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May 26, 2010

TJ Green Associates, LLC

Early Registration Cut-off This Friday for Microelectronic Packaging and Materials for Medical Devices Workshop (read more...)

Button Mid-Atlantic Microelectronics Conference - Early Registration and Hotel Deadlines TODAY (read more...)

Button Registration Closing Soon for Upcoming Webinars on: WLED Technologies; Precious Metal Financing; and Signal/Power Integrity (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Nordic Conference 2010 - Program Now Available (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11 (read more...)

Bullet New England Chapter June 22 Business/Technical Meeting (read more...)

Bullet UK Chapter One Day Technical Seminar on Interconnection Processes and Materials (read more...)

Submit Your IMAPS Awards Nominations (read more...)

Draper Laboratory

  IMAPS Events (view full Web Calendar)

Early Registration Cut-off This Friday for Microelectronic Packaging and Materials for Medical Devices Workshop    ^ Top
IMAPS and IMAPS Viking Chapter will host an a new Advanced Technology Workshop on Microelectronic Packaging and Materials for Medical Devices. The workshop will be held in Minneapolis, Minnesota, June 9-10, 2010, at the Crowne Plaza Minneapolis Northstar Downtown.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Wednesday, June 9, 2010

Registration: 12:00 pm – 5:00 pm

Professional Development Course (PDC):
Hermetic and “Near Hermetic” Testing of Class III Medical Implants

1:00 pm - 5:00 pm
Course Instructor: Thomas Green, TJ Green Associates

This PDC is co-located with the Workshop and available for a separate registration fee. This course is intended as an intermediate level course for process engineers, designers, quality engineers, and managers responsible for hermetic sealing, leak testing and RGA results and for those responsible for evaluating new polymeric cavity style packages.

Historically, hermeticity requirements for Class III Medical Implants have mirrored that for military and telecom applications. This course will briefly review the traditional hermeticity test methods (helium leak test and bubble method) and some of the pitfalls and lessons learned over the years. Recent changes to the hermeticity spec will be discussed along with the difficulties in testing to leak rates that are two orders of magnitude tighter than what exists today.

Packages made from polymeric materials (e.g. LCP and others) as opposed to traditional hermetic seals (i.e. metals, glasses, ceramic etc) require a different approach from a hermeticity design and testing standpoint. The problem is now one of moisture diffusion through the bulk and package interfaces, which is different than water vapor permeating a crack in a glass to metal seal. A brief review of the techniques and methods to evaluate a "near-hermetic" approach is presented along with a discussion of the pitfalls and issues with TM 1014 (Seal)  and TM 1018 (Internal Water Vapor) as applied to a “near hermetic package”.  Fick’s law of moisture diffusion is the dominant theory guiding “near hermetic” package styles and testing such as  WVTR, TGA and moisture diffusion coefficients are used in lieu of traditional helium based hermeticity techniques to evaluate and understand the integrity of the seal.  Applications of moisture sensing inside a package and a discussion on how to qualify a “near hermetic” package will also be presented.

Mr. Thomas Green is an independent consultant and respected teacher. He has over twenty-eight years experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has demonstrated expertise in seam sealing and hermeticity leak testing processes. He has conducted numerous hermeticity experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques including,  CHLD (cumulative helium leak detection) and OLT (optical leak test). At USAF Rome Labs he worked as a senior reliability engineer and analyzed hermeticity component failures from AF avionic equipment along with providing technical support for a variety of Mil specs including  MIL-STD-883 TM 1014 (Seal). Tom is an active IMAPS member and Society Fellow and has worked as a hermeticity consultant for a variety military and medical companies. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah. Tom is the principal at TJ Green Associates LLC (

Welcome Reception: 5:00pm - 6:30 pm

Reception Sponsored by:
Reception Sponsor - Ferrian Sales & Associates

Thursday, June 10, 2010

Registration: 7:00 am – 5:00 pm

Continental Breakfast: 7:00 am – 8:00 am

Exhibit Hours: 8:00 am – 5:00 pm
Sessions, Tabletop Exhibits and Food/Beverage all in the same room

Opening Remarks: 8:00 am – 8:15 am
General Chairs: Jay Ellingboe, Smiths Medical; Thomas Green, TJ Green Associates

Keynote Presentation:
8:15 am – 9:00 am

Emerging Markets for Microfluidics Applications
Jeff Perkins, General Manager, Yole, Inc.
Yole Développement is a market research and business development consulting firm facilitating market access for advanced technologies. Yole has been tracking the MEMS industry for over 10 years and maintains a focus on industries using wafer based manufacturing processes.

Jeff has over 20 years of experience working in emerging technologies. Jeff leads Yole’s business development activities in North America. His experience in emerging technology covers energy, medical, aerospace and consumer markets.

Session I: TITLE TBD
9:00 am - 12:00 am
Session Chair: TBD

Printing Silicon Integrated Circuits for Wireless Sensors
Jayna Sheats, Hamidreza Alemohammad, Ehsan Foroozmehr, Ara Kim, Tony Mantell, Amir Zadeh and David Biesty, Terepac Corporation

Stacking of Known Good Rebuilt Wafers Without TSV Applications to Memories and SiP
Christian Val, Pascal Couderc, Nadia Boulay, 3D Plus

Break: 10:00 am - 10:30 am

Laser Direct Structuring Method of Integrating Circuitry with Three-Dimensional Components
James Liddle, SelectConnect Technologies

3D Packaging Technique for a Flexible and Biocompatible Antenna Using Z-axis for Wireless Monitoring of Intraocular Pressure (IOP)
Tse-Yu Lin, Byung Guk Kim, Dohyuk Ha, Sungwook Moon, Eric Hoppenjans, William Chappell, Purdue University

High Performance and High Reliability Passives for Miniature Medical Devices Based Upon Silicon Technologies
Franck Murray, IPDIA

Lunch Break: 12:00 pm - 1:30 pm

Session II: TBD
1:30 pm – 5 :00 pm
Session Chair: TBD

Advances in Solid-State Magnetic Sensors for Medical Devices
Daniel Baker, Jay Brown, NVE Corporation

Hermetic, Radio-transparent Micropackaging for Implantable Neural Prosthetics
Charles Byers, Guangqiang Jiang, Alfred Mann Foundation

High Voltage, High Impedance Resistors Small Sized for Medical Applications
Wolfgang Tschanun, Hansperter Good, Dieter Kaegi, Reinhardt Microtech AG

Break: 3:00 pm - 3:30 pm

Leveraging the Insatiable Need for Smaller Microelectronic Packages: Opportunities for Medical Devices
Frank Stepniak, Texas Instruments

Ceramic Packaging in Medical Applications
Arne Knudsen, Iris Labadie, Ross Linker, Kyocera America

Advanced Technologies for High Reliability Medical Electronics Manufacturing 
Thomas Jacob, Ravi Subrahmanyan, Dyconex Inc. 

Closing Remarks: 5:00 pm – 5:15 pm
Technical Chairs: Sean Ferrian, Ferrian Sales; Thomas Jacob, Dyconex, Inc.

Minnesota Twins vs. Kansas City Royals Major League Baseball Game
Hosted by the IMAPS Viking Chapter
Thursday, June 10, 2010
7:10 pm Start
Club Level Seating
$20/Ticket - IMAPS Members
$26/Ticket - Non-Members

You must pre-register by June 1 to reserve your ticket

Reserve Tickets On-line When Registering (under Sessions)

 Register On-line

Mid-Atlantic Microelectronics Conference - Early Registration and Hotel Deadlines TODAY    ^ Top
The Mid-Atlantic Microelectronics Conference will be held in Atlantic City, New Jersey on June 17-18, 2010. For full details, or to register, visit

Conference Focus:
Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to attend the upcoming Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with two half-day professional development courses and will begin on the afternoon of Thursday, June 17. The Conference will also feature an evening reception that night.

Thursday, June 17

Registration: 12 Noon - 6:00 pm

Reception: 5:30 pm – 7:00 pm (Exhibit Hall)

Professional Development Courses (1/2 Day)
1:00 pm – 5:00 pm

PDC1: Wire Bonding
Instructor: Lee Levine, Consultant, Process Solutions Consulting

PDC2: Near Hermetic Packaging Concepts for Military and Medical Devices
Instructor: Tom Green, Consultant, TJ Green Associates, LLC

Session 1: Lead Free Solder
Chair: Benson Chan, Endicott Interconnect Technologies
1:00 pm – 3:00 pm

Solder Pad "Cratering" A Growing Concern for Lead Free Soldered Electronics
Venkatesh Raghavan, Michael Eberhart, Brian Roggeman, Peter Borgesen, State University of New York at Binghamton

On the Life of Lead Free Solder Joints in Cycling with Varying Amplitudes
Linlin Yang, V. Raghavan, B. Roggeman, L. Yin, P. Borgesen, State University of New York at Binghamton

Quantitative Assessment of Effects of Long Term Aging on Sn-Ag-Cu Solder Joint Reliability
Vikram Venkatadri, Peter Borgesen, K. Srihari, State University of New York at Binghamton; Liang Yin, Universal Instruments Corp.

Next Generation PoP Pastes for Electronics Assembly
Jim Hisert, Brandon Judd, Indium Corporation

Break: 3:00 pm – 3:15 pm

Session 2: Regulations & Standards
Chair: Erica Folk, Northrop Grumman Corporation
3:15 pm – 5:30 pm

Moisture Sensing in Microelectronic Packages
Thomas J. Green, TJ Green Associates LLC

Evaluation of the Performance of RoHS Compliant Thick Film Conductors with Various Lead Free Solder Alloys
Samson Shahbazi, Meg Tredinnick, Mark Challingsworth, Heraeus Materials Technology LLC

Counterfeit Detection in the Electronics Industry
Anne Poncheri, Jeff Shearer, Silicon Cert Laboratories

Identifying and Working with ITAR Regulations
Kelly Raia, American River International

Reception in Exhibit Hall: 5:30 pm – 7:00 pm

Friday, June 18

Registration: 7:00 am - 5:00 pm

Breakfast: 7:30 am - 8:20 am

Opening Remarks: 8:30 am – 8:45 am
General Chair: Voya Markovich, Endicott Interconnect Technologies

Exhibit Hours: 10:00 am – 5:00 pm
(Refreshment Break & Lunch will be held in the Exhibit Area.)

Keynote Presentation: 8:45 am – 9:30 am
3-D Packaging in High End Servers:
Promises and Acceptance Challenges

Speaker: George A. Katopis, IEEE Fellow

Mr. Katopis is an IEEE Fellow and a Distinguished Engineer Emeritus now that he has retired from IBM after 35 years of service. Mr. Katopis is the author of over 100 publications on all subjects of electrical package design and architecture, including signal integrity, identification and reduction of switching noise, measurements and electrical characterization of transmission lines and cost estimation of 1st level packaging. His current interests are in the development of macromodels for current I/O circuitry so that time domain analysis methods can be employed for the channel characterization. He holds 10 patents in issues relating to the switching and coupled noise control and he has authored chapters in 3 Packaging books.

He holds a MPh in Engineering from Columbia University of NY and a MS in Electrical and Computer Science from the same University, 1978 and 1973 respectively. He is an IMAPS member and still mentor’s graduate students at Universities in the US, Europe and Africa.

Session 3: Nanomaterials in Packaging
Chair: Michael Salloum, MLES
9:30 am – 12:30 pm

"Green" Nanocomposites for Electronic Packaging
Mark D. Poliks, Rabindra N. Das, Konstantinos I. Papathomas, Endicott Interconnect Technologies, Inc.

Session 4: Advanced Component Packaging
Chair: Ray Fillion
9:30 am – 12:30 pm

MEMS Device Sealing in a High Vacuum Atmosphere Achieving Long Term Reliable Vacuum Levels
Bruce Wilson, Paul Barnes, SST International

Break in Exhibit Hall: 10:00 am – 10:30 am

Printing Conductive Traces using Nano Silver-Based Inks
David Van Heerden, Hichang Yoon, Yu Do, Zhihao Yang, NanoMas Technologies, Inc.

Nanomaterials Construction for Thermal Interface Materials
Howard Wang, State University of New York at Binghamton

Mechanical Behavior of Silver Nanoparticle Films
Liwei Huang, Howard Wang, State University of New York at Binghamton

Design, Fabrication, Electrical Characterization and Reliability of Nanomaterials Based Embedded Passives
Rabindra Das, John M. Lauffer, Steven G. Rosser, Endicott Interconnect Technologies, Inc.

Solders in LED Packaging
Seth Homer, Indium Corporation

Reliability of a Chip Scale Packaged (CSP) Enhanced Linear Image Sensor
Awni Qasaimeh, Mahesh Murthy, Frank Andros, Susan Lu, State University of New York at Binghamton

Manufacturing and Reliability Challenges With QFN
Greg Caswell, DfR Solutions

Challenges in Assembly and Reliability of Package on Package
Brian Roggeman, Michael Meilunas, Universal Instruments Corp.

Lunch in the Exhibit Hall: 12:30 pm – 3:00 pm (Lunch Served: 12:30 pm – 1:15 pm)

Poster Session in Exhibit Hall
Chair: TBD
12:30 pm – 3:00 pm

Microstructure Evolution of Pb-Free Solder Alloys in Mechanical Fatigue Testing
Luke A. Wentlent, Liang Yin, Linlin Yang, Peter Borgesen, State University of New York at Binghamton

An Empirical Model for Lead Free Solder Joint Life in Thermal Cycling
Younis Jaradat, Awni Qasaimeh, Susan Lu, Peter Borgesen, State University of New York at Binghamton

Crack Behavior in Lead Free Solder Joints during Isothermal and Thermal Cycling
Awni Qasaimeh, Peter Borgesen, Susan Lu, State University of New York at Binghamton

Surface Mounted Components Reflow Process Temperature Profile Study
Jianjun Jiang, Krishnaswami Srihari, Ross Havens, State University of New York at Binghamton

Design and Packaging of a Device for Fingerprint Based Access Control System
Sandeepsarma Josyula, Temple University

Hardware Design for a Ultra-High Processing Throughput Computer
Son Nguyen, Bjorn Gruenwald, Joan Delalic, Temple University

Metallurgy Change at the Gold-Solder Bump Joint
Yong-Bin Sun, Ui-Jung Choi, Kyonggi University

Corporate Sponsor "Ignite Session"
Moderator: Leo Garvey, LFG Micro
1:15 pm - 2:00 pm
A fast paced focused 10 minute presentation from each of our corporate sponsors.

Vendor Open Mic: 2:00 pm - 3:00 pm

Session 5: Wire/Ribbon Bonding and Ceramic Substrates
Chair: Lee Levine, Process Solutions Consulting
3:00 pm – 5:00 pm

Wire Bond Surfaces for Large Diameter Aluminum Wire and PowerRibbon® Bonding
Mike McKeown, Orthodyne Electronics

Separable Ribbon Contact for High Frequency Modules
George Glatts, Z-Axis Connector Company

Process Integrated Quality Control Improves Wire Bonding Reliability
Roberto Gilardoni, Bill Maldonado, Hesse & Knipps Semiconductor Equipment

Techniques and Materials for Advanced Radars and Communications
Arne Knudsen, Jerry Aguirre, Mark Eblen, Iris Labadie, Joseph Tallo, Andrew Piloto, Kyocera America, Inc.

Session 6: Advanced Interconnects
Chair: John Mazurowski, Penn State University
3:00 pm – 5:00 pm

Embedded Power Packaging for Low Loss, High Performance
Chuck Bauer, Heuhaus Herb, Ray Fillion, TechLead Corp.

High Bandwidth Density and Low Cost Optical Interconnects and Packaging
Frank Libsch, IBM

Organic Optical Waveguides
How Lin, Benson Chan, Endicott Interconnect Technologies Inc.

The Merits of Open Bath Immersion Cooling of Datacom Equipment
Steve A. Pignato, Phillip E. Tuma, 3M

Closing Remarks: 5:00 pm
General Chair: Voya Markovich, Endicott Interconnect Technologies


Register On-line

To view the professional development courses, tabletop exhibit details, to register on-line or for full conference details, visit

Registration Closing Soon for Upcoming Webinars on: WLED Technologies; Precious Metal Financing; and Signal/Power Integrity    ^ Top
Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

Upcoming Programs:

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, June 8 and 15, 2010 . All webinars will be held 12:00 noon - 1:30 pm PACIFIC

Corporate Webinar on
Precious Metal Financing and Hedging
Presented by: Paul Angland, HSBC Bank USA
This corporate webinar will be held Wednesday, June 9, 2010 . This webinar will be held 12:00 noon - 1:30 pm EASTERN

PDC Webinar Series on
Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Presented by: Dr. Ivan Ndip, Fraunhofer-IZM; Prof. Ege Engin, San Diego State University
NEW TIMES -- This three-session on-line Professional Development Course (PDC) webinar will be held: Tuesdays, June 15, 22, and 29, 2010 . All webinars will be held 12:00 noon - 1:00 pm EDT

Details on all IMAPS webinars can be viewed at

  Chapter Activities (events listed in chronological order)

IMAPS Nordic Conference 2010 - Program Now Available    ^ Top
The IMAPS Nordic Conference 2010 will be held at the Elite Park Avenue Hotel from June 6-9, in Gothenburg, Sweden. For the latest information about the conference and the exhibition, visit our homepage at or send e-mail to or to the Exhibition Host at

IMAPS Nordic is proud to announce the year 2010 conference in Gothenburg Sweden. In Gothenburg we have Chalmers Technical University with its Department for Microtechnology and Nanoscience and IMEGO the well known Institute for Micro and Nanotechnology, and the  Swerea IVF Institute.

The program is now available and is planned with the following sessions and speakers:

                        SUNDAY 6th June
19:30                     COCKTAIL PARTY

                                MONDAY 7th June
9:00                        OPENING AND KEYNOTES
9:05                        Integrated passive devices and silicon interposers
                                Jean-Marc Yannou, Yole Développement
9:35                        Investing in Intellectual Assets
                                Bill Brox, IMEGO
10:05                     Exhibitor presentations
10:20                     COFFEE BREAK
                                FLIP CHIP TECHNOLOGY
11:00                     Temperature Cycling and Constant Humidity Test for Flip Chip Joints using Pre-Aged ACF
                                Anniina Parviainen, Tampere University of Technology
11:25                     Advanced Flip Chip bonding for imaging devices
                                Jörgen Alvebro, Irnova AB        
11:50                     Au Stud Bump Optimization for Anisotropic Conductive Adhesives Interconnects
                                Luca Petricca, Vestfold University College
12:15                     IMAPS NORDIC ANNUAL MEETING
13:00                     LUNCH
                                ADVANCED TECHNOLOGIES AND APPLICATIONS
14:00                     LED device developing trend & LED products tear down for understanding LED Packaging
                                T. Onishi, Grand Joint Technology Ltd
14:25                     3D Computational Fluid Dynamics Simulation of Carbon Nanotube Based Microchannel On-Chip Cooler
                                Nabi Nabiollahai,  Chalmers University of Technology
14:50                     Room temperature soldering of difficult components
                                Paul Collander, Poltronic OY
15:15                     COFFEE BREAK
                                RELIABILITY CONCERNS
15:45                     Managing the Reliability Time-bombs of Modern Electronics and Photonics
                                Nihal Sinnadurai, ATTAC
16:10                     Manufacturing and Reliability Challenges with QFN
                                Greg Caswell, DfR Solutions
                                POLYMERS AND ADHESIVES
16:35                     Changes in chemical structure of commercial ACF after thermal cycling and humidity testing
                                Laura Frisk  Tampere University of Technology
17:00                     Particle distribution in screen printed and dispensed ACF interconnections
                                Sanna Lahokallio, Tampere University of Technology
17:25                     End of session
19:30                     BANQUET DINNER
                                TUESDAY 8th JUNE
                                3D TECHNOLOGY
9:00                        Through Silicon Vias  Integration in 3D integrated passive technology
                                Olivier Garborieau, Franck Murray, IPDIA
9:25                        Die with TSV Packaging from Japan
                                T. Onishi, Grand Joint Technology  Ltd
9:50                        COFFEE BREAK
                                ENCAPSULATIONS, BONDING, AND SUBSTRATES
10:40                     HB-LED  Cavity Encapsulation
                                Horatio Quinones, ASYMTEK
11:05                     Coreless substrates - a new approach
                               Bernd K. Appel, ASE Europé
11:30                     Gold to Gold Thermosonic Bonding Characterization of Bonding Parameters
                                Thi-Thuy Luu, Vestfold University Collage
11:55                     Moisture effects on the performance of RFID tags with ACA joints
                                Kirsi Saarinen, Tampere University of Technology
12:20                     LUNCH
                                ADVANCED METHODS AND MATERIALS
13:20                     Hydraulic modelling of EMC screens and fans for telecommunication cabinets: state of the art
                                Anton Bengoechea, Tecnun-University of Navarra
13:45                     Acoustic Matching Layer for High Frequency Transducers made by Anisotropic Wet  Etching of Silicon
                                Thai Nguyen, Vestfold University Collage
14:10                     Comparison of ceramic multilayer technology for RF Integration of HTCC/LTCC
                                F. Bechtold, VIA Electronic GmbH
14:35                     Temperature and Humidity Testing of Rigid-Flex ACA Heat Seal Attachments
                                Janne Kiilunen, Tampere University of Technology
15:00                     End of session
15:30                     Visit to IMEGO (about 500 meters from the Conference Hotel)
                                WEDNESDAY 9th June
                                SHORT COURSES (separate fee)
8:30-12:00           The need for increased cleanliness in modern SMT manufacturing
                                Greg Caswell, DfR Solutions
12:00                     LUNCH (at attendees own cost)
13:00-16:00         Lead Free Reliability
                                Olli Salmela, Nokia Siemens Network

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) - Call For Papers before June 11    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150

New England Chapter June 22 Business/Technical Meeting    ^ Top
LOCATION: Courtyard By Marriott Marlborough – 75 Felton Street, Marlborough, MA

SCHEDULE (times approximate):
5:30 PM            Registration, Socializing, Networking & Cash Bar
6:30 PM            Dinner
7:30 PM           Election/Business Meeting
7:45 PM            “IPA Free Texturing of Mono-crystalline Wafers During Solar Cell Manufacturing”
Matt Moynihan - R&D Director, Dow Electronic Materials

Nominees for Fiscal year 2010-2011:

President            Dr. Wei Han
Vice President     Mr. Michael Gervais
Treasurer            Mr. Michael Gervais
Secretary            Mr. Mark Hyman

Solar Cell Manufacturing of Mono-crystalline Wafers IPA Free
by Matt Moynihan - R&D Director, Dow Electronic Materials

Silicon solar cell process engineering will be reviewed.  Detailed chemical etching technology for wafer surface texturing will be presented, with improved integrity and desired pyramid structure. The new additive has been shown to improved the overall process stability with respect to etch rate and reflectance while generating comparable cell performance for both horizontal and vertical equipment configurations.

Mr. Moynihan is currently the R&D Director within the Dow Advanced Materials division of Dow Electronic Materials focusing on advanced material development for the photovoltaic industry.  Prior to his current position, he was the R&D Program Manager for the Embedded Optical Interconnect business under the Circuit Board Technologies business unit of Rohm and Haas Electronic Materials LLC.  He has also held a number of technical and management positions within the Micro-Electronics business unit of Shipley Company where he worked on the development of 365nm and 248nm photo-resists and processes.  Mr. Moynihan has published several patents and publications in the area of photovoltaic wet chemistry, optical waveguide material development and lithographic processing. He holds B.S. in Chemical Engineering from the University of New Hampshire and a MBA from Babson University.

Full details at

UK Chapter One Day Technical Seminar on Interconnection Processes and Materials    ^ Top
Beyond Solder Technical Seminar
One Day Technical Seminar On Interconnection Processes & Materials

Wed 30th June 2010

Location: NPL, Teddington, London TW11 0LW

With its theme of interconnect processes, technology and materials, “Beyond Solder” has attracted leading presenters from Companies and Institutions such as IeMRC, Henkel, TWI, Kulicke & Soffa, Panda Europe, NPL & Irisys. 

The one-day seminar comprises eight technical presentations including: Joining & Packaging Technology for High Temperature Electronics, Ultrasonically Bonded Copper Interconnects, Press-fit Connections For High Reliability & Automotive Applications, End-Of-Life Options For Electronic Interconnects, Innovative Adhesive Technologies, Bonding With Nanotechnology, Optimisation Of A Process For A Fine Pitch ICA Interconnection and a keynote presentation from the IeMRC, which addresses The Benefits, Challenges & Opportunities For Solder-free Connections. 

The event is open to all, including non IMAPS-UK members; however interest has been strong, with the remaining spaces available on a first-come, first-served basis.

Further information:

Or email IMAPS-UK Beyond Solder: 

  Membership, Products and Publications

Submit Your IMAPS Awards Nominations   ^ Top
This is an urgent appeal from your 2010 Awards Committee Chair to submit your nominations for the following awards – the cutoff date is Aug 27, 2010.

  1. Corporate Recognition
  2. Daniel C. Hughes, Jr.
  3. William D. Ashman
  4.  John A. Wagnon
  5. Technical Achievement
  6. Fellow of the Society
  7. Sidney J. Stein Interglobal
  8. Lifetime Achievement
  9. Outstanding Educator

Any IMAPS member may submit a nomination for any IMAPS member but must use the Awards Nomination Form that is available on our website – please navigate as follows: Log in -> Membership -> Society Awards. Eligibility requirements must be considered in making any nominations and these are also available under “Awards”.

Many thanks.
Delip Doug” Bokil
2010 Awards Committee Chair
2010 First Past President


Oneida Research Services

Webinar Series on Advances in WLED... (2 Sessions)
June 8 and 15

Webinar on Precious Metal Financing and Hedging
June 9

ATW and Tabletop Exhibit on Microelectronic Packaging and Materials for Medical Devices
June 9-10
Minneapolis, MN
*Exhibitors contact

Mid-Atlantic Microelectronics Conference
June 17-18
Atlantic City, NJ
*Exhibitors contact

ATW on Advanced Interconnect Technologies
July 14
San Francisco, CA

ATW on Wire Bonding
July 15
San Francisco, CA

ATW on High Reliability Microelectronics for Military Applications
August 31 - September 2
Bethesda, MD

ATW on Thermal Management
September 28-30
Palo Alto, CA
*Exhibitors contact

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact

ETW on Nano-Integrated Microsystems Packaging:
Design, Materials, Processes and Applications

November 4-5, 2010
Raleigh, NC
Co-located with IMAPS 2010

^ Top



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