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February 25, 2010

TJ Green Associates, LLC

Device Packaging 2010 - Attend The Exhibits At No Charge (read more...)

Button Global Business Council 2010 Spring Conference - Begins Next Sunday With Golf Outing (read more...)

Button Workshop on Automotive Microelectronics and Packaging - Program and Registration (read more...)

Button Abstracts Due Next Friday for New Workshop on Microelectronic Packaging and Materials for Medical Devices (read more...)

Button Upcoming Webinars: Package on Package (PoP), BGA Inspection, RF/Microwave... (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS UK Chapter's MicroTech 2010 Begins February 28 (read more...)

Bullet IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor's Night (read more...)

Bullet IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted (read more...)

IMAPS Individual Member Benefits (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

Device Packaging 2010 - Attend The Exhibits At No Charge    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale/Fountain Hills, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The program, registration, professional development course information, keynote presentations, exhibit reservation details and full conference information can be found on-line at There is no charge for your exhibits hall pass, so register today.

Global Business Council 2010 Spring Conference - Begins Next Sunday With Golf Outing    ^ Top
The 2010 GBC Spring Conference on Emerging Markets: Segments to Strengthen the Recovery will be held in Scottsdale/Fountain Hills, Arizona, on March 7-8, 2010. This conference precedes the Device Packaging Conference and is co-located at the same venue. Full p
rogram, registration, golf and networking details can be found on-line at The early registration cut-off is this Friday, February 19, 2010.

Participants can gain industry, management, and technical insight to gain a competitive advantage for both product development and marketing. Participants can also network in receptions, meals, and golf outings.

Sunday March 7, 2010
12:45 pm -- Tee Time/Start for GBC Golf Outing.
Firerock Country Club in Fountain Hills - 

Cost: $140.00 per Player
Includes: Transportation to the Golf Course, Golf Cost, cart, box lunch, two drink tickets, and range balls for each player.

Note: The Course can reserve the cost of rental Clubs for an additional fee. Please let us know or the course know once you have registered if you will require the use of rental clubs. Rental Clubs are NOT included in the registration Fee. Tee Time Start: 12:45 pm (Transportation to Gold Course leaving at 11:45 am from Radisson Fort McDowell Lobby.

6:00 - 7:00 PM -- Registration
6:00 - 8:00 PM -- GBC Welcome Reception (Beverages and Appetizers)

Monday, March 8, 2010

7:00 AM - 5:00 PM -- Registration
7:00 AM - 8:00 AM -- Continental breakfast

Opening Remarks followed by Keynote Presentation
8:00 AM - 9:15 AM

Opening Remarks
Arne Knudsen,  General Manager, Development, Kyocera America, Inc.
Chair, IMAPS Global Business Council

Keynote:   “Future Drivers for Electronics Systems and Packaging.”
Brandon Prior, Senior Consultant, Prismark Partners LLC.

Telecommunications (4G and Wi-Max) and Infrastructure
Session 1:  9:15 AM - 10:15 AM

"RF Power Device Requirements for 4G Base Station Amplifiers."
Eric Toulouse, Manager RF Division Strategy, Freescale Semiconductor

“Disruptive Technologies in the Wireless and 4G Markets.”
Rich Rice, Senior Vice President, ASE (US), Inc.

Brief Break

Photovoltaics Market
Session 2: 10:30 AM - 11:30 AM

"Renewable Energy Business Model."
Jennie Hwang, CEO, H-Technologies Group and Adjunct Professor Case Western University

“Photovoltaic Industry Overview and Current Trends in Technology.”
Ryan Simpson, Product Manager – Marketing, Kyocera Solar

Biomedical Market
Session 3: 11:30 AM - 12:00 PM

“Emerging Markets for Microfluidics Applications.”
Frédéric Breussin, Yole Développement

Lunch Presentation
12:00 PM - 1:00 PM

"Analyzing the IC Market Upturn"
Bill McClean, President, IC Insights

LED Market
Session 4: 1:00 PM - 2:00 PM
Moderator: Peter Tortorici, Process Development Manager, Medtronic, Co-chair

“Business Perspectives & Market Road Map in Solid State Lighting.”
George Panagotacos, Director, Lighting and Displays, Teledyne Microelectronic Technologies
“High Power LED Market-Impact on Supporting Technologies.”
Franklin Wall, Senior Development Engineer, Phillips Lumileds Lighting Company

Automotive Market
Session 5: 2:00 PM - 3:30 PM

“Automotive 2020: Clarity Beyond the Chaos.”
Sanjay Rishi, IBM

“Thermal Management of Power Semiconductor Packages for the Transition to More Electric-Dominant Vehicle Propulsion.”
Kevin Bennion, Research Engineer,  NREL – National Renewable Energy Laboratory

“Power Electronic Packaging for Hybrid Vehicular Applications.”
Laura Marlino, Deputy Director, Power Electronics Center, Oak Ridge National Laboratory

Brief Break

Military - Power Efficiency Markets
Session 6: 3:45 PM - 4:45 PM

“Thermal Management Challenges for HEV-EV Powertrain Drives and Energy Storage.”
David Saums, Principal, DS&A LLC        

"Technology, Trends and Opportunities in Radar and Communications." 
Andrew Piloto, Member Technical Staff, Kyocera America, Inc. 

Conference Review and Evaluation Forms
4:45 – 5:00

5:00 PM - 7:00 PM - Device Packaging Welcome Reception
(GBC Attendees Invited - Beverages and Appetizers)

Workshop on Automotive Microelectronics and Packaging - Program and Registration    ^ Top
The Advanced Technology Workshop on Automotive Microelectronics and Packaging will be held in Dearborn, Michigan, April 27-28, 2010. For full details, or to register, visit

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Tuesday, April 27th

Registration: 7:00 am - 4:45 pm

Continental Breakfast: 7:00 am - 8:00 am

Opening Remarks: 8:00 - 8:15 am
Workshop Chairs

Keynote Presentation: 8:15 am – 9:00 am
Title: Power Electronics Application and Requirements for Hybrid Vehicle Traction Inverter - An Overview
Speaker: Shahram Zarei, Ford Motor Company
Mr. Zarei joined the automotive industry and specifically GM Research Lab in 1985 after graduating with his MSEE from Purdue. He joined Ford Research lab in 1993, and transferred to SMT which is responsible for Ford global hybrid programs in 2004. Since then, my team has been responsible for D&R of E-Drive and Traction Inverter systems for our hybrid programs.

Keynote Presentation: 9:00 am – 9:45 am
Title: Power Electronics within the FreedomCAR Partnership
Speaker: TBD, ORNL

Session 1a: Thermal Management
9:45 am - Noon

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies 
Kevin Bennion, Gilbert Moreno, Jason Lustbader, National Renewable Energy Laboratory   

Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
Dave Saums, DS&A LLC

Break: 10:45 am - 11:00 am

Micro-Channel Variation within Liquid Cold Plate Design and Impact on Thermal Performance
Matt Reeves, Sy-Jenq Loong, Peter Beucher, Wolverine Tube Inc. 

Thermal Interface Material for Automotive Applications: Basics and Selected Examples
Sanjay Misra, John Timmerman, Bergquist Company  

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm - 2:00 pm
Title: AlSiC Pin Fin Power Module Coolers and IGBT Baseplates for Hybrid Electric Vehicles (HEV)

Speaker: Bo Sullivan, Senior Account Manager, CPS Technologies

Session 1b: Thermal Management
2:00 pm – 4:45 pm

Effect of Compression Behavior of Thermal Interface Materials on Component Operating Temperature
Chris Severance, Parker Chomerics

Development of Double-Side Cooled Power Modules Joined by Low-Temperature Sintering of Nanosilver Paste for Electric Vehicles
Guo-Quan Lu, Xiao Cao, Tao Wang, Zheyuan Tan, Khai Ngo, Susan Luo, Virginia Tech.

Anisotropic Conductive Adhesives (ACA) Technology
William Chappell, Purdue University

Break: 3:30 pm - 3:45 pm

Silver Sintering
Frank Murch, Heraeus Circuit Materials Division

SOI Based Voltage Regulator for High-Temperature Applications
Benjamin McCue, B. J. Blalock, S. K. Islam, L. M. Tolbert, University of Tennessee

Wednesday, April 28th

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
Title: TBD

Speaker: TBD, University of Michigan

Session 2: Power Substrate Packaging
8:45 am - Noon

High Brightness LED Assembly using DPC Substrate and SuperMCPCB
Charles Lin, Nick Wang, Allen Hsu, Andy Lim, Jerry Tan, Bridge Semiconductor Corporation and Tong Hsing Electronic Industries Ltd.; Heinz Ru, Thompson Jiang, David Liao, Tong Hsing Electronic Industries Ltd.

Evaluation of an Electrically Insulating Glaze on Aluminum for Thermal Substrates in High Power LEDs
Michael Creamer, Mark Challingsworth, Samson Shahbazi, Heraeus Materials Technology LLC

Alumina Multilayer Substrate for Small Module Unit
Kouichi Hirayama, Hiroshi Matsumoto, Adam Schubring, Kyocera Corporation

Break: 10:15 am - 10:30 am

Development of a Fatigue Resistant Lead-Free Alloy For High Reliability Under Hood Applications
Mitch Holtzer, Anna Lifton, Paul Koep, Cookson Electronics Assembly Materials

Lead Free Thick Film Pastes for Fuel Level Sender Application
Christina Modes, Stefan Flick, Annette Kipka, W. C. Heraeus GmbH, TFD-TH

LCP Properties Ideal for Miniaturization Trend in Electronic Industry
Edson Ito, Ticona Engineering Polymers

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm – 2:00 pm
Title: Electronic Packaging Challenges for Safe, Green and Connected Vehicles

Speaker: D.H.R. Sarma, Delphi Electronics and Safety
Dr. D.H. R. Sarma is a Principal Technical Fellow and Engineering Group Manager in Advanced Engineering and Business Development at Delphi Electronics and Safety, Kokomo, Indiana.  Prior to joining Delphi, his work experience included a one and a half-year stint at CTS Microelectronics in West Lafayette, Indiana.  He has over 30 years of experience in electronic materials technologies. He received his B.S. degree from the Indian Institute of Science, Bangalore, India and his M.S. and Ph.D. degree from Purdue University.  Currently, he supervises the development of key technologies for future Delphi product portfolio. 

Keynote Presentation: 2:00 pm – 2:45 pm
Title: Electronics Manufacturing in Michigan

Speaker: TBD, Gentex

Session 4: Assembly, Material Processing
2:45 pm - 5:00 pm

Faster Computed Tomography for Advanced Failure Analysis
Sheri Martin, Andres Lechner, Jens Peter Steffan, YXLON FeinFocus

Surface Wettability Improvement for High Volume Automotive Manufacturing by Atmospheric Plasma Treatment 
Gene Dunn, Panasonic Factory Solutions of America

Break: 3:45 pm - 4:00 pm

Dispensing Solutions for Advanced Automotive Electronics
Dan Ashley, Asymtek

Adapting Press-Fit Connection Technology for Automotive Modular Electronic Units
Joseph J. Lynch, Jeff Parrish, Interplex Industries

Closing Remarks: 5:00 pm

Register On-Line

Abstracts Due Next Friday for New Workshop on Microelectronic Packaging and Materials for Medical Devices    ^ Top
IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 9-10, 2010 - venue to be determined. For full details, or to submit an abstract, visit

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Abstracts are being solicited in the following areas:

  • Trends and Challenges for Class III Medical Implants
  • Applications for Ultra-Miniature Micro-Electronics
    • Human Portable Monitoring Devices
    • Patient Monitoring
  • Innovations in 3-D Packaging
  • Embedded Passives and Associated Technologies
  • Sensor/MEMS Technology for Medical Devices
  • Enabling Technologies for Power Management
  • Micro-Fluidics, Bio-Sensors and Bio-Chips
  • Hermetic and Near-Hermetic Packaging Solutions
  • INTERACTIVE PANEL DISCUSSION—“Advances in Technology for Folded Flex Circuits 

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present at the Medical Devices Workshop, should submit a 200-word abstract electronically by March 5, 2010, using the on-line submittal form at: If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner ( or call 305-382-8433.

All abstracts submitted must represent advanced technology and be unpublished work. No formal technical paper is required. A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All Speakers are required to pay a reduced registration fee and are required to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  Speakers and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers.

Upcoming Webinars: Package on Package (PoP), BGA Inspection, RF/Microwave...    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at

Upcoming Programs:

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays March 18, 25 and April 1. All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Ball Grid Array Inspection Lead-Free Defect Guide
Presented by: Bob Willis, Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, March 23 and Wednesday, March 24, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Electrical Modeling, Analysis and Optimization of Electronic Packaging Structures for Signal and Power Integrity (Details Available Soon)
Presented by: Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, May 6, 13 and 20, 2010 . All webinars will be held 10:00 am - 11:00 am EDT

PDC Webinar Series on
Conformal Coating Applications, Inspection, Rework & Quality Control
Presented by: Bob Willis, Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, May 18 and Wednesday, May 19, 2010 . All webinars will be held 12:00 noon - 1:00 pm EDT

Details on all IMAPS webinars can be viewed at


  Chapter Activities (events listed in chronological order)

IMAPS UK Chapter's MicroTech 2010 Begins February 28    ^ Top

Dates: 28th February – 2nd March 2010

Møller Centre
Cambridge, United Kingdom

The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM) will be the major Spring 2010 Conferences on Electronics packaging, interconnection, integration in Europe.

MicroTech-2010 featuring Disruptive Technologies & APM featuring advanced polymer, organic and inorganic materials, will be co-located at the well known University of Cambridge Møller Centre. The location is ideally placed near many forward-thrusting companies as well as at a great historic city.

Short Courses will be held on 28th February

MicroTech-2010 Programme – Monday 1st March 2010
Venue: the Conference Centre at the Møller Centre, University of Cambridge

Plenary Keynotes:
“MEMS packaging and assembly in Harsh Environments” Sean Neylon, Colibrys, Switzerland

“Disruptive Technology its Application in Mobile Devices” - CSR plc , UK.

“New Approaches Wafer-Level Chip-Scale Packaging” – Lord Corporation, Europe. Speaker tbc

Disruptive Technologies and Advanced Packaging
“Fine Pitch Cu Wire Bonding” (Colleague), Bernd Appelt, ASE, California, USA

“Development of Microvia Copper Electroplating Technology for SiP Applications”, Cheng Fang, NXP, France

“Active implantable electrodes: Micro-Manufacturing with embedded IC”, A Vanhoestenbergh, UCL London

“Large 3D LTTC structures realised with sacrifcial materials”, M Hrovat, Stefan Josef Institute, Slovenia

“Assembly and Packaging of Pyroelectric Arrays for People counting and thermal imaging applications”, A Butler, Infra-red Integration Systems, Northampton

Disruptive Technologies and Reliability
“Improving the Efficiency of Hermetic Packaging using Novel Gettering Solutions”, S Catchpole, Johnson Matthey Catalysts

“An Investigation on the Effects of Solder Joint Daisy Chain Resistance Monitoring Method and Failure Criteria Selection on Board Level Reliability Test”, J Lo & Rickey Lee, HKUST, Hong Kong

“Advanced Reliability Testing of Embedded Passive Components for System-in-Package Applications”, H Goddin, TWI, UK

Drinks & Dinner
Social event

A tabletop exhibition will also be held. Please email

The Møller Centre and a number of local hotels very good quality and very good value accommodation adjacent to the venue. For information please visit the website

To get to the Møller Centre check the website (

Conference Officers
Conference Secretariat:
Vicky Holland (

Conference Co-Chairs:
Nihal Sinnadurai
Chief Executive, ATTAC

Chris Bailey
University of Greenwich

Andrew Holland
CSR plc

IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor Night    ^ Top

Dates: April 15, 2010
Schedule: 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)

Holiday Inn Ronkonkoma
Ronkonkoma, NY

PDC Registration:

500.00 Member
600.00 Non-Member

Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.

Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email to register

Exhibits Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by Professional Development Courses and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.

This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.

He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.

A Full Day Presentation on:
International Traffic in Arms Regulations(ITAR)
Course Leaders: Kelly Raia & Tom Cook, American River International

Every company's management wants to have complete confidence in its trade compliance effort with respect to the International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR). The question is: Is that an achievable goal? Do you have concerns about your staff not having the necessary skills and up-to-date knowledge needed to keep your company in compliance? This presentation will cover all of the following points:

       Managing Compliance in the Global Supply Chain
       EAR vs. ITAR
       Dept of Commerce
       Scope of the Export Administration Regulations
       Foreign Trade Regulations and Licensable Transactions
       Dept of Foreign Asset Controls
       Commodity Classifications
       ITAR Basics
       Prohibited Parties
       Destination Control Statement
       Exporting Under Dept of State Licenses
       License Amendments
       License Exemptions
       Penalties for ITAR Violations
       Compliance Actions
       Foreign Nationals
       Other Supply Chain Issues
       Managing Your Forwarder and Customs Broker in Licensable Transactions

About the presenters:
Kelly Raia

Kelly has been involved in freight forwarding and customhouse brokerage for over 20 years.

Kelly owned and managed Armac Transportation for 10 years.  This business specialized in customs clearances of time sensitive shipments such as live
animals, aircraft parts, chemicals and various perishable products.

Kelly joined FSI/American River in 1996.  During this time she has worked as a senior account manager leading to managing the international department including global export and import operations. 

In 1997 Kelly assumed various consulting responsibilities and became ARI’s in-house specialist for import/export compliance.

She has worked on some major accounts assisting their staff in global logistics, compliance management and working on the various international and government web sites for compliance resources.

Kelly has also developed various in-house programs for management training, utilizing technology in importing and exporting and in developing skills for import/export compliance management.

She has lectured at the World Trade Institute and supports Tom Cook and Rennie Alston for the many courses and programs they deliver on various international logistics and compliance matters.

Kelly is a licensed customhouse broker, haz-mat certified and TSA Security
training approved.

Kelly attended Long Island University, C.W. Post campus as well as Nassau Community College where she has taken many courses in business and communication.

She is the Import/Export Compliance Officer, Vice President and Associate Partner at American River International and serves on the executive committee.

Thomas A. Cook

Tom has been involved in global business for over 30 years in an array of diverse international trades.

He graduated from Maritime College at Fort Schuyler, NY, where he holds both a BS Degree in Transportation Science and a Graduate Degree in Transportation and Business Management.

His career began in the US Naval Reserve and the US and Dutch Merchant Marine, where he served as an officer in various commercial and military capacities on passenger, tug, oil, chemical, break-bulk and container vessels, all over the globe.

Tom has also been involved in the international insurance, manufacturing, exporting, marketing, in the trade finance arenas and in senior management and ownership positions, with an emphasis on logistics, compliance and security. 

He has authored over 225 articles and published seven books on international trade, the latest: “Managing Global Supply Chains” and has lectured all over the world on varied subjects involved with global trade.  He is considered by many leading professionals to be top in the field of global logistics and international operations.

Tom has numerous interests in third party logistics, global trade and international business.  He is on the board of many companies and organizations, such as but not limited to: American River International, FSI Global Logistics, The Trade Resource Group of Customs in Washington, DC, The Small Business Exporters Association, North American Exporters Association, World Trade Magazine, American Management Association, IOMA and The World Academy, New York District Export Council.

Tom currently serves as CEO and Managing Director of American River International, a premier consulting and logistics firm. 

Exhibit Registration Information:

Walter Becker
WJB Sales
631 331 0689

Steve Lehnert
Space Systems Loral
650 644 5218

IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted    ^ Top

Call for abstracts
The IMAPS Nordic Conference 2010
Elite Park Avenue Hotel, June 6-9, Gothenburg, Sweden

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2010. The abstract must be non-commercial and submitted in electronic form to no later than February 5.

Speakers will be notified of paper acceptance by email by March 19.

The deadline for the final paper is April 9.

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • HB LED - applications, bonding, substrates
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Photo Voltaics – silicon solar cells, thin film, printed
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Printed electronics – applications, technologies
  • Chip thinning & stacking, 3D-packaging, embedding
  • Microvia, HDI laminates, flex, embedded passives
  • CSP, flip chips, area array
  • High temperature electronics
  • Future electronics, trends & strategies
  • MEMS, MOEMS, sensor integration & applications
  • High frequency packaging
  • SMT and board assembly
  • Harsh environment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Manufacturing management & outsourcing
  • Wirebonding, COB



  Membership, Products and Publications

IMAPS Individual Membership Benefits   ^ Top

  • Discounts on events, publications, and iKnow Micro downloads
    • Take discounts on the Annual Symposium and many technical workshops.
    • Take discounts on publications and on-line library downloads;
  • IMAPS Chapter Membership
    • Learn from technical and management presentations by local and national experts.
    • Connect with industry peers through regional programs.
  • Advancing Microelectronics Magazine
    • Enjoy a complimentary one-year subscription to Advancing Microelectronics.
  • Access the Journal of Microelectronics and Electronic Packaging
    • View the Journal of Microelectronics and Electronic Packaging on-line.
  • Complimentary Access to JOBS Marketplace
    • Post resumes and search for current job openings.
    • Keep records easily - results and actions are conveniently recorded.
    • Enjoy helpful features of many expensive job search engines.
  • Access "Members-Only" sections on
    • Find individuals and companies that provide products and services.
    • Enter your own professional listing.

For more details about IMAPS Membership, visit or call Steve Greene, Membership Manager, at 202-548-4001 or



Lorac - Furnace Experts

2010 GBC Spring Conference March 7-8
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11
Fountain Hills, AZ

*Exhibitors contact

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies (3 Sessions)
Session 1: March 18

Session 2: March 25
Session 3: April 1

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact

^ Top


Compex Corp

Oneida Research Services


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