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September 22, 2010
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button IMAPS 2010 (Research Triangle) - Early Registration and Hotel Deadlines This Friday (read more...)

Button ATW on Thermal Management - Begins Next Tuesday (read more...)

Button Component Authentication and Screening Webinar Begins in 2 Weeks (read more...)

Button IMAPS 2010 Golf Tournament and Ca-Si-No Night to Benefit the Microelectronics Foundation (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT TUESDAY: IMAPS New England Chapter September 28 Dinner Meeting on Thermal Evaluation of Materials for LEDs (read more...)

Bullet IMAPS Chesapeake Chapter October 5 Dinner Meeting (read more...)

Bullet IMAPS Northern California Chapter October 6 Lunch Meeting on One Dimensional Nanostructures for Electronics and Photonics Applications (read more...)

Bullet Central Texas Electronics Association Electronics Design & Manufacturing Tech Forum & Expo (read more...)

Bullet IMAPS Rocky Mountain Chapter October 12 Fall Symposium (read more...)

Bullet IMAPS Chicago-Milwaukee Chapter October 13 Fall Technical Symposium on Failure Analysis (read more...)

Bullet IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference Enabling Packaging Technologies for System Integration (read more...)

Bullet IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology) (read more...)

Bullet IMAPS Keystone Chapter October 21 L-3 Plant Tour and Dinner Meeting on Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements (read more...)

Bullet IMAPS Garden State Chapter November 9 Dinner UTZ Facility Tour and Dinner Meeting on Low Cost Hermetic Sealing (read more...)

Bullet IMAPS France 6th ATW on Micropackaging and Thermal Management (read more...)

  IMAPS Events (view full Web Calendar)
 

IMAPS 2010 (Research Triangle) - Early Registration and Hotel Deadlines This Friday    ^ Top
The 43rd International Symposium on Microelectronics (IMAPS 2010) is being held October 31 - November 4, 2010, at the Raleigh Convention Center in Raleigh, North Carolina. The advance program, exhibit information and registration is now on-line at www.imaps2010.org.

The early registration and hotel deadlines are this Friday, September 24. Registration fees will increase after Friday. IMAPS cannot guarantee hotel room pricing or availability after Friday.

IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical sessions will be featured this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. In addition to the technical program, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech, will be held.

This year's symposium will also offer you 18 professional development courses. The PDCs being held at IMAPS 2010 are:

Sunday, October 31, 2010

S1
High-Performance Thermal Management Materials

Course Leader: Dr. Carl Zweben, Thermal Management Materials Consultant

S2
TSV and Other Key Enabling Technologies of 3D IC/Si Integrations

Course Leader: Dr. John H. Lau, ITRI

S3
MEMS Reliability and Packaging

Course Leader: Dr. Slobodan Petrovic, Oregon Institute of Technology

S4
Adhesion Fundamentals in Microelectronic Packaging

Course Leader: Dr. Raymond A. Pearson, Lehigh University

S5
RF/Microwave Hybrids: Basics, Materials and Processes

Course Leader: Richard Brown, Richard Brown Associates, Inc.

S6
Plating Processes for High Reliability Microelectronic Devices

Course Leader: Fred Mueller, CEF, General Magnaplate Corp.

S7
Hybrid Visual Inspection per Mil-STD-883

Course Leader: Thomas J. Green, TJ Green Associates LLC

½ Day Course: 8:00 am - Noon
S8
Understanding Failure and Root-Cause Analysis in Pb-Free Electronics

Course Leaders: Craig Hillman, Greg Caswell, DfR Solutions

½ Day Course: 1:00 pm - 5:00 pm
S9
LED Packaging Technology: Design, Materials, Processes, and Applications

Course Leader: Dr. S. W. Ricky Lee, Hong Kong University of Science and Technology

Monday, November 1, 2010

M1
Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity

Course Leaders: Dr. Ivan Ndip, Fraunhofer Institute for Reliability and Microintegration, IZM; Professor Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, Computer Simulation Technology (CST) of America

M2
Introduction to Microelectronics Packaging

Course Leader: Phillip G. Creter, Creter & Associates

M3
Technology of Screen Printing

Course Leaders: Arthur Dobie, Sefar Inc.; David Malanga, Heraeus, Inc., Circuit Materials Division

M4
Nanopackaging: Nanotechnologies in Microelectronics Packaging

Course Leader: Dr. James E. Morris, Portland State University

M5
An Electronics Expert Reliability Analysis Tool

Course Leaders: Craig Hillman, Greg Caswell, Nathan Blattau, DfR Solutions

M6
Wire Bonding in Microelectronics

Course Leader: Lee Levine, Process Solutions Consulting

M7
Hermeticity Testing and RGA (Residual Gas Analysis)

Course Leaders: Thomas J. Green, TJ Green Associates LLC; Philipp Schuessler, Schuessler Consulting

½ Day Course: 8:00 am - Noon
M8
3D Integration and Packaging Technologies, Assessment, Status and Applications

Course Leader: James Jian-Qiang Lu, Rensselaer Polytechnic Institute

½ Day Course: 1:00 pm - 5:00 pm
M9
3-D IC Integration

Course Leader: Dr. Philip E. Garrou, Microelectronic Consultants of NC

For more information, please visit www.imaps2010.org and make your reservations. IMAPS 2010 is a golden opportunity to expand your knowledge and your business and shouldn’t be missed.

ATW on Thermal Management - Begins Next Tuesday   ^ Top
The Advanced Technology Workshop and Tabletop Exhibition on Thermal Management will be held September 28-30, 2010, at the Dinah's Garden Hotel in Palo Alto, CA. Visit www.imaps.org/thermal today for full tabletop exhibition details and to register. Exhibits are now sold out.

Tuesday, September 28

Registration: 7:30 am - 8:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Opening Remarks: 8:25 am - 8:30 am

Exhibit Opens: During Breaks & Lunch

Session 1: Market Drivers
Chair: Dave Saums, DS&A LLC
8:30 am - 10:00 am

Market Trends and Developments for Coolants for Electronic Systems
David L. Saums, DS&A LLC

Extending the Life of Air Cooling Through Architecture
Roger Dickinson, Bergquist Torrington Company

Passive 2-Phase Immersion Cooling of Commercial and Developmental IGBT Modules
Phillip Tuma, 3M Company; Gilbert Moreno, Sreekant Narumanchi, National Renewable Energy Lab; Scott Brandenburg, Delphi; Mitchell Olszewski, Timothy Burress, Oak Ridge National Laboratory

Break: 10:00 am - 10:30 am

Session 2: Thermal Packaging Materials
Chair: George A. Meyer IV, Celsia Technologies
10:30 am - 12:00 pm

High Heat Flux, Low CTE Vapor Chamber Development
Evan Fleming, Pete Dussinger, Advanced Cooling Technologies, Inc.

Trends and Developments for IGBT Module Packaging and Thermal Materials
David L. Saums, DS&A LLC

Thermal Management for LED Lighting
Richard Hill, Laird Technologies

Lunch: 12:00 pm - 1:30 pm (Lunch served 12:00 pm - 1:00 pm)

Nano-Bond Assembly: A Rapid Room Temperature and Fluxless Soldering Process
Jacques Matteau, Indium Corporation of America

Session 3:  Thermal Analysis and Modeling
Chair: Guy R. Wagner, Electronic Cooling Solutions
2:00 pm - 5:00 pm

Student
Competition
Presentation

Adaptive Power Blurring Techniques to Calculate IC Temperature Profile under Large Temperature Variations
Amirkoushyar Ziabari, Zhixi Bian, Ali Shakouri, University of California - Santa Cruz


Simultaneous Thermal Imaging of Peltier and Joule Effects
Bjorn Vermeersch, Ali Shakouri, University of California - Santa Cruz

Break: 3:00 pm - 3:30 pm

Thermal Analysis and Testing of a Radio Frequency Pin Diode Switch for Avionics Applications
Robert Meikle, Rockwell Collins, Inc.

Design Optimization Framework for Integrated Cooling Systems
Brian St. Rock, Scott Kaslusky, United Technologies Research Center

Simulation of a Concentrating Solar Electric Generator
Guy Wagner, Electronic Cooling Solutions

Dinner: 5:00 pm - 6:30 pm

Session 3:  Thermal Analysis and Modeling (continues)
Chair: Guy R. Wagner, Electronic Cooling Solutions
6:30 pm - 8:00 pm

Thermal Management of a Novel iUHD-Technology Based MCM
William Roy, Peter Kwok, Livia Racz, Chung-Jen Chen, Draper Laboratory

Thermal Load Boards Improve Product Development Process
Bernie Siegal, Thermal Engineering Associates, Inc.

Thermoelectric Waste Heat Recovery in Notebook Computers - Optimization and Limitation
Kazuaki Yazawa, Ali Shakouri, University of California - Santa Cruz

Wednesday, September 29

Registration: 7:30 am - 8:30 pm

Continental Breakfast: 7:30 am - 8:30 am

Exhibit Opens: During Breaks & Lunch

Session 4: Thermal Interface Materials and Testing
Chair: Dave Saums, DS&A LLC
8:30 am - 12:00 pm

Student
Competition
Presentation

The Use of Infrared Imaging Microscope in the Measurement of Total Thermal Resistance of Vertically Aligned Carbon Nanotube Arrays
Andrew J. McNamara, Vivek Sahu, Yogendra Joshi, Zhuomin M. Zhang, Georgia Institute of Technology

Thermal Stress Management for Large IC Packages
M. Shane Thompson, LORD Corporation

Comparative Test Data for TIM Materials for Silicon and Silicon Carbide IGBT Modules
Victor Papanu, John Ziemski, AOS Thermal Compounds LLC

Break: 10:00 am - 10:30 am

Development of a New Type Thermal Interface Material (TIM1) for High Power Microprocessors
My Nguyen, Jason Brandi, Henkel Corporation

Thermal Transient Based TIM Material Characterization
Andras Vass-Varnai, Zoltan Sarkany, Gabor Farkas, Andras Poppe, Marta Rencz, Mentor Graphics

Reliability and Failure Mechanisms of Thermal Interface Materials in Electronic Assemblies
Ryan Verhulst, Radesh Jewram, Bergquist Company

Lunch: 12:00 pm - 1:30 pm (Lunch served 12:00 pm - 1:00 pm)

Session 5: Liquid, Phase-Change, and Refrigeration Cooling
Chair: John Peeples, The Citadel
1:30 pm - 5:30 pm

The Water Cooled Power7 IH Supercomputing Node/System - Part I
Michael J. Ellsworth, Jr., IBM Corporation

The Water Cooled Power7 IH Supercomputing Node/System - Part II
Michael J. Ellsworth, Jr., IBM Corporation

CPU Spray Cooling Analysis
Charles Ortloff, CFD Consultants International; Marlin Vogel, Electronic Cooling Solutions  

Break: 3:00 pm - 3:30 pm

Loop Vapor Chambers for Consumer Applications
George A. Meyer IV, Celsia Technologies

Student
Competition
Presentation

Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots
Vivek Sahu, Yogendra Joshi, Andrei Fedorov, Georgia Institute of Technology

Thermoelectric Cooling Modules Constructed using Thermally Conductive PCBs
Jeff Hershberger, Robert Smythe, Richard Hill, Laird Technologies

Performance of Passive 2-Phase Immersion Cooling of Server Hardware
Phillip Tuma, 3M Company; Benson Chan, How Lin, Endicott Interconnect; Stephen Polzer, Nathan Harff, Erik Daniel, Barry Gilbert, Mayo Clinic

Dinner: 5:30 pm - 7:00 pm

Session 6: Military and Aerospace Applications
Chair: Ross Wilcoxon, Rockwell Collins, Inc.
7:00 pm - 8:30 pm

An Integrated Centrifugal Blower Design for High Performance Air-Cooled Heat Sinks
Scott Kaslusky, Brian St. Rock, United Technologies Research Center

Thermoelectric Energy Harvesting - A Comparison of Flight Test Data to Test Bench and CFD Simulations
John Langley, Steve Morris, Marshall Taylor, Ambient Micro; Guy Wagner, Electronic Cooling Solutions

High Efficiency Compact Air to Air Heat Exchanger with Integrated Fan
Nicholas Herrick-Kaiser, AMETEK Rotron

Thursday, September 30

Registration: 7:30 am - 12:00 pm

Continental Breakfast: 7:30 am - 8:30 am

Session 7: System Cooling
Chair: Marlin Vogel, Electronic Cooling Solutions
8:30 am - 10:00 am

Micro Deformation Technology - A New Manufacturing Process to Create High Surface Area Cold Plates and Base Plates for Liquid Cooling of Power Electronics
Matt Reeves, Peter J. Beucher, Wolverine Tube, Inc. - MicroCool Division

Liquid Cooling with MicroChannel Enhanced Base Plates are Making In-Roads into the High-End Server Market
Peter Beucher, Jesus Moreno, Sy-Jenq Loong, Wolverine Tube, Inc. - MicroCool Division

Using Flow Optimizers to Save Cooling Fan Power
Howard Harrison, Distributed Thermal Systems

Break: 10:00 am - 10:30 am

Session 8: Data Center Cooling
Chair: David Copeland, Oracle
10:30 am - 12:00 pm

Room-Level Energy and Thermal Management in Data Centers
Magnus Herrlin, ANCIS

Real-Time Data Center Transient Analysis
Xuanhang (Simon) Zhang, James W. VanGilder, APC by Schneider Electric

Experimental Study of Rack Level Cooling in a Data Center
Susheela Narasimhan, Cisco Systems Inc.

Closing Remarks: 12:00 pm

Register On-line

Component Authentication and Screening Webinar Begins in 2 Weeks    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Component Authentication and Screening
Presented by: Bhanu Sood, University of Maryland, CALCE
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, October 6 and 13, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Rheology Issues in Electronic Packaging

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, November 16, 23 and 30, 2010. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Advances in WLED Technologies for Lighting and Backlighting
Presented by: Frank Shi, University of California, Irvine
This two-session on-line Professional Development Course (PDC) webinar will be held: November-December 2010 (TBD). All webinars will be held 12:00 noon - 1:30 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

IMAPS 2010 Golf Tournament and Ca-Si-No Night to Benefit the Microelectronics Foundation    ^ Top
16th IMAPS Golf Tournament to Benefit the Microelectronics Foundation
The IMAPS Foundation funds Technical Paper contests at workshops, Poster contests at the Symposium and at local events and helps to provide special travel funds for student events. This year we funded transportation costs for high school students to attend the Printed Electronic Workshop in Florida and several other students to travel to the RF workshop.

The funds for these types of events comes from donations and special fund raising events at the annual IMAPS Symposium. This year we are once again host a golf event at the Lonnie Poole golf course on the Centennial Campus of North Carolina State University. This course was designed by Arnold Palmer and was just opened to the Public in 2009 (see attached flyer).

This year we are looking for hole sponsors at $500 a hole. In return the sponsor will receive two golf T-times, publicity on the course and in the conference program. Although this may be a limited opportunity for publicity, the important point is that these donations to a 501.c3 charity are being used to support IMAPS students and help provide a better education experience for the next generation. I urge you to consider sponsoring a hole at the 16th IMAPS benefit for the Microelectronics Foundation. Consider donating the tickets for two T-times to your customers or come and spend several hours on the course with them. It will be a day they will remember you by. Full details on-line at www.imaps.org/imaps2010/golf.htm.

IMAPS Foundation Ca-Si-No Night and benefit Auction
If you or your customers do not play golf then have arranged a fun evening  Ca-si-no Night . On Tuesday November 2nd the Foundation will be hosting a evening of fun and entertainment. This is a limited ticket event and only the first 75 people will get tickets. Join us for an evening of chance an opportunity to win a grand prize, while making a donation to the Foundation. The cost will be $65 per person and ticket sales will be in advance when registration opens.

The Foundation also has a benefit auction and we urge members and chapters to consider making a donation of items such as an IPOD, GPS, bottles of wine or produce from your local part of the world that can be shipped to a winning auction bidder. Last year we had several bottle of wine reach $75 for the winning bid. We also had a couple of time share weeks donated for auction. All of these type of donations are readily accepted for the auction and each small contribution helps the Foundation.

So please take a minute and think if you can help us with a donation, sponsorship of a golf hole and attend one of the events and have some fun. Its all for a good cause and the more you enjoy these events the more the Foundation can do to help Students.

Regards,
Steve Adamson
IMAPS Microelectronic Foundation Chairman

  Chapter Activities (events listed in chronological order)
 

NEXT TUESDAY: IMAPS New England Chapter September 28 Dinner Meeting on Thermal Evaluation of Materials for LEDs    ^ Top

Dates: September 28, 2010
Schedule: 5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:15 PM Technical Presentation
Location:

The Marriott Courtyard – Marlborough, MA
75 Felton St.
Marlborough, MA 01752
508-480-0015

Cost:

Members: $25.00 if Pre-Registered by September 23, 2010.
$30.00 after September 23, 2010

Non-Members: $30.00 if Pre-Registered by September 23, 2010
$35.00 After September 23, 2010

Retired Members: $20.00 if Pre-Registered by September 23, 2010
$25.00 After September 23, 2010

Studentss: $5.00 if Pre-Registered by September 23, 2010
$10.00 After September 23, 2010

If you fail to cancel by noon on Friday [09/24] The Chapter will bill you for the registration fee

RSVP:

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner. SEND NO MONEY! BRING checks payable to “IMAPS New England”.

RSVP to: Jennifer Bailey bailey_jj@yahoo.com or call 781-696-9369 and note member status, dinner, and contact details.

"Thermal Evaluation of Materials for LEDs"
Adam Scotch, Ph.D.
Principal Scientist - OSRAM SYLVANIA

START PLANNING TODAY
IMAPS New England 38th Symposium & Expo

Tuesday May 3rd, 2011 at The Holiday Inn Boxborough Woods Conference Center

For information on exhibiting contact Harvey Smith

For information on presenting a paper or chairing a session contact Roger Benson

For the latest information please visit our website at www.imapsne.org

IMAPS Chesapeake Chapter October 5 Dinner Meeting    ^ Top

Dates: Tuesday, October 5, 2010
Schedule: 3:00 - Registration, Networking, and Participant Introductions begin
Location:

Applied Physics Laboratory of Johns Hopkins University
11100 Johns Hopkins Road
Laurel, MD 20723
For map and directions visit www.jhuapl.edu
Enter in the area marked Lobby 1 and check-in with APL staff

Cost:

On-line registration information will be e-mailed in two weeks

High Reliability Packaging for Defense & National Security

Program:

    3:00   Registration, Networking, and Participant Introductions.

    3:30   William Marsh, Senior Advisory Engineer of Northrop Grumman
               Hi-Rel Avionics at Northrop Grumman

   4:00   Nathan Blattua, Chief Technologist at DfR Solutions  
            Underfill Induced Tensile Strain Ratcheting and its Effect on Flip Chip Solder Bump Fatigue.
            
   4:30  Break (beverages served)
 
   4:45  Andrei Shkel, Program Manager at DARPA
            Precision Navigation and Timing Enabled by Micro Technology: Are We There Yet

   5:15 Event wrap-up.  Ideas for next event.  Elections.  Other business.

   5:30 Dinner

IMAPS Northern California Chapter October 6 Lunch Meeting on One Dimensional Nanostructures for Electronics and Photonics Applications    ^ Top

Dates: Wednesday, October 6, 2010
Schedule: 11:30 – 12:00 Registration & Networking
11:30 – 12:15 Buffet Luncheon
12:15 – 1:00 Speaker Presentation
Location:

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054
408-986-1666

Cost:

IMAPS Members $20.00;
Non-members $25.00;
Students (with ID) $10.00 SPACE IS LIMITED!

RSVP:

Only pre-registration guarantees lunch so pre-register by COB October 3. Pre-register: www.imaps.org/registration/2010oct_norcal.htm

One Dimensional Nanostructures for Electronics and Photonics Applications 

Presented by:
M. Meyyappan, Ph.D., Chief Scientist, NASA-Ames

Abstract:
Carbon nanotubes(CNTs) have received much attention for a variety of applications in the last decade due to their unique electronic properties and extraordinary mechanical properties. The ability to grow various semiconductor, oxide and other inorganic materials in the form of nanowires with controlled properties and orientation also provides a competitive avenue for many of those applications. Interestingly, growth of the inorganic nanowires and carbon nanotubes by processes such as chemical vapor deposition follows a common basis of vapor-liquid-solid mechanism. This talk will address growth and processing related issues in the preparation of carbon nanotubes, carbon nanofibers and various oxide and semiconduction nanowires. Integration of these one dimensional structures in applications will be illustrated with examples in the fields of electronics and photonics.

Presenter Bio:
Dr. Meyyappan is Chief Scientist for Exploration Technology at the Center for Nanotechnology, NASA Ames Research Center in Moffett Field, He was Director of the Center for Nanotechnology and Senior Scientist until June 2006. He is a founding member of the Interagency Working Group on Nanotechnology(IWGN) established by the Office of Science and Technology Policy(OSTP). He has authored or co-authored over 200 articles in peer- reviewed journals and made over 200 Invited/Keynote/Plenary talks on nanotechnology subjects across the world. His research interests include carbon nanotubes and various inorganic nanowires, their growth and characterization, and application development in chemical and biosensors, instrumentation, electronics and optoelectronics.

Central Texas Electronics Association Electronics Design & Manufacturing Tech Forum & Expo    ^ Top

Dates: Thursday, October 7, 2010
Location:

Norris Conference Center
at Northcross Mall in Austin
2525 West Anderson Lane
Austin, Texas

Cost:

This event is complimentary for IMAPS members and their guests.

RSVP:

Only pre-registration guarantees lunch so pre-register by COB October 5. Pre-register On-line

Program:

10:30 – 5:00 Trade Show Open

11:00 Dr. Randy Schueller of DfR Solutions. "Key Reliability Risks on Pb-free Products."

12:00 Complimentary Lunch and Door Prize Drawings

1:00 Iga Hallberg of HelioVolt. "Solar Power - Macroeconomic Trends."

2:15 Dr. Ron Lasky of Indium Corporation. "Establishing a High-Yield, Pb-free Process, including Ultra Fine Pitch Printing for Passives & CSPs."

3:00 Afternoon Refreshments, Networking, and Door Prize Drawings

3:30 David Carey of UBM TechInsights. "Packaging for Portables: Going Vertical and Getting Small."

5:00 More Door Prize Drawings

IMAPS Rocky Mountain Chapter October 12 Fall Symposium    ^ Top

Dates: Tuesday, October 12, 2010
Schedule: 3:00 Registration Opens
Location:

Atmel ( www.atmel.com )
719-540-1000
1150 E. Cheyenne Mountain Blvd.
Colorado Springs, CO 80906

Cost:

IMAPS Members $15.00;
Non-members $25.00;
Students (with ID) $5.00 SPACE IS LIMITED!

RSVP:

Only pre-registration guarantees lunch so pre-register by COB October 8. Pre-register On-line

Program:

3:00 Registration, Participant Introductions, Atmel Welcome, and Chapter Business

3:30 “Migrating from Paper to Interactive Paperless Work Instructions for Microelectronics.” Bill Loving, President & CEO of ScanCAD International, Inc.

4:15 Break

4:30 Atmel Tour
Atmel is a world leading supplier of micro-controllers, memory, and ASIC-integrated circuits. Atmel produced well over 1 billion integrated circuits in 2009. A window tour of the wafer fabrication facility will feature Atmel’s CMOS 150mm technology. Fabrication manager, Dan Malinaric, will lead the tour. Participants should plan on about ¼ mile of walking.

5:15 Catered Dinner

Presentation Abstract & Presenter Bios:

Key effects of increasing regulatory requirements and microelectronics globalization are the needs to disseminate and collect information across the shop floor and the enterprise. A variety of process and information technologies can provide solutions for process management and product traceability. Electronic process trees and work instructions can be used as collaborative information portals.

Bill Loving is President & CEO of ScanCAD International, Inc., a global provider of process control tools for the electronics industry. Bill focuses his energy on technologies as PCB re-engineering systems, stencil & screen inspection systems, and work instruction software. He joined ScanCAD in 1990. Previously, Bill worked for IBM and OZO Diversified Automation. He earned a Bachelor of Science in Mechanical Engineering.

IMAPS Chicago-Milwaukee Chapter October 13 Fall Technical Symposium on Failure Analysis    ^ Top

Dates: Wednesday, October 13, 2010
Location:

Sonoscan
847-437-6400
2149 E. Pratt Blvd.
Elk Grove Village, IL 60007

Cost:

IMAPS Members $15.00;
Non-members $20.00;
Students & Displaced Members $5.00
SPACE IS LIMITED!

RSVP:

Only pre-registration guarantees lunch so pre-register by COB October 9. Pre-register On-line

Program:

11:30 Registration and Networking

12:00 Lunch and Chapter Announcements

12:45 “Safety Science Research at UL and Hazard-Based Safety Engineering.”
Paul Brazis of Underwriters Laboratories, Inc.

1:15 “Dependant and Interdependent SMT Package Failures in Failure Case Histories.”
Paco Solis of Foresite

1:45 Break

2:00 “Analyzing and Predicting Electrochemical Migration Failures on Field Failure Returns.”
Chris Finch of Trace Laboratories, Inc.

2:30 “Head-In-Pillow Defects - Relevant to PoP and BGA Production Assembly.”
Rafael Padilla of SMIC Senju Comtel Corp.

3:00 “Advancements and Applications in Acoustic Micro Imaging.”
Jack Richtsmeier of Sonoscan

3:30 Tour and Demonstration

4:00 Conclusion

IMAPS Europe Co-Sponsoring SEMICON Advanced Packaging Conference Enabling Packaging Technologies for System Integration    ^ Top
SEMICON Advanced Packaging Conference
Enabling Packaging Technologies for System Integration
in conjunction with SEMICON Europa
2010 19-20 October
Dresden, Germany
Details on-line

IMPACT 2010 (The 5th International Microsystems, Packaging, Assembly and Circuits Technology)    ^ Top
2010 is a rebounding year of electronics industry. Google smart phones, smartbooks, eBooks, touch-screen devices, cloud computing, hybrid cars, wireless-sensor apparatuses and etc will be released in this year. It will bring countless business opportunity and possibility in to the market. Taiwan takes the lead in semiconductor, packaging, assembly and PCB industries in the world. With the advanced technologies in R&D and manufacturing, IMPACT will be a great platform for experience exchange and acquiring market trends.  

IMPACT 2010 as the fifth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, Tsing Hua University, SIPO and TPCA, points the theme that Embrace IMPACT, Create Possibilities to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. With the approach of recovery, such a great event looks forward to your paper to trigger off global impact on the earth.

Embrace IMPACT, Create Possibilities...

Date: Wednesday-Friday, October 20-22, 2010
Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan
Conference: The 5th IMPACT Conference
Exhibition: TPCA Show 2010

Plenary Speakers:

  • Dr. Rolf Aschenbrenner, President of the IEEE-CPMT Board The Fraunhofer IZM in Germany
  • Dr. Happy T. Holden, Vice President & chief technical officer Foxconn Technology Group in USA/Taiwan
  • Dr. Douglas C.H. Yu, Senior Director Taiwan Semiconductor Manufacturing Company (TSMC)  

For questions on paper submission, please contact:  

Technical Program Chair  
Prof. Hsien-Chie Cheng 鄭仙志
International Microelectronics And Packaging Society (IMAPS-Taiwan)  

Technical Program Cochair  
Dr. Wei-Chung Lo 駱韋仲
Industrial Technology Research Institute (ITRI)  

Requests for information about the symposia should be directed to:    
Secretariat
Taiwan Printed Circuit Association
Tel: +886 3 381 5659 #405 (Sylvia Yang)
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

IMAPS Keystone Chapter October 21 L-3 Plant Tour and Dinner Meeting on Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements    ^ Top

Dates: Thursday, October 21, 2010
Location:

L-3 Communications, Communication Systems - East
1 Federal Street
Camden, NJ 08103 Camden NJ 08103
(856) 338 3445

For Directions and Parking Info click here - http://www.l-3com.com/cs-east/ie_locmap.shtml

Park in the Visitor’s lot, 2nd gate on the left, once you get in the main entrance. There are two buildings on-site. The tour will be in the large 2 story manufacturing building to the east, away from the Delaware river.

Cost:

Advance $15.00;
Onsite $20.00

Students $0 with ID

RSVP:

Advance registration ends Monday, Oct 18th Participation is limited so register soon by e-mailing Greg Chesmar at gregches@aol.com Please register with the same name that is on your citizenship ID.

Program:

5:00 SHARP Plant Tour at L-3 Communications Features PCB surface mount lines at L-3 Communication East’s Manufacturing Facility.

6:00 Dinner

6:45 Keystone Chapter Business Meeting

7:00 L- 3 Communications Overview Presentation by Martha Veselka

7:15 “Ensuring Compliance to Next Generation of Industry and DoD Specifications and Requirements.” Craig Hillman, CEO of DfR Solutions

8: 00 Event Review and Planning Future Events

ALL PARTICIPANTS MUST PRODUCE AT LEAST ONE ID VERIFICATION AS PROOF OF US CITIZENSHIP TO PARTICIPATE!
Acceptable IDs are 1) E-mail from company HR Dept or school administration stating proof 2) Original passport. No copies allowed. 3) Original birth certificate. No copies allowed.

Presentation Abstract:
The U.S. Dept. of Defense (DoD) has initiated multiple efforts to revitalize reliability in defense systems acquisition and development. One of these projects involves updating MIL-HDBK-217 Rev F, the often imitated and frequently criticized reliability prediction bible for electronics equipment. The current version of this document defines a 1960 era actuarial approach where field failure data is fitted to statistical, empirical models to create tables of historical random failure rates for generic families of electronic component in various usage stress conditions. The tables are then used in a part counting technique to create a Mean Time To Failure (MTTF) estimate that can be further de-rated based on thermal stress conditions. It has not been updated since 1995 partly because this approach does not address infant mortality quality and end of life wear our related failure issues.

While there is still support for the actuarial approach in some quarters, the MIL-HDBK-217 revision team workgroup has also proposed modernizing reliability prediction techniques to include and standardize ways of using modern Computer Aided Engineering (CAE) analysis tools with science-based Physics of Failure (PoF) reliability modeling, simulations and probabilistic mechanics techniques. The CAE-PoF approach is based in the analysis of loads and stresses in an application and evaluating the ability of materials in a device to endure them from a strength and mechanics of material point of view. This approach has been proven to resolve many of the current limitations of traditional actuarial based reliability prediction methods.

The PoF approach used a virtual Computer Aided Design (CAD) representation of a new device to perform a virtual durability simulation. The result is a detailed reliability assessment of which items (components, material and features) in the new design are the most likely to fail, to which failure mechanisms, their individual time to first failure and their rate of failure growth there after. The interactive use of this analysis capability as the design is being created enables designers to identify and design out susceptibility to failure mechanisms by making design, material and manufacturing choices that minimize failure opportunities. This approach can be considered a form of Virtual Reliability Growth that produces reliability optimized, robust designs.

This proposal has been submitted and is under going review. This paper provides a brief overview of PoF methods and reviews the concepts on how they can be applied to update and modernize the reliability prediction techniques in MIL-HDBK-217 from the point of view of a member of the 217 revision team.

Presenter Bio:
Dr. Craig Hillman is the Chief Executive Officer of DfR Solutions. His specialties include best practices in Design for Reliability (DfR), strategies for transitioning to Pb-free, supplier qualification (commodity and engineered products), passive component technology (capacitors, resistors, etc.), and printed board failure mechanisms. During his years of experience in electronic packaging, Dr. Hillman has performed or directly supervised over 500 projects for over 150 companies in the area of quality and reliability of electronic components, products, and systems. Before forming DfR Solutions in 2004, he was the Director of Laboratory Services for CALCE Electronic Products and Systems Center. Dr. Hillman has over 40 publications and has presented on a wide variety of reliability issues to over 200 companies and organizations. He holds a B.S. from Carnegie Mellon in Metallurgical Engineering and Materials Science and Engineering and Public Policy and a PhD from University of California – Santa Barbara in Materials Science and was awarded a research fellowship at Cambridge University in England

IMAPS Garden State Chapter November 9 Dinner UTZ Facility Tour and Dinner Meeting on Low Cost Hermetic Sealing    ^ Top

Dates: Tuesday, November 9, 2010
Schedule: 5:00 Registration, Networking, and Opening Remarks
5:30 “Plant tour at the new UTZ facility”
6:30 Dinner Buffet
7:00 Presentation
7:45 Closing Remarks
Location:

UTZ --- http://www.utz.com
4 Peckman road
Little Falls NJ 07424-1631

Cost:

IMAPS Members $25.00;
Non-members $35.00;
Students (with ID) $10.00 SPACE IS LIMITED!

RSVP:

Only pre-registration guarantees lunch so pre-register by COB November 5. Pre-register On-line

Program:

5:00 Registration, Networking, and Opening Remarks

5:30 “Plant tour at the new UTZ facility”

6:30 Dinner Buffet

7:00 Presentation on “Low Cost Hermetic Sealing” by Thomas E. Salzer

Tom received degrees in mechanical engineering with high honors from Northeastern University. He spent 35 years as a principal engineer for Raytheon Company, most of this time devoted to areas of semiconductor and hybrid circuit assembly, reliability, and environmental testing. He has been awarded 15 US Patents, and has published more than 25 technical articles. Tom is the president of Hermetic, Inc., where he is involved in various semiconductor reliability related projects. His professional interests include the use of annular projection welding for production of low cost hermetic seals. He consults for several manufacturers, and is engaged in a wide range of projects including hermetic sealing of semiconductor, automotive, scientific instrument, medical implants, MEMS, photonic, and other devices.

7:45 Closing Remarks. (Planning the next event, recruiting chapter officers).

IMAPS France 6th ATW on Micropackaging and Thermal Management    ^ Top

Dates: February 2-3, 2011
Location:

Mercure Oceanide Vieux Port Sud La Rochelle

Details: www.imapsfrance.org

Conference Chairman :
Jean-Claude RAMES (MBDA France)

Technical Programme Committee:
Nick CHANDLER (BAE SYSTEMS)
Pierre LEWANDOWSKI (CONTINENTAL AUTOMOTIVE)
Michel MASSIOT (EGIDE)
Michel MERMET GUYENNET (ALSTOM)
Gilles POUPON (CEA LETI)
Claude SARNO (THALES AVIONICS)
Dave SAUMS (DS & A LLC)
Richard SEDDON (TECNALIA AEROSPACE)
Jean-Marc YANNOU (YOLE Développement)

The workshop sessions will include the following topics and papers are invited in
these areas:

  • Cooling solutions for microelectronics packaging,
  • Microcooling solutions,
  • Heat conductive materialsChip, board and system thermal management,
  • Thermal modelisation and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Experience return (products and systems cooling, power electronics, automotive
    transport,…)
  • Thermal management of opto electronics components.

Speakers should submit a 200-300 words abstract describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions) not later than November 5, 2010.

Speakers are required to pay a reduced registration fee (441.47 € exlcuded VAT) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: November 26, 2010.

Answer to Florence Vireton
by e-mail: imaps.france@imapsfrance.org
by fax: +33 (0) 1 39 02 71 93

TABLE TOP EXHIBITION (limited number first come first serve basis) : 1 table, 2 chairs 1 panel. Presentation of your activity, your last products and results (only for companies in relation with thermal management). 300 € excluded VAT


   
   

Oneida Research Services

ATW on Thermal Management
September 28-30
Palo Alto, CA
*Exhibitors contact abell@imaps.org

Webinar on Component Assurance and Screening
October 6, 13

IMAPS 2010 - Research Triangle
Oct 31 - Nov 4
Raleigh, NC

*Exhibitors contact abell@imaps.org

Webinar on Rheology Issues in Electronic Packaging
November 16, 23, 30

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact abell@imaps.org

ATW on Packaging of Solar Cells and Fuel Cells
March 29-30
Palo Alto, CA

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