Cooling
Xudong Tang, Jens Weyant, Scott Garner, Jon Zuo, Advanced Cooling Technologies, Inc.

Surface Roughness Effects on Boiling Heat Transfer
Benjamin J. Jones, Suresh V. Garimella, Purdue University

Dinner: 5:30 pm – 7:00 pm

Session 4: System Cooling
Chair: John Peeples, The Citadel
7:00 pm – 8:30 pm

Low Profile Heat Pipe Heat Sink and Green Performance Characterization for Next Generation CPU Module Thermal Designs
Marlin Vogel, G. Xu, D. Copeland, Sun Microsystems, Inc.; S. Kang, B. Whitney, Aavid Thermalloy; G. Meyer, Celsia; K. Kawabata, Furukawa; M. Connors, Thermacore

Thin Film Thermoelectric Heat Pump Chip Cooler
John Archibald, Northfield Engineering Company


Simulation of a Thermoelectric Adsorption Heat Pump for Harsh Environment Electronics Cooling
Ashish Sinha, Yogendra K. Joshi, Georgia Institute of Technology

Wednesday, October 7

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: 10:00 am – 3:00 pm

Session 5: Data Center Cooling
Chair: George A. Meyer IV, Celsia Technologies
8:30 am – 11:30 am

The Energy Efficiency Advantage of Water Cooling IT Equipment in the Data Center
Michael J. Ellsworth, Jr., IBM Corporation

A Scalable Thermal Management Architecture for Energy Efficient Containerized Data Center Cooling
Joe Marsala, Rob Hannemann, Thermal Form & Function Inc.

KRATOS: Automated Management of Data Center Cooling Capacity with Adaptive Vent Tiles
Alan McReynolds, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Monem Beitelmal, Rocky Shih, Hewlett Packard

Break: 10:00 am – 10:30 am

Cold Aisle Containment and Energy Efficiency of the Data Center
Ali Heydari, Veerendra Mulay, Facebook Inc.

A Cold Plate Cooling System for Servers and other Electronic Enclosures
Phil Hughes, Robert Lipp, Clustered Systems Company, Inc.

Session 6: Thermal Analysis II
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm

Thermomechanical Optimization of a Novel High Density Interconnect (HDI) Substrate
Brian R. Smith, Peter Kwok, Andrew Mueller, Livia Racz, Draper Laboratory

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)

Thermal Analysis of High Power LEDs at Dynamic Conditions
Bohan Yan, Nguyen Tran, Frank G. Shi, University of California-Irvine

Capturing PCB Artwork for Thermal Design
John Wilson, Mentor Graphics Corporation

Operating ICs Hotter to Dissipate Power
James J. Wang, Power Gold LLC

Break: 3:00 pm – 3:30 pm

Session 7: Thermal Interface Materials
Chair: Guy R. Wagner, Storage Genetics, Inc.
3:30 pm – 5:30 pm

Lead-Free Sintered Adhesives for High-Brightness Light Emitting Diode (HB-LED) Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Thermal Interface Material Performance of Commercial Particle-Filled Products with Carbon-Based Nanostructure Inclusions
Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Drazen Fabris, Cary Y. Yang, Santa Clara University

Thermally Conductive Liquid Materials for Electronics Packaging
Sanjay Misra, John Timmerman, The Bergquist Company

Metallic Thermal Interface and Die Attach Materials for IGBT Power Semiconductor Modules
Amanda Hartnett, Jordan Ross, Indium Corporation; David L. Saums, DS&A LLC; Wolfgang Bloching, Indium Corporation of Europe

Dinner: 5:30 pm – 7:00 pm

A Highly Thermally Conductive No Pump-Out Grease: Properties and Applications
Sara N. Paisner, LORD Corporation

Session 8: High Conductivity Materials I
Chair: William Maltz, Electronic Cooling Solutions
7:30 pm – 8:30 pm

Comparison of Temperature Cycling Behavior of Power Substrates Based on Different Advanced Joining Technologies and Substrate Materials
Alexander Roth, Marianna Ponomarenko, Matthias Knörr, Andreas Schletz, Fraunhofer IISB

Alkali Silicate Glass Based Hermetic Thermal Coatings
Ross Wilcoxon, Nathan Lower, Rockwell Collins, Inc.

Session 8 continues Thursday morning

Thursday, October 8

Registration: 7:30 am – 12:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 8: High Conductivity Materials I (continues)
Chair: William Maltz, Electronic Cooling Solutions
8:30 am – 9:30 am

Thermophysical Properties Measurements of High Thermal Conductive Organic Hybrid Materials by Sinusoidal Heating Thermoreflectance Technique
S. H. Firoz, T. Yagi, N. Taketoshi, T. Baba, AIST

Optimal Micro Heat Pipe Configuration for High Performance Heat Spreaders
Seema Singh, Nicole Okamoto, San Jose State University

Session 9: High Conductivity Materials II
Chair: William Maltz, Electronic Cooling Solutions
9:30 am – 12:00 pm

Recent Advances in the Development and Application of Higher Thermal Conductivity Graphite Heat Spreader Materials
Julian Norley, GrafTech International Ltd.

Break: 10:00 am – 10:30 am

Thermal Cycling Stability of High Thermal Conductive Diamondmetal Matrix Composites
Michael Kitzmantel, Vienna University of Technology; Neubauer Erich, Kapaun Wolfgang, Austrian Institute of Technology GmbH; Angerer Paul, CEST-Kompetenzzentrum für elektrochemische Oberflächentechnologie GmbH; Ivi Smid, Kristina Cowan-Giger Kristina, Pennsylvania State University

Natural Graphite Reinforced Aluminum: A Cost/Performance Paradigm Changing Technology for High Heat Flux Thermal Management
James A. Cornie, Rob Hay, Kevin Fennessy, Steve Cornie, Metal Matrix Composites

Closing Remarks: 11:30 pm

Register On-line for Thermal 2009

RF/Microwave Packaging Workshop Begins Tuesday - Registration Closing    ^ Top
The Second Annual Advanced Technology Workshop on RF/Microwave Packaging will be held September 22-24, 2009, in San Diego, CA. Full program, lodging and registration details are available at

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Tuesday, September 22

Golf Tournament sponsored by the IMAPS San Diego Chapter - Including lunch
7:30 am – 12:30 pm

Registration: 1:00 pm – 8:00 pm

Opening Remarks/Welcome: 2:00 pm – 2:15 pm

Session 1: Novel MMW Packaging & Materials Characterization
Chair: Sean Cahill, BridgeWave Communications
2:15 pm – 5:15 pm

Quilt Packaging of RF Systems with Ultrawide Bandwidths
Patrick Fay, David Kopp, Cai Liang, Jason Kulick, Mohammad Khan, Gary H. Bernstein, University of Notre Dame

Characterization of Barium Strontium Titanate at G-Band
Nurul Osman, Charles Free, University of Surrey

Flip Chip for Millimeter Wave Applications
James Bardeen, Mike Pettus, VubIQ Inc.

Break : 3:45 pm – 4:15 pm

A Novel Packaging Technology for Millimeter Wave Subsystems and Components
Dana E. Wheeler, John McNicol, HXI LLC

A Low Power CMOS 60GHz Transceiver with LTCC On-Package Patch Antenna
Maryam Tabesh, Cristian Marcu, Jungdong Park, Lingkai Kong, Debopriyo Chowdhury, Chintan Thakkar, Antti Lamminen, Jussi Säily, Kari Kautio, Elad Alon, Ali Niknejad, UC Berkeley & Technical Research Centre of Finland (VTT)

Wednesday, September 23

Registration: 7:00 am – 4:30 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
How to Start a Microelectronics and Packaging Business in Canada

Chantal Ramsay, Canadian Consulate LA
& Dr. Jayna Sheats, CTO, Terepac Corporation

Speaker Bio:
Ms. Ramsay is the Consul (Economic Affairs - Ontario) at the Ontario International Marketing Centre (OIMC) in the Canadian Consulate General in Los Angeles. The International Marketing Centre’s territory includes California, Arizona, New Mexico, Nevada and Hawaii. The role of the OIMC is to work with Ontario based companies wishing to do business in the territory, to attract investment from US and multinational companies into Ontario and to raise awareness of the Province in the region. Prior to this posting, Ms Ramsay was a Senior Manager with the Investment Branch of the Ministry of Economic Development and Trade of Ontario in Toronto, Ontario. Ms Ramsay is a graduate of the Laurentian University, Sudbury, Ontario - Honours Bachelor of Science in Language with a minor in Economics. She speaks Spanish, French and Italian.

Session 2: Advanced RF & Microwave Packaging Materials
Chair: Ken Kuang, Torrey Hills Technologies, LLC
8:45 am – 11:45 am

Advanced Getter Materials for GaAs, RF/MW, MEMs and Other Microelectronic Packages
Richard Kullberg, Bradley L. Phillip, Vacuum Energy Inc.; Timothy J. Shepodd, Sandia National Laboratories

Characterization of DuPont 9K7 LTCC Material System for RF/Microwave Packaging Applications
Deepukumar Nair, K. E. Souders, K. M. Nair, M. F. McCombs, J. M. Parisi, Brad Thrasher, DuPont

Modifiable Silicones for Harsh Environments
Michelle Velderrain, Nusil Technology LLC

Break : 10:15 am – 10:45 am

Development of Low Cost Heat Spreaders
Irwin Kim, ISQTECH

Materials Declaration for Semiconductor Packages
Mumtaz Yusuf Bora, Peregrine Semiconductors

Lunch: 11:45 am – 12:45 pm

Session 3: Advanced Thermal Management Materials
Chair: Bill Ishii, Torrey Hills Technologies, LLC
1:00 pm – 4:30 pm

Advanced Materials Solutions for Thermal Management Design: Metallized Pyrolytic Graphite Structures
Robert Moskaitis, Richard J. Lemak, MINTEQ International Inc./PYROGENICS Group; David Pickrell, OMEGAPIEZO

Advanced TPG Material for the Thermal Management of Electronics
Xiang "Shawn" Liu, Momentive Performance Materials

New Aluminum-Silicon Carbide Composites for Air Cavity Package Applications
Dan White, Thermal Transfer Composites LLC; Craig Rotay, ST Microelectronics,

Break: 2:30 pm – 3:00 pm

Transient Liquid Phase Sintering Adhesives for Radar T/R Module Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Performance and Cost Benefits of Si-Al Substrates in the Manufacture of RF and Microwave III-V Semiconductor Devices
Andrew J. W. Ogilvy, Sandvik Osprey Ltd.; Stuart Weinshanker, Advanced Packaging Associates, Inc.

Development of Super Copper Tungsten
Ken Kuang, Torrey Hills Technologies, LLC; Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd.; Junkun Ma, Southeastern Louisiana University

Thursday, September 24

Registration: 7:00 am – 4:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
RF & Microwave Packaging Development in China

Danny Zhu, Jiangsu Dingqi Science & Technology Co., Ltd.

Speaker Bio:
Mr. Danny Zhu is co-founder of Jiangsu Sci. & Tech Co Ltd and has been its General Manager since January 2008. Before that, Danny was sales engineer for Brush Wellman (China) and engineering manager for a major electronics component manufacturing company. Danny has a BS Degree in Materials Sci & Engineer from China University of Electronics.

Session 4: Novel RF & Microwave Packaging Manufacturing Process
Chair: Franklin Kim, Kyocera America, Inc.
8:45 am – 12:15 pm

Bridging the Manufacturing Gap between Macro and Micro to Build Packaging for Miniature RF Devices with Complex Geometries and Multiple Materials
Arthur L. Chait, EoPlex Technologies, Inc.

Near Hermetic Wafer Level Packaging using LCP Adhesive Layer
Brandon Pillans, Raytheon

Wide Band Gap RF/Microwave Power Transistors Require Package Updates
Mike Mallinger, Mar Caballero, Microsemi Corp RFIS

Break: 10:15 am – 10:45 am

Z-Axis Interconnection for Organic Laminate Electronic Packages
Voya R. Markovich, Frank Egitto, Subahu Desai, Endicott Interconnect Technologies, Inc.

Low Cost Test Technique for RF Interconnects in MCM Substrate
Sukeshwar Kannan, Bruce Kim, University of Alabama

Packaging Technology Development for Silicon on Sapphire based Commercial RF IC Products
John Yang, Peregrine Semiconductor

Session 5: Design / Simulation for Ceramic Based RF & Microwave Packaging
Chair: Susan Trulli, Raytheon RD Components
1:20 pm – 3:50 pm

Fundamentals of Highly Integrated Co-Fired Packaging
Dan Harris, Lockheed Martin

Numerical Study of the Performance of a Super CuW / BeO Package
Junkun Ma, Xialu Wei, Southeastern Louisiana University

Design of Transmit/Receive Modules
Rick Sturdivant, Microwave Packaging Technology, Inc.

Extraction of Dielectric Constant and Loss Tangent of Microwave Substrates using Full Sheet Resonance Method
A. Ege Engin, San Diego State University

Microwave Filters for RF/Microwave Circuits
Edward Liang, MCV Technologies, Inc.

Closing Remark : 3:50 pm

Register On-line

Guide to Component Chip Attach – Including Flip Chip Webinar Begins Tuesday    ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held
Tuesdays, September 22 and 29, 2009.
All webinars will be held 12:00 noon - 1:00 pm EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: September 21, 2009 Register On-line

Key Words

Chip attach, die attach, direct chip attach, flip chip, bonders, polymer adhesives, epoxy bonding, silver glass, die eutectics, dispensing, curing, SMT, UBM, ICA, ACA, underfill, stud bumping, wafer bumping, lot travelers, SMEMA, cleanroom, 883 Test Methods

Program Description

This course provides an industry-proven training guide to successful component chip attach for use by engineers and senior technicians in a prototype or manufacturing environment. It is also designed for entry level personnel with little or no experience. Students will learn various definitions, details of techniques, materials, processes and equipment used in traditional component chip attachment of passives (capacitors, inductors, resistors), actives (diodes, transistors, ICs, ASICs, microprocessors) and rework methods. Topics covered include: SMT solder reflow, pick/place, dispensing, stamping, stencil printing, epoxy vs. eutectic, rework, and process control. Examples of actual process procedures and industry lot travelers are included.

Special attention will be given to Flip Chip (Direct Chip Attach) and Flip Chip packaging applications. Students will learn definitions (WLP, C4, UBM, ICA, ACA, UF & stud bumping), techniques, processes, materials, substrates and equipment used in flip chip die attachment and underfill using both solder and polymers. Included: types of wafer bumping, pick/place, solder reflow, polymer cure, underfilling, and process control methodology.

Reliability testing and screening methods as well as analysis techniques for various types of component attach are discussed using optical, die shear, scanning electron microscopy and scanning acoustic microscopy. Operator issues include: setup, proper documentation, use of industry-proven lot travelers, inspection criteria, rework techniques and safety. Figures, photos and diagrams enhance the learning experience. Extensive references are included.

Students will have access to all course slides and in addition will receive a complete set of references/web links providing not only the source material but links to additional detailed information on all main topics covered. Also included is a complimentary detailed Glossary of Chip Component Packaging Terms.

This on-line PDC is a series of 2 one-hour lectures that can be taken in total or separately depending on the experience level of the student and topics of interest.  Below is a course outline for each session.  Each session is scheduled for 50 minutes of lecture followed by 10 minutes of Q&A.

Session 1 of 2: Tuesday, September 22 -- 12:00-1:00 PM EDT

  • Passive and Active Chip Components in New Advanced Applications
  • When a Chip is Not a Chip
  • Overview of Microelectronics Process
  • Back End Of Line (BEOL) Component Related Processing (Backside Treatments, Backgrinding, Bumping, MEMS)
  • Overview of Assembly Process (Dicing, Chip Attach, Wire Bond, Seal)
  • Substrates
  • Details of Chip Attach Assembly Processes
    • Polymers: Epoxy Die Bonding, Types of Equipment, Manual Dispensing Bonders, Screening/Stenciling, Transfer/Stamping, Auto Equipment, Curing, Detailed Epoxy Die Bonder Set Up Procedure and Process, Proven Industry Process Lot Traveler, Paste vs. Film Use, Generic Recommendations,Troubleshooting Process Problems, Avoiding Bleed, Adhesives for Advanced Applications, Evaluation and Acceptance Procedures for Polymeric Adhesives
    • Silver Glass: Glass Frit, Equipment and Process
    • Eutectic: General, Materials, Manual Eutectic Die Attach, Auto Equipment, Die Collets, Problems and Solutions, Detailed Eutectic Set Up Procedure and Process
    • Solder: SMT Process, Soft Solder and Polymers, Which Process to Use for Active and Passive Components
  • Glossary of Current Chip Attach Terminology – Including Flip Chip
  • References

Session 2 of 2: Tuesday, September 29 -- 12:00-1:00 PM EDT

  • Details of Chip Attach Assembly Processes (continued)
    • Flip Chip: C4, Applications, Substrates,Types of Under Bump Metallization (UBM), Bumping, Different Types of FC Bonds, ICA, NCA, ACA, Stud Bump Bonding, Underfill, Flux Residue and Underfill, Reworkable Underfill, Failure Modes, Example of Detailed Proven Industry FC Process Traveler
  • Automated Assembly of Chip Components
    • SMEMA Assembly Equipment
    • Pick/Place Requirements: Solder vs. Polymer
    • General Solder Processing: Which Solder to Use, Solderability, Solder Processing, Solder Paste
    • Rework and Repair
    • Cleanroom Operation: Operator, Handling Techniques, Cleanroom Recommendations, Plasma Cleaning
  • Chip Attach Process Control
    • Reliability Issues and Testing
    • Screen Tests
    • Visual Inspection: Test Method 2017
    • Die Shear Strength: Test Method 2019
    • Radiography: Test Method 2012
    • Ultrasonic Inspection of Die Attach (C-SCAN, SLAM, C-SAM): Test Method 2030
    • Flip Chip Pull-Off: Test Method 2031
    • Generic Failure Analysis
  • Glossary of Current Chip Attach Terminology – Including Flip Chip
  • References

Who Should Attend?

This course is designed for the attendee who has little initial familiarity with microelectronics packaging assembly processes at the chip component and flip chip level. Ideal for entry-level technicians and engineers but also for people in quality assurance, sales, marketing, purchasing, safety, administration and program management. Emphasis will be on visual aids.

No prior knowledge of microelectronics chip attach is required since this course is designed for the student who has little initial familiarity with process and materials specifics of chip attach. The course uses simple terms for ease of understanding yet includes aspects of advanced packaging for senior engineers new to the field and needing a running start in packaging technology.

Thomas Green


Phillip Creter has over 30 years of microelectronics packaging experience and is a Life member of IMAPS. He was elected a Fellow of the Society, National Treasurer and President of the New England Chapter (twice). He received a BS in Chemistry with honors from Suffolk University and has published numerous papers, holds a U.S. patent, has made many technical presentations (received IMAPS Best Paper of Session award) and chaired numerous technical sessions for symposia. He is currently a consultant (Creter & Associates) gaining his microelectronics packaging experience at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek Corporation. His past positions include GTE Microelectronics Center Manager (receiving coveted corporate Lesley Warner Technical Achievement Award), Process Engineering Manager, Process Development Manager, Materials Engineering Manager and Manufacturing Engineer. Phil currently teaches courses at microelectronics events and is an experienced Webinar instructor. He is also an active certified instructor for the Department of Homeland Security currently teaching courses locally.

Register On-line

IMAPS 2009, San Jose - 15 Professional Development Courses   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.
Learn more about IMAPS 2009 and register on-line at

All PDCs run 9:00 am - 5:00 pm, unless otherwise noted

Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today’s competitive global market? The Technical Committee of IMAPS is pleased to present a comprehensive offering of Professional Development Courses that provide detailed information on topics of immediate interest to the Microelectronics and Packaging community.  So please be sure to choose from the 15 in-depth Professional Development Courses taught by recognized industry experts.  You will discover the following key ways that will benefit you.

Better understand the skills and knowledge necessary in today’s industry.
  • Be exposed to the rapidly expanding developments in new materials and technologies.
  • Consult with renowned authorities about your current R&D or manufacturing problems and challenges.
  • Learn new ways to identify, think about, and address your problems and opportunities.
  • Great opportunities to interact with industry experts and other course attendees.
  • Certificate of Attendance and much more…

Your PDC Registration Fee Includes:

  • Lunch on the day of your course
  • Refreshment breaks
  • All course materials
  • PDC Reception on Sunday evening (for Attendees & Instructors only)
  • Certificate of Attendance
Sunday, November 1
Monday, November 2

S1: RF/Microwave Hybrids:
Basics, Materials and Processes

S2: Advanced Packaging for Power and Energy

S3: Hybrid Visual Inspection per Mil-STD-883

S4: Design and Analysis of Experiments

S5: Plating Processes for High Reliability Microelectronic Devices

S6: Multilayer Co-fired Ceramics

S7 - ½ day: 9 am - Noon
Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration

S8 - ½ day: 1 pm - 5 pm
Reliability of Lead-Free System - How to Alleviate Failures - Practical Issues

M1: Wire Bonding in

M2: High-Performance Thermal
Management Materials

M3: Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts

M4: Introduction to Microelectronics Packaging Technology
M5: Technology of Screen Printing

M6: TSV and Other Enabling Technologies for 3D IC Integration and WLP

M7: Electronics, Energy, and the Environment
Register on-line at
  Chapter Activities (events listed in chronological order)

TODAY: Tri-Valley Chapter Fall Technical Symposium on September 16 in Santa Clarita    ^ Top

Dates: Wednesday, September 16
Schedule: 6:00 PM Start - Reception, Light Dinner, Opening Remarks

Alfred Mann Foundation
25134 Rye Canyon Loop, # 200
Santa Clarita, CA 91355


$ 15.00 IMAPS members
$ 25.00 non-member
$5.00 students

Register on-site


6:00:  Reception, light dinner, and opening remarks, Charles Byers

6:45: John Moore of Daetec, LLC
          “Enabling Technologies for Substrate Thinning and Backside Processing in 3D-Packaging."

7:15:  Michelle Velderrain of NuSil Technology, LLC  
           “Low Contaminating Silicones for Optical and Electrical Applications"  
7:45: Nasser Budraa of Microwave Bonding Instruments
         “Low Temperature Single-Shot 3-D Assembly By Microwave Technology."       
8:15  Closing Remarks  (Event wrap-up, Next event, Chapter leadership. . .)

8:30: Optional tour of Alfred Mann Foundation by Charles Byers

TOMORROW: Carolinas Chapter Fall Technical Symposium on September 17 in Durham    ^ Top

Dates: Thursday, September 17
Schedule: 12:00 PM Start - Reception, Lunch, Opening Remarks

NC IDEA Campus (No citizenship or ID requirements)
3021 E. Cornwallis Rd., Building 1
Durham, NC 27709


$ 20.00 IMAPS members
$ 30.00 non-member
$ 5.00 students
$ 75.00 exhibitor tabletops


Register on-site


12:00   Reception and Lunch

12:45   Introductions – all participants

1:00   “Computed tomography for 3-dimensional analysis.”                   
Ms. Sheri Martin of Yxlon FeinFocus

1:30   "Embedding high permittivity BaTiO3-based ceramic dielectrics into organic packages using the film-on-foil approach."
Dr. Jon Paul Maria of North Carolina State University.
2:00  “Thermal Analysis and its Application to GaN HEMT Amplifiers.”
Art Prejs of CREE

2:30   15 minutes of non-technical presentations. 

A) Riverside High School (Durham) engineering classes.  Tim Velegol.     
B) Michael O’Donoghue, IMAPS Executive Director, to discuss 2010 Symposium. 

2:45    Refreshment Break in the Vendor Area

3:45     “SMIF – shared resource for materials, device characterization, and fabrication.”
Dr. Mark Walters, Duke’s Shared Materials Instrumentation Facility (SMIF)
4:15   “Copper pillar, flip-chip technology in a RF Component Application.”
Ms. Shannon Pan of RF Micro Devices
4:45   Closing Statements, Discussion of event and next event

TOMORROW: Northwest Chapter September 17 Lunch Meeting at Crane Interpoint    ^ Top

Dates: Thursday, September 17
Schedule: 11:00 AM Start - Reception, Lunch, Opening Remarks

Crane Interpoint
3rd Floor Conference room holds 40 people.
10201 Willows Road NE
Redmond, WA 98073-9705
Some security requirements see below.


Registration fees will be charged to cover the costs which may be:

IMAPS members-$20,
non-members-$30, and

Registration: Register on-site


11:00 Reception

11:30 Lunch and Introductions

12:15  Bob Hook from Crane Interpoint
            Wire bonding – A reliable Interconnect Technology

12:45 Paul Garland from Kyocera
"Material Trade Offs in Packaging: A Case Study in T/R Module Design"
1:30 Break

2:00 Peter Heisen from The Boeing Company

3:00 Optional tour for cleared participants

Interpoint Corporation will be hosting this quarters IMAPS meeting at their Redmond, Washington facility.  Interpoint Corporation is a leading designer and manufacturer of power handling products including: DC/DC Converters; ElectroMagnetic Interference (EMI) Filters; and custom designed Microelectronics Hybrid Microcircuits, and state of the art medical implantable devices.  Interpoint is a wholly-owned subsidiary of Crane Co., and a member of the Crane Electronics Group. 

Interpoint Corporation manufactures products which are governed and regulated by both the U.S. Department of State and Commerce, and therefore subject to export licensing controls.  As a result, Interpoint must validate the citizenship status of all Visitors entering the Redmond facility.  In support of these regulatory requirements, you must complete an R.S.V.P. in advance of attending this quarterly meeting. Contact Steve Annas for RSVP/security details:

Steve Annas
Senior Sales Manager
Crane Aerospace & Electronics Group
Microelectronics Solutions
6336 SE Aspen Street
Milwaukie, OR 97222
(O) 503-653-1761
(C) 503-260-2002
(F) 503-653-7438

TOMORROW: Metro Chapter September 17 Dinner Meeting on Copper Plate Up for Enhanced Power Handling and Thermal Conductivity    ^ Top

Dates: Thursday, September 17
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779


Price: Members: $25.00 if Pre-Registered by September 14, 2009.
$50.00 after September 14, 2009

Non-Members: $50.00 if Pre-Registered by September 14, 2009.
$75.00 After September 14, 2009

Student Members: Free if Pre-Registered by September 14, 2009.
$25.00 September 14, 2009


Register on-site
Email: , Phone: Steve Lehnert (631) 379-8239

There are a limited number of vendor tables available for this event. Please contact Steve Lehnert for further details.


Keystone Chapter Dinner Presentations on September 24    ^ Top

Dates: Thursday, September 24
Schedule: 6:00 PM Start - Registration, Networking and Dinner

Kulicke & Soffa Industries, Inc.
1005 Virginia Drive
Ft. Washington, PA 19034
Click here for map & directions


Advance registration $15.00, on-site $20.00.
Students complimentary with advance registration. (Advance registration by Monday, September 21)
E-mailing Greg Chesmar at


6:00  Registration and networking

6:30  Pizza dinner

7:00  Kulicke and Soffa company spotlight and presenters.  

             “Status of Copper Wire Bonding”  by Horst Clauberg, Principal Process Engineer

             “Advanced Looping in Copper Wire Bonding” by Jon Brunner, Senior Staff Engineer

             “NiPd Bond Pads of Copper Wire Bonding” by Horst Clauberg

 8:30    Optional facility tour

IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation   ^ Top
The Southern California (SoCal) Chapters of the International Microelectronics and Packaging Society (IMAPS) and the Jet Propulsion Laboratory (JPL) Counterfeit Electronic Parts Working Group announce a co-hosted Topical Workshop on Counterfeit Electronic Parts: Awareness, Avoidance, Detection and Mitigation. The workshop will be held Thursday, October 1, 2009, at the Radisson Hotel at LAX, 6225 W. Century Blvd, Los Angeles, CA.

General Chair: 

Phil Zulueta
Jet Propulsion Laboratory
(818) 354-1566

Counterfeit Electronic Parts; Awareness, Avoidance,
Detection and Mitigation Workshop Organizing Committee:

        Hossein Ahmad        (310) 662-6251 
        Humna Khan       (818) 354-2452 
        Debra Eggeman     (714) 670-0200 
        Christine Purcell  (310) 283-7323 
        Bill Gaines  (626) 812-2199 
        Robert Warren      (949) 483-5883 
        Maurice Lowery  (310) 814-1890 
        Larry Driscoll  (818) 704-9087 
        Dan DiMase       (401)-374-1914 

Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation Workshop Focus:

Counterfeit electronic parts have been found in almost every sector of the electronics industry and continue to be an increasing threat to electronic hardware, posing significant performance, reliability and safety risks. Aerospace industry organizations, in particular, must produce and continually improve safe, reliable products that meet or exceed performance specifications and requirements. The globalization of the aerospace industry and the resulting diversity of regional/national requirements and expectations have complicated this objective. End-product organizations face the challenge of assuring the quality and integration of product purchased from suppliers throughout the world and at all levels within the supply chain.

The objective of the Counterfeit Electronic Parts Workshop is to increase awareness of this global issue, promote discussion and to present solutions in a SoCal IMAPS workshop format. Serial presentations are specifically organized to provide a unique forum for personnel involved with Parts Engineering, Quality Assurance, Electronics Manufacturing, Receiving Inspection, In-process Inspection, Procurement, and all levels of Management from the electronics industry. Presenters are individuals who have been working in the area of Counterfeit Electronic Parts avoidance, detection and mitigation and disposition. The workshop will host Tabletop Exhibits that form an essential part of the counterfeit solution. There will be no cost to attendees in efforts to disseminate this important information.

Attendee complimentary on-line registration:

Exhibitor Registration:
Or Contact:

Hossein Ahmad        (310) 662-6251 

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:


  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors


  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004

More information is on-line at:

  Membership, Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to or feel free to contact me at the phone/e-mail below.



Lorac - Furnace Experts

ATW on RF/Microwave Packaging
September 22-24, 2009
San Diego, CA

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip (2 Sessions)
Session 1: Sept 22, 2009

Session 2: Sept 29, 2009

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: Oct 13, 2009
Session 2: Oct 20, 2009

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

^ Top

Compex Corp

Oneida Research Services


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