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April 6, 2010
 

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   IMAPS EVENTS
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High Temperature Electronics Conference (HiTEC 2010) - Hotel/Registration Deadlines This Friday, April 9 (read more...)

Button This Friday: Workshop on Automotive Microelectronics and Packaging - Early Registration Ends April 9 (read more...)

Button Printed Devices and Applications Workship and Tabletop Exhibition - Program and Registration Now Available (read more...)

Button IMAPS 2010 (Research Triangle) - Abstracts Now Accepted Through April 16 (read more...)

Button CICMT 2010 (Japan) - Program and Registration (read more...)

Button Mid-Atlantic Microelectronics Conference - Abstracts Still Being Accepted (read more...)

Button Topical Workshop on Portable/Wireless Devices - Abstracts Due This Friday (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor's Night (read more...)

Bullet IMAPS Indiana Chapter Vendor's Day and Mini-Symposium (read more...)

Bullet IMAPS Chesapeake Chapter Spring Symposium April 28 (read more...)

Bullet IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging (read more...)

Bullet IMAPS Nordic Conference 2010 - Program Available Soon (read more...)

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IMAPS Individual Member Benefits (read more...)

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  IMAPS Events (view full Web Calendar)
 

High Temperature Electronics Conference (HiTEC 2010) - Hotel/Registration Deadlines This Friday April 9    ^ Top
The International Conference on High Temperature Electronics (HiTEC 2010) will be held in Albuquerque, New Mexico, May 11-13, 2010. For full details, or to register, visit www.imaps.org/hitec. The hotel deadline, early registration and exhibits cut-offs are April 9. After this date, IMAPS cannot guarantee room availability or rates.

The members of the Conference Committee are pleased to invite you to the IMAPS High Temperature Electronics Conference (HiTEC 2010). This is the premier event addressing the needs of the high temperature electronics community. Applications for high temperature electronics include smart energy, underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc. HiTEC 2010 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of these applications. Tabletop exhibits will compliment the technical program by providing you an opportunity to view the latest products for high temperature electronics. This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important area.

Technical Program | Register On-line
Tabletop Exhibit Information | Reserve Tabletop(s)

This Friday: Workshop on Automotive Microelectronics and Packaging - Early Registration Ends April 9    ^ Top
The Advanced Technology Workshop on Automotive Microelectronics and Packaging will be held in Dearborn, Michigan, April 27-28, 2010. For full details, or to register, visit www.imaps.org/automotive. The early registration deadline is April 9. Register On-Line

Printed Devices and Applications Workship and Tabletop Exhibition - Program and Registration Now Available    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Printed Devices and Applications will be held in Orlando, Florida, May 6-7, 2010. For full details, or to register, visit www.imaps.org/printed. The hotel deadline, early registration and exhibits cut-offs are April 13. After this date, IMAPS cannot guarantee room availability or rates.

Thursday, May 6th

Registration: 7:30 am – 7:00 pm

Continental Breakfast: 7:30 am – 8:30 am

Welcome: 8:00 am – 8:15 am
General Chair: C. Mike Newton, nScrypt Inc.

Opening Remarks: 8:15 am – 8:30 am
Technical Chair: Kenneth Church, nScrypt, Inc.

Exhibit Hours: 10:00 am – 7:00 pm

High School Student Printed Electronics Posters: 10:00 am – 1:30 pm
Bayside High School Communications Technology Students will be demonstrating their knowledge of screen printing techniques to incorporate printed circuit boards using non-traditional materials through a Tinker Toy lamp project that they built in class.  Students learned basic electronic fundamentals and how circuitry functions.  They applied their knowledge and married it with the printing applications learned in class to demonstrate by bringing their lamps to the Advanced Technical Workshop for display.  Students expect to share and answer questions related to printed electronics.

University Student Posters: 10:00 am – 7:00 pm
Poster Judging at 5:45 pm

Large Area Deposition of Nano Particulate Suspensions for the Manufacture
of Flexible Electroluminescence Lamps
Nadja Straue, Martin Rauscher, Andreas Roosen, University Erlangen-Nuremberg

Design of pH Sensor Module for Wireless Sensor Network
Ho-Jeong Sohn, Sekwang Park, Kyungpook National University

Capacitive Sensor for Automotive Engine Oil Degradation using Wireless Network
Jaedong Cho, Sekwang Park, Kyungpook National University

Towards a Printed Reserve Cell Zinc-Air Battery
Krista L. Hawthorne, Christopher A. Apblett, Eric Branson, Adam Cook, Kyle Fenton, Paul Clem,
University of New Mexico

Session I: Processes & Materials
8:30 am - 11:30 am
Session Chair: C. Mike Newton, nScrypt Inc.

Inexpensive Copper Films: Reducing Printed Copper Oxideon Low Temperature Substrates at Industrial Speeds in Air
Kurt Schroder, Stan Farnsworth, Dave Pope, Ian Rawson, NovaCentrix

Aerosol Jet Material Deposition for High Resolution Printed Electronic Applications
Michael J. Renn, Optomec

Large Area Patterning of Conductors Utilizing Silver Nanoparticle Inks with Traditional Printing Processes
Michael Mastropietro, PChem Associates Inc.

Break: 10:00 am - 10:30 am

MicroDispensing/Spraying for Printed Electronics
Xudong (Donny) Chen, nScrypt Inc.

Solder-Free Electronics Assembly Materials – SEAM
Alfred A. Zinn, Lockheed Martin Space System Company

Buffet Lunch: 12:00 pm - 1:00 pm

Keynote Speaker: 12:30 pm – 1:00 pm
Dr. Pradeep P. Fulay, NSF

Session II: Device & Applications
1:30 pm – 5 :00 pm
Session Chair: Kenneth Church, nScrypt, Inc.

The Ideal Design System for the new Printed Devices technology
John Sovinsky, CAD Design Services, Inc.

The Integration of Electronics with Textiles via Inkjet Printing and Non-metallic Conductive Fibers
Michael D. Irwin, Richard I. Olivas, Eric W. MacDonald, University of Texas at El Paso

What’s Nano about Electronics?
David R. Darling, Lockheed Martin Missiles and Fire Control

Break: 3:00 pm - 3:30 pm

Towards a Fully Printable Battery: Robocast Deposition of LiFePO4 
Chris Apblett, Sandia National Laboratories; Kyle Fenton, Plamen Atanassov, University of New Mexico

Magnetic Polymer Nanocomposites for RF and Microwave Applications
Jing Wang, Cesar Morales, Julio Dewdney, Susmita Pal, Kristen Stojak, Hariharan Srikanth, Thomas Weller, University of South Florida

Advantages of Printed Electronics for Small Vehicle Platforms such as Un-manned Air Vehicles (UAVs)
Robert M. Taylor, Sciperio, Inc.

Reception:  5:15 pm – 7:00 pm

University Student Poster Judging: 5:45 pm - 6:30 pm

Dinner: On your own


Friday, May 7th

Registration: 7:30 am - 12:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Hours: 8:00 – 12:00

Session III: Panel Discussion – Global Printed Electronics & Trends
Session Chairs: Kenneth Church, Sciperio, Inc.; C. Mike Newton, nScrypt Inc.
8:30 am - 12:00 pm

The panel discussion will focus on the technical and disruptive obstacles that must be overcome before printed devices will dominate next generation consumer electronics.  While replacing existing products is one goal, the more obvious vision and impact will come from never before produced products; well not outside of Hollywood.

Featured Panel Discussion Speaker:
Printed Electronics in Asia
Namsoo (Peter) Kim, Professor & Director, Seokyoung University

University Student Poster Winners (Winners selected on May 6th)

Closing Remarks: 12:00 pm

IMAPS 2010 (Research Triangle) - Abstracts Now Accepted Through April 16    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010 - Raleigh, NC) will be held in Raleigh, NC, on October 31-November 4, 2010. The abstract deadline has been extended until Friday, April 16.
Full symposium details can be found on-line at www.imaps2010.org or submit your abstract using the on-line submittal form at: www.imaps.org/abstracts.htm.

Planned Sessions Include:

Industry “Focused”

• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming

• Automotive, Industrial, Harsh Environment Electronics Applications

• Solar and Alternative Energy

3D Integration and Packaging Track
• 3D System Integration
• 3D Packaging Approaches
• 3D Processing Technology
• 3D Equipment and Materials Advances
• 3D Simulation and Modeling
Systems & Applications

• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices

 
Design

• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials

Materials and Process

• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics
• Ultra Low-K Packaging
• Uses of Precious Metals in Microelectronics

Translated
(Invited Speakers Only)

• Japanese (Japanese to English translation)
• Chinese (Chinese to English translation)

Interactive Poster Session

Outstanding papers that do not fit in planned or created sessions will be considered for this interactive session.

CICMT 2010 (Japan) - Program and Registration    ^ Top
The IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) will be held in Chiba, Japan on April 18-21, 2010. For full details, or to register, visit www.cicmt.org.

Mid-Atlantic Microelectronics Conference - Abstracts Still Being Accepted    ^ Top
The Mid-Atlantic Microelectronics Conference will be held in Atlantic City, New Jersey on June 17-18, 2010. For full details, or to register, visit www.imaps.org/midatlantic. This event will be co-located with IMAPS Portable Workshop - www.imaps.org/portable.

Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to submit an abstract for review for the Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with two half-day professional development courses and a full-day workshop on Portable Electronics on Thursday, June 17. The Conference will officially begin with an evening reception that night.

The Program Committee seeks papers that demonstrate how products, technologies, and applications are expanding and redefining the microelectronics industry. Presentations in four sessions will be determined based on the following business and industry topics:

Industry

  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal Managemen
  • Manufacturing, Outsourcing & Quality
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Nano-Technologies
  • Opto-electronics
  • Market Analysis and Drivers

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green packaging / Compliance with RoHS
  • Flip-Chips
  • Wirebonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Those wishing to present a paper at the Mid-Atlantic Microelectronics Conference must submit a 200-300 word abstract electronically by April 9, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 28, 2010.

Topical Workshop on Portable/Wireless Devices - Abstracts Due This Friday    ^ Top
The Topical Workshop on Portable/Wireless Devices will be held in Atlantic City, New Jersey on June 17, 2010. For full details, or to register, visit www.imaps.org/portable. This event will be co-located with IMAPS Mid-Atlantic MIcroelectronics Packaging Conference - www.imaps.org/midatlantic.

The objective of the 2010 Portable/Wireless Device (PWD) Workshop is to bring together electrical, materials, mechanical, optical, reliability, packaging and manufacturing, as well as business leaders involved or interested in various types of portable and wireless devices, to address and discuss the state-of-the-art, challenges, attributes and pitfalls in theses areas of electronics and packaging engineering. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to design, fabrication, reliability and cultural-and-business aspects of the devices. Abstracts are being requested on, but are not limited to, the following topics:

  • Functional (electrical, thermal, optical) and “physical” (mechanical) design-for-reliability
  • Home entertainment devices & systems • Predictive modeling
  • Probabilistic approaches
  • Experimental evaluations and testing
  • Cellular phones
  • Wireless devices
  • Wearable computers
  • Hardware/software interaction
  • Power generation, supply, conversion
  • Role of human factor
  • Man-machine communication
  • Access to information
  • Audio and video recognition and processing
  • Implantable and imaging devices
  • Biosensors
  • MEMS
  • Outsourcing issues
  • Impact on society
  • Nanomaterials and nanotechnology
  • Hearing/vision Aids
  • Neurological devices
  • Blood diagnostics
  • Disposable electronics
  • Biometric identification
  • Wireless/RF telemetry
  • Microfluidics
  • Environmental aspects/constraints
  • Biocompatible materials
  • Reliability assessments
  • Environmental durability
  • Accelerated testing
  • Qualification approaches
  • RoHS compliance & regulations
  • Economics and business issues
  • Government/regulatory issues
  • Homeland security related issues

Those wishing to present a paper at the Portable/Wireless Devices Workshop must submit a 200-300 word abstract electronically by April 9, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 28, 2010.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

  Chapter Activities (events listed in chronological order)
 

IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor Night    ^ Top

Dates: April 15, 2010
Schedule: 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)
Location:

Holiday Inn Ronkonkoma
Ronkonkoma, NY

PDC Registration:

500.00 Member
600.00 Non-Member

Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.

Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email slehnert@imaps.org to register

Exhibits Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by Professional Development Courses and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.

This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.

He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.

A Full Day Presentation on:
International Traffic in Arms Regulations(ITAR)
Course Leaders: Kelly Raia & Tom Cook, American River International

Every company's management wants to have complete confidence in its trade compliance effort with respect to the International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR). The question is: Is that an achievable goal? Do you have concerns about your staff not having the necessary skills and up-to-date knowledge needed to keep your company in compliance? This presentation will cover all of the following points:

       Managing Compliance in the Global Supply Chain
       EAR vs. ITAR
       Dept of Commerce
       Scope of the Export Administration Regulations
       Foreign Trade Regulations and Licensable Transactions
       Dept of Foreign Asset Controls
       Commodity Classifications
       USML
       ITAR Basics
       Prohibited Parties
       Destination Control Statement
       Exporting Under Dept of State Licenses
       License Amendments
       License Exemptions
       Penalties for ITAR Violations
       Compliance Actions
       Foreign Nationals
       Other Supply Chain Issues
       Incoterms
       Recordkeeping
       Managing Your Forwarder and Customs Broker in Licensable Transactions
       Resources

About the presenters:
Kelly Raia

Kelly has been involved in freight forwarding and customhouse brokerage for over 20 years.

Kelly owned and managed Armac Transportation for 10 years.  This business specialized in customs clearances of time sensitive shipments such as live
animals, aircraft parts, chemicals and various perishable products.

Kelly joined FSI/American River in 1996.  During this time she has worked as a senior account manager leading to managing the international department including global export and import operations. 

In 1997 Kelly assumed various consulting responsibilities and became ARI’s in-house specialist for import/export compliance.

She has worked on some major accounts assisting their staff in global logistics, compliance management and working on the various international and government web sites for compliance resources.

Kelly has also developed various in-house programs for management training, utilizing technology in importing and exporting and in developing skills for import/export compliance management.

She has lectured at the World Trade Institute and supports Tom Cook and Rennie Alston for the many courses and programs they deliver on various international logistics and compliance matters.

Kelly is a licensed customhouse broker, haz-mat certified and TSA Security
training approved.

Kelly attended Long Island University, C.W. Post campus as well as Nassau Community College where she has taken many courses in business and communication.

She is the Import/Export Compliance Officer, Vice President and Associate Partner at American River International and serves on the executive committee.

Thomas A. Cook

Tom has been involved in global business for over 30 years in an array of diverse international trades.

He graduated from Maritime College at Fort Schuyler, NY, where he holds both a BS Degree in Transportation Science and a Graduate Degree in Transportation and Business Management.

His career began in the US Naval Reserve and the US and Dutch Merchant Marine, where he served as an officer in various commercial and military capacities on passenger, tug, oil, chemical, break-bulk and container vessels, all over the globe.

Tom has also been involved in the international insurance, manufacturing, exporting, marketing, in the trade finance arenas and in senior management and ownership positions, with an emphasis on logistics, compliance and security. 

He has authored over 225 articles and published seven books on international trade, the latest: “Managing Global Supply Chains” and has lectured all over the world on varied subjects involved with global trade.  He is considered by many leading professionals to be top in the field of global logistics and international operations.

Tom has numerous interests in third party logistics, global trade and international business.  He is on the board of many companies and organizations, such as but not limited to: American River International, FSI Global Logistics, The Trade Resource Group of Customs in Washington, DC, The Small Business Exporters Association, North American Exporters Association, World Trade Magazine, American Management Association, IOMA and The World Academy, New York District Export Council.

Tom currently serves as CEO and Managing Director of American River International, a premier consulting and logistics firm. 

Exhibit Registration Information:

Walter Becker
WJB Sales
631 331 0689
wbecker@wlbsales.com

Steve Lehnert
Space Systems Loral
650 644 5218
metroimaps@optonline.net

IMAPS Indiana Chapter Vendor's Day and Mini-Symposium    ^ Top

Dates: Monday, April 19, 2010
Location:

Clarion Waterfront Plaza Hotel and Conference Center
2930 Waterfront Parkway West Drive, Indianapolis, IN

Registration:

Complimentary - No advance registration is required

Schedule of Events
12:00 PM – 6:30 PM       On-Site Registration
1:00 PM – 5:00 PM         Technical Presentations
5:00 PM – 6:30 PM         IMAPS Vendor Displays

No advance registration is required.  The event is free to all attendees.  Come out and support the local Indiana IMAPS and SMTA chapters and the vendors who contribute much to these organizations.  IMAPS or SMTA membership not required to attend.  There will be refreshments, and door prizes at 6:00 PM for which you must be present to win.  See you there!

IMAPS Chesapeake Chapter Spring Symposium April 28    ^ Top

Dates: April 28, 2010
Schedule: 3:00 - Registration, Networking, and Group Introductions
3:30 - 5:30 - Presentations
5:30 - 5:45 - Business Meeting
5:45 - Dinner
Location:

Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road, Laurel, MD 20723
www.jhuapl.edu
Enter in the area marked Lobby 1 and check-in with APL staff
Call John Lehtonen of APL at 240-228-3479 for on-site information only.

Registration:

IMAPS Members-$20, non-members-$30, and students with ID-$5.00.
Register On-line
On-line registration ends of Monday, April 26 at 12:00 Noon.
A fee of $5.00 will be charged for on-site registrations.

Program:

    3:00   Registration, Networking, and Group Introductions

    3:30   Patricia Campbell, Professor at the University of Maryland’s School of Law 
               “Intellectual Property Law: An Overview.”  

Abstract:  This presentation will provide an overview of the four basic areas of intellectual property law, including patents, trade secrets, copyrights and trademarks.   The discussion will focus on the types of property rights that are protected by each area of the law and how they are perfected by the intellectual property rights owner.  The presentation will conclude with a brief discussion of a few of the "hot" issues in intellectual property law today.

Biography:  Patricia Campbell is an Associate Professor at the University of Maryland’s School of Law and she is the Director of the Maryland Intellectual Property Legal Resource Center.  Prior to joining the law school in 2007, Professor Campbell was a litigator and transactional attorney in the Fish & Neave IP Group at Ropes & Gray in Palo Alto, California, and Washington, DC.  Professor Campbell has also worked at law firms in Pittsburgh and Philadelphia and at a high tech company in Silicon Valley.

    3:45  Brief Break
         
    4:00    Sarah Reynolds, Senior Consultant at American River International
                 “Understanding Deemed Exports.”

Abstract:  This presentation will review the particulars of an export transaction such as; what is the definition of an export, how to determine if your export transaction is controlled and if so, by which government agency.  The session will also bring awareness to deemed exports and discuss the controls that should be put in place in order to manage your exports and deemed exports compliantly, including how to obtain a deemed export license and who is defined as a foreign national and its importance.

Biography:  Sarah Reynolds has over 25 years experience in the international logistic industry specializing in supply chain management to difficult and problematic countries.  Sarah’s experience includes employment by notable international freight forwarders such as Kuehne & Nagel, SDV and UTI and exposure to various aspects of the industry such as; sales and customer service, worldwide bid negotiation, network development and compliance management.  Sarah is currently a Senior Consultant at American River International where she provides consulting services and training to companies involved in the international supply chain industry.

           
   4:45  Brief Break
 
   5:00  Vidyu Challa, PhD Candidate at the Center for Advanced Life Cycle Engineering (CALCE) University of Maryland
              “Effect of Joule Heating on Reliability of High Pin Count Land Grid Array Sockets." 

Abstract:  Performance requirements in high-end microprocessors have led to higher I/O counts and interconnect densities.  As greater currents pass through the microprocessor interconnect, higher temperatures driven by Joule heating are expected to pose a reliability risk to high-pin microprocessor sockets. In this study, the properties of the polymer housing were found to be sensitive to temperature effects owing to its visco-elastic nature, and to significantly influence the stress relaxation behavior of the socket, potentially leading to earlier failure. The factors that influence Joule heating and therefore contribute to earlier failure by stress relaxation were examined using a combination of experimental and numerical methods. Polymer visco-elasticity was characterized and the properties were subsequently used to demonstrate earlier failure by stress relaxation for land-grid array sockets at higher temperatures driven by Joule heating.

Biography:  Vidyu Challa is a PhD candidate in Mechanical Engineering at CALCE. Prior to joining CALCE, Vidyu spent 4 years in the microelectronics industry in the areas of material characterization and failure analysis as an Applications Engineer at Sonix, Inc.  Vidyu received the Phi Delta Gamma award for interdisciplinary scholarship achievement and the Ann Wylie Dissertation Fellowship. Her research interests include socket and connector reliability, qualification of electronic components/systems, material characterization, and finite-element modeling for electronics.  Vidyu has 10 publications from her work at CALCE and her previous position.  She received the M.S degree in Chemical Engineering from the University of Akron.

   
   5:30  Event wrap-up.  Ideas for next event.  2010 Elections - other business.

   5:45  Dinner

IMAPS Israel announces a Topical Workshop on Advanced Microelectronic Packaging    ^ Top
The IMAPS Israel Workshop on Advanced Microelectronic Packaging will be held at the Sharon Hotel from June 2, in Herzelia, Israel.

The objective of the Microelectronic Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to packaging.

  • 3-D Packaging
  • Cooling High Density Circuits
  • MEMS and MOEMS
  • Photovoltaic and Fuel Cell
  • Assembly Processes and Handling Issues
  • Wirebonding and Bumping
  • Novel Packaging and Design
  • High Reliability & LTCC
  • BGA, CSP
  • Portable Electronics
  • Biomedical Electronics
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling
  • New and Nano Materials
  • Lead-Free Materials & Electronics

Those wishing to present a paper at the Portable/Wireless Devices Workshop must submit a 200-300 word abstract electronically by April 30, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

IMAPS Nordic Conference 2010 - Program Available Soon    ^ Top
The IMAPS Nordic Conference 2010 will be held at the Elite Park Avenue Hotel from June 6-9, in Gothenburg, Sweden.

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org

  Membership, Products and Publications
 

IMAPS Individual Membership Benefits   ^ Top

  • Discounts on events, publications, and iKnow Micro downloads
    • Take discounts on the Annual Symposium and many technical workshops.
    • Take discounts on publications and on-line library downloads; http://www.imaps.org/imapsstore/default.aspx
  • IMAPS Chapter Membership
    • Learn from technical and management presentations by local and national experts.
    • Connect with industry peers through regional programs.
  • Advancing Microelectronics Magazine
    • Enjoy a complimentary one-year subscription to Advancing Microelectronics.
  • Access the Journal of Microelectronics and Electronic Packaging
    • View the Journal of Microelectronics and Electronic Packaging on-line.
  • Complimentary Access to JOBS Marketplace
    • Post resumes and search for current job openings.
    • Keep records easily - results and actions are conveniently recorded.
    • Enjoy helpful features of many expensive job search engines.
  • Access "Members-Only" sections on imaps.org
    • Find individuals and companies that provide products and services.
    • Enter your own professional listing.

For more details about IMAPS Membership, visit www.imaps.org or call Steve Greene, Membership Manager, at 202-548-4001 or sgreene@imaps.org.

 

   
   

Oneida Research Services

PDC Webinar Series on RF/Microwave Hybrids: Materials and Processing (2 Sessions)
Session 2: April 13

CICMT 2010
April 18-21
Chiba, Japan

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact abell@imaps.org

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact abell@imaps.org

ATW Portable/Wireless Devices
June 17
Atlantic City, NJ

Mid-Atlantic Microelectronics Conference
June 17-18
Atlantic City, NJ
*Exhibitors contact abell@imaps.org

ATW on Advanced Interconnect Technologies
July 14
San Francisco, CA

ATW on Wire Bonding
July 15
San Francisco, CA

ATW on Electronic Packaging of Solar Cells and Fuel Cells
September 14-16
Cleveland, OH

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

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