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November 30, 2010
 

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   IMAPS EVENTS
Button Device Packaging 2011 - Abstracts Due This Friday! (read more...)

Button ATW & Exhibition on Printed System Level Packaging - Abstracts Due (read more...)

Button Workshop on Electronic Packaging of Solar Cells and Fuel Cells (read more...)

Button Announcing the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: IMAPS Northern California Chapter December 1 Lunch Meeting (read more...)

Bullet IMAPS San Diego Chapter December 7 Holiday Social and Dinner (read more...)

Bullet IMAPS Florida Chapter's Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition (read more...)

Bullet IMAPS France 6th ATW on Micropackaging and Thermal Management (read more...)

Bullet IMAPS Southern California Chapters and OCE Announce SoCal 2011 (read more...)

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2011 - Abstracts Due This Friday!    ^ Top
The seventh Annual Device Packaging Conference (DPC2011) will be held in Scottsdale, Arizona, on March 7-10, 2011. Abstracts must be submitted this Friday, December 3. For more information, visit www.imaps.org/devicepackaging.

The 2011 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 3, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 28, 2011. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 7th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 3, 2010.

ATW & Exhibition on Printed System Level Packaging - Abstracts Due    ^ Top
The Advanced Technology Workshop and Tabletop Exhibit on Printed System Level Packaging is being held February 23-24, 2011, in Orlando, Florida. This workshop is co-located with the Florida Chapter Microelectronics Symposium (www.imaps.org/chapters/florida/). Abstracts are now being accepted at www.imaps.org/printed. The program will be available in December. Tabletop exhibits will also be available.

The objective of the Florida Chapter Microelectronics Symposium & Exhibition and the IMAPS Printed System Level Packaging Workshop and Tabletop Exhibition is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of microelectronics, printed electronics, additive manufacturing as an emerging packaging technology, and microelectronics. This event enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • 3D & Additive Manufacturing
  • Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Cyber Design
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Thin and ultra miniature components
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present at the Printed Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 30, 2010. Abstracts can be submitted using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 21, 2011.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Questions about Exhibiting? Contact Michael McEntee at Mike.mcentee@tektronix.com.

Workshop on Electronic Packaging of Solar Cells and Fuel Cells    ^ Top
The workshop will be held at the Hilton Garden Inn Cleveland Airport Hotel in Cleveland, Ohio, on March 29-30, 2011. Abstracts will be accepted until December 17. To submit an abstract and for more information, visit www.imaps.org/energy.

This workshop is a continuation of the first Alternative Energy Conference started several years ago. It will focus on this critical field that will be affecting every aspect of our lives worldwide. Core issues involve both new technologies, and materials/processes for renewable, non-renewable, and innovative application of existing technologies. Incentives for research, investment, and adoption are already practiced in some Asian and European countries. Following new energy policies in the US and other countries, these incentives are now available to encourage the adoption, research, and development of new technologies.

Abstracts are being solicited in the following areas that support the major topics on either Solar (Photovoltaics) or Fuel Cells:

  • Design for Efficiency
  • Materials, Processing and Design
  • Balance of Plant
  • System Integration
  • Thermal and Power Management
  • Robustness and Cost
  • Qualification Approaches
  • Environmental Regulations
  • Government/State Policies and Incentives
  • Integration with Energy Storage Systems 

Those wishing to present at the Solar Cells and Fuel Cells Workshop, should submit a 250-300 word abstract electronically by December 17, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

Announcing the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN)    ^ Top
The International Conference and Exhibition on High Temperature Electronics Network (HiTEN) is being held July 18-20, 2011, at St. Catherine’s College Oxford in Oxford, United Kingdom. The call for abstracts and full conference details can be found on-line at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later January 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due May 2011, for all accepted abstract.

  Chapter Activities (events listed in chronological order)
 

TOMORROW: IMAPS Northern California Chapter December 1 Lunch Meeting    ^ Top
It is my pleasure to invite you to attend the IMAPS Northern California Chapter's December 1, 2010 Lunch Meeting which will be held at:

David's Restaurant, Banquet & Conference Facilities,
5151 Stars and Stripes
Drive, Santa Clara, CA 95054.

The presentation on "RELIABILITY OF MICROELECTRONICS PACKAGING IN THE ERA OF ENERGYWISE AND BORDERLESS NETWORKS" will be another very informative, engaging and thought-provoking talk, in keeping with the tradition of IMAPS.  This presentation will be of great interest to all microelectronics and optoelectronics assembly and interconnect professionals as the speaker will be discussing the challenges and opportunities as technological paradigms keep changing.

The speaker is Dr. Li Li, Distinguished Engineer, CISCO Systems, Inc.

Dr. Li is a highly accomplished individual whose scientific and technological capabilities and accomplishments have been widely recognized.   He has authored and co-authored over 40 papers and two book chapters and holds 7 US patents.  He serves on the Interconnection Committee for the IEEE-ECTC and the JEDEC JC-14 and JEDEC JC-42 committees.  Prior to joining CISCO seven years ago, he worked at IBM, Fujitsu, and Philips Electronics.

In addition to yourself attending this talk, we would appreciate your forwarding this announcement to any of your colleagues and friends who you think might be interested in, and/or could benefit from, this presentation.

Please respond to Roger Underwood, IMAPS NorCal Chapter Treasurer, at runderwood@cctlaser.com to make your lunch reservations. We look forward to seeing you on December 1, 2010.

Guna Selvaduray, Ph.D.
Biomedical Engineering Coordinator
Professor, Materials Engineering
College of Engineering
San Jose State University
San Jose,  CA 95192-0082
Phone: (408) 924-3874

IMAPS San Diego Chapter December 7 Holiday Social and Dinner    ^ Top
Join old friends and make new friends at a wonderful holiday dinner.  An event surely not to be missed.  Enjoy the holiday cheer while enjoying a scrumptious Mexican food buffet.  Attendees will receive a coupon for a complimentary beverage of their choice.  Lucky winners of a drawing will receive prizes.

Event Logistics:
Tuesday, December 7th
Mixer starts at 6:00pm, followed by Dinner at 7:00
Casa Machado Restaurant
3750 John J. Montgomery Drive
San Diego, CA 92123
For directions and information, go to www.casamachadorestaurant.com/locations.html

Only $25.00 per person.  Reservations required please.
Complimentary for students with ID.
Please RSVP by Friday, December 3 at 4:00

To register, please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430

IMAPS Florida Chapter's Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition    ^ Top

February 23 - 24, 2011 (Tentative)
Orlando, Florida ATW
Co-Located with IMAPS ATW on Printed System Level Packaging

Symposium Abstract Deadline: December 30, 2010
ATW Abstract Deadline: November 30, 2010

The objective of the Florida Chapter Microelectronics Symposium and IMAPS Printed System Level Packaging Workshop is to provide a unique forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in printed electronics, additive manufacturing and microelectronics. Presentations in the two technology areas will focus on topics outlined below.

Florida Chapter Symposium:

  • 3D Packaging
  • RF Packaging
  • Hi Rel Microelectronics Assembly Process
  • LED Packaging
  • High Density Interconnect Technology
  • Embedded Active/Passive Components
  • Electrostatic Discharge (ESD) Prevention

Those wishing to present a paper at the Printed System Level Packaging ATW must submit abstract no later than November 30, 2010 and those wishing to present at the Florida Chapter Microelectronics, Manufacturing, Materials and Application Symposium must submit no later than December 30, 2010. A 200-300 word abstract must be submitted electronically using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001, ext. 709 if you have questions.

IMAPS France 6th ATW on Micropackaging and Thermal Management    ^ Top

Dates: February 2-3, 2011
Location:

Mercure Oceanide Vieux Port Sud La Rochelle

Details: www.imapsfrance.org

Conference Chairman :
Jean-Claude RAMES (MBDA France)

Technical Programme Committee:
Nick CHANDLER (BAE SYSTEMS)
Pierre LEWANDOWSKI (CONTINENTAL AUTOMOTIVE)
Michel MASSIOT (EGIDE)
Michel MERMET GUYENNET (ALSTOM)
Gilles POUPON (CEA LETI)
Claude SARNO (THALES AVIONICS)
Dave SAUMS (DS & A LLC)
Richard SEDDON (TECNALIA AEROSPACE)
Jean-Marc YANNOU (YOLE Développement)

The workshop sessions will include the following topics and papers are invited in
these areas:

  • Cooling solutions for microelectronics packaging,
  • Microcooling solutions,
  • Heat conductive materialsChip, board and system thermal management,
  • Thermal modelisation and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Experience return (products and systems cooling, power electronics, automotive
    transport,…)
  • Thermal management of opto electronics components.

The program will be available soon.

Speakers are required to pay a reduced registration fee (441.47 € exlcuded VAT) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Answer to Florence Vireton
by e-mail: imaps.france@imapsfrance.org
by fax: +33 (0) 1 39 02 71 93

TABLE TOP EXHIBITION (limited number first come first serve basis) : 1 table, 2 chairs 1 panel. Presentation of your activity, your last products and results (only for companies in relation with thermal management). 300 € excluded VAT

IMAPS Southern California Chapters and OCE Announce SoCal 2011    ^ Top
The Southern California Chapters of IMAPS are partnering with OCE Shows this year for SoCal11. SoCal 2011 will be held March 15-16, 2011, at the OC Fairgrounds.

We are looking for technical papers on (but not limited to):

  • Counterfeit Components
  • Green Technology
    • Product Design
    • Manufacturing Processes
  • Reliability / Failure Analysis
  • Aerospace Topics
  • Lighting technology
  • Test & measurement

Please submit your abstract/paper for consideration to:
Bill Gaines, Program Chairman, SoCal11
William.gaines@nge.com

Deadline for Abstract submission is 29 October 2010

For Registration or Exhibiting information, go to the OCE Show website at:
http://www.oceshow.com/

Bill Gaines
Program Chairman, SoCal11
626-812-2199 (office)      714-403-5053 (cell)


   
   

LORD Corporation

Printed System Level Packaging
February 23-24
Orlando, FL
*Exhibitors contact ekeller@imaps.org

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact ekeller@imaps.org

Packaging of Solar Cells and Fuel Cells
March 29-30
Cleveland, OH

IMAPS/ACerS CICMT
April 5-7
San Diego, CA
*Exhibitors contact ekeller@imaps.org

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact ekeller@imaps.org

RF/Microwave
September 20-22
San Diego, CA

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact ekeller@imaps.org

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