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August 31, 2010
 

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   IMAPS EVENTS
Button IMAPS 2010 (Research Triangle) - Program and Registration Now Available; Booths Selling Quickly (read more...)

Button New Workshop on Packaging of Sensors and Power Modules - Abstracts Due Next Week (read more...)

Button ATW on Thermal Management - Technical Program Now Available (read more...)

Button Polymers for Semiconductor Packaging Webinar Begins Next Wednesday (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Arizona Chapter September 16 Lunch Meeting on Fine Pitch Copper Pillar Flip Chip Technology (read more...)

Bullet IMAPS Metro Chapter September 16 Dinner Meeting on Copper Wirebonding in Microelectronics (read more...)

Bullet IMAPS Chesapeake Chapter October 5 Dinner Meeting (read more...)

Bullet IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference “Enabling Packaging Technologies for System Integration” (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) (read more...)

  IMAPS Events (view full Web Calendar)
 

IMAPS 2010 (Research Triangle) - Program and Registration Now Available    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010) is being held October 31 - November 4, 2010, at the Raleigh Convention Center in Raleigh, North Carolina. The advance program, exhibit information and registration is now on-line at www.imaps2010.org. The website and additional details will be enhanced in the days ahead.

IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions will be featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. This year's symposium will also offer you 18 professional development courses, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech.

Along with our usual outstanding technical program, Professional Development Courses and state-of-the-art exposition, there are many other opportunities available this year because of the location of IMAPS 2010. Raleigh, NC, is part of the world-renown Research Triangle Park (RTP). The three points of the Research Triangle are three major universities, Duke University, The University of North Carolina at Chapel Hill and North Carolina State University.

The RTP is the leading and largest high technology research and science park in the United States and the second largest in the world. RTP boasts a critical mass of full-time technology and knowledge workers and is home to a number of US Federal Government laboratories and institutes, as well as multinational companies such as IBM, Sony, Panasonic, Cree, etc. We are proud to announce that our exhibit hall will feature the addition of the IBM Servers Group that will display current research and developments.

170 world-class firms employ 42,000 professionals. Not only are these companies engaged in vital research, but they are developing products and services using our technologies. Networking at IMAPS 2010 will surpass any other opportunities IMAPS has offered in years past. You will meet the scientists and business leaders you need to impact. As you can see, IMAPS 2010 offers you the advantage of being where the real technological action is. You will also be able to network with officials located in the RTP and plan visits while you are attending IMAPS 2010.

For more information, please visit www.imaps2010.org and make your reservations. IMAPS 2010 is a golden opportunity to expand your knowledge and your business and shouldn’t be missed.

New Workshop on Packaging of Sensors and Power Modules - Abstracts Due Next Week    ^ Top
The Topical Workshop on Packaging of Sensors and Power Modules will be held October 12, 2010, at the Ohio Aerospace Institute in Cleveland, Ohio. Abstracts are now being accepted through September 8. The full program and registration will be available in mid-September. Visit www.imaps.org/powerpackaging today for full details and to submit your abstracts.

The objective of Power Packaging and Sensors Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Power Packaging and Sensor. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to the following topics:

  • Substrates
  • Encapsulants and Adhesives
  • Die Attach Technology
  • Interconnect Methods
  • Heat Sinks and Thermal Strategies
  • Novel Packaging and Design
  • Failure Analysis and Reliability
  • Simulation and Modeling

Those wishing to discuss the findings and developments in the form of a presentation at this workshop, should submit a 250-300 word abstract electronically by September 8, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

ATW on Thermal Management - Technical Program Now Available    ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management will be held September 28-30, 2010, at the Dinah's Garden Hotel in Palo Alto, CA. The full program is now available below and on-line. Visit www.imaps.org/thermal today for full tabletop exhibition details and to register. Only a few tabletops remain.

Tuesday, September 28

Registration: 8:00 am - 7:30 pm

Continental Breakfast: 8:00 am - 9:00 am

Opening Remarks: 8:55 am - 9:00 am

Exhibit Opens: During Breaks & Lunch

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
9:00 am - 10:00 am

Market Trends and Developments for Coolants for Electronic Systems
David L. Saums, DS&A LLC

Extending the Life of Air Cooling Through Architecture
Roger Dickinson, Bergquist Torrington Company

Session 2: Thermal Packaging Materials
Chair: George A. Meyer IV, Celsia Technologies
10:00 am - 12:30 pm

High Heat Flux, Low CTE Vapor Chamber Development
Evan Fleming, Pete Dussinger, Advanced Cooling Technologies, Inc.

Break: 10:30 am - 11:00 am

Trends and Developments for IGBT Module Packaging and Thermal Materials
David L. Saums, DS&A LLC

Thermal Management for LED Lighting
Richard Hill, Laird Technologies

Nano-Bond Assembly: A Rapid Room Temperature and Fluxless Soldering Process
Jacques Matteau, Indium Corporation of America

Lunch: 12:30 pm - 2:00 pm (Lunch served 12:30 pm - 1:30 pm)

Session 3:  Thermal Analysis and Modeling
Chair: Guy R. Wagner, Electronic Cooling Solutions
2:00 pm - 4:30 pm

Student
Competition
Presentation

Adaptive Power Blurring Techniques to Calculate IC Temperature Profile under Large Temperature Variations
Amirkoushyar Ziabari, Zhixi Bian, Ali Shakouri, University of California - Santa Cruz


Simultaneous Thermal Imaging of Peltier and Joule Effects
Bjorn Vermeersch, Ali Shakouri, University of California - Santa Cruz

Break: 3:00 pm - 3:30 pm

Thermal Analysis and Testing of a Radio Frequency Pin Diode Switch for Avionics Applications
Robert Meikle, Rockwell Collins, Inc.

Design Optimization Framework for Integrated Cooling Systems
Brian St. Rock, Scott Kaslusky, United Technologies Research Center

Simulation of a Concentrating Solar Electric Generator
Guy Wagner, Electronic Cooling Solutions

Dinner: 5:00 pm - 6:30 pm

Session 3:  Thermal Analysis and Modeling (continues)
Chair: Guy R. Wagner, Electronic Cooling Solutions
6:30 pm - 7:30 pm

Thermal Management of a Novel iUHD-Technology Based MCM
William Roy, Peter Kwok, Livia Racz, Chung-Jen Chen, Draper Laboratory

Thermal Load Boards Improve Product Development Process
Bernie Siegal, Thermal Engineering Associates, Inc.

Wednesday, September 29

Registration: 8:00 am - 8:00 pm

Continental Breakfast: 8:00 am - 9:00 am

Exhibit Opens: During Breaks & Lunch

Session 4: Thermal Interface Materials and Testing
Chair: Dave Saums, DS&A LLC
9:00 am - 12:30 pm

Student
Competition
Presentation

The Use of Infrared Imaging Microscope in the Measurement of Total Thermal Resistance of Vertically Aligned Carbon Nanotube Arrays
Andrew J. McNamara, Vivek Sahu, Yogendra Joshi, Zhuomin M. Zhang, Georgia Institute of Technology

Thermal Stress Management for Large IC Packages
M. Shane Thompson, LORD Corporation

Comparative Test Data for TIM Materials for Silicon and Silicon Carbide IGBT Modules
Victor Papanu, John Ziemski, AOS Thermal Compounds LLC

Break: 10:30 am - 11:00 am

Development of a New Type Thermal Interface Material (TIM1) for High Power Microprocessors
My Nguyen, Jason Brandi, Henkel Corporation

Thermal Transient Based TIM Material Characterization
Andras Vass-Varnai, Zoltan Sarkany, Gabor Farkas, Andras Poppe, Marta Rencz, Mentor Graphics

Reliability and Failure Mechanisms of Thermal Interface Materials in Electronic Assemblies
Ryan Verhulst, Radesh Jewram, Bergquist Company

Lunch: 12:30 pm - 2:00 pm (Lunch served 12:30 pm - 1:30 pm)

Session 5: Liquid, Phase-Change, and Refrigeration Cooling
Chair: John Peeples, The Citadel
2:00 pm - 5:00 pm

The Water Cooled Power7 IH Supercomputing Node/System - Part I
Michael J. Ellsworth, Jr., IBM Corporation

The Water Cooled Power7 IH Supercomputing Node/System - Part II
Michael J. Ellsworth, Jr., IBM Corporation

Break: 3:00 pm - 3:30 pm

CPU Spray Cooling Analysis
Charles Ortloff, CFD Consultants International; Marlin Vogel, Electronic Cooling Solutions  

Loop Vapor Chambers for Consumer Applications
George A. Meyer IV, Celsia Technologies

Student
Competition
Presentation

Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots
Vivek Sahu, Yogendra Joshi, Andrei Fedorov, Georgia Institute of Technology

Dinner: 5:00 pm - 6:30 pm

Session 6: Military and Aerospace Applications
Chair: Ross Wilcoxon, Rockwell Collins, Inc.
6:30 pm - 8:00 pm

An Integrated Centrifugal Blower Design for High Performance Air-Cooled Heat Sinks
Scott Kaslusky, Brian St. Rock, United Technologies Research Center

Thermoelectric Energy Harvesting - A Comparison of Flight Test Data to Test Bench and CFD Simulations
John Langley, Steve Morris, Marshall Taylor, Ambient Micro; Guy Wagner, Electronic Cooling Solutions

High Efficiency Compact Air to Air Heat Exchanger with Integrated Fan
Nicholas Herrick-Kaiser, AMETEK Rotron

Thursday, September 30

Registration: 8:00 am - 12:30 pm

Continental Breakfast: 8:00 am - 9:00 am

Session 7: System Cooling
Chair: Marlin Vogel, Electronic Cooling Solutions
9:00 am - 10:30 am

Micro Deformation Technology - A New Manufacturing Process to Create High Surface Area Cold Plates and Base Plates for Liquid Cooling of Power Electronics
Matt Reeves, Peter J. Beucher, Wolverine Tube, Inc. - MicroCool Division

Liquid Cooling with MicroChannel Enhanced Base Plates are Making In-Roads into the High-End Server Market
Peter Beucher, Jesus Moreno, Sy-Jenq Loong, Wolverine Tube, Inc. - MicroCool Division

Using Flow Optimizers to Save Cooling Fan Power
Howard Harrison, Distributed Thermal Systems

Break: 10:30 am - 11:00 am

Session 8: Data Center Cooling
Chair: David Copeland, Oracle
11:00 am - 12:30 pm

Room-Level Energy and Thermal Management in Data Centers
Magnus Herrlin, ANCIS

Real-Time Data Center Transient Analysis
Xuanhang (Simon) Zhang, James W. VanGilder, APC by Schneider Electric

Experimental Study of Rack Level Cooling in a Data Center
Susheela Narasimhan, Cisco Systems Inc.

Closing Remarks: 12:30 pm

Register On-line

Early Registration/Exhibit and Hotel Deadlines: September 13, 2010

Polymers for Semiconductor Packaging Webinar Begins Next Wednesday    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Polymers for Semiconductor Packaging

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, September 8, 15 and 22, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip

Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, September 14, and 21, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on
Precious Metal Financing and Hedging
Presented by: Paul Angland, HSBC Bank USA
This corporate webinar will be held September 16, 2010. This webinar will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Component Authentication and Screening
Presented by: Bhanu Sood, University of Maryland, CALCE
**NEW DATES**
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, October 6 and 13, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: September 2010 (TBD). All webinars will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Rheology Issues in Electronic Packaging -- Details Available Soon

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, November 16, 23 and 30, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

  Chapter Activities (events listed in chronological order)
 

IMAPS Arizona Chapter September 16 Lunch Meeting on Fine Pitch Copper Pillar Flip Chip Technology    ^ Top

Dates: Thursday, September 16, 2010
Schedule: 11:30am - 1:00pm
Location:

Crowne Plaza San Marcos Resort
Chandler, AZ

Cost:

Attendees: $20 pre-registered; $25 at the door
Tabletop Exhibitors: $100

RSVP:

Fine Pitch Copper Pillar Flip Chip Technology - Enabling Higher Interconnect Densities for Next Generation Silicon Nodes 

Presented by:
Robert Lanzone, VP Advanced Package Development Amkor Technology, Inc.

Background:
On July 7th Amkor and Texas Instruments announced they teamed to deliver the "industry's first fine pitch copper pillar flip chip packages" to the market, enabling reductions in chip and package sizes at lower cost with higher performance.  TI and Amkor provided more information regarding this fine pitch FC and copper pillar platform technology at Semicon West explaining how.

This presentation will provide more details on the development, qualification and production status for this new FC bump and packaging technology.

Abstract:
This presentation will review the process development and advancement of several next generation fine pitch Cu Pillar bumping and assembly processes, with pitches less than 50um, that are focused on addressing the challenges seen on silicon nodes such as 45nm and below.  The advantages of the fine pitch Cu pillar structure will be reviewed in comparison to competing technologies. The risk assessment and rational decision making methodologies used will help illustrate the accelerated development and qualification path taken to meet an aggressive market introduction timeline for advanced device applications.  Through a structured collaborative approach to process & material development, design simulation, and reliability assessment approach, the team achieved its goal to provide a robust, reliable, and low cost bump and assembly process to meet the demands of current and future fine pitch, low-k, advanced silicon node technologies.

IMAPS Metro Chapter September 16 Dinner Meeting on Copper Wirebonding in Microelectronics    ^ Top

Dates: Thursday, September 16, 2010
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Cost:

Members: $30.00 if Pre-Registered by September 13, 2010.
$50.00 after September 13, 2010

Non-Members: $50.00 if Pre-Registered by September 13, 2010
$75.00 After September 13, 2010

Student Members: Free if Pre-Registered by September 13, 2010
$25.00 after September 13, 2010

RSVP:

Registration Email: metroimaps@optonline.net , Phone: Steve Lehnert (650) 644-5218

There are a limited number of vendor tables available for this event. Please contact Steve Lehnert for further details.

Copper Wirebonding in Microelectronics
Presented By: Lee Levine Process Solutions

Wire bonding is the dominant IC interconnection method. More than 13 trillion wires are now bonded annually. Copper ball bonding is the highest growth segment of this market, presently only 5% of the total wire bonded interconnects are copper ball bonded (650 billion wires) but even 5% represents an enormous number of devices. Currently bonder manufacturers are reporting that virtually all new machine shipments require copper ball bonding capability (new machine shipments are presently at an all time record high) and retrofit kits for older machines are also in high demand.

Copper’s properties provide both advantages and disadvantages in bonding. Compared to gold it has lower cost (approximately 10% that of gold currently) and higher conductivity (both thermal and electrical). It is also harder and strain hardens during bonding significantly more than gold does. The increased hardness makes bonding on conventional Al bond pads difficult with increased probability of cratering.

New bond pad metallization designs, using ENIPIG (Electroless Nickel, Immersion Palladium, Immersion Gold) have been shown to provide excellent bondability and reliability with copper. They can be plated directly on copper plated bond pads eliminating the need for a conventional Al sputtered bond pad and the ENIPIG bond pads can be bonded with either copper or gold wire.

The talk will discuss the pros and cons of copper ball bonding and provide some perspective on the realities of the current market dynamics.

About Lee Levine:
Lee’s experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa  and Distinguished Member of the Technical Staff at Agere Systems. Currently he consults for his own company, Process Solutions Consulting, Inc. providing process consulting, yield improvement, SEM, EDS and Metallography services to the microelectronics industry. He has been awarded 4 patents, published more than 50 technical papers, and won the 1999 John A. Wagnon Technical Achievement award from the International Microelectronics and Packaging Society, IMAPS. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. He is a Fellow, V.P of the Keystone Chapter, and V.P Technology for IMAPS.

IMAPS Chesapeake Chapter October 5 Dinner Meeting    ^ Top

Dates: Tuesday, October 5, 2010
Schedule: 3:00 - Registration, Networking, and Participant Introductions begin
Location:

Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road
Laurel, MD 20723
For map and directions visit www.jhuapl.edu
Enter in the area marked Lobby 1 and check-in with APL staff

Cost:

On-line registration information will be e-mailed in two weeks

High Reliability Packaging for Defense & National Security

Program:

    3:00   Registration, Networking, and Participant Introductions.

    3:30   William Marsh, Senior Advisory Engineer of Northrop Grumman
               Hi-Rel Avionics at Northrop Grumman

   4:00   Nathan Blattua, Chief Technologist at DfR Solutions  
            Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue.
            
   4:30  Break (beverages served)
 
   4:45  Andrei Shkel, Program Manager at DARPA
            Precision Navigation and Timing Enabled by Micro Technology: Are We There Yet

   5:15 Event wrap-up.  Ideas for next event.  Elections.  Other business.

   5:30 Dinner

IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference “Enabling Packaging Technologies for System Integration”    ^ Top
SEMICON Advanced Packaging Conference
“Enabling Packaging Technologies for System Integration”
in conjunction with SEMICON Europa
2010 19-20 October
Dresden, Germany
Details on-line

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology)    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Secretariat
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw


   
   

Oneida Research Services

ATW on Thermal Management
September 28-30
Palo Alto, CA
*Exhibitors contact abell@imaps.org

TW on Packaging of Sensors and Power Modules
October 12
Cleveland, OH

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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