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October 14, 2010

TJ Green Associates, LLC

Button IMAPS 2010 (Research Triangle) - Less Than 3 Weeks Away - Register On-Line (read more...)

Button Thank You to the IMAPS 2010 Exhibiting Companies - Your Company Can Still Be On This List! (read more...)

Button Dr. John Edmond, Co-Founder of CREE Research, and Dr. Rao Tummala, Professor/Director at Georgia Tech, to Keynote at IMAPS 2010 Raleigh (read more...)

Button IMAPS 2010 Golf Tournament and Ca-Si-No Night to Benefit the MicroelectronicsFoundation (read more...)

Button Rheology Issues In Electronic Packaging Webinar (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference Enabling Packaging Technologies for System Integration (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) (read more...)

Bullet IMAPS Keystone Chapter October 21 L-3 Plant Tour and Dinner Meeting on Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements (read more...)

Bullet IMAPS New England Chapter October 26 Dinner Meeting on Ceramic Packaging in Medical Applications (read more...)

Bullet IMAPS Florida Chapter October 28 Dinner Meeting on 3D Print and Play CubeSATs - The Future of System-Level Packaging (read more...)

Bullet IMAPS Garden State Chapter November 9 Dinner UTZ Facility Tour and Dinner Meeting on Low Cost Hermetic Sealing (read more...)

Bullet IMAPS France 6th ATW on Micropackaging and Thermal Management (read more...)

Bullet IMAPS Southern California Chapters and OCE Announce SoCal 2011 (read more...)

  IMAPS Events (view full Web Calendar)

IMAPS 2010 (Research Triangle) - Less Than 3 Weeks Away - Register On-Line    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010) is being held October 31 - November 4, 2010, at the Raleigh Convention Center in Raleigh, North Carolina. The advance program, exhibit information and registration is now on-line at

IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions will be featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. In addition to the technical program, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech, will be held.

This year's symposium will also offer you 18 professional development courses. The PDCs being held at IMAPS 2010 are:

Sunday, October 31, 2010

Polymers for Electronic Packaging

Course Leader: Dr. Jeff Gotro, Innocentrix LLC

TSV and Other Key Enabling Technologies of 3D IC/Si Integrations

Course Leader: Dr. John H. Lau, ITRI

MEMS Reliability and Packaging

Course Leader: Dr. Slobodan Petrovic, Oregon Institute of Technology

Adhesion Fundamentals in Microelectronic Packaging

Course Leader: Dr. Raymond A. Pearson, Lehigh University

RF/Microwave Hybrids: Basics, Materials and Processes

Course Leader: Richard Brown, Richard Brown Associates, Inc.

Plating Processes for High Reliability Microelectronic Devices

Course Leader: Fred Mueller, CEF, General Magnaplate Corp.

Hybrid Visual Inspection per Mil-STD-883

Course Leader: Thomas J. Green, TJ Green Associates LLC

½ Day Course: 8:00 am - Noon
Understanding Failure and Root-Cause Analysis in Pb-Free Electronics

Course Leaders: Craig Hillman, Greg Caswell, DfR Solutions

½ Day Course: 1:00 pm - 5:00 pm
LED Packaging Technology: Design, Materials, Processes, and Applications

Course Leader: Dr. S. W. Ricky Lee, Hong Kong University of Science and Technology

Monday, November 1, 2010

Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity

Course Leaders: Dr. Ivan Ndip, Fraunhofer Institute for Reliability and Microintegration, IZM; Professor Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, Computer Simulation Technology (CST) of America

Introduction to Microelectronics Packaging

Course Leader: Phillip G. Creter, Creter & Associates

Technology of Screen Printing

Course Leaders: Arthur Dobie, Sefar Inc.; David Malanga, Heraeus, Inc., Circuit Materials Division

Nanopackaging: Nanotechnologies in Microelectronics Packaging

Course Leader: Dr. James E. Morris, Portland State University

An Electronics Expert Reliability Analysis Tool

Course Leaders: Craig Hillman, Greg Caswell, Nathan Blattau, DfR Solutions

Wire Bonding in Microelectronics

Course Leader: Lee Levine, Process Solutions Consulting

Hermeticity Testing and RGA (Residual Gas Analysis)

Course Leaders: Thomas J. Green, TJ Green Associates LLC; Philipp Schuessler, Schuessler Consulting

½ Day Course: 8:00 am - Noon
3D Integration and Packaging Technologies, Assessment, Status and Applications

Course Leader: James Jian-Qiang Lu, Rensselaer Polytechnic Institute

½ Day Course: 1:00 pm - 5:00 pm
3-D IC Integration

Course Leader: Dr. Philip E. Garrou, Microelectronic Consultants of NC

For more information, please visit and make your reservations. IMAPS 2010 is a golden opportunity to expand your knowledge and your business and shouldn’t be missed.

Thank You to the IMAPS 2010 Exhibiting Companies - Your Company Can Still Be On This List!    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010) is being held October 31 - November 4, 2010, at the Raleigh Convention Center in Raleigh, North Carolina. The advance program, exhibit information and registration is now on-line at

IMAPS 2010 exhibiting companies will have the opportunity to impact the largest number of industry customers in one venue, introduce new products and concepts to this highly competitive market, network to enhance relationships with existing customers and be recognized as an industry leader. Here are the companies that have already reserved exhibit space (as for October 10):

Exhibitor Booth Booth Type Booth Category
3D Systems Packaging Research Center at Georgia Tech Booth: 512 10 x 10 In-Line
AdTech Ceramics Booth: 812 10 x 10 In-Line
Advanced Cooling Technologies Booth: 410 10 x 10 In-Line
Advance Reproductions Corp. Booth: 420 10 x 10 In-Line
AI Technology, Inc. Booth: 504 10 x 10 In-Line
Air-Vac Engineering Company Booth: 313 10 x 10 In-Line
All Flex Flexible Circuits Booth: 413 10 x 10 In-Line
ALLVIA, Inc. Booth: 605 10 x 10 In-Line
Amicra Microtechnologies GmbH Booth: 212 10 x 10 In-Line
Atotech USA, Inc. Booth: 710 10 x 10 In-Line
Batten & Allen, Ltd. Booth: 722 10 x 10 Corner
Besi Northamerica, Inc. Booth: 320 10 x 10 In-Line
Brewer Science, Inc. Booth: 433 10 x 10 Corner
CAD Design Software, Inc. Booth: 318 10 x 10 Corner
Chip Supply, Inc. Booth: 510 10 x 10 In-Line
Cicor Booth: 226 10 x 10 Corner
Coining, Inc. Booth: 708 10 x 10 In-Line
Colt Refining, Inc. Booth: 732 10 x 10 Corner
Co-Planar, Inc. Booth: 803 10 x 20 Island
CPS Technologies Corporation Booth: 321 10 x 10 In-Line
Crane Aerospace and Electronics Booth: 622 10 x 10 Corner
Cyber Technologies Booth: 429 10 x 10 In-Line
Disco Hi-Tec Booth: 431 10 x 10 In-Line
DuPont Electronics and Communications Booth: 623 10 x 10 Corner
Empower Materials Booth: 523 10 x 10 Corner
Endicott Interconnect Technologies, Inc. Booth: 712 10 x 10 In-Line
Epoxy Technology, Inc. Booth: 522 10 x 10 Corner
ES Components, Inc. Booth: 222 10 x 10 Corner
ESL ElectroScience Booth: 619 10 x 10 Corner
F & K Delvotec, Inc. Booth: 200 10 x 10 Corner
Ferro Corporation Booth: 506 10 x 20 In-Line
F&K Delvotec Booth: 200 10 x 10 Corner
Finetech, Inc. Booth: 706 10 x 10 In-Line
Geib Refining Corporation Booth: 518 10 x 10 Corner
Haiku Tech, Inc. Booth: 427 10 x 10 Corner
Harrop Industries, Inc. Booth: 409 10 x 10 In-Line
Hary Manufacturing, Inc. (HMI) Booth: 211 10 x 10 Corner
HEI, Inc. Booth: 422 10 x 10 Corner
Hengli Eletek Co., Ltd. Booth: 810 10 x 10 In-Line
Henkel Corporation Booth: 405 10 x 20 In-Line
Heraeus Thick Film Division Booth: 703 10 x 30 Corner
Hesse & Knipps, Inc. Booth: 509 Island - 20 x 20 Island
High Connection Density Booth: 818 10 x 10 Corner
Hi-Rel Laboratories, Inc Booth: 621 10 x 10 In-Line
IBM Servers Group Booth: 809 Island - 20 x 20 Island
Indium Corporation of America Booth: 415 10 x 10 Corner
Infinite Graphics, Inc. Booth: 726 10 x 10 Corner
Interconnect Systems, Inc. Booth: 408 10 x 10 Corner
Interplex Engineered Products, Inc. Booth: 730 10 x 10 In-Line
Kyocera America, Inc. Booth: 311 10 x 10 In-Line
Kyzen Corporation Booth: 315 10 x 10 Corner
LambdaTechnologies, Inc. Booth: 823 10 x 10 Corner
Laser Tech, Inc. Booth: 411 10 x 10 In-Line
LORD Corporation Booth: 414 10 x 10 Corner
Metallix Refining, Inc. Booth: 219 10 x 10 Corner
Micro Hybrid Dimensions, Inc. Booth: 304 10 x 10 In-Line
Microcertec Booth: 822 10 x 10 Corner
Micropac Industires, Inc. Booth: 633 10 x 10 Corner
MicroScreen LLC Booth: 603 10 x 10 Corner
Micross Components Corp. Booth: 711 10 x 10 In-Line
Minco Technology Labs, LLC Booth: 814 10 x 10 Corner
Mini-Systems, Inc. Booth: 613 10 x 10 In-Line
Mundt & Associates, Inc. Booth: 323 10 x 10 Corner
NAMICS Corporation Booth: 615 10 x 10 Corner
nanosystec, GmbH Booth: 607 10 x 10 In-Line
Natel Engineering Co., Inc. Booth: 503 Island - 20 x 20 Island
Newport Corporation Booth: 521 10 x 10 In-Line
NorCom Systems, Inc. Booth: 502 10 x 10 Corner
Nordson DAGE Booth: 303 Island - 20 x 20 Island
Nordson EFD, Inc. Booth: 303 Island - 20 x 20 Island
Nordson YESTECH, Inc. Booth: 310 10 x 10 Corner
NTK Technologies, Inc. Booth: 631 10 x 10 In-Line
Orthodyne Electronics Booth: 721 10 x 20 Corner
Pac Tech Packaging Technologies USA Booth: 808 10 x 10 Corner
Pacific Aerospace & Electronics Booth: 319 10 x 10 Corner
Palomar Technologies, Inc. Booth: 530 10 x 20 Corner
Perfection Products, Inc. Booth: 718 10 x 10 Corner
Photo Sciences, Inc. Booth: 202 10 x 10 In-Line
Quartzdyne Electronics Booth: 720 10 x 10 In-Line
Reldan Metals Co. Booth: 309 10 x 10 Corner
Remtec, Inc. Booth: 214 10 x 10 Corner
Riv, Inc. Booth: 618 10 x 10 Corner
Rogers Corporation Booth: 709 10 x 10 Corner
Royce Instruments, Inc. Booth: 520 10 x 10 In-Line
RTI International Booth: 220 10 x 10 In-Line
SEFAR Printing Solutions, Inc. Booth: 302 10 x 10 Corner
Semi Dice Booth: 821 10 x 10 In-Line
Semiconductor Equipment Corporation Booth: 526 10 x 10 Corner
Sikama International, Inc. Booth: 611 10 x 10 In-Line
Silicon Cert, Ltd. Booth: 412 10 x 10 In-Line
Smart Equipment Technology (S.E.T.) Booth: 419 10 x 10 Corner
Sonoscan, Inc. Booth: 519 10 x 10 Corner
South Dakota State University   10 x 10 In-Line
SST International Booth: 627 10 x 10 Corner
Stellar Industries Corp. Booth: 403 10 x 10 Corner
Stellar Microelectronics Inc. Booth: 714 10 x 10 Corner
Tamarack Scientific Co., Inc. Booth: 308 10 x 10 In-Line
TDK Corporation Booth: 702 10 x 10 Corner
Technic, Inc. Booth: 629 10 x 10 In-Line
Technical Materials, Inc. Booth: 322 10 x 10 Corner
TechSearch International Booth: 218 10 x 10 Corner
Teledyne Microelectronic Technologies, Inc. Booth: 514 10 x 10 Corner
Torrey Hills Technologies, LLC Booth: 620 10 x 10 In-Line
Trebor Instrument Corp. Booth: 609 10 x 10 In-Line
Tresky Corporation Booth: 418 10 x 10 Corner
Twilight Technology, Inc. Booth: 421 10 x 10 In-Line
U.S. Tech Booth: 820 10 x 10 In-Line
Universal Instruments Booth: 223 10 x 10 Corner
University of Arkansas   10 x 10 In-Line
University of Waterloo   10 x 10 In-Line
Utz Technologies, Inc. Booth: 704 10 x 10 In-Line
Valtronic Technologies (USA), Inc. Booth: 423 10 x 10 Corner
VIOX Corporation Booth: 719 10 x 10 Corner
Wafer & Device Packaging and Interconnect Booth: 203 10 x 10 Corner
West-Bond, Inc. Booth: 713 10 x 20 Corner
Williams Advanced Materials Booth: 306 10 x 10 In-Line
XYZTEC Booth: 528 10 x 20 Corner
Yxlon Fein Focus Booth: 728 10 x 20 In-Line

Dr. John Edmond, Co-Founder of CREE Research, and Dr. Rao Tummala, Professor/Director at Georgia Tech, to Keynote at IMAPS 2010 Raleigh    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010) is being held October 31 - November 4, 2010, at the Raleigh Convention Center in Raleigh, North Carolina. The advance program, exhibit information and registration is now on-line at

Dr. John Edmond, CREE

Tuesday, November 2, 2010
12:00 PM

Dr. John Edmond
CREE Research, Inc.

Presentation Title:
High Efficiency Blue and White LEDs for the New Lightbulb

Dr. John Edmond graduated summa cum laude from Alfred University in 1983 with a Bachelor of Science degree in ceramic engineering. He earned his Ph.D. in Materials Science at NC State University in 1987 and upon graduation co-founded Cree Research, Inc. Since its founding, Dr. Edmond has worked on the development and production of blue and green LEDs, first in SiC, then the Group III Nitrides on SiC.

In July 2007, Dr. Edmond earned a place on Business 2.0s ‘50 Who Matter Now’ list. The distinction places him alongside business celebrities such as Steve Jobs, founder and CEO of Apple, and the chiefs of Amazon, Cisco and Google. He and his team continue to advance the performance of LEDs to enable high efficiency solid state lighting solutions. He has 73 issued and 33 pending patents in the US, with an additional 147 issued and 127 pending foreign patents in the field of SiC and Group III-Nitrides.


Dr. Rao Tummala, GA Tech

Wednesday, November 3, 2010
11:45 AM

Dr. Rao Tummala
Professor and Director of 3D Systems Packaging Research Center
Georgia Institute of Technology

Presentation Title:
Grand Challenges and Potential Solutions in the Changing World of Nano-Electronics from ICs to 3D ICs to 3D Systems

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision, since 1994. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on gas discharge, the first and next three generations of multichip packaging - alumina, glass-ceramic-copper and copperpolymer thin film, and materials for ink-jet printing and magnetic storage.

He received many industry, academic and professional society awards including Industry Week’s award for improving U.S. competitiveness, IEEE’s David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS, Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award from SME, John Jeppson’s award from the American Ceramic Society as well as the Distinguished Alumni Awards from the University of Illinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received his BS from IISc, Bangalore and Ph.D. from the University of Illinois.

Prof. Tummala published 426 technical papers, holds 74 patents and inventions; authored the first modern packaging reference book - Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook - Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and first book introducing the System-On-Package technology. He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering in the USA and in India. He was the President of both IEEE-CPMT and IMAPS.

IMAPS 2010 Golf Tournament and Ca-Si-No Night to Benefit the Microelectronics Foundation    ^ Top
16th IMAPS Golf Tournament to Benefit the Microelectronics Foundation
The IMAPS Foundation funds Technical Paper contests at workshops, Poster contests at the Symposium and at local events and helps to provide special travel funds for student events. This year we funded transportation costs for high school students to attend the Printed Electronic Workshop in Florida and several other students to travel to the RF workshop.

The funds for these types of events comes from donations and special fund raising events at the annual IMAPS Symposium. This year we are once again host a golf event at the Lonnie Poole golf course on the Centennial Campus of North Carolina State University. This course was designed by Arnold Palmer and was just opened to the Public in 2009 (see attached flyer).

This year we are looking for hole sponsors at $500 a hole. In return the sponsor will receive two golf T-times, publicity on the course and in the conference program. Although this may be a limited opportunity for publicity, the important point is that these donations to a 501.c3 charity are being used to support IMAPS students and help provide a better education experience for the next generation. I urge you to consider sponsoring a hole at the 16th IMAPS benefit for the Microelectronics Foundation. Consider donating the tickets for two T-times to your customers or come and spend several hours on the course with them. It will be a day they will remember you by. Full details on-line at

IMAPS Foundation Ca-Si-No Night and benefit Auction
If you or your customers do not play golf then have arranged a fun evening  Ca-si-no Night . On Tuesday November 2nd the Foundation will be hosting a evening of fun and entertainment. This is a limited ticket event and only the first 70 people will get tickets. Join us for an evening of chance an opportunity to win a grand prize, while making a donation to the Foundation. The cost will be $50 per person and ticket sales will be in advance when registration opens. Details and registration on-line at

The Foundation also has a benefit auction and we urge members and chapters to consider making a donation of items such as an IPOD, GPS, bottles of wine or produce from your local part of the world that can be shipped to a winning auction bidder. Last year we had several bottle of wine reach $75 for the winning bid. We also had a couple of time share weeks donated for auction. All of these type of donations are readily accepted for the auction and each small contribution helps the Foundation.

So please take a minute and think if you can help us with a donation, sponsorship of a golf hole and attend one of the events and have some fun. Its all for a good cause and the more you enjoy these events the more the Foundation can do to help Students.

Steve Adamson
IMAPS Microelectronic Foundation Chairman

Rheology Issues In Electronic Packaging Webinar    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Rheology Issues in Electronic Packaging

This three-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, November 16, 23 and 30, 2010

All webinars will be held 12:00 noon - 1:00 pm EST

IMAPS Members: $125 per webinar; 3-course series $250
Non-members: $200 per webinar; 3-course series $500

Registration Deadlines: November 15, 2010

Register Online

Key Words/Topics

Rheology, polymers, thermosets, thermosetting polymers, adhesives, coatings, mold compounds, die attach, rheology during curing, chemorheology of epoxy curing, epoxies, dielectric cure monitoring

Program Description

These 3 one-hour PDC lectures can be taken in total or separately, but to gain the most benefit it is recommended to attend the whole series in order. Each session is scheduled for 50 minutes of presentation followed by 10 minutes of Questions and Answers. A brief description of each session follows:

Session 1 of 3: Tuesday, November 16 -- 12:00-1:00 PM EST

Introduction to Rheology
This session will provide a broad overview of the basic concepts of rheological properties and types of instrumentation for rheological measurements. Topics to be covered:

  • Why Rheology is important
  • Basic rheological definitions (viscosity, shear stress, shear rate, moduli)
  • Types of rheological measurements
  • Examples of typical rheological properties of polymers  

Session 2 of 3: Tuesday, November 23 -- 12:00-1:00 PM EST

Rheology in Semiconductor Packaging
This session will build on the previous webinar and cover some key rheological considerations governing the performance of polymer-based materials used in packaging semiconductors. In most cases, adhesives, underfills, mold compounds and coatings are applied as viscous liquids and then cured. The flow properties are critical to performance in high volume manufacturing. This session will cover the basics in:
  • Introduction to the rheological properties of adhesives (shear thinning, viscosity, time dependence, rheology changes during curing)
  • Rheology of Capillary Underfills
  • Encapsulants (mold compounds) and coatings

Session 3 of 3: Tuesday, November 30 -- 12:00-1:00 PM EST

Rheological Considerations in Substrate and Printed Circuit Board Fabrication
Semiconductor substrates and printed circuit boards are complex composites typically manufactured using a lamination process. Cores with circuit features are laminated with prepregs (B-staged, partially cured glass cloth composites) to form multilayer structures. The lamination process involves both chemical and viscoelastic property changes during lamination. The session will cover:

  • Chemorheology during curing
  • Concept of the rheological flow window
  • Gelation and vitrification during curing and the impact on flow
  • Overview of dielectric cure monitoring for in-situ measurement of the rheology and curing process

Who Should Attend?

Packaging engineers involved in the development, production, and reliability testing of semiconductor packages would benefit from the series. Those interested in gaining a basic understanding of the role of polymers and polymer-based materials used in electronic packaging will also find this series valuable.

Thomas Green


Dr. Jeff Gotro has over twenty-six years experience in polymers for electronic applications and composites having held scientific and leadership positions at IBM, AlliedSignal, Honeywell, and Ablestik Laboratories. He is an accomplished technology professional with demonstrated success directing new product development, leading to multi-million dollar revenues. He has global experience developing new products having established a full function R&D and Applications Engineering lab in Shanghai, China for Ablestik Laboratories. Jeff has consulting experience with companies ranging from early-stage start-ups to Fortune 50 companies.

Jeff is a nationally recognized authority in thermosetting polymers and he has received invitations to speak at prestigious Gordon Research Conferences (Thermosetting Polymers and Composites). He has presented numerous lectures and short courses at national technical conferences.   Jeff was an Adjunct Professor at Syracuse University in the Dept. of Chemical Engineering and Materials Science from 1986-1993.  He taught Six Sigma Black Belt and Green Belt at California State University at Fullerton from 2001-2006, and teaches courses on Innovation and Product Development in the MBA program at Concordia University in Irvine, CA. 

Jeff is a member of the Product Development and Management Association (PDMA), American Chemical Society (ACS), the Institute for Management Consultants (IMC), the Forensic Expert Witness Association (FEWA), and the International Microelectronics and Packaging Society (IMAPS).

Jeff has published 60 technical papers (including 4 book chapters) in the field of polymeric materials for advanced electronic packaging applications, holds 13 issued US patents, and has 7 patents pending. 

Jeff has a Ph.D. in Materials Science from Northwestern University with a specialty in polymer science and a B.S. in Mechanical Engineering/Materials Science from Marquette University.

Register Online

  Chapter Activities (events listed in chronological order)

IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference Enabling Packaging Technologies for System Integration    ^ Top
SEMICON Advanced Packaging Conference
Enabling Packaging Technologies for System Integration
in conjunction with SEMICON Europa
2010 19-20 October
Dresden, Germany
Details on-line

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology)    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150

IMAPS Keystone Chapter October 21 L-3 Plant Tour and Dinner Meeting on Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements    ^ Top

Dates: Thursday, October 21, 2010

L-3 Communications, Communication Systems - East
1 Federal Street
Camden, NJ 08103 Camden NJ 08103
(856) 338 3445

For Directions and Parking Info click here -

Park in the Visitor’s lot, 2nd gate on the left, once you get in the main entrance. There are two buildings on-site. The tour will be in the large 2 story manufacturing building to the east, away from the Delaware river.


Advance $15.00;
Onsite $20.00

Students $0 with ID


Advance registration ends Monday, Oct 18th Participation is limited so register soon by e-mailing Greg Chesmar at Please register with the same name that is on your citizenship ID.


5:00 SHARP Plant Tour at L-3 Communications Features PCB surface mount lines at L-3 Communication East’s Manufacturing Facility.

6:00 Dinner

6:45 Keystone Chapter Business Meeting

7:00 L- 3 Communications Overview Presentation by Martha Veselka

7:15 “Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements.” Craig Hillman, CEO of DfR Solutions

8: 00 Event Review and Planning Future Events

Acceptable IDs are 1) E-mail from company HR Dept or school administration stating proof 2) Original passport. No copies allowed. 3) Original birth certificate. No copies allowed.

Presentation Abstract:
The U.S. Dept. of Defense (DoD) has initiated multiple efforts to revitalize reliability in defense systems acquisition and development. One of these projects involves updating MIL-HDBK-217 Rev F, the often imitated and frequently criticized reliability prediction bible for electronics equipment. The current version of this document defines a 1960 era actuarial approach where field failure data is fitted to statistical, empirical models to create tables of historical random failure rates for generic families of electronic component in various usage stress conditions. The tables are then used in a part counting technique to create a Mean Time To Failure (MTTF) estimate that can be further de-rated based on thermal stress conditions. It has not been updated since 1995 partly because this approach does not address infant mortality quality and end of life wear our related failure issues.

While there is still support for the actuarial approach in some quarters, the MIL-HDBK-217 revision team workgroup has also proposed modernizing reliability prediction techniques to include and standardize ways of using modern Computer Aided Engineering (CAE) analysis tools with science-based Physics of Failure (PoF) reliability modeling, simulations and probabilistic mechanics techniques. The CAE-PoF approach is based in the analysis of loads and stresses in an application and evaluating the ability of materials in a device to endure them from a strength and mechanics of material point of view. This approach has been proven to resolve many of the current limitations of traditional actuarial based reliability prediction methods.

The PoF approach used a virtual Computer Aided Design (CAD) representation of a new device to perform a virtual durability simulation. The result is a detailed reliability assessment of which items (components, material and features) in the new design are the most likely to fail, to which failure mechanisms, their individual time to first failure and their rate of failure growth there after. The interactive use of this analysis capability as the design is being created enables designers to identify and design out susceptibility to failure mechanisms by making design, material and manufacturing choices that minimize failure opportunities. This approach can be considered a form of Virtual Reliability Growth that produces reliability optimized, robust designs.

This proposal has been submitted and is under going review. This paper provides a brief overview of PoF methods and reviews the concepts on how they can be applied to update and modernize the reliability prediction techniques in MIL-HDBK-217 from the point of view of a member of the 217 revision team.

Presenter Bio:
Dr. Craig Hillman is the Chief Executive Officer of DfR Solutions. His specialties include best practices in Design for Reliability (DfR), strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology (capacitors, resistors, etc.), and printed board failure mechanisms. During his years of experience in electronic packaging, Dr. Hillman has performed or directly supervised over 500 projects for over 150 companies in the area of quality and reliability of electronic components, products, and systems. Before forming DfR Solutions in 2004, he was the Director of Laboratory Services for CALCE Electronic Products and Systems Center. Dr. Hillman has over 40 publications and has presented on a wide variety of reliability issues to over 200 companies and organizations. He holds a B.S. from Carnegie Mellon in Metallurgical Engineering and Materials Science and Engineering and Public Policy and a PhD from University of California – Santa Barbara in Materials Science and was awarded a research fellowship at Cambridge University in England

IMAPS New England Chapter October 26 Dinner Meeting on Ceramic Packaging in Medical Applications

IMAPS New England Chapter October 26 Dinner Meeting on Ceramic Packaging in Medical Applications    ^ Top

Dates: October 26, 2010

The Marriott Courtyard – Marlborough, MA
75 Felton St.
Marlborough, MA 01752


5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:15 PM Technical Presentation


Meeting & Dinner Cost:
Non-Member $30.00;
Member $25.00;
Retired/Unemployed Member $20.00;
Student $10.00


Send registration details to: Jennifer Bailey or call 781-696-9369

Registration deadline is October 21, and cancellation by October 22. After October 21, you must register at-door - At-door registration is an additional $5.00. If you fail to cancel by noon on Friday [10/22] The Chapter will bill you for the registration fee


Ceramic Packaging in Medical Applications
Dr. Arne Knudsen, General Manager of Development - Kyocera America

IMAPS Florida Chapter October 28 Dinner Meeting on 3D Print and Play CubeSATs - The Future of System-Level Packaging    ^ Top

Dates: October 28, 2010

Doubletree Hotel @ Universal Studios
5780 Major Blvd.
Orlando, Florida 32819


6:00 - 7:00pm happy hour; cash bar;
Dinner @7:00pm


$25 members, $30 non-members, payable at the door (cash or check); $10 for Students.
Six (6) foot skirted tables w/power available for tabletop exhibits. Cost: $150.


Tim Davis, Chapter Arrangements @ or 407-341-3359 (mobile)


The current goal of the CubeSat community is to develop a system architecture that allows for a modular Satellite design – based on an existing, successful commercial analog – USB computer interface. Modules can be fabricated and placed on the shelf and when a mission has been identified, the CubeSat can be designed, assembled Lego-fashion and tested - reducing development time from six months to six days. This revolutionary vision describing how future satellites will be manufactured is referred to by AFRL as Plug and Play (PnP) – similar to the relationship between contemporary computers and associated commercial peripherals (i.e. printer, mouse, etc).

The concept of Print and Play is intended to be a computer driven technology that is able to perform monolithic 3Df Functional Printing. 3Df printing represents the ability to print 3 dimensional devices containing electrical, optical, thermal, mechanical, biological and fluidic features. This new and dynamic approach will enable a process that is impossible to fabricate by hand or with existing manufacturing processes. The concept “Print and Play” – in which entire satellites or fractionated satellites could be fabricated spatially in a monolithic, intelligent structure and thus reduce development time not from “months to days” but rather “days to hours”. Since this technology is form factor agnostic, this technology could be extended to other DoD or consumer based systems.

IMAPS Garden State Chapter November 9 Dinner UTZ Facility Tour and Dinner Meeting on Low Cost Hermetic Sealing    ^ Top

Dates: Tuesday, November 9, 2010
Schedule: 5:00 Registration, Networking, and Opening Remarks
5:30 “Plant tour at the new UTZ facility”
6:30 Dinner Buffet
7:00 Presentation
7:45 Closing Remarks

UTZ ---
4 Peckman road
Little Falls NJ 07424-1631


IMAPS Members $25.00;
Non-members $35.00;
Students (with ID) $10.00 SPACE IS LIMITED!


Only pre-registration guarantees lunch so pre-register by COB November 5. Pre-register On-line


5:00 Registration, Networking, and Opening Remarks

5:30 “Plant tour at the new UTZ facility”

6:30 Dinner Buffet

7:00 Presentation on “Low Cost Hermetic Sealing” by Thomas E. Salzer

Tom received degrees in mechanical engineering with high honors from Northeastern University. He spent 35 years as a principal engineer for Raytheon Company, most of this time devoted to areas of semiconductor and hybrid circuit assembly, reliability, and environmental testing. He has been awarded 15 US Patents, and has published more than 25 technical articles. Tom is the president of Hermetic, Inc., where he is involved in various semiconductor reliability related projects. His professional interests include the use of annular projection welding for production of low cost hermetic seals. He consults for several manufacturers, and is engaged in a wide range of projects including hermetic sealing of semiconductor, automotive, scientific instrument, medical implants, MEMS, photonic, and other devices.

7:45 Closing Remarks. (Planning the next event, recruiting chapter officers).

IMAPS France 6th ATW on Micropackaging and Thermal Management    ^ Top

Dates: February 2-3, 2011

Mercure Oceanide Vieux Port Sud La Rochelle


Conference Chairman :
Jean-Claude RAMES (MBDA France)

Technical Programme Committee:
Jean-Marc YANNOU (YOLE Développement)

The workshop sessions will include the following topics and papers are invited in
these areas:

  • Cooling solutions for microelectronics packaging,
  • Microcooling solutions,
  • Heat conductive materialsChip, board and system thermal management,
  • Thermal modelisation and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Experience return (products and systems cooling, power electronics, automotive
  • Thermal management of opto electronics components.

Speakers should submit a 200-300 words abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions) not later than November 5, 2010.

Speakers are required to pay a reduced registration fee (441.47 € exlcuded VAT) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: November 26, 2010.

Answer to Florence Vireton
by e-mail:
by fax: +33 (0) 1 39 02 71 93

TABLE TOP EXHIBITION (limited number first come first serve basis) : 1 table, 2 chairs 1 panel. Presentation of your activity, your last products and results (only for companies in relation with thermal management). 300 € excluded VAT

IMAPS Southern California Chapters and OCE Announce SoCal 2011    ^ Top
The Southern California Chapters of IMAPS are partnering with OCE Shows this year for SoCal11. SoCal 2011 will be held March 15-16, 2011, at the OC Fairgrounds.

We are looking for technical papers on (but not limited to):

  • Counterfeit Components
  • Green Technology
    • Product Design
    • Manufacturing Processes
  • Reliability / Failure Analysis
  • Aerospace Topics
  • Lighting technology
  • Test & measurement

Please submit your abstract/paper for consideration to:
Bill Gaines, Program Chairman, SoCal11

Deadline for Abstract submission is 29 October 2010

For Registration or Exhibiting information, go to the OCE Show website at:

Bill Gaines
Program Chairman, SoCal11
626-812-2199 (office)      714-403-5053 (cell)


LORD Corporation

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact

Webinar on Rheology Issues in Electronic Packaging
November 16, 23, 30

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact

ATW on Packaging of Solar Cells and Fuel Cells
March 29-30
Palo Alto, CA

^ Top




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