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January 19, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
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Device Packaging 2010 - Program and Registration Now Available (read more...)

Button Design for Manufacturability Webinar Begins THIS THURSDAY (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Viking Chapter Winter Technical Symposium January 26 (read more...)

Bullet IMAPS San Diego Chapter Lunch Presentation by HP on January 26 (read more...)

Bullet IMAPS Chesapeake Chapter Winter Symposium on January 27 (read more...)

Bullet IMAPS Northern California Chapter Lunch February 3 (read more...)

Bullet IMAPS Arizona Chapter Lunch Meeting on February 4 (read more...)

Bullet IMAPS Northwest Chapter Winter Workshop on February 10 (read more...)

Bullet IMAPS Chicago/Milwaukee Chapter Winter Technical Symposium February 16 (read more...)

Bullet IMAPS UK Chapter's MicroTech 2010 Begins February 28 (read more...)

Bullet IMAPS Metro Chapter Vendor Night April 15 (read more...)

Bullet IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted (read more...)

   PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2010 - Program and Registration Now Available    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale/Fountain Hills, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The program, registration, professional development course information, keynote presentations, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging and the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. There are booths still available. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Design for Manufacturability Webinar Begins THIS THURSDAY    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at bschieman@imaps.org.

Upcoming Programs:

In 2 Days:
PDC Webinar Series on

Design for Manufacturability in a Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, January 21, 28, and February 4, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Introduction to Microelectronics Packaging Technology
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held: Wednesdays, February 3, 10, and 17, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, February 9, 16, and 23, 2010. All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, February 11, 18, and 25, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

  Chapter Activities (events listed in chronological order)
 

IMAPS Viking Chapter Winter Technical Symposium January 26    ^ Top

Dates: January 26, 2010
Schedule: 1:30 PM Registration/Vendor Hall
2:15 to 3 PM Welcome/Speakers
3:15 to 4 PM Tours
4 PM Keynote Speaker
4:30 to 6 PM Social Hour/Vendor Exhibit Hall
Location:

Starkey Laboratories
William Austin Center
6425 Washington Avenue South
Eden Prairie, MN 55344
Phone: 951-941-6401

Registration:

Complimentary to IMAPS Members
$15 for Non-Members
(Tip: Apply to $75 yearly membership)
Students Complimentary

RSVP by Tues Jan 19th to Cathy Peterson from Peterson Sales and Associates: sales@petersonsales.biz Phone: 952-914-0011

Three Great Presentations, Large Exhibitor Show, and a Tour of Starkey Custom Hearing Aid Manufacturing

Dr. John Dzarnoski of Starkey will present on the “History of Hearing Aid Chip Packaging.”

Doug Link of Starkey will present on future trends with a paper entitled “High Density Hearing Aid Chip Packaging using TSV.” (Thru Silicon Via)

KEYNOTE SPEAKER: Professor Emeritus Fred Zimmerman of St. Thomas University will present “Opportunities in Electronics Development and Manufacturing in 2010 and Beyond.”

IMAPS San Diego Chapter Lunch Presentation by HP on January 26    ^ Top

Dates: January 26, 2010
Schedule: Begins at 12:00 noon
Location:

Hewlett Packard
16399 West Bernardo Drive
San Diego, CA 92127

The Visitor Parking Area is to the right of the guard shack and faces Building 61 (B61). All visitors sign in with Security in the lobby of B61.

Registration:

$15 for IMAPS, IEEE/CPMT, ACerS Members
$20 for all others
Students Complimentary

To register, please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430

Tour of HP Museum to follow presentation

“Disrupting the Printing Ecosystem.”   Hewlett-Packard has a long history of utilizing innovative MEMS technology in its Ink Jet print systems.  With the release of its fourth generation MEMS-based inkjet print heads and innovative pigment and latex inks, HP is leading the analog to digital conversion in printing markets.

Presenter Bio:  Eric Wiesner is the R&D Director of Hewlett-Packard’s Media Supplies and Solutions Division.  He oversees the development of a broad portfolio of innovative printing substrates that supports HP’s printing business.  Eric has spent the majority of his twenty-five years with HP in both R&D and manufacturing leadership roles.  He has helped to bring multiple inkjet print head and ink systems to market including those found in the Graphics, Small/Medium Business, and Enterprise markets. 

Eric holds a Bachelor of Science degree in Mechanical Engineering from the University of Texas at Austin.

IMAPS Chesapeake Chapter Winter Symposium on January 27    ^ Top

Dates: January 27, 2010
Schedule: Begins at 3:00 registration and networking
Location:

Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road
Laurel, MD 20723

Enter in the area marked Lobby 1 and check-in with APL Staff
Call Bruce Romenesko at 240-228-8065 for on-site information only.

Registration:

$20 for IMAPS Members
$30 for Non-Members
$5 for Students

On-line Registration

Registration Closes: 12noon EST on January 25, 2010
Call Bruce Romenesko at 240-228-8065 with questions.

Program:

3:00   Registration and networking

3:30   Mike Osterman, Senior Research Scientist of the University of Maryland’s CALCE
“Effect of Temperature Cycling Parameters (Dwell and Mean Temperature) on the Durability of Pb-free solders

Abstract: To assure reliability of electronic hardware, it is important to understand the reliability of solder joints under use conditions. The conversion to RoHS-compliant materials has raised concerns about the reliability of lead-free solders used in electronic products. One of the primary mechanisms of solder joint failure is fatigue due to fluctuations in temperature resulting from operational and environmental conditions. Fatigue of solder arises from cyclic strain within the solder joint due to different rates of temperature expansion in the solder and interconnected structures. To address the solder joint reliability concern of lead-free solder, a systematic set of experiments was conducted to examine the impact of dwell time and mean temperature on solder joint reliability. SAC305, SN100C, and SnPbAg solders were tested and compared with prior test results. The results indicated that lowering the mean cyclic temperature increased the thermal cycling durability of the solders dramatically. Results on the impact of cyclic mean temperature and dwell time revealed that dwell had a larger effect when the mean cyclic temperature was lower. Extended low temperature dwell for a temperature cycle of -25ºC to 75oC was found to be more damaging than expected, particularly for SnPbAg. For a maximum temperature of 125oC, a dwell-time increase from 15 to 75 minutes did not have much effect. Results indicated that SAC305 was slightly less durable than SAC379 but was more reliable than SN100C and SnPbAg solders. SnPbAg was less durable than SnPb solder.

4:00  Jay Brusse, Senior Components Engineer of NASA Goddard Space Center-Perot Systems
“Metal Whiskers:  A Discussion of Risks and Mitigations”

4:30  Break   

4:45   Craig Hillman, CEO and Managing Partner of DFR Solutions 
“Manufacturing and Reliability Challenges With QFN.”
  
5:15   Harry Charles, Chief Engineer of the JHU/APL Milton Eisenhower Research Center
“Green Electronics: Solar Cells to Light Emitting Diodes.”

Abstract: Energy availability and its cost are major concerns to every person. Fossil fuels in general and oil in particular, are limited and the world’s reserves are depleting. In addition, the proliferation of electronic products and their manufacture now pose additional threats to the fragile balance in the Earth’s eco systems. While posing threats, electronics can be the solution to many of our current and future environmental and energy related problems. A brief discussion of “green” electronics is presented along with how solar cells and solid state lighting will impact the energy picture of the future.

5:45  Closing Comments (spring event planning and East Coast event in June)                         

5:50  Catered Dinner, Honey teriyaki chicken or penne pasta with marinara sauce.

IMAPS Northern California Chapter Lunch February 3    ^ Top

Dates: February 3, 2010
Location:

David's Restaurant
5151 Stars and Stripes Drive
Santa Clara, CA

http://davids-restaurant.com/

Registration:

To register, please contact Gina Love at glove@cctlaser.com or 209-833-1110

Mr. Mulugeta Abtew, VP at Sanmina-SCI, presents on the impact of surface finishes on the soldering of PCB assemblies.

IMAPS Arizona Chapter Lunch Meeting on February 4    ^ Top

Dates: February 4, 2010
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location:

Fiesta Inn & Resort
2100 South Priest Drive
Tempe, AZ 85282

Registration:

$20 for IMAPS Members
$30 for Non-Members
$25 for Vendor Display Tables

RSVP by 15 Jan 2010 online or via e-mail http://www.imaps.org/registration/az2010feb.htm / greg.clemons@live.com

Analyzing The Recovery

The IC industry is poised for an impressive rebound and solid growth in 2010! Unit demand remains strong, 300mm fabs are running near capacity, and IC average selling prices are headed higher. For the first time in a long while, companies in the IC industry have reason to be upbeat about the coming year.

Global recessions should be thought of as periods of “pent-up” demand for electronic systems. Although these severe downturns always cause a temporary push-out of electronic system purchases, they do not destroy the underlying desire to purchase.

Global recessions typically set the stage for a booming IC market. Over the past 30 years, the world has endured four global recessions, and after every one of these recessions, a booming IC market immediately followed! Moreover, the strong IC market that followed the global recession has always lasted at least two years.

IC Insights’ will examine the relationship between worldwide GDP, electronic system sales, the IC market, and IC unit volume shipments and present its 2010 forecast for each of these segments.

Presenter: Bill McClean
Position: President
Company: IC Insights

Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With nearly 30 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones.

Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide.

Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

IMAPS Northwest Chapter Winter Workshop on February 10    ^ Top

Dates: February 10, 2010
Schedule: Registration and Lunch at 4:00
Presentations begin at 4:30
Location:

Kyocera Industrial Ceramics
5713 East Fourth Plain Blvd.
Vancouver, WA 98661
On-site POC is Scott Tse at Scott.Tse@kyocera.com

Registration:

$20 for IMAPS Members ($25 on-site)
$30 for Non-Members ($35 on-site)
$5 for Students w/ID

Register by February 8, 2010 online at: http://www.imaps.org/registration/2010feb_northwest.htm

Program:

4:00   Registration and networking

4:30   Nathan Onbattuvelli, PhD Student from Oregon State University
“Injection Molding of SiC ceramics for Power Electronics.”

5:00  James Morris, Professor from Portland State University
“Nanopackaging: Nanotechnologies in Microelectronics Packaging."

Abstract: Nanotechnologies offer a variety of materials options for reliability improvements in microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior properties of carbon nanotubes. Nanocomposite materials are studied for resistors, high-k dielectrics, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancements, while CNTs may also find thermal, interconnect, and shielding applications. The talk will focus on these technologies, with some discussion of nanoparticle and CNT properties, modeling, and technology scaling, and a mention of the packaging reliability issues for post-CMOS nanoelectronics technologies.

5:30   Roger Devaney, VP - Laboratory Director of Hi-Rel Labs
“The Metallurgy and Failure Analysis of Solder Joints in Electronics.”
  
6:00
  Event Wrap-up (event review, next event, announcements)                      

6:15 Dinner

IMAPS Chicago/Milwaukee Chapter Winter Technical Symposium February 16    ^ Top

Dates: February 16, 2010
Location:

Panasonic Factory Solutions Company of America
909 Asbury Dr.
Buffalo Grove, IL 60089
847-495-6131
No ID required for participants.

Registration:

$15 for IMAPS Members
$25 for Non-Members
$5 for Students w/ ID

Register on-line before February 12 at:
http://www.imaps.org/registration/2010feb_chicago.htm

Program:

11:30  Registration and networking

12:00  Lunch and break

1:00  “Optimizing a Standard Print Process for Mixed Technology Assembly”
            Rich Lieske, Solutions Engineering Manager at DEK America.

1:30    “Benchmarking of 96% Alumina Substrates for Thick Film Hybrids” 
             Sarah Groman, Technical Service Engineer at Heraeus
                    
 2:00   Break

 2:15   “Embedded Passive Materials for Use in PCB/IC Packaging”
             Joel Peiffer, Engineering Specialist at 3M Electronic Solutions.

 2: 45   "Ceramics for MEMS Packaging" 
              Adam Schubring, Sr. Market Development Engineer at Kyocera America, Inc.

3:15 Event wrap-up and chapter elections

3:30 Optional tour of Panasonic’s Advanced Packaging Lab

         Features demonstrations of gold to gold thermosonic flip chip bonding, plasma cleaning process technologies, X-Ray inspection, and SEM cross-section analysis.

4:00 Conclusion

IMAPS UK Chapter's MicroTech 2010 Begins February 28    ^ Top

Dates: 28th February – 2nd March 2010
Location:

Møller Centre
Cambridge, United Kingdom

The IMAPS-UK MicroTech-2010 and IEEE-CPMT Advanced Packaging Materials (APM) will be the major Spring 2010 Conferences on Electronics packaging, interconnection, integration in Europe.

MicroTech-2010 featuring Disruptive Technologies & APM featuring advanced polymer, organic and inorganic materials, will be co-located at the well known University of Cambridge Møller Centre. The location is ideally placed near many forward-thrusting companies as well as at a great historic city.

Short Courses will be held on 28th February

MicroTech-2010 Programme – Monday 1st March 2010
Venue: the Conference Centre at the Møller Centre, University of Cambridge

Plenary Keynotes:
“MEMS packaging and assembly in Harsh Environments” Sean Neylon, Colibrys, Switzerland

“Disruptive Technology its Application in Mobile Devices” - CSR plc , UK.

“New Approaches Wafer-Level Chip-Scale Packaging” – Lord Corporation, Europe. Speaker tbc

Disruptive Technologies and Advanced Packaging
“Fine Pitch Cu Wire Bonding” (Colleague), Bernd Appelt, ASE, California, USA

“Development of Microvia Copper Electroplating Technology for SiP Applications”, Cheng Fang, NXP, France

“Active implantable electrodes: Micro-Manufacturing with embedded IC”, A Vanhoestenbergh, UCL London

“Large 3D LTTC structures realised with sacrifcial materials”, M Hrovat, Stefan Josef Institute, Slovenia

“Assembly and Packaging of Pyroelectric Arrays for People counting and thermal imaging applications”, A Butler, Infra-red Integration Systems, Northampton

Disruptive Technologies and Reliability
“Improving the Efficiency of Hermetic Packaging using Novel Gettering Solutions”, S Catchpole, Johnson Matthey Catalysts

“An Investigation on the Effects of Solder Joint Daisy Chain Resistance Monitoring Method and Failure Criteria Selection on Board Level Reliability Test”, J Lo & Rickey Lee, HKUST, Hong Kong

“Advanced Reliability Testing of Embedded Passive Components for System-in-Package Applications”, H Goddin, TWI, UK

IMAPS-UK AGM
Drinks & Dinner
Social event

Exhibition
A tabletop exhibition will also be held. Please email secretariat@imaps.org.uk

Accommodation
The Møller Centre and a number of local hotels very good quality and very good value accommodation adjacent to the venue. For information please visit the website http://www.mollercentre.co.uk

Travel
To get to the Møller Centre check the website (http://www.mollercentre.co.uk/location/index.html)

Conference Officers
Conference Secretariat:
Vicky Holland (secretariat@imaps.org.uk)

Conference Co-Chairs:
Nihal Sinnadurai
Chief Executive, ATTAC
sinnadurai@aol.com

Chris Bailey
University of Greenwich
c.bailey@gre.ac.uk

Andrew Holland
CSR plc
andrew.holland@csr.com

IMAPS Metro Chapter Vendor Night April 15    ^ Top

Dates: April 15, 2010
Schedule: 3:00-8:00 PM
Location:

Holiday Inn Ronkonkoma
Ronkonkoma, NY

Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by 2 Professional Development Courses and 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

Registration Information:

Walter Becker
WJB Sales
631 331 0689
wbecker@wlbsales.com

Steve Lehnert
Space Systems Loral
650 644 5218
metroimaps@optonline.net

IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted    ^ Top

Call for abstracts
The IMAPS Nordic Conference 2010
Elite Park Avenue Hotel, June 6-9, Gothenburg, Sweden

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2010. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than February 5.

Speakers will be notified of paper acceptance by email by March 19.

The deadline for the final paper is April 9.

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • HB LED - applications, bonding, substrates
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Photo Voltaics – silicon solar cells, thin film, printed
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Printed electronics – applications, technologies
  • Chip thinning & stacking, 3D-packaging, embedding
  • Microvia, HDI laminates, flex, embedded passives
  • CSP, flip chips, area array
  • High temperature electronics
  • Future electronics, trends & strategies
  • MEMS, MOEMS, sensor integration & applications
  • High frequency packaging
  • SMT and board assembly
  • Harsh environment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Manufacturing management & outsourcing
  • Wirebonding, COB

 

 

  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Design for Manufacturability in a Lead Free World (3 Sessions)
Session 1: January 21

Session 2: January 28
Session 3: February 4

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 1: February 3

Session 2: February 10
Session 3: February 17

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies (3 Sessions)
Session 1: February 9

Session 2: February 16
Session 3: February 23

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World (3 Sessions)
Session 1: February 11

Session 2: February 18
Session 3: February 25

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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