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August 4, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Early Registration and Hotel Deadlines This Friday: ATW on High Reliability Microelectronics for Military Applications (read more...)

Button Abstracts Due August 13: ATW on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications (read more...)

Button Upcoming Webinars on Polymers; Component Chip Attach; Precious Metals; and Component Authenticaion (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TODAY: Northern California Chapter Lunch Presentation on Wednesday, August 4 on Thermal Management Challenges for 3D Packaging (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
Submit Your IMAPS Awards Nominations (read more...)

  IMAPS Events (view full Web Calendar)
 

Early Registration and Hotel Deadlines This Friday: ATW on High Reliability Microelectronics for Military Applications    ^ Top
The ATW on High Reliability Microelectronics for Military Applications will be held August 31 - September 2, 2010, at the Bethesda North Marriott Hotel & Conference Center in Bethesda, Maryland. Visit www.imaps.org/military for full details and to register. Early Registration and Hotel Deadlines are August 6, 2010. Registration rates increase at that time and IMAPS cannot guarantee Hotel rates or availability after August 6.

In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level.

Tuesday, August 31st

Registration: 7:00 am - 4:15 pm
Continental Breakfast: 7:15 am - 8:00 am

Opening Remarks: 8:00 am - 8:15 am
General Chair: Greg Caswell, DfR Solutions

Keynote Presentation: 8:15 am - 9:00 am
Challenges in DoD Acquisition: Reliability Design and Assessment in a Post-MIL-STD World

Grant Schmieder, USD AT&L/DDR&E/SE/MA

Grant Richard Schmieder is a senior reliability engineer supporting the Office of the Director, Defense Research and Engineering/Systems Engineering, in Arlington, VA.  Mr. Schmieder has 26 years of experience in logistics and reliability engineering, including 19 years in defense; a BS in engineering from the University of Santa Clara in Santa Clara, CA; and an MS in systems and industrial engineering from the University of Arizona in Tucson. He spent 16 years with Hughes (now Raytheon) Missile Systems in Tucson, working as a logistics engineer on the Maverick, AMRAAM, ESSM, AIM-9X, and Phoenix missile programs. Transitioning to reliability engineering while obtaining his master’s degree in systems and industrial engineering, he served as the reliability engineer on the Stinger missile system. After a brief stint as a reliability engineer for Cubic Defense Systems in San Diego, he spent 7 years working as the reliability lead for Telabs’ Salix Division and BioVeris Corporation in Maryland. He is an American Society for Quality Certified Reliability Engineer and holds the Professional Certificate in Reliability and Quality Engineering from the University of Arizona.


Keynote Presentation: 9:00 am - 9:45 am
Pb-Free Electronics Overview

Edward A. Morris, Lockheed Martin Corporation

Edward A. Morris is Director of Mechanical Engineering & Manufacturing on the Lockheed Martin Corporate Engineering & Technology team.  His focus is on improving the effectiveness of mechanical engineering design and manufacturing processes and technologies, and establishing practices that link the Mechanical Engineering, Production, Supply Chain Management and Sustainment communities so that life-cycle cost can be effectively managed.  He is Vice Chairman of the Lockheed Martin Corporate Production Council.  Additionally, Ed is responsible for developing and executing a proactive Lockheed Martin approach for Pb (lead)-free electronics risk management.  Ed has a BS in Aeronautical Engineering from Purdue University and an MBA from the University of Texas at Arlington.  He has 39 years of defense, commercial and international aerospace industry experience.

Break: 9:45 am - 10:15 am

Session 1: System Level/Mission Assurance
Session Chair: Keith Sturcken, BAE Systems
10:15 am - 11:45 am

Microcircuit Reliability Prediction Based on Physics-of-Failure Models
Lloyd Condra, Boeing; Craig Hillman, Ed Wyrwas, DfR Solutions; Dave Redman, Aerospace Vehicle Systems Institute

Derating Guidelines - Need to be Used Properly in Design
Dave Kayser, NAVAIR

HB0009 Reliability Program Handbook - Effective Reliability Programs
Paul E. Shedlock, Raytheon Missile Systems

Lunch: 11:45 am - 12:45 pm

Session 2: System Level Reliability
Session Chairs: Maureen Curran, Orbital Sciences; Keith Rogers, Department of Defense
 12:45 pm - 4:15 pm

High Reliability Microelectronics for Military Applications
Jim McLeish, DfR Solutions

NanoChromics™ Printed Security Solutions Applications to Anti-Counterfeit, Identification, and Authentication Applications
Alain C. Briancon, NTERA, Inc. 

Minimizing the Risk of Counterfeit Electronic Devices
Mark Marshall, Integra Technologies LLC

Break: 2:15 pm - 2:45 pm

High Reliability Avionics at Northrop Grumman Electronic Systems
Bill Marsh, Northrop Grumman

Considering Counterfeits - Evaluating Anti-Counterfeit Partners and Strategies with Business Fundamentals
Philip Comer, DMEA

Using DNA to Safeguard Electrical Components and Protect Against Counterfeiting and Diversion 
Janice Meraglia, James Hayward, Applied DNA Sciences

Wednesday, September 1st

Registration: 7:00 am - 4:15 pm
Continental Breakfast: 7:15 am - 8:00 am

Session 3: Test Session/Reliability, Qualification
Session Chair: Rick Gunn, NexTek Inc.
8:00 am - 11:30 am

Optical Leak Test Data per Latest Release of MIL-STD 750, Test Method 1071
Chris Aubertin, Dick Vanderneut, NorCom Systems Inc.; Thomas J Green, TJ Green Associates LLC

Low Cost Hermetic Sealing of Large Electronic Packages
Thomas E. Salzer, Hermetric, Inc. 

Quantifying the Impact of Lead Free Assembly Using High Temperature Testing
Bill Birch, PWB Interconnect Solutions Inc.

Break: 9:30 am - 10:00 am

Reliability Testing for Microvias in Printed Wire Boards 
Bill Birch, PWB Interconnect Solutions Inc.

Understanding Semiconductor Package Hermeticity
John Pernicka, Pernicka Corporation

Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development
Nathan Blattau, DfR Solutions

Lunch: 11:30 am - 12:30 pm

Keynote Speaker: 12:35 pm – 1:15 pm
Leading on the Tough Days

Colonel Danny McKnight

Colonel Danny R. McKnight, U.S. Army, Retired, was born in Columbus, Georgia; moved to Rockledge, Florida in 1959; graduated from Cocoa High School in 1969 and Brevard Community College in 1971. He was a Distinguished Military Graduate from Florida State University in 1973, where he earned a BS in Management. In 1985, Danny earned his Master’s in Higher Education from the University of Florida while assigned as an Assistant Professor of Military Science in the ROTC Department.  His military career included combat duty on two occasions, Panama 1989 and Somalia 1993 (basis for the Book and Movie “Black Hawk Down”). Colonel McKnight now focuses all his efforts on being a nationwide motivational speaker. He and his wife, Linda, reside in Rockledge, Florida.

Session 4: Packaging/Board Level
Session Chair: Ed Kurek, Northrop Grumman
1:15 pm - 4:15 pm

Leveraging Device Level 3D Integration Technologies for High Performance/Reliability Modules
Dan Baldwin, Engent

Ceramic Column Grid Array Durability in Rugged Environments
Jerry Keller, Scott Dukes, Roy Belaen, Honeywell Aerospace 

Break: 2:15 pm - 2:45 pm

Printed Wiring Board Failure - Detailed Investigation
David Boyarsky, Debasis Basak, Orbital Sciences Corporation

Electronic Packaging Trends and Drivers in USA
Voya Markovich, Endicott Interconnect, Inc.

Low-Temperature Soldering Options for High-Reliability Hermetic Sealing
Christopher Nash, Thomas Acchione, Carol Gowans, Indium Corporation

Thursday, September 2nd

Registration: 7:00 am - 10:00 am
Continental Breakfast: 7:15 am - 8:00 am

Session 5: Materials/Components
Session Chair: Carolynn Drudik, DMEA
8:00 am - 10:00 am

A Review of Flip Chip Ceramic CGA Packaging
Joseph Fabula, Xilinx, Inc. 

Broadband Printing - Enhanced Solder Joint Reliability
Rick Love, Cookson Electronics

Mixed Metals Impact on Reliability
Rick Gunn, Nextek Incorporated

The Reliability Impact of Reballing COTS Pb-Free BGAs to Sn/Pb for Military Applications
Stephen Meschter, BAE Systems; Joelle Arnold, DfR Solutions

Closing Remarks: 10:00 am

Register On-line

Abstracts Due August 13: ATW on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications    ^ Top
The Advanced Technology Workshop on Nano-Integrated Microsystems Packaging: Design, Materials, Processes and Applications will be held November 4-5, 2010, at the Marriott Raleigh City Center in Raleigh, NC. Abstracts are being accepted until August 13. Submit today. Visit www.imaps.org/nano for full details.

Workshop Focus:
Onset of 21st Century is marked with significant nanotechnology breakthroughs to enable new class of designs, materials and processes and nano-integrated systems. Microsystems, including microelectronics packaging, are one of the primary beneficiaries of this revolution. At the foundation of these nano innovations are the fundamental value additions offered due to nano size (<100 nm) enabling high surface to volume ratio, pristine functional characteristics and thus, unique device and material properties, ultra high packaging density, etc. Examples of nanoscale building blocks are nano structured metals like copper, quantum dots of III-V compounds, carbon nanotubes, zinc oxide nanorods, BaTiO3 nanoparticles, etc. These new classes of materials and their unprecedented properties offer opportunities to deliver excellent candidates for next generation of packaging delivering high performance and multifunctions, per dollar. Example beneficiaries are LEDs and OLEDs, z-axis interconnects, anisotropic underfills, thermally conductive epoxies, die attach solders, passive capacitors, etc. This first workshop is an important forum towards building a community of scientists, engineers and businesses working on nanointegrated technologies adding value to traditional products as well as creating new products in electronic, energy, communication, chemical and other sectors of businesses for sustainable economy.

Planned sessions include the following technical areas for keynote and invited speakers:

  • Session I: Nano Materials and Properties
  • Session II: Nonmaterial Integrated Structures: (substrates, interconnects, Underfill, adhesive, etc.) and performance
  • Session III: Nanofabrication and Assembly Processes and Instrumentation
  • Session IV: Nano-Integrated Microsystems Packaging Applications and Case Studies
  • Panel: Quo Vadimus for enabling Nano-integrated Packaging Product Innovations

Those wishing to discuss the findings and developments in the form of a presentation at this workshop, should submit a 250-300 word abstract electronically by July 23, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

Upcoming Webinars on Polymers; Component Chip Attach; Precious Metals; and Component Authenticaion    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Polymers for Semiconductor Packaging

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, September 8, 15 and 22, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip

Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, September 14, and 21, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on
Precious Metal Financing and Hedging
Presented by: Paul Angland, HSBC Bank USA
This corporate webinar will be held September 16, 2010. This webinar will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Component Authentication and Screening
Presented by: Bhanu Sood, University of Maryland, CALCE
**NEW DATES**
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, October 6 and 13, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: September 2010 (TBD). All webinars will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Rheology Issues in Electronic Packaging -- Details Available Soon

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, November 16, 23 and 30, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

  Chapter Activities (events listed in chronological order)
 

TODAY: Northern California Chapter Lunch Presentation on Wednesday, August 4 Thermal Management Challenges for 3D Packaging    ^ Top
IMAPS Northern California Chapter will hold a Lunch Presentation on Wednesday, August 4 on Thermal Management Challenges for 3D Packaging by Thomas Tarter, President of Package Science, LLC

Abstract:
Chip stacking techniques improve electrical performance by thinning the stacked die and by maintaining short path lengths. However; the challenges for thermal management becomes more profound when the chip stacks are meant to create a complete system-in-package with mixed die. This presentation highlights challenges in cooling 3D stacks, ‘traditional’, and TSV applications. It will also provide an overview of measurement, modeling, and implementation needs.

Presenter Bio:
Thomas Tarter is an expert on thermal management, thermal and electrical characterization, and design of packaging structures. He spent 17 years at AMD in package characterization as a Senior Member of the Technical Staff. Later he was Director of BGA Packaging at Advanced Interconnect Technology, and then Principal Engineer for at NeoPhotonics Corporation, Inc.

Tom recently started Package Science Services LLC to provide electronic packaging expertise in design, analysis, and characterization for all phases of IC, solar cell, LED, and other chip packaging. Tom has published 30 papers, holds 5 patents, and has presented numerous short courses and lectures. He chaired the JEDEC JC15.1 task group on thermal standards for five years and now serves on the SEMI-THERM executive committee.

Logistics:
Wednesday, August 4, 2010
David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054 408-986-1666

11:30 – 12:00 Registration & Networking
11:30 – 12:15 Buffet Luncheon
12:15 – 1:00 Presentation

IMAPS Members $20.00;
Non-members $25.00;
Students (with ID) $10.00
Price includes lunch and program.

Please email Roger Underwood at runderwood@cctlaser.com before COB August 2, 2010 to guarantee your lunch. SPACE IS LIMITED! Registrations will be confirmed via e-mail. We only accept cash and checks at the door.

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology)    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Secretariat
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw


  Membership, Products and Publications
 

Submit Your IMAPS Awards Nominations   ^ Top
This is an urgent appeal from your 2010 Awards Committee Chair to submit your nominations for the following awards – the cutoff date is Aug 27, 2010.

  1. Corporate Recognition
  2. Daniel C. Hughes, Jr.
  3. William D. Ashman
  4.  John A. Wagnon
  5. Technical Achievement
  6. Fellow of the Society
  7. Sidney J. Stein Interglobal
  8. Lifetime Achievement
  9. Outstanding Educator

Any IMAPS member may submit a nomination for any IMAPS member but must use the Awards Nomination Form that is available on our website – please navigate as follows: Log in -> Membership -> Society Awards. Eligibility requirements must be considered in making any nominations and these are also available under “Awards”.

Many thanks.
Regards,
Delip Doug” Bokil
2010 Awards Committee Chair
2010 First Past President

   
   

Oneida Research Services

ATW on High Reliability Microelectronics for Military Applications
August 31 - September 2
Bethesda, MD

ATW on Thermal Management
September 28-30
Palo Alto, CA
*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

ETW on Nano-Integrated Microsystems Packaging:
Design, Materials, Processes and Applications

November 4-5, 2010
Raleigh, NC
Co-located with IMAPS 2010

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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