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February 16, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button
Device Packaging 2010 - Early Registration Deadline This Friday (read more...)

Button Global Business Council 2010 Spring Conference - Early Registration Deadline This Friday (read more...)

Button Upcoming Webinars: This Thursday - Troubleshooting SMT-BGA-BTC Yield Problems (read more...)

Button New Workshop on Microelectronic Packaging and Materials for Medical Devices (read more...)

Button Advanced Technology Workshop on Electronic Packaging of Solar Cells and Fuel Cells (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet New England Chapter February 23 Dinner Meeting (read more...)

Bullet IMAPS UK Chapter's MicroTech 2010 Begins February 28 (read more...)

Bullet IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor's Night (read more...)

Bullet IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted (read more...)

   MEMBERSHIP, PRODUCTS AND PUBLICATIONS
IMAPS Individual Member Benefits (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2010 - Early Registration Deadline This Friday    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale/Fountain Hills, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The program, registration, professional development course information, keynote presentations, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging. The early registration cut-off is this Friday, February 19, 2010.

Global Business Council 2010 Spring Conference - Early Registration Deadline This Friday    ^ Top
The 2010 GBC Spring Conference on Emerging Markets: Segments to Strengthen the Recovery will be held in Scottsdale/Fountain Hills, Arizona, on March 7-8, 2010. This conference precedes the Device Packaging Conference and is co-located at the same venue. Full p
rogram, registration, golf and networking details can be found on-line at www.imaps.org/programs/gbc10spring.htm. The early registration cut-off is this Friday, February 19, 2010.

Participants can gain industry, management, and technical insight to gain a competitive advantage for both product development and marketing. Participants can also network in receptions, meals, and golf outings.

Sunday March 7, 2010
12:45 pm -- Tee Time/Start for GBC Golf Outing.
Firerock Country Club in Fountain Hills - www.firerockcc.com 

Cost: $140.00 per Player
Includes: Transportation to the Golf Course, Golf Cost, cart, box lunch, two drink tickets, and range balls for each player.

Note: The Course can reserve the cost of rental Clubs for an additional fee. Please let us know or the course know once you have registered if you will require the use of rental clubs. Rental Clubs are NOT included in the registration Fee. Tee Time Start: 12:45 pm (Transportation to Gold Course leaving at 11:45 am from Radisson Fort McDowell Lobby.

6:00 - 7:00 PM -- Registration
6:00 - 8:00 PM -- GBC Welcome Reception (Beverages and Appetizers)

Monday, March 8, 2010

7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

Opening Remarks followed by Keynote Presentation
8:00 AM - 9:15 AM

Opening Remarks
Arne Knudsen,  General Manager, Development, Kyocera America, Inc.
Chair, IMAPS Global Business Council

Keynote:   “Future Drivers for Electronics Systems and Packaging.”
Brandon Prior, Senior Consultant, Prismark Partners LLC.

Telecommunications (4G and Wi-Max) and Infrastructure
Session 1:  9:15 AM - 10:15 AM

"RF Power Device Requirements for 4G Base Station Amplifiers."
Eric Toulouse, Manager RF Division Strategy, Freescale Semiconductor

“Disruptive Technologies in the Wireless and 4G Markets.”
Rich Rice, Senior Vice President, ASE (US), Inc.

Brief Break

Photovoltaics Market
Session 2: 10:30 AM - 11:30 AM

"Renewable Energy Business Model."
Jennie Hwang, CEO, H-Technologies Group and Adjunct Professor Case Western University

“Photovoltaic Industry Overview and Current Trends in Technology.”
Ryan Simpson, Product Manager – Marketing, Kyocera Solar

Biomedical Market
Session 3: 11:30 AM - 12:00 PM

“Emerging Markets for Microfluidics Applications.”
Frédéric Breussin, Yole Développement

Lunch Presentation
12:00 PM - 1:00 PM

"Analyzing the IC Market Upturn"
Bill McClean, President, IC Insights

LED Market
Session 4: 1:00 PM - 2:00 PM
Moderator: Peter Tortorici, Process Development Manager, Medtronic, Co-chair

“Business Perspectives & Market Road Map in Solid State Lighting.”
George Panagotacos, Director, Lighting and Displays, Teledyne Microelectronic Technologies
  
“High Power LED Market-Impact on Supporting Technologies.”
Franklin Wall, Senior Development Engineer, Phillips Lumileds Lighting Company

Automotive Market
Session 5: 2:00 PM - 3:30 PM

“Automotive 2020: Clarity Beyond the Chaos.”
Sanjay Rishi, IBM

“Thermal Management of Power Semiconductor Packages for the Transition to More Electric-Dominant Vehicle Propulsion.”
Kevin Bennion, Research Engineer,  NREL – National Renewable Energy Laboratory

“Power Electronic Packaging for Hybrid Vehicular Applications.”
Laura Marlino, Deputy Director, Power Electronics Center, Oak Ridge National Laboratory

Brief Break

Military - Power Efficiency Markets
Session 6: 3:45 PM - 4:45 PM

“Thermal Management Challenges for HEV-EV Powertrain Drives and Energy Storage.”
David Saums, Principal, DS&A LLC        

"Technology, Trends and Opportunities in Radar and Communications." 
Andrew Piloto, Member Technical Staff, Kyocera America, Inc. 

Conference Review and Evaluation Forms
4:45 – 5:00

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

Upcoming Webinars: This Thursday - Troubleshooting SMT-BGA-BTC Yield Problems    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at bschieman@imaps.org.

Upcoming Programs:

THIS THURSDAY
PDC Webinar Series on

Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This two-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, February 18, and 25, 2010 . All webinars will be held 12:00 noon - 1:30 pm EST

* DATE CHANGE *
PDC Webinar Series on

Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays March 18, 25 and April 1. All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Ball Grid Array Inspection Lead-Free Defect Guide
Presented by: Bob Willis, ASKbobwillis.com Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, March 23 and Wednesday, March 24, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (Details Available Soon)
Presented by: Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, May 6, 13 and 20, 2010 . All webinars will be held 10:00 am - 11:00 am EDT

PDC Webinar Series on
Conformal Coating Applications, Inspection, Rework & Quality Control
Presented by: Bob Willis, ASKbobwillis.com Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, May 18 and Wednesday, May 19, 2010 . All webinars will be held 12:00 noon - 1:00 pm EDT

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

New Workshop on Microelectronic Packaging and Materials for Medical Devices    ^ Top
IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 9-10, 2010 - venue to be determined. For full details, or to submit an abstract, visit www.imaps.org/medical.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Abstracts are being solicited in the following areas:

  • Trends and Challenges for Class III Medical Implants
  • Applications for Ultra-Miniature Micro-Electronics
    • Human Portable Monitoring Devices
    • Patient Monitoring
  • Innovations in 3-D Packaging
  • Embedded Passives and Associated Technologies
  • Sensor/MEMS Technology for Medical Devices
  • Enabling Technologies for Power Management
  • Micro-Fluidics, Bio-Sensors and Bio-Chips
  • Hermetic and Near-Hermetic Packaging Solutions
  • INTERACTIVE PANEL DISCUSSION—“Advances in Technology for Folded Flex Circuits 

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present at the Medical Devices Workshop, should submit a 200-word abstract electronically by March 5, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

All abstracts submitted must represent advanced technology and be unpublished work. No formal technical paper is required. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  Speakers and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Advanced Technology Workshop on Electronic Packaging of Solar Cells and Fuel Cells    ^ Top
The Advanced Technology Workshop on Electronic Packaging of Solar Cells and Fuel Cells will be held in Cleveland, Ohio, September 14-16, 2010. For full details, or to submit an abstract, visit www.imaps.org/energy.

Electronic Packaging of Solar Cell and Fuel Cells Workshop Focus:
This workshop is a continuation of the first Alternative Energy Conference started several years ago. It will focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve both new technologies, and materials/processes for renewable, non-renewable, and innovative application of existing technologies. Incentives for research, investment, and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage the adoption, research, and development of new technologies.

Abstracts are being solicited in the following areas that support the major topics on either Solar (Photovoltaics) or Fuel Cells:

  • Design for Efficiency
  • Materials, Processing and Design
  • Balance of Plant
  • System Integration
  • Thermal and Power Management
  • Robustness and Cost
  • Qualification Approaches
  • Environmental Regulations
  • Government/State Policies and Incentives
  • Integration with Energy Storage Systems 

Those wishing to present at the Solar Cells and Fuel Cells Workshop, should submit a 250-300 word abstract electronically by April 2, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

  Chapter Activities (events listed in chronological order)
 

New England Chapter February 23 Dinner Meeting    ^ Top

Dates: February 23, 2010
Location:

Courtyard Marriott Marlborough

Schedule:

Agenda: Times are Approximate
5:30 PM Registration and Socializing
6:30 PM Dinner
7:20 PM Announcements
7:30 PM Presentation
9:00 PM Closing

Registration:

Member $ 25.00
Retired Member $ 20.00
Student $ 5.00
Non-Member $ 30.00

Pre-registration must be received by Thursday before the event
At-door registration is an additional $5.00.
RSVP REQUIRED

Details on the website can be found here: http://www.imapsne.org/meeting.html

Solders in LED Packaging
presented by
Seth Homer, Product Specialist
Indium Corporation, Clinton NY

ABSTRACT:

Successful LED packaging is achieved through a dependable method of attachment. Various methods / materials exist, and possess their own characteristics. The demand for a more robust and brighter LED presents a set of challenges that will need to be addressed. In these cases, a metallic solution offers the attributes required for a successful bond.

This presentation will highlight the different product types, associated alloys and process improvements that contribute to this application. One such improvement is a low oxide method of manufacturing Gold-Tin (AuSn) preforms. AuSn is used in high power die attach applications. Other applications and materials to be discussed are: NanoFoil® used in NanoBonding®, Solder paste printing suggestions, Compressible Metal TIMs or Heat-Springs® used in heat sinking LED packages to a cooling solution. In addition it will cover the different pack methods which can be used for HVM manufacturing. A presentation and hand outs will be provided for public use.

BIOGRAPHY

Seth is the Product Support Specialist for Engineered Solder Materials. He has been with Indium Corporation for over 15 years, serving as manufacturing supervisor for various engineered electronics assembly materials , including: solder spheres, sputtering targets, indium chemicals and solder preforms. Seth has also worked extensively with Customer Support teams, especially those in China, Singapore and Europe.

IMAPS UK Chapter's MicroTech 2010 Begins February 28    ^ Top

Dates: 28th February – 2nd March 2010
Location:

Møller Centre
Cambridge, United Kingdom

The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM) will be the major Spring 2010 Conferences on Electronics packaging, interconnection, integration in Europe.

MicroTech-2010 featuring Disruptive Technologies & APM featuring advanced polymer, organic and inorganic materials, will be co-located at the well known University of Cambridge Møller Centre. The location is ideally placed near many forward-thrusting companies as well as at a great historic city.

Short Courses will be held on 28th February

MicroTech-2010 Programme – Monday 1st March 2010
Venue: the Conference Centre at the Møller Centre, University of Cambridge

Plenary Keynotes:
“MEMS packaging and assembly in Harsh Environments” Sean Neylon, Colibrys, Switzerland

“Disruptive Technology its Application in Mobile Devices” - CSR plc , UK.

“New Approaches Wafer-Level Chip-Scale Packaging” – Lord Corporation, Europe. Speaker tbc

Disruptive Technologies and Advanced Packaging
“Fine Pitch Cu Wire Bonding” (Colleague), Bernd Appelt, ASE, California, USA

“Development of Microvia Copper Electroplating Technology for SiP Applications”, Cheng Fang, NXP, France

“Active implantable electrodes: Micro-Manufacturing with embedded IC”, A Vanhoestenbergh, UCL London

“Large 3D LTTC structures realised with sacrifcial materials”, M Hrovat, Stefan Josef Institute, Slovenia

“Assembly and Packaging of Pyroelectric Arrays for People counting and thermal imaging applications”, A Butler, Infra-red Integration Systems, Northampton

Disruptive Technologies and Reliability
“Improving the Efficiency of Hermetic Packaging using Novel Gettering Solutions”, S Catchpole, Johnson Matthey Catalysts

“An Investigation on the Effects of Solder Joint Daisy Chain Resistance Monitoring Method and Failure Criteria Selection on Board Level Reliability Test”, J Lo & Rickey Lee, HKUST, Hong Kong

“Advanced Reliability Testing of Embedded Passive Components for System-in-Package Applications”, H Goddin, TWI, UK

IMAPS-UK AGM
Drinks & Dinner
Social event

Exhibition
A tabletop exhibition will also be held. Please email secretariat@imaps.org.uk

Accommodation
The Møller Centre and a number of local hotels very good quality and very good value accommodation adjacent to the venue. For information please visit the website http://www.mollercentre.co.uk

Travel
To get to the Møller Centre check the website (http://www.mollercentre.co.uk/location/index.html)

Conference Officers
Conference Secretariat:
Vicky Holland (secretariat@imaps.org.uk)

Conference Co-Chairs:
Nihal Sinnadurai
Chief Executive, ATTAC
sinnadurai@aol.com

Chris Bailey
University of Greenwich
c.bailey@gre.ac.uk

Andrew Holland
CSR plc
andrew.holland@csr.com

IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor Night    ^ Top

Dates: April 15, 2010
Schedule: 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)
Location:

Holiday Inn Ronkonkoma
Ronkonkoma, NY

PDC Registration:

500.00 Member
600.00 Non-Member

Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.

Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email slehnert@imaps.org to register

Exhibits Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by Professional Development Courses and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.

This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.

He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.

A Full Day Presentation on:
International Traffic in Arms Regulations(ITAR)
Course Leaders: Kelly Raia & Tom Cook, American River International

Every company's management wants to have complete confidence in its trade compliance effort with respect to the International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR). The question is: Is that an achievable goal? Do you have concerns about your staff not having the necessary skills and up-to-date knowledge needed to keep your company in compliance? This presentation will cover all of the following points:

       Managing Compliance in the Global Supply Chain
       EAR vs. ITAR
       Dept of Commerce
       Scope of the Export Administration Regulations
       Foreign Trade Regulations and Licensable Transactions
       Dept of Foreign Asset Controls
       Commodity Classifications
       USML
       ITAR Basics
       Prohibited Parties
       Destination Control Statement
       Exporting Under Dept of State Licenses
       License Amendments
       License Exemptions
       Penalties for ITAR Violations
       Compliance Actions
       Foreign Nationals
       Other Supply Chain Issues
       Incoterms
       Recordkeeping
       Managing Your Forwarder and Customs Broker in Licensable Transactions
       Resources

About the presenters:
Kelly Raia

Kelly has been involved in freight forwarding and customhouse brokerage for over 20 years.

Kelly owned and managed Armac Transportation for 10 years.  This business specialized in customs clearances of time sensitive shipments such as live
animals, aircraft parts, chemicals and various perishable products.

Kelly joined FSI/American River in 1996.  During this time she has worked as a senior account manager leading to managing the international department including global export and import operations. 

In 1997 Kelly assumed various consulting responsibilities and became ARI’s in-house specialist for import/export compliance.

She has worked on some major accounts assisting their staff in global logistics, compliance management and working on the various international and government web sites for compliance resources.

Kelly has also developed various in-house programs for management training, utilizing technology in importing and exporting and in developing skills for import/export compliance management.

She has lectured at the World Trade Institute and supports Tom Cook and Rennie Alston for the many courses and programs they deliver on various international logistics and compliance matters.

Kelly is a licensed customhouse broker, haz-mat certified and TSA Security
training approved.

Kelly attended Long Island University, C.W. Post campus as well as Nassau Community College where she has taken many courses in business and communication.

She is the Import/Export Compliance Officer, Vice President and Associate Partner at American River International and serves on the executive committee.

Thomas A. Cook

Tom has been involved in global business for over 30 years in an array of diverse international trades.

He graduated from Maritime College at Fort Schuyler, NY, where he holds both a BS Degree in Transportation Science and a Graduate Degree in Transportation and Business Management.

His career began in the US Naval Reserve and the US and Dutch Merchant Marine, where he served as an officer in various commercial and military capacities on passenger, tug, oil, chemical, break-bulk and container vessels, all over the globe.

Tom has also been involved in the international insurance, manufacturing, exporting, marketing, in the trade finance arenas and in senior management and ownership positions, with an emphasis on logistics, compliance and security. 

He has authored over 225 articles and published seven books on international trade, the latest: “Managing Global Supply Chains” and has lectured all over the world on varied subjects involved with global trade.  He is considered by many leading professionals to be top in the field of global logistics and international operations.

Tom has numerous interests in third party logistics, global trade and international business.  He is on the board of many companies and organizations, such as but not limited to: American River International, FSI Global Logistics, The Trade Resource Group of Customs in Washington, DC, The Small Business Exporters Association, North American Exporters Association, World Trade Magazine, American Management Association, IOMA and The World Academy, New York District Export Council.

Tom currently serves as CEO and Managing Director of American River International, a premier consulting and logistics firm. 

Exhibit Registration Information:

Walter Becker
WJB Sales
631 331 0689
wbecker@wlbsales.com

Steve Lehnert
Space Systems Loral
650 644 5218
metroimaps@optonline.net

IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted    ^ Top

Call for abstracts
The IMAPS Nordic Conference 2010
Elite Park Avenue Hotel, June 6-9, Gothenburg, Sweden

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2010. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than February 5.

Speakers will be notified of paper acceptance by email by March 19.

The deadline for the final paper is April 9.

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • HB LED - applications, bonding, substrates
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Photo Voltaics – silicon solar cells, thin film, printed
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Printed electronics – applications, technologies
  • Chip thinning & stacking, 3D-packaging, embedding
  • Microvia, HDI laminates, flex, embedded passives
  • CSP, flip chips, area array
  • High temperature electronics
  • Future electronics, trends & strategies
  • MEMS, MOEMS, sensor integration & applications
  • High frequency packaging
  • SMT and board assembly
  • Harsh environment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Manufacturing management & outsourcing
  • Wirebonding, COB

 

 

  Membership, Products and Publications
 

IMAPS Individual Membership Benefits   ^ Top

  • Discounts on events, publications, and iKnow Micro downloads
    • Take discounts on the Annual Symposium and many technical workshops.
    • Take discounts on publications and on-line library downloads; http://www.imaps.org/imapsstore/default.aspx
  • IMAPS Chapter Membership
    • Learn from technical and management presentations by local and national experts.
    • Connect with industry peers through regional programs.
  • Advancing Microelectronics Magazine
    • Enjoy a complimentary one-year subscription to Advancing Microelectronics.
  • Access the Journal of Microelectronics and Electronic Packaging
    • View the Journal of Microelectronics and Electronic Packaging on-line.
  • Complimentary Access to JOBS Marketplace
    • Post resumes and search for current job openings.
    • Keep records easily - results and actions are conveniently recorded.
    • Enjoy helpful features of many expensive job search engines.
  • Access "Members-Only" sections on imaps.org
    • Find individuals and companies that provide products and services.
    • Enter your own professional listing.

For more details about IMAPS Membership, visit www.imaps.org or call Steve Greene, Membership Manager, at 202-548-4001 or sgreene@imaps.org.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 3: February 17

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World (2 Sessions)
Session 1: February 18

Session 2: February 25

2010 GBC Spring Conference March 7-8
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies (3 Sessions)
Session 1: March 18

Session 2: March 25
Session 3: April 1

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact abell@imaps.org

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact abell@imaps.org

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

 

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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