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April 28, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
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THIS FRIDAY: Printed Devices and Applications Workship and Tabletop Exhibition - Exhibit and Registration Deadline April 30 (read more...)

Button Program, Registration and Tabletops Now Available for the Microelectronic Packaging and Materials for Medical Devices Workshop (read more...)

Button THIS FRIDAY: ATW on Wire Bonding Abstracts Due April 30 (read more...)

Button THIS FRIDAY: ATW on Advanced Interconnect Technologies Abstracts Due April 30 (read more...)

Button New Webinar Begin Next Thursday: Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity (read more...)

Button Mid-Atlantic Microelectronics Conference - Tabletops Sure To Sell Out (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: IMAPS Chesapeake Chapter Spring Symposium April 28 (read more...)

Bullet ON-LINE REGISTRATION ENDS THIS FRIDAY: IMAPS New England 37th Symposium and Expo on May 4 (read more...)

Bullet IMAPS Central Texas Chapter Electronics Design and Manufacturing Symposium on May 11 (read more...)

Bullet IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging (read more...)

Bullet IMAPS Nordic Conference 2010 - Program Now Available (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11 (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Submit Your IMAPS Awards Nominations (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

THIS FRIDAY: Printed Devices and Applications Workship and Tabletop Exhibition - Exhibit and Registration Deadline April 30    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held in Orlando, Florida, May 6-7, 2010. For full details, or to register, visit www.imaps.org/printed. The hotel deadline, early registration and exhibits cut-offs are April 30. After this date, IMAPS cannot guarantee room availability or rates.

Program, Registration and Tabletops Now Available for the Microelectronic Packaging and Materials for Medical Devices Workshop    ^ Top
IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 10, 2010, at the Crowne Plaza Minneapolis Northstar Downtown.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Wednesday, June 9, 2010

Registration: 12:00 pm – 5:00 pm

Professional Development Course (PDC):
Hermetic and “Near Hermetic” Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates

This PDC is co-located with the Workshop and available for a separate registration fee. This course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.

Historically, hermeticity requirements for Class III Medical Implants have mirrored that for military and telecom applications. This course will briefly review the traditional hermeticity test methods (helium leak test and bubble method) and some of the pitfalls and lessons learned over the years. Recent changes to the hermeticity spec will be discussed along with the difficulties in testing to leak rates that are two orders of magnitude tighter than what exists today.

Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. A brief review of the techniques and methods to evaluate a "near-hermetic" approach is presented along with a discussion of the pitfalls and issues with TM 1014 (Seal)  and TM 1018 (Internal Water Vapor) as applied to a “near hermetic package”.  Fick’s law of moisture diffusion is the dominant theory guiding “near hermetic” package styles and testing such as  WVTR, TGA and moisture diffusion coefficients are used in lieu of traditional helium based hermeticity techniques to evaluate and understand the integrity of the seal.  Applications of moisture sensing inside a package and a discussion on how to qualify a “near hermetic” package will also be presented.

Biography:
Mr. Thomas Green is an independent consultant and respected teacher. He has over twenty-eight years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including,  CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including  MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow and has worked as a hermeticity consultant for a variety military and medical companies. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com).


Thursday, June 10, 2010

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 8:00 am – 5:00 pm
Sessions, Tabletop Exhibits and Food/Beverage all in the same room

Opening Remarks: 8:00 am – 8:15 am
General Chairs: Jay Ellingboe, Smiths Medical; Thomas Green, TJ Green Associates

Keynote Presentation:
8:15 am – 9:00 am

Emerging Markets for Microfluidics Applications
Jeff Perkins, General Manager, Yole, Inc.
Yole Développement is a market research and business development consulting firm facilitating market access for advanced technologies. Yole has been tracking the MEMS industry for over 10 years and maintains a focus on industries using wafer based manufacturing processes.

Jeff has over 20 years of experience working in emerging technologies. Jeff leads Yole’s business development activities in North America. His experience in emerging technology covers energy, medical, aerospace and consumer markets.

Session I: TITLE TBD
9:00 am - 12:00 am
Session Chair: TBD

Printing Silicon Integrated Circuits for Wireless Sensors
Jayna Sheats, Hamidreza Alemohammad, Ehsan Foroozmehr, Ara Kim, Tony Mantell, Amir Zadeh and David Biesty, Terepac Corporation

Stacking of Known Good Rebuilt Wafers Without TSV Applications to Memories and SiP
Christian Val, Pascal Couderc, Nadia Boulay, 3D Plus

Break: 10:00 am - 10:30 am

Laser Direct Structuring Method of Integrating Circuitry with Three-Dimensional Components
James Liddle, SelectConnect Technologies

3D Packaging Technique for a Flexible and Biocompatible Antenna Using Z-axis for Wireless Monitoring of Intraocular Pressure (IOP)
Tse-Yu Lin, Byung Guk Kim, Dohyuk Ha, Sungwook Moon, Eric Hoppenjans, William Chappell, Purdue University

High Performance and High Reliability Passives for Miniature Medical Devices Based Upon Silicon Technologies
Franck Murray, IPDIA

Lunch Break: 12:00 pm - 1:30 pm

Session II: TBD
1:30 pm – 5 :00 pm
Session Chair: TBD

Advances in Solid-State Magnetic Sensors for Medical Devices
Daniel Baker, Jay Brown, NVE Corporation

Hermetic, Radio-transparent Micropackaging for Implantable Neural Prosthetics
Charles Byers, Guangqiang Jiang, Alfred Mann Foundation

High Voltage, High Impedance Resistors Small Sized for Medical Applications
Wolfgang Tschanun, Hansperter Good, Dieter Kaegi, Reinhardt Microtech AG

Break: 3:00 pm - 3:30 pm

Leveraging the Insatiable Need for Smaller Microelectronic Packages: Opportunities for Medical Devices
Frank Stepniak, Texas Instruments

Ceramic Packaging in Medical Applications
Arne Knudsen, Iris Labadie, Ross Linker, Kyocera America

Advanced Technologies for High Reliability Medical Electronics Manufacturing 
Thomas Jacob, Ravi Subrahmanyan, Dyconex Inc. 

Closing Remarks: 5:00 pm – 5:15 pm
Technical Chairs: Sean Ferrian, Ferrian Sales; Thomas Jacob, Dyconex, Inc.

 Register On-line

THIS FRIDAY: ATW on Wire Bonding Abstracts Due April 30    ^ Top
The Advanced Technology Workshop on Wire Bonding will be held in San Francisco, California, July 15, 2010. This event will be co-located with IMAPS Workshop on Advanced Interconnect Technologies and with SEMICON West 2010. For full details, or to submit your abstract, visit www.imaps.org/wirebonding. The abstract deadline is this Friday, April 30.

Wire Bonding Workshop Focus:
The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

  • Copper Ball Bonding and Bumping
  • Cu/Low-K Processes and Materials
  • Stacked Die and 3D Packaging
  • Wire Bonding and Bumping
  • Novel Packaging and Design
  • Heavy Wire Bonding
  • Failure Analysis and Reliability
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 18, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

THIS FRIDAY: ATW on Advanced Interconnect Technologies Abstracts Due April 30    ^ Top
The Advanced Technology Workshop on Advanced Interconnect Technologies will be held in San Francisco, California, July 14, 2010. This event will be co-located with IMAPS Workshop on Wire Bonding and with SEMICON West 2010. For full details, or to submit your abstract, visit www.imaps.org/advintercon. The abstract deadline is this Friday, April 30.

Workshop Focus:

The Advanced Interconnect Technologies Workshop has been organized to allow for the presentation and debate of some of the latest interconnect and processing technologies in Electronic Packaging. Sessions and presentations are planned around (but not limited to) the following topics:

  • Nano Printing Technology and Optointerconnect
  • Integration of Packaging and Semiconductor Technology
  • Nano Materials Applications in Electronic Packaging Industry
  • 3D ICs Interconnect Technologies
  • Wafer Level Chip Scale Packaging
  • Printed Electronics

Those wishing to present a paper at the Advanced Interconnect Technologies Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 18, 2010.

New Webinar Begins Next Thursday: Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity    ^ Top
Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

Upcoming Programs:

PDC Webinar Series on
Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Presented by: Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, May 6, 13 and 20, 2010 . All webinars will be held 10:00 am - 11:00 am EDT

PDC Webinar Series on
Conformal Coating Applications, Inspection, Rework & Quality Control
Presented by: Bob Willis, ASKbobwillis.com Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, May 18 and Wednesday, May 19, 2010 . All webinars will be held 12:00 noon - 1:00 pm EDT

Corporate Webinar on
Precious Metal Financing and Hedging
Presented by: Paul Angland, HSBC Bank USA
This corporate webinar will be held Wednesday, June 9, 2010 . This webinar will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, June 8 and 15, 2010 . All webinars will be held 12:00 noon - 1:30 pm PACIFIC

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

Mid-Atlantic Microelectronics Conference - Tabletops Sure To Sell Out    ^ Top
The Mid-Atlantic Microelectronics Conference will be held in Atlantic City, New Jersey on June 17-18, 2010. For full details, or to register, visit www.imaps.org/midatlantic.

Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to attend the upcoming Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with two half-day professional development courses on Wire Bonding and Near Hermetic Packaging Concepts for Military and Medical Devices. The Conference will begin on the afternoon of Thursday, June 17, and will also feature an evening reception that night.

The Program Committee is currently finalizing the technical program. To view the professional development courses, tabletop exhibit details, to register on-line or for full conference details, visit www.imaps.org/midatlantic.

 

  Chapter Activities (events listed in chronological order)
 

TODAY: IMAPS Chesapeake Chapter Spring Symposium April 28    ^ Top

Dates: April 28, 2010
Schedule: 3:00 - Registration, Networking, and Group Introductions
3:30 - 5:30 - Presentations
5:30 - 5:45 - Business Meeting
5:45 - Dinner
Location:

Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road, Laurel, MD 20723
www.jhuapl.edu
Enter in the area marked Lobby 1 and check-in with APL staff
Call John Lehtonen of APL at 240-228-3479 for on-site information only.

Registration:

IMAPS Members-$20, non-members-$30, and students with ID-$5.00.
Register On-line
On-line registration ends of Monday, April 26 at 12:00 Noon.
A fee of $5.00 will be charged for on-site registrations.

Program:

    3:00   Registration, Networking, and Group Introductions

    3:30   Patricia Campbell, Professor at the University of Maryland’s School of Law 
               “Intellectual Property Law: An Overview.”  

Abstract:  This presentation will provide an overview of the four basic areas of intellectual property law, including patents, trade secrets, copyrights and trademarks.   The discussion will focus on the types of property rights that are protected by each area of the law and how they are perfected by the intellectual property rights owner.  The presentation will conclude with a brief discussion of a few of the "hot" issues in intellectual property law today.

Biography:  Patricia Campbell is an Associate Professor at the University of Maryland’s School of Law and she is the Director of the Maryland Intellectual Property Legal Resource Center.  Prior to joining the law school in 2007, Professor Campbell was a litigator and transactional attorney in the Fish & Neave IP Group at Ropes & Gray in Palo Alto, California, and Washington, DC.  Professor Campbell has also worked at law firms in Pittsburgh and Philadelphia and at a high tech company in Silicon Valley.

    3:45  Brief Break
         
    4:00    Sarah Reynolds, Senior Consultant at American River International
                 “Understanding Deemed Exports.”

Abstract:  This presentation will review the particulars of an export transaction such as; what is the definition of an export, how to determine if your export transaction is controlled and if so, by which government agency.  The session will also bring awareness to deemed exports and discuss the controls that should be put in place in order to manage your exports and deemed exports compliantly, including how to obtain a deemed export license and who is defined as a foreign national and its importance.

Biography:  Sarah Reynolds has over 25 years experience in the international logistic industry specializing in supply chain management to difficult and problematic countries.  Sarah’s experience includes employment by notable international freight forwarders such as Kuehne & Nagel, SDV and UTI and exposure to various aspects of the industry such as; sales and customer service, worldwide bid negotiation, network development and compliance management.  Sarah is currently a Senior Consultant at American River International where she provides consulting services and training to companies involved in the international supply chain industry.

           
   4:45  Brief Break
 
   5:00  Vidyu Challa, PhD Candidate at the Center for Advanced Life Cycle Engineering (CALCE) University of Maryland
              “Effect of Joule Heating on Reliability of High Pin Count Land Grid Array Sockets." 

Abstract:  Performance requirements in high-end microprocessors have led to higher I/O counts and interconnect densities.  As greater currents pass through the microprocessor interconnect, higher temperatures driven by Joule heating are expected to pose a reliability risk to high-pin microprocessor sockets. In this study, the properties of the polymer housing were found to be sensitive to temperature effects owing to its visco-elastic nature, and to significantly influence the stress relaxation behavior of the socket, potentially leading to earlier failure. The factors that influence Joule heating and therefore contribute to earlier failure by stress relaxation were examined using a combination of experimental and numerical methods. Polymer visco-elasticity was characterized and the properties were subsequently used to demonstrate earlier failure by stress relaxation for land-grid array sockets at higher temperatures driven by Joule heating.

Biography:  Vidyu Challa is a PhD candidate in Mechanical Engineering at CALCE. Prior to joining CALCE, Vidyu spent 4 years in the microelectronics industry in the areas of material characterization and failure analysis as an Applications Engineer at Sonix, Inc.  Vidyu received the Phi Delta Gamma award for interdisciplinary scholarship achievement and the Ann Wylie Dissertation Fellowship. Her research interests include socket and connector reliability, qualification of electronic components/systems, material characterization, and finite-element modeling for electronics.  Vidyu has 10 publications from her work at CALCE and her previous position.  She received the M.S degree in Chemical Engineering from the University of Akron.

   
   5:30  Event wrap-up.  Ideas for next event.  2010 Elections - other business.

   5:45  Dinner

ON-LINE REGISTRATION ENDS THIS FRIDAY: IMAPS New England 37th Symposium and Expo on May 4    ^ Top
IMAPS New England's 37th Symposium and Expo will be held May 4, 2010, at the Holiday Inn Boxborough Woods, Boxborough MA.

Time is Running Short:  You need to put the New England IMAPS “Get Smart” Symposium and Expo Tuesday May 4th in your schedule (21 Days).  There are a lot of GREAT papers listed in our technical program.  And if you have not signed up as an exhibitor yet please contact Harvey Smith  See all the exhibitors who have already signed up - listing of exhibitors.  

You can now register ON-LINE.

IMAPS Central Texas Chapter Electronics Design and Manufacturing Symposium on May 11    ^ Top

Dates: May 11, 2010
Schedule: 3:00 - Registration, Networking Begins
3:35 - 4:35 - Flextronics Facility Video Tour
4:50 - Technical Presentations Begin
6:00 - Food/Refreshments
Location:

Flextronics at 12455 Research Boulevard in NW Austin
Exit US-183 at Oak Knoll and turn right onto Riata Trace Parkway
Main entrance is left turn off Riata Trace Parkway (Visitor parking in front of Lobby)
(512) 425-4100
See Map at: http://local.yahoo.com/info-19425416-flextronics-international-austin

Registration:

IMAPS Members-Complimentary, non-members-$10

RSVP to Bob Baker at:  rjbakeratx@austin.rr.com

Program:

3:00  -  Registration and Networking

3:30  -  Welcome and Introductions

3:35  -  "Flextronics Facility Video Tour"  David Mendez of Flextronics
                   
4:35  -  Break & Networking

4:50  -  "Challenges Associated With Conversion to No-clean Process from Water Clean Process
                  for High Reliability Circuit Boards."   Gordon O’Hara of Flextronics

5:20  -  "Nanotechnology for Electronics and Packaging Applications."  Richard Fink, Applied Nanotech

5:50  -  Closing Remarks

6:00  -  Food & Refreshments Served

IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging    ^ Top
The IMAPS Israel Workshop on Advanced Microelectronic Packaging will be held at the Sharon Hotel from June 2, in Herzelia, Israel.

The objective of the Microelectronic Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to packaging.

  • 3-D Packaging
  • Cooling High Density Circuits
  • MEMS and MOEMS
  • Photovoltaic and Fuel Cell
  • Assembly Processes and Handling Issues
  • Wirebonding and Bumping
  • Novel Packaging and Design
  • High Reliability & LTCC
  • BGA, CSP
  • Portable Electronics
  • Biomedical Electronics
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling
  • New and Nano Materials
  • Lead-Free Materials & Electronics

Those wishing to present a paper at the IMAPS Israel Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

IMAPS Nordic Conference 2010 - Program Now Available    ^ Top
The IMAPS Nordic Conference 2010 will be held at the Elite Park Avenue Hotel from June 6-9, in Gothenburg, Sweden. For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

The program is now available and is planned with the following sessions and speakers:

                        SUNDAY 6th June
                               
19:30                     COCKTAIL PARTY
                               

                                MONDAY 7th June
                               
9:00                        OPENING AND KEYNOTES
9:05                        Integrated passive devices and silicon interposers
                                Jean-Marc Yannou, Yole Développement
                               
9:35                        Investing in Intellectual Assets
                                Bill Brox, IMEGO
                               
10:05                     Exhibitor presentations
                               
10:20                     COFFEE BREAK
                               
                                FLIP CHIP TECHNOLOGY
                               
11:00                     Temperature Cycling and Constant Humidity Test for Flip Chip Joints using Pre-Aged ACF
                                Anniina Parviainen, Tampere University of Technology
                               
11:25                     Advanced Flip Chip bonding for imaging devices
                                Jörgen Alvebro, Irnova AB        
                               
11:50                     Au Stud Bump Optimization for Anisotropic Conductive Adhesives Interconnects
                                Luca Petricca, Vestfold University College
                               
12:15                     IMAPS NORDIC ANNUAL MEETING
                               
13:00                     LUNCH
                               
                                ADVANCED TECHNOLOGIES AND APPLICATIONS
                               
14:00                     LED device developing trend & LED products tear down for understanding LED Packaging
                                T. Onishi, Grand Joint Technology Ltd
                               
14:25                     3D Computational Fluid Dynamics Simulation of Carbon Nanotube Based Microchannel On-Chip Cooler
                                Nabi Nabiollahai,  Chalmers University of Technology
                               
14:50                     Room temperature soldering of difficult components
                                Paul Collander, Poltronic OY
                               
15:15                     COFFEE BREAK
                               
                                RELIABILITY CONCERNS
                               
15:45                     Managing the Reliability Time-bombs of Modern Electronics and Photonics
                                Nihal Sinnadurai, ATTAC
                               
16:10                     Manufacturing and Reliability Challenges with QFN
                                Greg Caswell, DfR Solutions
                               
                                POLYMERS AND ADHESIVES
                               
16:35                     Changes in chemical structure of commercial ACF after thermal cycling and humidity testing
                                Laura Frisk  Tampere University of Technology
                               
17:00                     Particle distribution in screen printed and dispensed ACF interconnections
                                Sanna Lahokallio, Tampere University of Technology
                               
17:25                     End of session
                               
19:30                     BANQUET DINNER
                               
                               
                                TUESDAY 8th JUNE
                               
                                3D TECHNOLOGY
                               
9:00                        Through Silicon Vias  Integration in 3D integrated passive technology
                                Olivier Garborieau, Franck Murray, IPDIA
                               
9:25                        Die with TSV Packaging from Japan
                                T. Onishi, Grand Joint Technology  Ltd
                               
9:50                        COFFEE BREAK
                               
                                ENCAPSULATIONS, BONDING, AND SUBSTRATES
                               
10:40                     HB-LED  Cavity Encapsulation
                                Horatio Quinones, ASYMTEK
                               
11:05                     Coreless substrates - a new approach
                               Bernd K. Appel, ASE Europé
                               
11:30                     Gold to Gold Thermosonic Bonding Characterization of Bonding Parameters
                                Thi-Thuy Luu, Vestfold University Collage
                               
11:55                     Moisture effects on the performance of RFID tags with ACA joints
                                Kirsi Saarinen, Tampere University of Technology
                               
12:20                     LUNCH
                               
                                ADVANCED METHODS AND MATERIALS
                               
13:20                     Hydraulic modelling of EMC screens and fans for telecommunication cabinets: state of the art
                                Anton Bengoechea, Tecnun-University of Navarra
                               
13:45                     Acoustic Matching Layer for High Frequency Transducers made by Anisotropic Wet  Etching of Silicon
                                Thai Nguyen, Vestfold University Collage
                               
14:10                     Comparison of ceramic multilayer technology for RF Integration of HTCC/LTCC
                                F. Bechtold, VIA Electronic GmbH
                               
14:35                     Temperature and Humidity Testing of Rigid-Flex ACA Heat Seal Attachments
                                Janne Kiilunen, Tampere University of Technology
                               
15:00                     End of session
                               
15:30                     Visit to IMEGO (about 500 meters from the Conference Hotel)
                               
                               
                                WEDNESDAY 9th June
                               
                                SHORT COURSES (separate fee)
                               
8:30-12:00           The need for increased cleanliness in modern SMT manufacturing
                                Greg Caswell, DfR Solutions
                               
12:00                     LUNCH (at attendees own cost)
                               
13:00-16:00         Lead Free Reliability
                                Olli Salmela, Nokia Siemens Network

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Secretariat
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

  Membership, Products and Publications
 

Submit Your IMAPS Awards Nominations   ^ Top
This is an urgent appeal from your 2010 Awards Committee Chair to submit your nominations for the following awards – the cutoff date is Aug 27, 2010.

  1. Corporate Recognition
  2. Daniel C. Hughes, Jr.
  3. William D. Ashman
  4.  John A. Wagnon
  5. Technical Achievement
  6. Fellow of the Society
  7. Sidney J. Stein Interglobal
  8. Lifetime Achievement
  9. Outstanding Educator

Any IMAPS member may submit a nomination for any IMAPS member but must use the Awards Nomination Form that is available on our website – please navigate as follows: Log in -> Membership -> Society Awards. Eligibility requirements must be considered in making any nominations and these are also available under “Awards”.

Many thanks.
Regards,
Delip Doug” Bokil
2010 Awards Committee Chair
2010 First Past President

   
   

Oneida Research Services

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact abell@imaps.org

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact abell@imaps.org

Mid-Atlantic Microelectronics Conference
June 17-18
Atlantic City, NJ
*Exhibitors contact abell@imaps.org

ATW on Advanced Interconnect Technologies
July 14
San Francisco, CA

ATW on Wire Bonding
July 15
San Francisco, CA

ATW on High Reliability Microelectronics for Military Applications
August 31 - September 2
Bethesda, MD

ATW on Electronic Packaging of Solar Cells and Fuel Cells
September 14-16
Cleveland, OH

ATW on Thermal Management
September 28-30
Palo Alto, CA
*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

ETW on Nano-Integrated Microsystems Packaging:
Design, Materials, Processes and Applications

November 4-5, 2010
Raleigh, NC
Co-located with IMAPS 2010

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