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September 22, 2009

TJ Green Associates, LLC

Button IMAPS 2009, San Jose - Early Registration Deadline and Hotel Cut-off This Thursday (read more...)

Button Thermal Management Workshop Begins in Two Weeks - On-line Registration Closes Next Friday (read more...)

Button Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity Webinar Begins In Three Weeks (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet THIS THURSDAY: Keystone Chapter Dinner Presentations on September 24 (read more...)

Bullet IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation (read more...)

Bullet IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (read more...)

Bullet Chicago/Milwaukee Fall Technical Symposium on October 20 (read more...)

Bullet Germany Chapter's 2009 Conference (read more...)

Bullet Metro Chapter Dinner Presentation on October 28 (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

IMAPS 2009, San Jose - Early Registration Deadline and Hotel Cut-off This Thursday   ^ Top
The advance program and registration for IMAPS 2009, the 42nd International Symposium on Microelectronics, is now available on-line. The 2009 symposium returns to Northern California from November 1-5 at the McEnery Convention Center in San Jose, California.
The early registration deadline and hotel cut-off are this Thursday, September 24. Registration fees increase after Thursday. Hotel pricing and availability cannot be guaranteed after September 24. Learn more about IMAPS 2009 and register on-line at

Thermal Management Workshop Begins in Two Weeks - On-line Registration Closes Next Friday    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. Program and registration details are available on-line at On-line registration closes next Friday, October 2.

Tuesday, October 6

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: Noon – 5:30 pm

Opening Remarks: 8:25 am – 8:30 am

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:30 am – 11:30 am

Thermal Challenges and Requirements in Designing for Telco/Telcom Equipment in the NEBS Environment
Herman Chu, Cisco Systems, Inc.

Thermal Management Challenges for Hybrid Vehicle Powertrain Drives
David Saums, DS&A LLC

Advanced Module Concepts
Andreas Schletz, M. März, E. Shimaneck, Fraunhofer IISB

Break: 10:00 am – 10:30 am

Thermal Characterization of High Power LEDS - An Introduction to the Issues
Bernie Siegal, Thermal Engineering Associates, Inc.

Pool-Boiling Based Heat Sink Solutions
Jesse Kim, S.M. You, Joo H. Kim, Vapro Inc.

Session 2:  Thermal Analysis I
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm


Chronicles from the Frequency Domain: Benefits and Applications of AC Thermal Modeling, Simulation and Measurement
Bjorn Vermeersch, Gilbert De Mey, Jedrzej Banaszczyk, Ali Shakouri, Kofi Makinwa, Ghent University

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)


Multi Objective Optimization of Force Fed Microchannel Heat Sinks
Edvin Cetegen, Serguei Dessiatoun, Michael Ohadi, University of Maryland

Thermal Management Requirements of Photonic Nanohole Array Sensors
Mehmet Sen, Gregory J. Kowalski, Dale Larson, Northeastern University

Characterization of Single-Phase Heat Transfer and Hydraulic Performance in Non-Uniformly Heated Microgap Channels
Ihab Andre Ali, Avram Bar-Cohen, University of Maryland; Ceferino Sanchez, William Maltz, Electronic Cooling Solutions Inc.

Break: 3:00 pm – 3:30 pm

Session 3: Liquid Cooling
Chair: John Peeples, The Citadel
3:30 pm – 5:30 pm


System Package Embedded Active Liquid Cooling using 3D-MID Technology (Molded Interconnect Devices)
Thomas Leneke, Sören Hirsch, TEPROSA - Otto-von-Guericke-University Magdeburg

Cooling for IGBTs in Small Channels Based on Velocity and Length Using Common Cooling Liquid
Christopher A. Soule, Thermshield LLC

Development of Heat Pipe Loop Technology for Electronics Cooling
Xudong Tang, Jens Weyant, Scott Garner, Jon Zuo, Advanced Cooling Technologies, Inc.

Surface Roughness Effects on Boiling Heat Transfer
Benjamin J. Jones, Suresh V. Garimella, Purdue University

Dinner: 5:30 pm – 7:00 pm

Session 4: System Cooling
Chair: John Peeples, The Citadel
7:00 pm – 8:30 pm

Low Profile Heat Pipe Heat Sink and Green Performance Characterization for Next Generation CPU Module Thermal Designs
Marlin Vogel, G. Xu, D. Copeland, Sun Microsystems, Inc.; S. Kang, B. Whitney, Aavid Thermalloy; G. Meyer, Celsia; K. Kawabata, Furukawa; M. Connors, Thermacore

Thin Film Thermoelectric Heat Pump Chip Cooler
John Archibald, Northfield Engineering Company


Simulation of a Thermoelectric Adsorption Heat Pump for Harsh Environment Electronics Cooling
Ashish Sinha, Yogendra K. Joshi, Georgia Institute of Technology

Wednesday, October 7

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: 10:00 am – 3:00 pm

Session 5: Data Center Cooling
Chair: George A. Meyer IV, Celsia Technologies
8:30 am – 11:30 am

The Energy Efficiency Advantage of Water Cooling IT Equipment in the Data Center
Michael J. Ellsworth, Jr., IBM Corporation

A Scalable Thermal Management Architecture for Energy Efficient Containerized Data Center Cooling
Joe Marsala, Rob Hannemann, Thermal Form & Function Inc.

KRATOS: Automated Management of Data Center Cooling Capacity with Adaptive Vent Tiles
Alan McReynolds, Zhikui Wang, Carlos Felix, Cullen Bash, Christopher Hoover, Monem Beitelmal, Rocky Shih, Hewlett Packard

Break: 10:00 am – 10:30 am

Cold Aisle Containment and Energy Efficiency of the Data Center
Ali Heydari, Veerendra Mulay, Facebook Inc.

A Cold Plate Cooling System for Servers and other Electronic Enclosures
Phil Hughes, Robert Lipp, Clustered Systems Company, Inc.

Session 6: Thermal Analysis II
Chair: David Copeland, Sun Microsystems Inc.
11:30 am – 3:00 pm

Thermomechanical Optimization of a Novel High Density Interconnect (HDI) Substrate
Brian R. Smith, Peter Kwok, Andrew Mueller, Livia Racz, Draper Laboratory

Lunch: 12:00 pm – 1:30 pm (session continues after lunch)

Thermal Analysis of High Power LEDs at Dynamic Conditions
Bohan Yan, Nguyen Tran, Frank G. Shi, University of California-Irvine

Capturing PCB Artwork for Thermal Design
John Wilson, Mentor Graphics Corporation

Operating ICs Hotter to Dissipate Power
James J. Wang, Power Gold LLC

Break: 3:00 pm – 3:30 pm

Session 7: Thermal Interface Materials
Chair: Guy R. Wagner, Storage Genetics, Inc.
3:30 pm – 5:30 pm

Lead-Free Sintered Adhesives for High-Brightness Light Emitting Diode (HB-LED) Thermal Management
Matthew Wrosch, Arsenia Soriano, Creative Electron, Inc.

Thermal Interface Material Performance of Commercial Particle-Filled Products with Carbon-Based Nanostructure Inclusions
Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Drazen Fabris, Cary Y. Yang, Santa Clara University

Thermally Conductive Liquid Materials for Electronics Packaging
Sanjay Misra, John Timmerman, The Bergquist Company

Metallic Thermal Interface and Die Attach Materials for IGBT Power Semiconductor Modules
Amanda Hartnett, Jordan Ross, Indium Corporation; David L. Saums, DS&A LLC; Wolfgang Bloching, Indium Corporation of Europe

Dinner: 5:30 pm – 7:00 pm

A Highly Thermally Conductive No Pump-Out Grease: Properties and Applications
Sara N. Paisner, LORD Corporation

Session 8: High Conductivity Materials I
Chair: William Maltz, Electronic Cooling Solutions
7:30 pm – 8:30 pm

Comparison of Temperature Cycling Behavior of Power Substrates Based on Different Advanced Joining Technologies and Substrate Materials
Alexander Roth, Marianna Ponomarenko, Matthias Knörr, Andreas Schletz, Fraunhofer IISB

Alkali Silicate Glass Based Hermetic Thermal Coatings
Ross Wilcoxon, Nathan Lower, Rockwell Collins, Inc.

Session 8 continues Thursday morning

Thursday, October 8

Registration: 7:30 am – 12:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 8: High Conductivity Materials I (continues)
Chair: William Maltz, Electronic Cooling Solutions
8:30 am – 9:30 am

Thermophysical Properties Measurements of High Thermal Conductive Organic Hybrid Materials by Sinusoidal Heating Thermoreflectance Technique
S. H. Firoz, T. Yagi, N. Taketoshi, T. Baba, AIST

Optimal Micro Heat Pipe Configuration for High Performance Heat Spreaders
Seema Singh, Nicole Okamoto, San Jose State University

Session 9: High Conductivity Materials II
Chair: William Maltz, Electronic Cooling Solutions
9:30 am – 12:00 pm

Recent Advances in the Development and Application of Higher Thermal Conductivity Graphite Heat Spreader Materials
Julian Norley, GrafTech International Ltd.

Break: 10:00 am – 10:30 am

Thermal Cycling Stability of High Thermal Conductive Diamondmetal Matrix Composites
Michael Kitzmantel, Vienna University of Technology; Neubauer Erich, Kapaun Wolfgang, Austrian Institute of Technology GmbH; Angerer Paul, CEST-Kompetenzzentrum für elektrochemische Oberflächentechnologie GmbH; Ivi Smid, Kristina Cowan-Giger Kristina, Pennsylvania State University

Natural Graphite Reinforced Aluminum: A Cost/Performance Paradigm Changing Technology for High Heat Flux Thermal Management
James A. Cornie, Rob Hay, Kevin Fennessy, Steve Cornie, Metal Matrix Composites

Closing Remarks: 11:30 pm

Register On-line for Thermal 2009

Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity Webinar Begins In Three Weeks    ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held
Tuesdays, October 13 and 20, 2009.
All webinars will be held 10:00 am - 11:00 am EDT

IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadline: October 12, 2009 Register On-line

Program Description

Successful and low-cost design of electronic packages and boards requires (in addition to thermal and thermo-mechanical issues), a good understanding of the root causes of signal integrity (SI), power integrity (PI) and electromagnetic interference (EMI) issues, as well as methods to analyze, prevent or solve them.

The objective of this course is to provide methods for accurate and efficient electrical modeling, measurement and analysis of packages and PCBs, under consideration of SI, PI and EMI/EMC issues. Techniques for characterizing dielectric materials in dependent on frequency and temperature will also be discussed. Finally, guidelines for optimizing the electrical performance of high-speed packages and PCBs will be provided.

Outline of Sessions:

  • Root causes of SI, PI and EMI/EMC problems, and how they affect system performance.
  • Methods for electrical modeling, simulation and measurement of packaging structures under consideration of SI, PI and EMI/EMC issues.
  • Examples of packaging structures that will be considered include: Transmission lines, layer stack-up with power-ground plane pairs, decoupling capacitors, vias and solder balls.
  • Methods for extracting the relative dielectric constant and loss tangent of dielectric materials in dependent on temperature and frequency.
  • Guidelines for optimizing the electrical performance of high-speed packages and PCBs.

Who Should Attend?

Engineers, scientists, researchers, designers and managers involved in the process of electrical modeling, layouts and/or design of single-chip packages, system packages (e.g., SiPs, SoPs, MCMs), PCBs and their interconnections.


Dr. Ivan Ndip - Ivan Ndip obtained his M.Sc. and Ph.D. with the highest distinction (Summa Cum Laude) in electrical engineering from the Technische Universitaet Berlin, Germany. In 2002, he joined the Fraunhofer-Institute for Reliability and Microintegration (IZM) Berlin as a research engineer and in 2005 he was appointed Group Manager. Since then, he has been responsible for developing and leading research projects at IZM that focus on modeling, simulation, measurement, design and optimization of RF/high-speed packages and PCBs, integrated antennas and passive RF front-end components.

In addition to his research at IZM, Dr. Ndip also teaches graduate courses on Electromagnetic Reliability (EMR) of Microsystems at the Technische Universitaet Berlin.

He has won 4 best paper awards at leading international conferences. He is also a recipient of the Tiburtius-Prize, awarded yearly for outstanding Ph.D. dissertations in the state of Berlin.

Prof. Ege Engin - Ege Engin received his B.S. and M.S. degrees in electrical engineering from Middle East Technical University, Ankara, Turkey, and from University of Paderborn, Germany in 1998 and 2001, respectively. He received his Ph.D degree with Summa Cum Laude from the University of Hannover, Germany in 2004.

Dr. Engin has worked as a research engineer with the Fraunhofer-Institute for Reliability and Microintegration in Berlin, Germany and at Georgia Tech. He is currently an Assistant Professor in the Electrical and Computer Engineering Department of San Diego State University. He has more than 60 publications in the areas of signal and power integrity modeling and simulation and 4 patent applications. He has co-authored the book "Power Integrity Modeling and Design for Semiconductors and Systems," published by Prentice Hall in 2007. Register On-line


  Chapter Activities (events listed in chronological order)

THIS THURSDAY: Keystone Chapter Dinner Presentations on September 24    ^ Top

Dates: Thursday, September 24
Schedule: 6:00 PM Start - Registration, Networking and Dinner

Kulicke & Soffa Industries, Inc.
1005 Virginia Drive
Ft. Washington, PA 19034
Click here for map & directions


Advance registration $15.00, on-site $20.00.
Students complimentary with advance registration. (Advance registration by Monday, September 21)
E-mailing Greg Chesmar at


6:00  Registration and networking

6:30  Pizza dinner

7:00  Kulicke and Soffa company spotlight and presenters.  

             “Status of Copper Wire Bonding”  by Horst Clauberg, Principal Process Engineer

             “Advanced Looping in Copper Wire Bonding” by Jon Brunner, Senior Staff Engineer

             “NiPd Bond Pads of Copper Wire Bonding” by Horst Clauberg

 8:30    Optional facility tour

IMAPS SoCal09 & JPL Symposium & Exhibition - Workshop on Counterfeit Electronic parts: Awareness, Avoidance Detection and Mitigation   ^ Top
The Southern California (SoCal) Chapters of the International Microelectronics and Packaging Society (IMAPS) and the Jet Propulsion Laboratory (JPL) Counterfeit Electronic Parts Working Group announce a co-hosted Topical Workshop on Counterfeit Electronic Parts: Awareness, Avoidance, Detection and Mitigation. The workshop will be held Thursday, October 1, 2009, at the Radisson Hotel at LAX, 6225 W. Century Blvd, Los Angeles, CA.

General Chair: 

Phil Zulueta
Jet Propulsion Laboratory
(818) 354-1566

Counterfeit Electronic Parts; Awareness, Avoidance,
Detection and Mitigation Workshop Organizing Committee:

        Hossein Ahmad        (310) 662-6251 
        Humna Khan       (818) 354-2452 
        Debra Eggeman     (714) 670-0200 
        Christine Purcell  (310) 283-7323 
        Bill Gaines  (626) 812-2199 
        Robert Warren      (949) 483-5883 
        Maurice Lowery  (310) 814-1890 
        Larry Driscoll  (818) 704-9087 
        Dan DiMase       (401)-374-1914 

Counterfeit Electronic Parts; Awareness, Avoidance, Detection and Mitigation Workshop Focus:

Counterfeit electronic parts have been found in almost every sector of the electronics industry and continue to be an increasing threat to electronic hardware, posing significant performance, reliability and safety risks. Aerospace industry organizations, in particular, must produce and continually improve safe, reliable products that meet or exceed performance specifications and requirements. The globalization of the aerospace industry and the resulting diversity of regional/national requirements and expectations have complicated this objective. End-product organizations face the challenge of assuring the quality and integration of product purchased from suppliers throughout the world and at all levels within the supply chain.

The objective of the Counterfeit Electronic Parts Workshop is to increase awareness of this global issue, promote discussion and to present solutions in a SoCal IMAPS workshop format. Serial presentations are specifically organized to provide a unique forum for personnel involved with Parts Engineering, Quality Assurance, Electronics Manufacturing, Receiving Inspection, In-process Inspection, Procurement, and all levels of Management from the electronics industry. Presenters are individuals who have been working in the area of Counterfeit Electronic Parts avoidance, detection and mitigation and disposition. The workshop will host Tabletop Exhibits that form an essential part of the counterfeit solution. There will be no cost to attendees in efforts to disseminate this important information.

Attendee complimentary on-line registration:

Exhibitor Registration:
Or Contact:

Hossein Ahmad        (310) 662-6251 

IBM, ASE Will Spotlight in IMPACT 2009 - 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference    ^ Top
The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) is Jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SMTA, TPCA, and co-organized by TTMA, National Tsing Hua University and Taiwan PCB Institute. It will be held at Taipei Nangang Exhibition Hall during October 21 to 23, 2009. For attracting distinguished researchers, engineers and experts from Microsystems, Electronic materials, IC packaging, Assembly, PCB and Thermal areas to attend this technology banquet, this year, organizers focus on the theme for “IMPACT Your Future: Integration, Efficiency, & the Eco-Friendly”.

Taiwan always takes a lead in IC Packaging, Testing, Thermal, Microsystem and PCB industry. Because of this outstanding industrious performance, Taiwan is known as “Technology Island”. Organizers expect Taiwan technology could be voiced by this international conference. In addition, Taiwan technology industry could communicate with foreign advanced technology by this global platform. According to the practice, the IMPACT Technical Program Committee will select Best Student Paper Award and Outstanding Paper Award. However, for encouraging the students who study in Taiwanese University to submit PCB related thesis, organizers cooperated with Taiwan PCB institute this year. Once contributions are Taiwanese students who submit PCB paper, they could join in PCB Outstanding Thesis Award. The Gold Award will be rewarded 60,000 NTD.

IMPACT hosts have invited IBM famous manager, Dr. Steven J. Koester to give a speech. Dr. Steven J. Koester has ever announced a high-speed photodetector that could greatly increase the speed at which information travels to and from microchips, promoting performance in computers and other types of electronic systems with his partners. In this Conference, he will make an address in 3D IC technology. In addition, Dr. Ho-Ming Tong, General Manager for ASE Group, will give a keynote speech as well. Dr. Tong is a noted authority on advanced packaging technology. Besides, advanced IC packaging manufacturer, ASE will continue to join Industrial Session. Without doubt, it must lead a technical discussion and communication; in addition, organizers are going to invite other international masters to join this conference. We sincerely welcome your contribution. More detail, please refer to IMPACT 2009 Website: or contact with the secretariat, Yaffy Liu. Tel: 886-3-3177272 ext. 402.

Chicago/Milwaukee Fall Technical Symposium on October 20    ^ Top

Dates: Tuesday, October 20
Schedule: 11:30 AM Start - Registration, Networking and Lunch

TDK Corporation of America
1221 Business Center Drive
Mt. Prospect, IL 60056
Tel: 972-409-4519 (Sara Reynoso)
Click here for MapQuest


IMAPS Members-$15, non-members-$25, and students - $ 5. 
Pre-registered, job-displaced IMAPS members $5.00. 
Click here for on-line registration.  ( Space may be limited for on-site registration ! )   


11:30 Registration and Networking

12:00 Lunch

12:45  Welcome and Introductions

1:00  Gene Dunn of Panasonic
           “Atmospheric Plasma Cleaning Technology for Microelectronics and Packaging."

1:30 Gordon Smith of GSI Technologies  
           “Manufacturing of Electro-chromic Displays Utilizing Fully Additive Methods.” 

2:00 Refreshment Break

2:15 Victor Zaderej of Molex
           “The Future of Solid State Lighting."   

2:45 Iris Labadie of Kyocera America
             “Material Trade-offs in Designing Ceramic Packages.”

3:15 Phil Couts of TDK
        “Advances in Thermosonic Flip Chip Gold-to-Gold Interconnect for CMOS Assembly."

3:45  Optional – Tables and Poster Presentations of Presenters and NIU students.


Germany Chapter's 2009 Conference    ^ Top

Dates: October 27-28, 2009

Hochschule of Munich (near Central Station)
Munich, Germany

On-line Info:

The German IMAPS-Conference 2009 will take place at the Hochschule of Munich, near Central Station. Sessions are being organized on the following topics of microelectronics, packaging or interconnection technology:


  • Telecommunication
  • Medical
  • Automotive
  • Avionics
  • Industrial Electronics
  • Logistics
  • Sensors


  • Design Software
  • Design for Manufacturability
  • Design for Testability
  • Simulation
  • Thermal/electrical/mechanical
  • Simulations, RF/Microwave Simulation

System Aspects / Problem Solutions

  • Reliability & Live Cycle
  • Packaging
  • Semiconductors, MEMS, System in Package, Chip Scale Packages, MCM, System on Chip
  • Fluid Systems
  • Optoelectronics
  • Mechatronics Systems
  • High Temperature Electronics
  • Power Electronics
  • High Frequency Electronics
  • Test Systems

Processes und Materials

  • Wafer Level Processes
  • Ceramic und Organic Circuits
    • Materials, 3D Forming, HDI-Processes, Inkjetprinting, Screenprinting, Photolithography, Laser Shaping …
  • Materials
    • (Adhesives, Solders, Encapsulation, Nanomaterials, functional Layers)
  • Assembly- and Connection Technology
    • FlipChip, Wirebonding, SMT …
  • Process Control

Abstract submission has closed but direct questions to:

Dr.-Ing. Gisela Dittmar, Ingenieurbüro Elektroniktechnologie Dittmar
Albrecht-Erhardt-Str. 17, D-73433 Aalen
Tel.: +49(0)7361/931129, Fax: +49(0)7361/943004

More information is on-line at:

Metro Chapter Dinner Presentation on October 28    ^ Top

Dates: Wednesday, October 28
Schedule: 5:30 PM Start - Registration, Networking and Dinner

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779


Members: $25.00 if Pre-Registered by October 26, 2009.
$50.00 after October 26, 2009

Non-Members: $50.00 if Pre-Registered by October 26, 2009.
$75.00 After October 26, 2009

Student Members: Free if Pre-Registered by October 26, 2009.
$25.00 after October 26, 2009

Due to the anticipated large turnout, we will be giving preference to members. Please provide your membership number when registering.

Pre Registration Email:
Phone: Steve Lehnert (631) 379-8239  

Leverage Your ERP System & Lean Manufacturing Strategies to Cut Inventory Costs

Are you being squeezed on costs from your customers and global competition? Find out how you can leverage your ERP system to shrink inventory costs, free up manpower and accelerate your lean manufacturing results.  This presentation will present a step by step methodology to implementing true demand based pull throughout your extended supply chain using Kanban. 
What you”ll Learn:

  • How to determine if your business is a good candidate for Pull/Kanban
  • Establishing the critical few parts to get the most benefit
  • How to enable an extended supply chain pull system
  • How to simplify inventory control

Who should attend?
If you are an operations professional, materials or purchasing manager or business owner and are constantly struggling with part shortages, supplier issues or demand fluctuations you should attend.


Ronald E. Loveland
Ron Loveland, partner at Summit Business Solutions is an expert lean trainer and practitioner.  He is a certified Lean Practitioner by NIST and a graduate of Toyota University.  Ron Loveland has over 25 years of manufacturing, leadership, general management, business development, and operations experience. As a Black Hawk Program Manager at United Technologies’ Sikorsky Aircraft division, Ron was responsible for all phases of design, development, production, financial management, business development and after market support domestically and internationally for this state-of-the-art complex aircraft. Ron’s diverse assignments include General Manager of a heating & air conditioning dealership, Strategic Business Unit manager of an engineering & test laboratory, and Regional Manager for Northeast Sales for an international industrial automation manufacturer, where he led a team of direct sales people and distributors. As a process improvement consultant he helps business reduce cost and improve customer satisfaction.  Ron holds an engineering degree from West Point and an MBA from Rensselaer Polytechnic Institute.

About Summit Business Solutions:
Summit is a consulting and training firm that specializes in Lean Six Sigma, Supply Chain Management and Quality Management Systems.  Among its many deliverables Summit offers on site IPC Solder Certification Training and ISO compliance programs.  To learn more email or visit summit at

  Membership, Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to or feel free to contact me at the phone/e-mail below.



Lorac - Furnace Experts

ATW and Tabletop Exhibition on Thermal Management
October 5-8, 2009
Palo Alto, CA

*Exhibitors contact

PDC Webinar Series on Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (2 Sessions)
Session 1: Oct 13, 2009
Session 2: Oct 20, 2009

IMAPS 2009 - San Jose
November 1-5, 2009
San Jose, CA

*Exhibitors contact

PDC Webinar Series on Near Hermetic Packaging Concepts for Military and Medical Packages (2 Sessions)
Session 1: Nov 17, 2009
Session 2: Nov 24, 2009

PDC Webinar Series on Wire Bonding (3 Sessions)
Session 1: Dec 1, 2009

Session 2: Dec 8, 2009
Session 3: Dec 15, 2009

^ Top

Compex Corp

Oneida Research Services


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