Printed Devices and Applications Workship and Tabletop Exhibition - Registration Deadline Extended To April 30 (read
IMAPS 2010 (Research Triangle) - Abstracts Now Accepted Through This Friday, April 16 (read
CICMT 2010 (Japan) - Program and Registration (read
Mid-Atlantic Microelectronics Conference - Registration and Tabletop Exhibits Now Available, Program Soon (read
listed in chronological order)
THIS THURSDAY: IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor's Night (read
IMAPS Indiana Chapter Vendor's Day and Mini-Symposium (read
IMAPS Chesapeake Chapter Spring Symposium April 28 (read
IMAPS New England 37th Symposium and Expo on May 4 - Register On-Line (read
IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging (read
IMAPS Nordic Conference 2010 - Program Available Soon (read
IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11 (read
MEMBERSHIP, PRODUCTS AND PUBLICATIONS
IMAPS Individual Member Benefits (read
full Web Calendar)
Printed Devices and Applications Workship and Tabletop Exhibition - Registration Deadline Extended To April 30 ^
The Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held in Orlando, Florida, May 6-7, 2010. For full details, or to register, visit www.imaps.org/printed. The hotel deadline, early registration and exhibits cut-offs are April 30. After this date, IMAPS cannot guarantee room availability or rates.
Thursday, May 6th
Registration: 7:30 am – 7:00 pm
Continental Breakfast: 7:30 am – 8:30 am
Welcome: 8:00 am – 8:15 am
General Chair: C. Mike Newton, nScrypt Inc.
Opening Remarks: 8:15 am – 8:30 am
Technical Chair: Kenneth Church, nScrypt, Inc.
Exhibit Hours: 10:00 am – 7:00 pm
High School Student Printed Electronics Posters: 10:00 am – 1:30 pm
Bayside High School Communications Technology Students will be demonstrating their knowledge of screen printing techniques to incorporate printed circuit boards using non-traditional materials through a Tinker Toy lamp project that they built in class. Students learned basic electronic fundamentals and how circuitry functions. They applied their knowledge and married it with the printing applications learned in class to demonstrate by bringing their lamps to the Advanced Technical Workshop for display. Students expect to share and answer questions related to printed electronics.
University Student Posters: 10:00 am – 7:00 pm
Poster Judging at 5:45 pm
Large Area Deposition of Nano Particulate Suspensions for the Manufacture
of Flexible Electroluminescence Lamps
Nadja Straue, Martin Rauscher, Andreas Roosen, University Erlangen-Nuremberg
Design of pH Sensor Module for Wireless Sensor Network
Ho-Jeong Sohn, Sekwang Park, Kyungpook National University
Capacitive Sensor for Automotive Engine Oil Degradation using Wireless Network
Jaedong Cho, Sekwang Park, Kyungpook National University
Towards a Printed Reserve Cell Zinc-Air Battery
Krista L. Hawthorne, Christopher A. Apblett, Eric Branson, Adam Cook, Kyle Fenton, Paul Clem,
University of New Mexico
Session I: Processes & Materials
8:30 am - 11:30 am
Session Chair: C. Mike Newton, nScrypt Inc.
Inexpensive Copper Films: Reducing Printed Copper Oxideon Low Temperature Substrates at Industrial Speeds in Air
Kurt Schroder, Stan Farnsworth, Dave Pope, Ian Rawson, NovaCentrix
Aerosol Jet Material Deposition for High Resolution Printed Electronic Applications
Michael J. Renn, Optomec
Large Area Patterning of Conductors Utilizing Silver Nanoparticle Inks with Traditional Printing Processes
Michael Mastropietro, PChem Associates Inc.
Break: 10:00 am - 10:30 am
MicroDispensing/Spraying for Printed Electronics
Xudong (Donny) Chen, nScrypt Inc.
Solder-Free Electronics Assembly Materials – SEAM
Alfred A. Zinn, Lockheed Martin Space System Company
Buffet Lunch: 12:00 pm - 1:00 pm
Keynote Speaker: 12:30 pm – 1:00 pm
Dr. Pradeep P. Fulay, NSF
Session II: Device & Applications
1:30 pm – 5 :00 pm
Session Chair: Kenneth Church, nScrypt, Inc.
The Ideal Design System for the new Printed Devices technology
John Sovinsky, CAD Design Services, Inc.
The Integration of Electronics with Textiles via Inkjet Printing and Non-metallic Conductive Fibers
Michael D. Irwin, Richard I. Olivas, Eric W. MacDonald, University of Texas at El Paso
What’s Nano about Electronics?
David R. Darling, Lockheed Martin Missiles and Fire Control
Break: 3:00 pm - 3:30 pm
Towards a Fully Printable Battery: Robocast Deposition of LiFePO4
Chris Apblett, Sandia National Laboratories; Kyle Fenton, Plamen Atanassov, University of New Mexico
Magnetic Polymer Nanocomposites for RF and Microwave Applications
Jing Wang, Cesar Morales, Julio Dewdney, Susmita Pal, Kristen Stojak, Hariharan Srikanth, Thomas Weller, University of South Florida
Advantages of Printed Electronics for Small Vehicle Platforms such as Un-manned Air Vehicles (UAVs)
Robert M. Taylor, Sciperio, Inc.
Reception: 5:15 pm – 7:00 pm
University Student Poster Judging: 5:45 pm - 6:30 pm
Dinner: On your own
Friday, May 7th
Registration: 7:30 am - 12:00 pm
Continental Breakfast: 7:30 am - 8:30 am
Exhibit Hours: 8:00 – 12:00
Session III: Panel Discussion – Global Printed Electronics & Trends
Session Chairs: Kenneth Church, Sciperio, Inc.; C. Mike Newton, nScrypt Inc.
8:30 am - 12:00 pm
The panel discussion will focus on the technical and disruptive obstacles that must be overcome before printed devices will dominate next generation consumer electronics. While replacing existing products is one goal, the more obvious vision and impact will come from never before produced products; well not outside of Hollywood.
Featured Panel Discussion Speaker:
Printed Electronics in Asia
Namsoo (Peter) Kim, Professor & Director, Seokyoung University
University Student Poster Winners (Winners selected on May 6th)
Closing Remarks: 12:00 pm
IMAPS 2010 (Research Triangle) - Abstracts Now Accepted Through This Friday, April 16 ^
The 43rd International Symposium on Microelectronics (IMAPS 2010 - Raleigh, NC) will be held in Raleigh, NC, on October 31-November 4, 2010. The abstract deadline has been extended until Friday, April 16. Full symposium details can be found on-line at www.imaps2010.org or submit your abstract using the on-line submittal form at: www.imaps.org/abstracts.htm.
• Consumer, Portable and Wireless
• Defense and Security
• Computing and Gaming
• Automotive, Industrial, Harsh Environment Electronics Applications
• Solar and Alternative Energy
|3D Integration and Packaging Track
|• 3D System Integration
• 3D Packaging Approaches
• 3D Processing Technology
• 3D Equipment and Materials Advances
• 3D Simulation and Modeling
|Systems & Applications
• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices
• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials
|Materials and Process
• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics
• Ultra Low-K Packaging
• Uses of Precious Metals in Microelectronics
(Invited Speakers Only)
• Japanese (Japanese
to English translation)
• Chinese (Chinese to English translation)
|Interactive Poster Session
Outstanding papers that
do not fit in planned or created
sessions will be considered for this interactive session.
CICMT 2010 (Japan) - Program and Registration ^
The IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) will be held in Chiba, Japan on April 18-21, 2010. For full details, or to register, visit www.cicmt.org.
Mid-Atlantic Microelectronics Conference - Registration and Tabletop Exhibits Now Available - Program Soon ^
The Mid-Atlantic Microelectronics Conference will be held in Atlantic City, New Jersey on June 17-18, 2010. For full details, or to register, visit www.imaps.org/midatlantic.
Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to submit an abstract for review for the Mid-Atlantic Microelectronics Packaging Conference.
The Conference will be co-located with two half-day professional development courses and a full-day workshop on Portable Electronics on Thursday, June 17. The Conference will officially begin with an evening reception that night.
The Program Committee is currently finalizing the technical program. To view the professional development courses, tabletop exhibit details, to register on-line or for full conference details, visit www.imaps.org/midatlantic.
listed in chronological order)
THIS THURSDAY: IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor Night ^
||April 15, 2010
|| 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)
Holiday Inn Ronkonkoma
Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.
Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email firstname.lastname@example.org to register
400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010
100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010
The vendor night will be preceded by Professional Development Courses and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.
A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.
This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.
Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.
Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.
He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.
A Full Day Presentation on:
International Traffic in Arms Regulations(ITAR)
Course Leaders: Kelly Raia & Tom Cook, American River International
Every company's management wants to have complete confidence in its trade compliance effort with respect to the International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR). The question is: Is that an achievable goal? Do you have concerns about your staff not having the necessary skills and up-to-date knowledge needed to keep your company in compliance? This presentation will cover all of the following points:
Managing Compliance in the Global Supply Chain
EAR vs. ITAR
Dept of Commerce
Scope of the Export Administration Regulations
Foreign Trade Regulations and Licensable Transactions
Dept of Foreign Asset Controls
Destination Control Statement
Exporting Under Dept of State Licenses
Penalties for ITAR Violations
Other Supply Chain Issues
Managing Your Forwarder and Customs Broker in Licensable Transactions
About the presenters:
Kelly has been involved in freight forwarding and customhouse brokerage for over 20 years.
Kelly owned and managed Armac Transportation for 10 years. This business specialized in customs clearances of time sensitive shipments such as live
animals, aircraft parts, chemicals and various perishable products.
Kelly joined FSI/American River in 1996. During this time she has worked as a senior account manager leading to managing the international department including global export and import operations.
In 1997 Kelly assumed various consulting responsibilities and became ARI’s in-house specialist for import/export compliance.
She has worked on some major accounts assisting their staff in global logistics, compliance management and working on the various international and government web sites for compliance resources.
Kelly has also developed various in-house programs for management training, utilizing technology in importing and exporting and in developing skills for import/export compliance management.
She has lectured at the World Trade Institute and supports Tom Cook and Rennie Alston for the many courses and programs they deliver on various international logistics and compliance matters.
Kelly is a licensed customhouse broker, haz-mat certified and TSA Security
Kelly attended Long Island University, C.W. Post campus as well as Nassau Community College where she has taken many courses in business and communication.
She is the Import/Export Compliance Officer, Vice President and Associate Partner at American River International and serves on the executive committee.
Thomas A. Cook
Tom has been involved in global business for over 30 years in an array of diverse international trades.
He graduated from Maritime College at Fort Schuyler, NY, where he holds both a BS Degree in Transportation Science and a Graduate Degree in Transportation and Business Management.
His career began in the US Naval Reserve and the US and Dutch Merchant Marine, where he served as an officer in various commercial and military capacities on passenger, tug, oil, chemical, break-bulk and container vessels, all over the globe.
Tom has also been involved in the international insurance, manufacturing, exporting, marketing, in the trade finance arenas and in senior management and ownership positions, with an emphasis on logistics, compliance and security.
He has authored over 225 articles and published seven books on international trade, the latest: “Managing Global Supply Chains” and has lectured all over the world on varied subjects involved with global trade. He is considered by many leading professionals to be top in the field of global logistics and international operations.
Tom has numerous interests in third party logistics, global trade and international business. He is on the board of many companies and organizations, such as but not limited to: American River International, FSI Global Logistics, The Trade Resource Group of Customs in Washington, DC, The Small Business Exporters Association, North American Exporters Association, World Trade Magazine, American Management Association, IOMA and The World Academy, New York District Export Council.
Tom currently serves as CEO and Managing Director of American River International, a premier consulting and logistics firm.
Exhibit Registration Information:
631 331 0689
Space Systems Loral
650 644 5218
IMAPS Indiana Chapter Vendor's Day and Mini-Symposium ^
||Monday, April 19, 2010
Clarion Waterfront Plaza Hotel and Conference Center
2930 Waterfront Parkway West Drive, Indianapolis, IN
Complimentary - No advance registration is required
Schedule of Events
12:00 PM – 6:30 PM On-Site Registration
1:00 PM – 5:00 PM Technical Presentations
5:00 PM – 6:30 PM IMAPS Vendor Displays
No advance registration is required. The event is free to all attendees. Come out and support the local Indiana IMAPS and SMTA chapters and the vendors who contribute much to these organizations. IMAPS or SMTA membership not required to attend. There will be refreshments, and door prizes at 6:00 PM for which you must be present to win. See you there!
IMAPS Chesapeake Chapter Spring Symposium April 28 ^
||April 28, 2010
|| 3:00 - Registration, Networking, and Group Introductions
3:30 - 5:30 - Presentations
5:30 - 5:45 - Business Meeting
5:45 - Dinner
Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road, Laurel, MD 20723
Enter in the area marked Lobby 1 and check-in with APL staff
Call John Lehtonen of APL at 240-228-3479 for on-site information only.
IMAPS Members-$20, non-members-$30, and students with ID-$5.00.
On-line registration ends of Monday, April 26 at 12:00 Noon.
A fee of $5.00 will be charged for on-site registrations.
3:00 Registration, Networking, and Group Introductions
3:30 Patricia Campbell, Professor at the University of Maryland’s School of Law
“Intellectual Property Law: An Overview.”
Abstract: This presentation will provide an overview of the four basic areas of intellectual property law, including patents, trade secrets, copyrights and trademarks. The discussion will focus on the types of property rights that are protected by each area of the law and how they are perfected by the intellectual property rights owner. The presentation will conclude with a brief discussion of a few of the "hot" issues in intellectual property law today.
Biography: Patricia Campbell is an Associate Professor at the University of Maryland’s School of Law and she is the Director of the Maryland Intellectual Property Legal Resource Center. Prior to joining the law school in 2007, Professor Campbell was a litigator and transactional attorney in the Fish & Neave IP Group at Ropes & Gray in Palo Alto, California, and Washington, DC. Professor Campbell has also worked at law firms in Pittsburgh and Philadelphia and at a high tech company in Silicon Valley.
3:45 Brief Break
4:00 Sarah Reynolds, Senior Consultant at American River International
“Understanding Deemed Exports.”
Abstract: This presentation will review the particulars of an export transaction such as; what is the definition of an export, how to determine if your export transaction is controlled and if so, by which government agency. The session will also bring awareness to deemed exports and discuss the controls that should be put in place in order to manage your exports and deemed exports compliantly, including how to obtain a deemed export license and who is defined as a foreign national and its importance.
Biography: Sarah Reynolds has over 25 years experience in the international logistic industry specializing in supply chain management to difficult and problematic countries. Sarah’s experience includes employment by notable international freight forwarders such as Kuehne & Nagel, SDV and UTI and exposure to various aspects of the industry such as; sales and customer service, worldwide bid negotiation, network development and compliance management. Sarah is currently a Senior Consultant at American River International where she provides consulting services and training to companies involved in the international supply chain industry.
4:45 Brief Break
5:00 Vidyu Challa, PhD Candidate at the Center for Advanced Life Cycle Engineering (CALCE) University of Maryland
“Effect of Joule Heating on Reliability of High Pin Count Land Grid Array Sockets."
Abstract: Performance requirements in high-end microprocessors have led to higher I/O counts and interconnect densities. As greater currents pass through the microprocessor interconnect, higher temperatures driven by Joule heating are expected to pose a reliability risk to high-pin microprocessor sockets. In this study, the properties of the polymer housing were found to be sensitive to temperature effects owing to its visco-elastic nature, and to significantly influence the stress relaxation behavior of the socket, potentially leading to earlier failure. The factors that influence Joule heating and therefore contribute to earlier failure by stress relaxation were examined using a combination of experimental and numerical methods. Polymer visco-elasticity was characterized and the properties were subsequently used to demonstrate earlier failure by stress relaxation for land-grid array sockets at higher temperatures driven by Joule heating.
Biography: Vidyu Challa is a PhD candidate in Mechanical Engineering at CALCE. Prior to joining CALCE, Vidyu spent 4 years in the microelectronics industry in the areas of material characterization and failure analysis as an Applications Engineer at Sonix, Inc. Vidyu received the Phi Delta Gamma award for interdisciplinary scholarship achievement and the Ann Wylie Dissertation Fellowship. Her research interests include socket and connector reliability, qualification of electronic components/systems, material characterization, and finite-element modeling for electronics. Vidyu has 10 publications from her work at CALCE and her previous position. She received the M.S degree in Chemical Engineering from the University of Akron.
5:30 Event wrap-up. Ideas for next event. 2010 Elections - other business.
IMAPS New England 37th Symposium and Expo on May 4 - Register On-Line ^
IMAPS New England's 37th Symposium and Expo will be held May 4, 2010, at the Holiday Inn Boxborough Woods, Boxborough MA.
Time is Running Short: You need to put the New England IMAPS “Get Smart” Symposium and Expo Tuesday May 4th in your schedule (21 Days). There are a lot of GREAT papers listed in our technical program. And if you have not signed up as an exhibitor yet please contact Harvey Smith See all the exhibitors who have already signed up - listing of exhibitors.
You can now register ON-LINE.
IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging ^
The IMAPS Israel Workshop on Advanced Microelectronic Packaging will be held at the
Sharon Hotel from June 2, in Herzelia, Israel.
The objective of the Microelectronic Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to packaging.
- 3-D Packaging
- Cooling High Density Circuits
- MEMS and MOEMS
- Photovoltaic and Fuel Cell
- Assembly Processes and Handling Issues
- Wirebonding and Bumping
- Novel Packaging and Design
- High Reliability & LTCC
- BGA, CSP
- Portable Electronics
- Biomedical Electronics
- Electromigration and Interfacial Adhesion
- Testing and Probing Challenges
- Simulation and Modeling
- New and Nano Materials
- Lead-Free Materials & Electronics
Those wishing to present a paper at the Portable/Wireless Devices Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm.
Please contact Jackki Morris-Joyner by email at email@example.com or by phone at 202-548-4001 if you have questions.
IMAPS Nordic Conference 2010 - Program Available Soon ^
The IMAPS Nordic Conference 2010 will be held at the
Elite Park Avenue Hotel from June 6-9, in Gothenburg, Sweden.
IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the Swerea IVF Institute.
For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to firstname.lastname@example.org or to the Exhibition Host at email@example.com.
IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11 ^
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.
IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.
Embrace IMPACT, Create Possibilities...
Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010
- Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
- Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
- Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)
For questions on paper submission, please contact:
Technical Program Chair
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)
Technical Program Cochair
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)
Requests for information about the symposia should be directed to:
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150
||Membership, Products and Publications
IMAPS Individual Membership Benefits ^
- Discounts on events, publications, and iKnow Micro downloads
- Take discounts on the Annual Symposium and many technical workshops.
- Take discounts on publications and on-line library downloads; http://www.imaps.org/imapsstore/default.aspx
- IMAPS Chapter Membership
- Learn from technical and management presentations by local and national experts.
- Connect with industry peers through regional programs.
- Advancing Microelectronics Magazine
- Enjoy a complimentary one-year subscription to Advancing Microelectronics.
- Access the Journal of Microelectronics and Electronic Packaging
- View the Journal of Microelectronics and Electronic Packaging on-line.
- Complimentary Access to JOBS Marketplace
- Post resumes and search for current job openings.
- Keep records easily - results and actions are conveniently recorded.
- Enjoy helpful features of many expensive job search engines.
- Access "Members-Only" sections on imaps.org
- Find individuals and companies that provide products and services.
- Enter your own professional listing.
For more details about IMAPS Membership, visit www.imaps.org or call Steve Greene, Membership Manager, at 202-548-4001 or firstname.lastname@example.org.
ATW on Automotive Microelectronics and Packaging
ATW and Tabletop Exhibit on Printed Devices and Applications
*Exhibitors contact email@example.com
International Conference on High Temperature Electronics (HiTEC 2010)
*Exhibitors contact firstname.lastname@example.org
ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
*Exhibitors contact email@example.com
Mid-Atlantic Microelectronics Conference
Atlantic City, NJ
*Exhibitors contact firstname.lastname@example.org
ATW on Advanced Interconnect Technologies
San Francisco, CA
ATW on Wire Bonding
San Francisco, CA
ATW on Electronic Packaging of Solar Cells and Fuel Cells
IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
*Exhibitors contact email@example.com