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March 18, 2010

TJ Green Associates, LLC

IMAPS 2010 (Research Triangle) - Abstracts Due Tomorrow, March 19 (read more...)

Button Workshop on Automotive Microelectronics and Packaging - Hotel Deadline March 26 (read more...)

Button High Temperature Electronics Conference (HiTEC 2010) - Program and Registration On-Line (read more...)

Button Upcoming Webinars: BGA Inspection (Begins Tuesday), RF/Microwave... (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT TUESDAY: IMAPS Angel Chapter Lunch Meeting March 23 (read more...)

Bullet NEXT THURSDAY: IMAPS Keystone Chapter Dinner Meeting March 25 (read more...)

Bullet IMAPS Carolinas Chapter Spring Symposium on 3D Packaging and Advanced Materials March 30 (read more...)

Bullet IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor's Night (read more...)

Bullet IMAPS Nordic Conference 2010 - Program Available Soon (read more...)

IMAPS Individual Member Benefits (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

IMAPS 2010 (Research Triangle) - Abstracts Due Tomorrow, March 19    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010 - Raleigh, NC) will be held in Raleigh, NC, on October 31-November 4, 2010. The abstract deadline is tomorrow, Friday, March 19.
Full symposium details can be found on-line at or submit your abstract using the on-line submittal form at:

Planned Sessions Include:

Industry “Focused”

• Consumer, Portable and Wireless
• Biomedical
• Telecom
• Defense and Security
• Computing and Gaming

• Automotive, Industrial, Harsh Environment Electronics Applications

• Solar and Alternative Energy

3D Integration and Packaging Track
• 3D System Integration
• 3D Packaging Approaches
• 3D Processing Technology
• 3D Equipment and Materials Advances
• 3D Simulation and Modeling
Systems & Applications

• Thermal Management
• Power Management
• Cost Reduction, Outsourcing and Supply Chain Management
• Electromagnetic Interference (EMI)
• Sensors and Nano Packaging
• Emerging Technologies
• System Packaging
• Microwave & RF Applications
• Electrostatic Discharge (ESD) Protection
• Photonic / Optoelectronic Packaging
• Packaging for Extreme Environments
• MEMS Packaging
• LED Packaging
• Packaging of Compound Semiconductor Devices


• Electrical Modeling, Signal & Power Integrity
• High Performance Interconnects and Boards
• Embedded and Integrated Passives
• Wafer Level Packaging / CSP
• Advanced Materials

Materials and Process

• Flip-Chip and Wafer Bumping Processes and Reliability
• Underfill/Encapsulants and Adhesives
• Pb-Free Solder Materials, RoHS, Processes, and Reliability
• Design for Reliability
• Package Reliability Testing
• Wirebonding and Stud Bumping
• Ceramic and LTCC Packaging
• Substrate Materials and Technology
• Printed Electronics
• Ultra Low-K Packaging
• Uses of Precious Metals in Microelectronics

(Invited Speakers Only)

• Japanese (Japanese to English translation)
• Chinese (Chinese to English translation)

Interactive Poster Session

Outstanding papers that do not fit in planned or created sessions will be considered for this interactive session.

Workshop on Automotive Microelectronics and Packaging - Hotel Deadline March 26    ^ Top
The Advanced Technology Workshop on Automotive Microelectronics and Packaging will be held in Dearborn, Michigan, April 27-28, 2010. For full details, or to register, visit The hotel deadline is March 26. After this date, IMAPS cannot guarantee room availability or rates. The early registration deadline is April 9.

Automotive electronic content continues to rise in vehicles every year. As content rises, microelectronic packaging will continue to play a larger role, as the automobile industry drives for electronics that are smaller in size, lower in cost, higher in content, and more reliable in harsh environments. This Advanced Technology Workshop (ATW) is focused, solely, on advanced developments in automotive electronic packaging. We are looking for presentations on advanced technologies that are pushing the envelope of automotive packaging, in the areas of systems & applications, design, and materials & processes. Your presentation may cover an advanced technology that you have or an advanced technology you need.

Tuesday, April 27th

Registration: 7:00 am - 4:45 pm

Continental Breakfast: 7:00 am - 8:00 am

Opening Remarks: 8:00 - 8:15 am
Workshop Chairs

Keynote Presentation: 8:15 am – 9:00 am
Title: Power Electronics Application and Requirements for Hybrid Vehicle Traction Inverter - An Overview
Speaker: Shahram Zarei, Ford Motor Company
Mr. Zarei joined the automotive industry and specifically GM Research Lab in 1985 after graduating with his MSEE from Purdue. He joined Ford Research lab in 1993, and transferred to SMT which is responsible for Ford global hybrid programs in 2004. Since then, my team has been responsible for D&R of E-Drive and Traction Inverter systems for our hybrid programs.

Keynote Presentation: 9:00 am – 9:45 am
Title: Power Electronics within the FreedomCAR Partnership
Speaker: TBD, ORNL

Session 1a: Thermal Management
9:45 am - Noon

Thermal Management of Power Semiconductor Packages - Matching Cooling Technologies with Packaging Technologies 
Kevin Bennion, Gilbert Moreno, Jason Lustbader, National Renewable Energy Laboratory   

Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
Dave Saums, DS&A LLC

Break: 10:45 am - 11:00 am

Micro-Channel Variation within Liquid Cold Plate Design and Impact on Thermal Performance
Matt Reeves, Sy-Jenq Loong, Peter Beucher, Wolverine Tube Inc. 

Thermal Interface Material for Automotive Applications: Basics and Selected Examples
Sanjay Misra, John Timmerman, Bergquist Company  

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm - 2:00 pm
Title: AlSiC Pin Fin Power Module Coolers and IGBT Baseplates for Hybrid Electric Vehicles (HEV)

Speaker: Bo Sullivan, Senior Account Manager, CPS Technologies

Session 1b: Thermal Management
2:00 pm – 4:45 pm

Effect of Compression Behavior of Thermal Interface Materials on Component Operating Temperature
Chris Severance, Parker Chomerics

Development of Double-Side Cooled Power Modules Joined by Low-Temperature Sintering of Nanosilver Paste for Electric Vehicles
Guo-Quan Lu, Xiao Cao, Tao Wang, Zheyuan Tan, Khai Ngo, Susan Luo, Virginia Tech.

Anisotropic Conductive Adhesives (ACA) Technology
William Chappell, Purdue University

Break: 3:30 pm - 3:45 pm

Silver Sintering
Frank Murch, Heraeus Circuit Materials Division

SOI Based Voltage Regulator for High-Temperature Applications
Benjamin McCue, B. J. Blalock, S. K. Islam, L. M. Tolbert, University of Tennessee

Wednesday, April 28th

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Keynote Presentation: 8:00 am – 8:45 am
Title: TBD

Speaker: TBD, University of Michigan

Session 2: Power Substrate Packaging
8:45 am - Noon

High Brightness LED Assembly using DPC Substrate and SuperMCPCB
Charles Lin, Nick Wang, Allen Hsu, Andy Lim, Jerry Tan, Bridge Semiconductor Corporation and Tong Hsing Electronic Industries Ltd.; Heinz Ru, Thompson Jiang, David Liao, Tong Hsing Electronic Industries Ltd.

Evaluation of an Electrically Insulating Glaze on Aluminum for Thermal Substrates in High Power LEDs
Michael Creamer, Mark Challingsworth, Samson Shahbazi, Heraeus Materials Technology LLC

Alumina Multilayer Substrate for Small Module Unit
Kouichi Hirayama, Hiroshi Matsumoto, Adam Schubring, Kyocera Corporation

Break: 10:15 am - 10:30 am

Development of a Fatigue Resistant Lead-Free Alloy For High Reliability Under Hood Applications
Mitch Holtzer, Anna Lifton, Paul Koep, Cookson Electronics Assembly Materials

Lead Free Thick Film Pastes for Fuel Level Sender Application
Christina Modes, Stefan Flick, Annette Kipka, W. C. Heraeus GmbH, TFD-TH

LCP Properties Ideal for Miniaturization Trend in Electronic Industry
Edson Ito, Ticona Engineering Polymers

Lunch: Noon - 1:00 pm

Keynote Presentation: 1:15 pm – 2:00 pm
Title: Electronic Packaging Challenges for Safe, Green and Connected Vehicles

Speaker: D.H.R. Sarma, Delphi Electronics and Safety
Dr. D.H. R. Sarma is a Principal Technical Fellow and Engineering Group Manager in Advanced Engineering and Business Development at Delphi Electronics and Safety, Kokomo, Indiana.  Prior to joining Delphi, his work experience included a one and a half-year stint at CTS Microelectronics in West Lafayette, Indiana.  He has over 30 years of experience in electronic materials technologies. He received his B.S. degree from the Indian Institute of Science, Bangalore, India and his M.S. and Ph.D. degree from Purdue University.  Currently, he supervises the development of key technologies for future Delphi product portfolio. 

Keynote Presentation: 2:00 pm – 2:45 pm
Title: Electronics Manufacturing in Michigan

Speaker: TBD, Gentex

Session 4: Assembly, Material Processing
2:45 pm - 4:15 pm

Surface Wettability Improvement for High Volume Automotive Manufacturing by Atmospheric Plasma Treatment 
Gene Dunn, Panasonic Factory Solutions of America

Dispensing Solutions for Advanced Automotive Electronics
Dan Ashley, Asymtek

Adapting Press-Fit Connection Technology for Automotive Modular Electronic Units
Joseph J. Lynch, Jeff Parrish, Interplex Industries

Closing Remarks: 4:15 pm

Register On-Line

High Temperature Electronics Conference (HiTEC 2010) - Program and Registration On-Line    ^ Top
The International Conference on High Temperature Electronics (HiTEC 2010) will be held in Albuquerque, New Mexico, May 11-13, 2010. For full details, or to register, visit The hotel deadline, early registration and exhibits cut-offs are April 10. After this date, IMAPS cannot guarantee room availability or rates.

The members of the Conference Committee are pleased to invite you to the IMAPS High Temperature Electronics Conference (HiTEC 2010). This is the premier event addressing the needs of the high temperature electronics community. Applications for high temperature electronics include smart energy, underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc. HiTEC 2010 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of these applications. Tabletop exhibits will compliment the technical program by providing you an opportunity to view the latest products for high temperature electronics. This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important area.

Technical Program | Register On-line
Tabletop Exhibit Information | Reserve Tabletop(s)

Upcoming Webinars: BGA Inspection (Begins Tuesday), RF/Microwave...    ^ Top

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

Upcoming Programs:

PDC Webinar Series on
Ball Grid Array Inspection Lead-Free Defect Guide
Presented by: Bob Willis, Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, March 23 and Wednesday, March 24, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
RF/Microwave Hybrids: Materials and Processing
Presented by: Richard Brown, Richard Brown Associates
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, April 6, and 13, 2010 . All webinars will be held 12:00 noon - 1:00 pm EST

PDC Webinar Series on
Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Presented by: Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University
This three-session on-line Professional Development Course (PDC) webinar will be held: Thursdays, May 6, 13 and 20, 2010 . All webinars will be held 10:00 am - 11:00 am EDT

PDC Webinar Series on
Conformal Coating Applications, Inspection, Rework & Quality Control
Presented by: Bob Willis, Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesday, May 18 and Wednesday, May 19, 2010 . All webinars will be held 12:00 noon - 1:00 pm EDT

Details on all IMAPS webinars can be viewed at


  Chapter Activities (events listed in chronological order)

NEXT TUESDAY: IMAPS Angel Chapter Lunch Meeting March 23    ^ Top

Dates: Tuesday, March 23, 2010
11:30am - 1:00pm

SpringHills Suites By Marriott
(next to Western Federal Credit Union and across Northrop Space Systems)
14620 Aviation Boulevard Hawthorne, CA 90250


By 3/19/10 to Salim Akbany, , (310) 812-0343

International Microelectronics and Packaging Society - Angel Chapter and Indium Corp. invites you to attend a Lunch time Technical Session (Lunch Provided)

Nano-Bond Assembly - A Rapid Room Temperature , Fluxless Soldering Proces

Indium Corporation of America has begun the commercialization of theNano-Bond technology that was acquired from RNT in 2009. The product technology and application will be reviewed in detail . TheNano-bond joining process is based on the use of reactive multilayer foils as local heat sources. The foils are a new class of nano-engineered materials, in which self propagating exothermic reactions can be ignited at room temperature through an ignition process. By inserting a multilayer foil between two solder layers and two components, heat generated by the reaction in the foil melts the solder and consequently bonds the components. The joining process can be completed at room temperature in air, argon or vacuum in approximately one second. The resulting metallic joints exhibit thermal conductivities two orders of magnitude higher, and thermal resistivity an order of magnitude lower, than current commercial TIMs.

The use of reactive foils as a local heat source eliminates the need for torches, furnaces, or lasers, speeds the soldering processes, and dramatically reduces the total heat that is needed. Thus, temperature-sensitive or small components can be joined without thermal damage or excessive heating. In addition, mismatches in thermal contraction on cooling can be avoided because components see very small increases in temperature. This is particularly beneficial for joining metals to ceramics. The fabrication and characterization of the reactive foils is described, and the value proposition for NanoBonding is presented. The presentation will also cover the applicability of this platform technology to many areas of packaging including Thermal Interface Materials, microelectronics, optoelectronics, and Light Emitting Diodes (LEDs).

By:     Jacques Matteau, Global Sales Manager, NanoBond® and NanoFoil®, Indium Corporation

NEXT THURSDAY: IMAPS Keystone Chapter Dinner Meeting March 25    ^ Top

Dates: Thursday, March 25, 2010

Plant Tour at Infinera Corporation
7360 Windsor Drive, Allentown, PA 18106

Dinner/meeting at Holiday Inn in Allentown
Routes 100 at I-78 (RT. 22) - 7736 Adrienne Drive


Advance registration is $20.00, on-site is $25.00.
Students complimentary with school ID and advance registration.

Advance registration ends Monday, March 22nd. Participation is limited so register soon. E-mail Greg Chesmar at


5:00  Plant Tour at Infinera Corporation (30 Minutes)
          7360 Windsor Drive, Allentown, PA 18106    (484) 866-4600
          Click here for more company information


5:45 Networking Reception

6:15 Dinner   
         Holiday Inn in Allentown.    Routes 100 at I-78 (RT. 22) - 7736 Adrienne Drive
        Click for more hotel information 

7:00  Keystone Chapter Business Meeting

7:15  Presentation  
                “Counterfeit Detection in the Electronics Industry”
               Anne Poncheri, Quality Manager of Silicon Cert Laboratories
               Please see abstract and bio below.

8: 00 Event Review and Planning Future Events


This presentation will discuss the sources of counterfeit electronic components, how these parts enter the supply chain and some statistics which highlight the severity of the problem. Two standards have been published to help deter counterfeit devices; IDEA-STD-1010-A – Independent Distributor of Electronics – “Acceptability of Electronic Components Distributed in the Open Market; Revision A, October, 2006”  and SAE AS5553 – “Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition, Issued 2009-04”.  Counterfeit detection methods include non-destructive tests, internal imaging, destructive tests and electrical parametric testing. In order to minimize the risk of counterfeit components, a company should implement Risk Mitigation Policies.


Anne Poncheri is the Quality Manager for Silicon Cert Laboratories in Reading, PA. She has over twenty years experience in Quality Management Systems. Anne has held various management positions in Quality and Engineering  in industries including telecommunications, automotive, plastics, and chemicals. 

Currently, she is a member of the SAE Aerospace G19 Counterfeit Electronic Components Committee which is chartered to address aspects of preventing, detecting, responding to and counteracting the threat of counterfeit electronic components.  Ms. Poncheri has in-depth knowledge of ISO 9001, ISO/TS 16949, ISO/IEC 17025 and TL 9000.  Silicon Cert Laboratories is an independent testing facility which offers reliability testing and analytical services.  They have a comprehensive Electronic Component Counterfeit Detection program.

IMAPS Carolinas Chapter Spring Symposium on 3D Packaging and Advanced Materials March 30    ^ Top

Dates: Tuesday, March 30, 2010

North Carolina State University. 
Monteith Research Center (MRC) at the Centennial Campus
2410 Campus Shore Drive

Click here for map and directions ( 
From Western Blvd, turn right on Avent Ferry Road, left on Varsity Drive, right on Main Campus Drive.


IMAPS members-$20, non-members-$30, and students with IDs-$5.00.

Register On-line
On-line registration guarantees both seating and lunch. It closes on Friday, March 26. On-site registration is by cash or check only


12:00   Reception and Lunch (Start of table-top exhibits)

12:50   Introductions of all participants

1:00   Iris Labadie, Market Development Specialist at Kyocera America
   Material Trade-offs in Designing Electronic Packages”

1:30  Brief break

1:45   Paul Enquist, VP and CTO of Ziptronix.
                  “Direct Bonding for Wafer Level Packaging and 3D Integration.”

2:15  Brief break (with refreshments in vendor area)

2:30  Dan Balwin, President of Engent Inc.
                “3D Wafer Level Chip Scale Packaging.”

3:15  Event review, Next event, 2010 Symposium, and Chapter Elections

IMAPS Metro Chapter April 15 - Professional Development Courses and Vendor Night    ^ Top

Dates: April 15, 2010
Schedule: 8:00 AM-4:30 PM (PDC)
3:00-8:00 PM (Vendor Night)

Holiday Inn Ronkonkoma
Ronkonkoma, NY

PDC Registration:

500.00 Member
600.00 Non-Member

Includes breakfast, lunch and admission to Vendor Night and Cocktail Reception.

Contact Steve Lehnert Phone (650) 644-5218 or (631) 379-8239 Email to register

Exhibits Registration:

400.00 to Exhibit - must submit payment by 3/15/2010
500.00 to Exhibit - after 3/15/2010

100.00 Discount if you have exhibited at a chapter event in the past 2 years and you register by 3/15/2010

The vendor night will be preceded by Professional Development Courses and possibly 1-2 short technical sessions designed to bring out the Engineering Professionals and Decision Makers from the Tri-State area. Space is limited so register early to guarantee your spot.

A Full Day Presentation on:
RF/Microwave Hybrids: Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates

Course Description:
In recent years, the demands for high frequency systems and products have been growing at a rapid pace. Coupled with the continuing development of monolithic integrated circuits, MMICs, are new materials and process refinement of hybrids. As a result, system and product designers are faced with the choice between hybrids and MMICs; i.e., complete system on a chip vs. hybrids with discrete devices, or more often, somewhere in-between.

This course will begin with a short, non-mathematical review of high frequency basics. Next a comparison of MMICs and hybrids is presented. The transmission line as the basic circuit component of RF and microwave hybrids will be reviewed. Hybrid “waveguide” structures will be compared as they relate to transmission line properties. The basic materials (conductors, dielectrics and substrates) and their properties will be introduced. Their effect on impedance, circuit properties and performance will be discussed. Processing technologies suitable for RF/microwave hybrids will be reviewed. Selected packaging protocols, such as vias and bonding wires, will be discussed in light of their influence on RF/microwave performance. At the completion of this course, attendees will have a better understanding of many of the critical materials and processing factors affecting high frequency circuit performance.

Who Should Attend?
Any industry professionals who want to better appreciate the critical materials, process interactions and variables affecting high frequency hybrid manufacturing. Supervisors, engineers and technicians involved in product development, design and manufacture are encouraged to attend.

Richard Brown is a technical and engineering consultant in hybrids, with more than 30 years experience, encompassing thin and thick film, electroplating and substrate technologies. He began his career at Bell Telephone Laboratories. After joining RCA Solid State in 1968, he transferred in 1979 to the RCA Microwave Technology Center in Princeton. In 1991, Mr. Brown joined an Alcoa Electronic Packaging technology team as program manager to implement thin film on high temperature co-fired ceramic for MCMs.

He has published extensively, authoring a chapter on Thin Film for Microwave Hybrids in “Handbook of Thin Film Technology,” McGraw-Hill, NY, 1998, A. Elshabini-Riad, Ed., and most recently RF/Microwave Hybrids; Basics, Materials and Processes, Kluwer Academic Press, 2003. In 1995, ISHM awarded him the prestigious John A. Wagnon, Jr. Technical Achievement Award.

A Full Day Presentation on:
International Traffic in Arms Regulations(ITAR)
Course Leaders: Kelly Raia & Tom Cook, American River International

Every company's management wants to have complete confidence in its trade compliance effort with respect to the International Traffic in Arms Regulations (ITAR) and Export Administration Regulations (EAR). The question is: Is that an achievable goal? Do you have concerns about your staff not having the necessary skills and up-to-date knowledge needed to keep your company in compliance? This presentation will cover all of the following points:

       Managing Compliance in the Global Supply Chain
       EAR vs. ITAR
       Dept of Commerce
       Scope of the Export Administration Regulations
       Foreign Trade Regulations and Licensable Transactions
       Dept of Foreign Asset Controls
       Commodity Classifications
       ITAR Basics
       Prohibited Parties
       Destination Control Statement
       Exporting Under Dept of State Licenses
       License Amendments
       License Exemptions
       Penalties for ITAR Violations
       Compliance Actions
       Foreign Nationals
       Other Supply Chain Issues
       Managing Your Forwarder and Customs Broker in Licensable Transactions

About the presenters:
Kelly Raia

Kelly has been involved in freight forwarding and customhouse brokerage for over 20 years.

Kelly owned and managed Armac Transportation for 10 years.  This business specialized in customs clearances of time sensitive shipments such as live
animals, aircraft parts, chemicals and various perishable products.

Kelly joined FSI/American River in 1996.  During this time she has worked as a senior account manager leading to managing the international department including global export and import operations. 

In 1997 Kelly assumed various consulting responsibilities and became ARI’s in-house specialist for import/export compliance.

She has worked on some major accounts assisting their staff in global logistics, compliance management and working on the various international and government web sites for compliance resources.

Kelly has also developed various in-house programs for management training, utilizing technology in importing and exporting and in developing skills for import/export compliance management.

She has lectured at the World Trade Institute and supports Tom Cook and Rennie Alston for the many courses and programs they deliver on various international logistics and compliance matters.

Kelly is a licensed customhouse broker, haz-mat certified and TSA Security
training approved.

Kelly attended Long Island University, C.W. Post campus as well as Nassau Community College where she has taken many courses in business and communication.

She is the Import/Export Compliance Officer, Vice President and Associate Partner at American River International and serves on the executive committee.

Thomas A. Cook

Tom has been involved in global business for over 30 years in an array of diverse international trades.

He graduated from Maritime College at Fort Schuyler, NY, where he holds both a BS Degree in Transportation Science and a Graduate Degree in Transportation and Business Management.

His career began in the US Naval Reserve and the US and Dutch Merchant Marine, where he served as an officer in various commercial and military capacities on passenger, tug, oil, chemical, break-bulk and container vessels, all over the globe.

Tom has also been involved in the international insurance, manufacturing, exporting, marketing, in the trade finance arenas and in senior management and ownership positions, with an emphasis on logistics, compliance and security. 

He has authored over 225 articles and published seven books on international trade, the latest: “Managing Global Supply Chains” and has lectured all over the world on varied subjects involved with global trade.  He is considered by many leading professionals to be top in the field of global logistics and international operations.

Tom has numerous interests in third party logistics, global trade and international business.  He is on the board of many companies and organizations, such as but not limited to: American River International, FSI Global Logistics, The Trade Resource Group of Customs in Washington, DC, The Small Business Exporters Association, North American Exporters Association, World Trade Magazine, American Management Association, IOMA and The World Academy, New York District Export Council.

Tom currently serves as CEO and Managing Director of American River International, a premier consulting and logistics firm. 

Exhibit Registration Information:

Walter Becker
WJB Sales
631 331 0689

Steve Lehnert
Space Systems Loral
650 644 5218

IMAPS Nordic Conference 2010 - Program Available Soon    ^ Top
The IMAPS Nordic Conference 2010 will be held at the Elite Park Avenue Hotel from June 6-9, in Gothenburg, Sweden.

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

For the latest information about the conference and the exhibition, visit our homepage at or send e-mail to or to the Exhibition Host at

  Membership, Products and Publications

IMAPS Individual Membership Benefits   ^ Top

  • Discounts on events, publications, and iKnow Micro downloads
    • Take discounts on the Annual Symposium and many technical workshops.
    • Take discounts on publications and on-line library downloads;
  • IMAPS Chapter Membership
    • Learn from technical and management presentations by local and national experts.
    • Connect with industry peers through regional programs.
  • Advancing Microelectronics Magazine
    • Enjoy a complimentary one-year subscription to Advancing Microelectronics.
  • Access the Journal of Microelectronics and Electronic Packaging
    • View the Journal of Microelectronics and Electronic Packaging on-line.
  • Complimentary Access to JOBS Marketplace
    • Post resumes and search for current job openings.
    • Keep records easily - results and actions are conveniently recorded.
    • Enjoy helpful features of many expensive job search engines.
  • Access "Members-Only" sections on
    • Find individuals and companies that provide products and services.
    • Enter your own professional listing.

For more details about IMAPS Membership, visit or call Steve Greene, Membership Manager, at 202-548-4001 or



Lorac - Furnace Experts

PDC Webinar Series on Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies (3 Sessions)
Session 2: March 25
Session 3: April 1

PDC Webinar Series on Ball Grid Array Inspection Lead-Free Defect Guide (2 Sessions)
Session 1: March 23

Session 2: March 24

PDC Webinar Series on RF/Microwave Hybrids: Materials and Processing (2 Sessions)
Session 1: April 6

Session 2: April 13

CICMT 2010
April 18-21
Chiba, Japan

ATW on Automotive Microelectronics and Packaging
April 28-30
Dearborn, MI

ATW and Tabletop Exhibit on Printed Devices and Applications
May 6-7
Orlando, FL
*Exhibitors contact

International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13
Albuquerque, NM

*Exhibitors contact

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact

ATW Portable/Wireless Devices
June 17
Atlantic City, NJ

Mid-Atlantic Microelectronics Conference
June 17-18
Atlantic City, NJ
*Exhibitors contact

ATW on Advanced Interconnect Technologies
July 14
San Francisco, CA

ATW on Wire Bonding
July 15
San Francisco, CA

ATW on Electronic Packaging of Solar Cells and Fuel Cells
September 14-16
Cleveland, OH

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact

^ Top


Compex Corp

Oneida Research Services


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