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January 5, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Device Packaging 2010 - A Few Exhibit Spaces Still Available - Program Available Soon! (read more...)

Button Design for Manufacturability and Other Upcoming PDC Webinars (read more...)

Button Abstracts Due January 11 for IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan (read more...)

Button Abstracts Due January 15 for Workshop on Automotive Microelectronics and Packaging (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS-UK Prototyping To Production Event Hailed A Success (read more...)

Bullet IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted (read more...)

   PRODUCTS AND PUBLICATIONS
Get Published With IMAPS (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2010 - A Few Exhibit Spaces Still Available - Program Coming Soon!    ^ Top
The Sixth Annual Device Packaging Conference (DPC2010) will be held in Scottsdale, Arizona, on March 8-11, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.imaps.org/devicepackaging.

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging and the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. There are booths still available. The program will be published in the next week, so reserve your spot before it's too late, and in time to have your name in print in the program before it mails.

Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Design for Manufacturability and Other Upcoming PDC Webinars    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

We encourage you to send us your comments, questions or requests/proposals for a Webinar. Please contact Brian Schieman at bschieman@imaps.org.

Upcoming Programs:

PDC Webinar Series on
Design for Manufacturability in a Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, January 21, 28, and February 4, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held: January 2010 (Dates to be announced in early-January). All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Introduction to Microelectronics Packaging Technology
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held: Wednesdays, February 3, 10, and 17, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World
Presented by: Dr. Ray Prasad, Ray Prasad Consultancy Group
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, February 11, 18, and 25, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

Details on all IMAPS webinars can be viewed at www.imaps.org/webcasts.

Abstracts Due January 11 for IMAPS/ACerS 6th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2010) in Chiba, Japan    ^ Top
The Sixth Annual CICMT Conference will be held in Chiba, Japan, on April 18-21, 2010. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS) and co-sponsored by the American Ceramics Society (ACerS), IMAPS Japan, Ceramics Society of Japan, Ferroelectric Committee of Japan (FMA), Japan Society of Applied Physics, MRS-Japan, and AIST .
The call for abstracts, exhibit reservation details and full conference information can be found on-line at www.cicmt.org.

Abstracts must be submitted electronically at www.cicmt.org by January 11, 2010.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect topics focus on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, de-fense/security, and communication industries. The Ceramic Microsystems topics focus on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sens-ing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both topical areas, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety appli-cations continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyp-ing capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic struc-tures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems topics of the CICMT conference target new developments in microsystems that in-clude fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Sessions Include:

Session 1) Organized by IMAPs Japan

Dr. Kishio Yokouchi (Fujitu Interconnect Tech.)

Dr. Shinichi Nishi (Konicaminolta IJ Technologies, Inc.)

Session 2) Multilayer Ceramic Microsystems

Amy Moll, Boise State University

Leszek Golonka,Wroclaw University

Keisuke Kageyama, Murata Manu. 

Session 3) Electromagnetic Properties

Dr.-Ing. Jens Mueller, Technical University Ilmanau

Mike Janezic, NIST Boulder

Dr. Soshu Kirihara, Osaka Univ., Japan

Session 4) Direct Write Technology

Jun Akedo, Ntnl Inst of Advanced Industrial Sci.and Tech, Japan

Chris Apblett, Sandia National Laboratory

Session 5) Piezoelectric applications including MEMS

Yuji Noguchi, Tokyo Univ., Japan

Richard Eitel, University of Kentucky

Wei Ren, Xian Jiaotong University

Session 6) Ceramics in Energy Systems

Dr. Masanobu Awano, AIST., Japan

Nigel Sammes, Colorado School of Mines

Session 7) Novel Processing Techniques

Dr. Minoru Osada (NIMS., Japan)

Session 8) Dielectric and Ferroelectric Materials and Components

 Dr. Hyotae Kim (KICET)

Yong Cho (Yonsei University)

Session 9) Poster Session

Dr. Hiroaki Takeda (Tokyo Tech., Japan)

Abstract Cut-off Date: January 11, 2010
Notice of Acceptance: January 18, 2010
Final Manuscripts Due: February 19, 2010

Please send your 250-300 word abstract electronically only by January 11, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

Abstracts Due January 15 for Workshop on Automotive Microelectronics and Packaging    ^ Top
The Second Advanced Technology Workshop on Automotive Microelectronics and Packaging will be held in Dearborn, Michigan on April 28-30, 2010.
The call for abstracts and full workshop information can be found on-line at www.imaps.org/automotive.

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Planned Sessions Include:

  • Sensors
  • Power Electronics/Modules
  • Fuel Cells
  • LED Packaging
  • Additional Topics to be Considered:

Systems & Applications

  • Power/Hybrid Modules
  • Powertrain Control
  • Collision Avoidance and Safety
  • X-by-Wire
  • Driver Comfort/Information/Audio Systems
  • Telematics

Design

  • Thermal and Power Management
  • RF/Wireless/mmWave/RADAR/LIDAR/IR
  • Harsh Environment
  • MEMS and Sensors
  • High Performance Interconnects
  • Systems on Chip

Materials & Process

  • Thermal and Power Packaging
  • Sensor and MEMS Packaging
  • Advanced Interconnects, Connectors and Wirebonding
  • Ceramic Substrates and Ceramic Technologies
  • High Density and High Performance Organic Substrates
  • Underfill/Encapsulants and Adhesives
  • Solder Materials, Processes, and Reliability
  • Flip-Chip and Bumping: Processes, Reliability 
  • LED Packaging
  • Embedded and Integrated Passives
  • Green Packaging/Compliance with RoHS

Those wishing to make a presentation at the Automotive Workshop, please submit a 250-300 word abstract electronically by January 15, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner at: jmorris@imaps.org or call 305-382-8433.

  Chapter Activities (events listed in chronological order)
 

IMAPS-UK Prototyping To Production Event Hailed A Success    ^ Top
UK-Prototyping to Production was the theme for a recent IMAPS-UK event held at Unisem Europe’s Advanced Semiconductor and Test facility in Crumlin, South Wales on 3rd Dec 2009.

Despite seeing “four seasons in one day”, as one delegate commented, over fifty people were there to learn and network, with many traveling long distances to attend. 

The International Microelectronics Packaging Society (IMAPS-UK), which plays a leading role in the advancement of the high technology electronics industry, hosted the technical workshop in order to highlight UK Expertise & Capabilities, New Processes & Materials, Product Qualification, Industry Trends and Emerging Technologies. 

The first speaker for the day was Andrew Holland of CSR, who introduced the event by providing an overview of the development process from prototype to production, for one of CSR’s latest wireless devices.  This was followed by Unisem’s presentations that overviewed their experiences in providing a pathway from device prototyping to mass production, for leading fabless semiconductor companies throughout Europe. 

Other proceedings also included presentations from Reltech, an independent test laboratory, on providing the route to product qualification of semiconductor devices; DELO on their latest adhesives for electronic packaging and encapsulation; Inseto on the advancements in wire bonding; Optocap on their experiences in supporting our customer’s requirements from prototype to production and AML on the latest innovations in wafer bonding technology and trends for sub-contract wafer bonding. 

Besides the excellent presentations, highlights of the day included a factory tour of Unisem Europe’s production facility and the tabletop exhibition from leading companies in the field, including Inseto, Optocap, Unisem, TS2, Accelonix, LEW Techniques, Reltech and NTK Ceramics etc. Their displays created plenty of interest for the delegates and a great networking opportunity, with old acquaintances being renewed and plenty of new ones established.

The feedback received from delegates was also very appreciative and positive.  Copies of the papers were also presented on departure on a one-gigabyte memory stick, which was kindly sponsored by the Welsh Electronics Forum.   Copies of the proceedings can still be obtained from the Societies Secretariat office, for those that were unable to attend.

IMAPS-UK will be holding its next event, which is their annual MicroTech Conference alongside IEEE/CPMT’s Advanced Packaging Materials (APM), from 1st - 2nd March 2010.  Further details can be found on the IMAPS-UK website www.imaps.org.uk.

-----End News Release-----

About IMAPS-UK: The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers chapters around the globe, creating a global network with more than 8,000 worldwide members.  The United Kingdom Chapter of IMAPS was the first international Chapter and continues to maintain strong links with other European countries, the USA and Asia. 

IMAPS-UK plays a leading role in the UK electronics industry.  We work closely with other governing bodies, societies, industrial and academic institutions, to ensure that members are kept up to date with the latest developments & innovations in microelectronics and to provide a forum for the industry to meet and shape its future.

The Society's objectives are achieved through regional seminars, workshops, major international conferences and exhibitions, the publication of newsletters, & technical papers and other activities relevant to promoting knowledge within the industry.

Additional information on IMAPS-UK can also be found on our website: http://ww.imaps.org.uk

For further information about this News Release, please contact:

IMAPS UK Secretariat – Vicky Holland
16 Pound Way,
Swaffham Bulbeck,
Cambridge  
CB25 0NL

Telephone: 0843 2898689
Email: secretariat@imaps.org.uk
Internet: www.imaps.org.uk

IMAPS Nordic Conference 2010 - Abstracts Now Being Accepted    ^ Top

Call for abstracts
The IMAPS Nordic Conference 2010
Elite Park Avenue Hotel, June 6-9, Gothenburg, Sweden

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2010. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than February 5.

Speakers will be notified of paper acceptance by email by March 19.

The deadline for the final paper is April 9.

Proposed topics include:

  • 3D Advanced interconnect, Advanced packaging
  • HB LED - applications, bonding, substrates
  • Integrated passive devices (IPD) & System in Package (SiP)
  • Photo Voltaics – silicon solar cells, thin film, printed
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Printed electronics – applications, technologies
  • Chip thinning & stacking, 3D-packaging, embedding
  • Microvia, HDI laminates, flex, embedded passives
  • CSP, flip chips, area array
  • High temperature electronics
  • Future electronics, trends & strategies
  • MEMS, MOEMS, sensor integration & applications
  • High frequency packaging
  • SMT and board assembly
  • Harsh environment
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Manufacturing management & outsourcing
  • Wirebonding, COB

 

 

  Membership, Products and Publications
 

Get Published With IMAPS   ^ Top
We invite you to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP).

The IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused solely on microelectronics topics and the electronic packaging of these technologies, JMEP contains only papers relevant to your business and industry.

Complete information regarding this publication may be found on the IMAPS website at www.imaps.org/jmep; however, the key points are:

• With such a technically focused publication, you can get to print much faster with JMEP – 2-4 months on average from submission to publication.
• All submissions must be in electronic format, and should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submitted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files
• The Transfer of Copyright form must be filled out on the IMAPS website.        http://www.imaps.org/jmep/copyright.pdf.

Authors of papers that have been printed in other IMAPS publications or presented at IMAPS workshops are invited to submit updated and/or expanded versions of their papers for possible publication in the Journal.

Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact me at the phone/e-mail below.

 

   
   

Lorac - Furnace Experts

PDC Webinar Series on Design for Manufacturability in a Lead Free World (3 Sessions)
Session 1: January 21, 2010

Session 2: January 28, 2010
Session 3: February 4, 2010

PDC Webinar Series on Introduction to Microelectronics Packaging Technology (3 Sessions)
Session 1: February 3, 2010

Session 2: February 10, 2010
Session 3: February 17, 2010

PDC Webinar Series on Troubleshooting SMT-BGA-BTC Yield Problems in Sn-Pb & Lead Free World (3 Sessions)
Session 1: February 11, 2010

Session 2: February 18, 2010
Session 3: February 25, 2010

ATW and Tabletop Exhibit on Printed Devices and Applications
February 23-25, 2010
Orlando, FL
*Exhibitors contact abell@imaps.org

2010 GBC Spring Conference March 7-8, 2010
Fountain Hills, AZ

6th International Conference and Exhibition on Device Packaging
March 8-11, 2010
Fountain Hills, AZ

*Exhibitors contact abell@imaps.org

ATW on Automotive Microelectronics and Packaging
April 28-30, 2010
Dearborn, MI

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, 2010
Albuquerque, NM

*Exhibitors contact abell@imaps.org

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4, 2010
Raleigh, NC

*Exhibitors contact abell@imaps.org

^ Top

Compex Corp

Oneida Research Services

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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