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February 2, 2010

TJ Green Associates, LLC

Device Packaging 2010 - Hotel Deadline This Thursday (read more...)

Button Upcoming Webinars: Tomorrow - Intro to Microelectronics; Next Week - Package on Package (PoP) and Troubleshooting SMT-BGA-BTC (read more...)

Button New Workshop on Microelectronic Packaging and Materials for Medical Devices (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Tomorrow: IMAPS Northern California Chapter Lunch February 3 (read more...)

Bullet This Thursday: IMAPS Arizona Chapter Lunch Meeting on February 4 (read more...)

Bullet Next Week: IMAPS Northwest Chapter Winter Workshop on February 10 (read more...)

Bullet IMAPS Chicago/Milwaukee Chapter Winter Technical Symposium February 16 (read more...)

Bullet IMAPS UK Chapter's MicroTech 2010 Begins February 28 (read more...)

Bullet IMAPS Metro Chapter April 15 - Professional Development Course and Vendor's Night (read more...)

Bullet IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted (read more...)

Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

Device Packaging 2010 - Hotel Deadline This Thursday    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale/Fountain Hills, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The program, registration, professional development course information, keynote presentations, exhibit reservation details and full conference information can be found on-line at

The hotel deadline is this Thursday, February 4, 2010. The early registration cut-off is February 19, 2010.

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging and the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. There are booths still available. Please review the exhibit information or contact Ann Bell by email at or by phone at 202-548-8717.

Upcoming Webinars: Tomorrow - Intro to Microelectronics; Next Week - Package on Package (PoP) and Troubleshooting SMT-BGA-BTC    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at

Upcoming Programs:

PDC Webinar Series on
Introduction to Microelectronics Packaging Technology
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held: Wednesdays, February 3, 10, and 17, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

Next Tuesday:
PDC Webinar Series on

Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, February 9, 16, and 23, 2010. All webinars will be held 12:00 noon - 1:00 pm EST

Next Thursday:
PDC Webinar Series on

Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, February 11, 18, and 25, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

Details on all IMAPS webinars can be viewed at

New Workshop on Microelectronic Packaging and Materials for Medical Devices    ^ Top
IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 9-10, 2010 - venue to be determined. For full details, or to submit an abstract, visit

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Abstracts are being solicited in the following areas:

  • Trends and Challenges for Class III Medical Implants
  • Applications for Ultra-Miniature Micro-Electronics
    • Human Portable Monitoring Devices
    • Patient Monitoring
  • Innovations in 3-D Packaging
  • Embedded Passives and Associated Technologies
  • Sensor/MEMS Technology for Medical Devices
  • Enabling Technologies for Power Management
  • Micro-Fluidics, Bio-Sensors and Bio-Chips
  • Hermetic and Near-Hermetic Packaging Solutions
  • INTERACTIVE PANEL DISCUSSION—“Advances in Technology for Folded Flex Circuits 

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present at the Medical Devices Workshop, should submit a 200-word abstract electronically by March 5, 2010, using the on-line submittal form at: If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner ( or call 305-382-8433.

All abstracts submitted must represent advanced technology and be unpublished work. No formal technical paper is required. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  Speakers and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

  Chapter Activities (events listed in chronological order)

Tomorrow: IMAPS Northern California Chapter Lunch February 3    ^ Top

Dates: February 3, 2010

David's Restaurant
5151 Stars and Stripes Drive
Santa Clara, CA


To register, please contact Gina Love at or 209-833-1110

Mr. Mulugeta Abtew, VP at Sanmina-SCI, presents on the impact of surface finishes on the soldering of PCB assemblies.

This Thursday: IMAPS Arizona Chapter Lunch Meeting on February 4    ^ Top

Dates: February 4, 2010
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00

Fiesta Inn & Resort
2100 South Priest Drive
Tempe, AZ 85282


$20 for IMAPS Members
$30 for Non-Members
$25 for Vendor Display Tables

RSVP by 15 Jan 2010 online or via e-mail /

Analyzing The Recovery

The IC industry is poised for an impressive rebound and solid growth in 2010! Unit demand remains strong, 300mm fabs are running near capacity, and IC average selling prices are headed higher. For the first time in a long while, companies in the IC industry have reason to be upbeat about the coming year.

Global recessions should be thought of as periods of “pent-up” demand for electronic systems. Although these severe downturns always cause a temporary push-out of electronic system purchases, they do not destroy the underlying desire to purchase.

Global recessions typically set the stage for a booming IC market. Over the past 30 years, the world has endured four global recessions, and after every one of these recessions, a booming IC market immediately followed! Moreover, the strong IC market that followed the global recession has always lasted at least two years.

IC Insights’ will examine the relationship between worldwide GDP, electronic system sales, the IC market, and IC unit volume shipments and present its 2010 forecast for each of these segments.

Presenter: Bill McClean
Position: President
Company: IC Insights

Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With nearly 30 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones.

Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide.

Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

Next Week: IMAPS Northwest Chapter Winter Workshop on February 10    ^ Top

Dates: February 10, 2010
Schedule: Registration and Lunch at 4:00
Presentations begin at 4:30

Kyocera Industrial Ceramics
5713 East Fourth Plain Blvd.
Vancouver, WA 98661
On-site POC is Scott Tse at


$20 for IMAPS Members ($25 on-site)
$30 for Non-Members ($35 on-site)
$5 for Students w/ID

Register by February 8, 2010 online at:


4:00   Registration and networking

4:30   Nathan Onbattuvelli, PhD Student from Oregon State University
“Injection Molding of SiC ceramics for Power Electronics.”

5:00  James Morris, Professor from Portland State University
“Nanopackaging: Nanotechnologies in Microelectronics Packaging."

Abstract: Nanotechnologies offer a variety of materials options for reliability improvements in microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior properties of carbon nanotubes. Nanocomposite materials are studied for resistors, high-k dielectrics, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancements, while CNTs may also find thermal, interconnect, and shielding applications. The talk will focus on these technologies, with some discussion of nanoparticle and CNT properties, modeling, and technology scaling, and a mention of the packaging reliability issues for post-CMOS nanoelectronics technologies.

5:30   Roger Devaney, VP - Laboratory Director of Hi-Rel Labs
“The Metallurgy and Failure Analysis of Solder Joints in Electronics.”
  Event Wrap-up (event review, next event, announcements)                      

6:15 Dinner

IMAPS Chicago/Milwaukee Chapter Winter Technical Symposium February 16    ^ Top

Dates: February 16, 2010

Panasonic Factory Solutions Company of America
909 Asbury Dr.
Buffalo Grove, IL 60089
No ID required for participants.


$15 for IMAPS Members
$25 for Non-Members
$5 for Students w/ ID

Register on-line before February 12 at:


11:30  Registration and networking

12:00  Lunch and break

1:00  “Optimizing a Standard Print Process for Mixed Technology Assembly”
            Rich Lieske, Solutions Engineering Manager at DEK America.

1:30    “Benchmarking of 96% Alumina Substrates for Thick Film Hybrids” 
             Sarah Groman, Technical Service Engineer at Heraeus
 2:00   Break

 2:15   “Embedded Passive Materials for Use in PCB/IC Packaging”
             Joel Peiffer, Engineering Specialist at 3M Electronic Solutions.

 2: 45   "Ceramics for MEMS Packaging" 
              Adam Schubring, Sr. Market Development Engineer at Kyocera America, Inc.

3:15 Event wrap-up and chapter elections

3:30 Optional tour of Panasonic’s Advanced Packaging Lab

         Features demonstrations of gold to gold thermosonic flip chip bonding, plasma cleaning process technologies, X-Ray inspection, and SEM cross-section analysis.

4:00 Conclusion

IMAPS UK Chapter's MicroTech 2010 Begins February 28    ^ Top

Dates: 28th February – 2nd March 2010

Møller Centre
Cambridge, United Kingdom

The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM) will be the major Spring 2010 Conferences on Electronics packaging, interconnection, integration in Europe.

MicroTech-2010 featuring Disruptive Technologies & APM featuring advanced polymer, organic and inorganic materials, will be co-located at the well known University of Cambridge Møller Centre. The location is ideally placed near many forward-thrusting companies as well as at a great historic city.

Short Courses will be held on 28th February

MicroTech-2010 Programme – Monday 1st March 2010
Venue: the Conference Centre at the Møller Centre, University of Cambridge

Plenary Keynotes:
“MEMS packaging and assembly in Harsh Environments” Sean Neylon, Colibrys, Switzerland

“Disruptive Technology its Application in Mobile Devices” - CSR plc , UK.

“New Approaches Wafer-Level Chip-Scale Packaging” – Lord Corporation, Europe. Speaker tbc

Disruptive Technologies and Advanced Packaging
“Fine Pitch Cu Wire Bonding” (Colleague), Bernd Appelt, ASE, California, USA

“Development of Microvia Copper Electroplating Technology for SiP Applications”, Cheng Fang, NXP, France

“Active implantable electrodes: Micro-Manufacturing with embedded IC”, A Vanhoestenbergh, UCL London

“Large 3D LTTC structures realised with sacrifcial materials”, M Hrovat, Stefan Josef Institute, Slovenia

“Assembly and Packaging of Pyroelectric Arrays for People counting and thermal imaging applications”, A Butler, Infra-red Integration Systems, Northampton

Disruptive Technologies and Reliability
“Improving the Efficiency of Hermetic Packaging using Novel Gettering Solutions”, S Catchpole, Johnson Matthey Catalysts

“An Investigation on the Effects of Solder Joint Daisy Chain Resistance Monitoring Method and Failure Criteria Selection on Board Level Reliability Test”, J Lo & Rickey Lee, HKUST, Hong Kong

“Advanced Reliability Testing of Embedded Passive Components for System-in-Package Applications”, H Goddin, TWI, UK

Drinks & Dinner
Social event

A tabletop exhibition will also be held. Please email

The Møller Centre and a number of local hotels very good quality and very good value accommodation adjacent to the venue. For information please visit the website

To get to the Møller Centre check the website (

Conference Officers
Conference Secretariat:
Vicky Holland (

Conference Co-Chairs:
Nihal Sinnadurai
Chief Executive, ATTAC

Chris Bailey
University of Greenwich

Andrew Holland
CSR plc

IMAPS Metro Chapter April 15 - Professional Development Course and Vendor Night    ^ Top

Dates: April 15, 2010
Schedule: 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)

Holiday Inn Ronkonkoma
Ronkonkoma, NY

PDC Registration:

500.00 Member
600.00 Non-Member

Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.

Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email to register

Exhibits Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by a Professional Development Course and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.

This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.

He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.

Exhibit Registration Information:

Walter Becker
WJB Sales
631 331 0689

Steve Lehnert
Space Systems Loral
650 644 5218

IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted    ^ Top

Call for abstracts
The IMAPS Nordic Conference 2010
Elite Park Avenue Hotel, June 6-9, Gothenburg, Sweden

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2010. The abstract must be non-commercial and submitted in electronic form to no later than February 5.

Speakers will be notified of paper acceptance by email by March 19.

The deadline for the final paper is April 9.

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • HB LED - applications, bonding, substrates
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Photo Voltaics – silicon solar cells, thin film, printed
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Printed electronics – applications, technologies
  • Chip thinning & stacking, 3D-packaging, embedding
  • Microvia, HDI laminates, flex, embedded passives
  • CSP, flip chips, area array
  • High temperature electronics
  • Future electronics, trends & strategies
  • MEMS, MOEMS, sensor integration & applications
  • High frequency packaging
  • SMT and board assembly
  • Harsh environment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Manufacturing management & outsourcing
  • Wirebonding, COB



  Membership, Products and Publications

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to or feel free to contact me at the phone/e-mail below.



Lorac - Furnace Experts

PDC Webinar Series on Design for Manufacturability in a Lead Free World (2 Sessions)
Session 2: February 4

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 1: February 3

Session 2: February 10
Session 3: February 17

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies (3 Sessions)
Session 1: February 9

Session 2: February 16
Session 3: February 23

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World (3 Sessions)
Session 1: February 11

Session 2: February 18
Session 3: February 25

2010 GBC Spring Conference March 7-8
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11
Fountain Hills, AZ

*Exhibitors contact

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact

^ Top


Compex Corp

Oneida Research Services


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