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April 14, 2011
 

Palomar Technologies

   IMAPS EVENTS
Button Program and Registration Now Available for the Workshop on High Reliability Microelectronics for Military Applications (read more...)

Button Hybrid and Microwave Module Design for Manufacturability (DFM) Webinar NEXT WEEK (read more...)

Button Abstracts Due Next Week for the IMAPS/SEMI Workshop on Wire Bonding (read more...)

Button IMAPS/SEMI Workshop on Advanced Interconnect and Substrate Technologies - Abstracts Due (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Florida Chapter April 28 Technical Meeting on Near-Hermetic Electronic Packages (read more...)

Bullet New England Chapter 38th Symposium & Expo on May 3 (read more...)

Bullet France Chapter To Hold MiNaPAD Forum 2011 on May 11-12 (read more...)

Bullet Nordic Chapter Conference in Finland June 5-8 (read more...)

Bullet UK Chapter Hosting EMPC2011 (read more...)

Bullet IMAPS Taiwan Chapter's IMPACT is now calling papers until June 10 (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

Program and Registration Now Available for the Workshop on High Reliability Microelectronics for Military Applications    ^ Top
IMAPS Advanced Technology Workshop on High Reliability Microelectronics for Military Applications will be held at the Holiday Inn Baltimore-BWI International Airport in Baltimore, Maryland, on May 17-19, 2011. For the technical program, registration and other details, visit www.imaps.org/military.

The International Microelectronics And Packaging Society (IMAPS) is sponsoring an Advanced Technology Workshop on Military High Reliability Packaging Issues and Applications to be held May 17 - 19, 2011, at the Holiday Inn Baltimore-BWI International Airport (soon to be the Doubletree BWI), Linthicum Heights, Maryland.

In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level.

Tuesday, May 17

Registration: 7:00 am - 5:50 pm
Continental Breakfast: 7:15 am - 8:00 am

Opening Remarks: 8:00 am - 8:15 am
General Chair: Greg Caswell, DfR Solutions

Keynote Presentation: 8:15 am - 9:00 am
Department of Homeland Security Project Shield America Export Compliance

William F. Corcoran, Special Agent, Department of Homeland Security

Session 1: Reliability Issues
Session Chair: Jeff Kennedy, Celestica, Inc
9:00 am - 12:30 pm

Likelihood of Metal Vapor Arc by Tin Whiskers
Sungwon Han, Michael Osterman, University of Maryland - CALCE

Thermal Cycling Reliability of Sn96.5Ag3.0Cu0.5 Solder Assembled with ENIG and OSP Pad Finishes
Preeti Chauhan, Michael Osterman, Michael Pecht, University of Maryland

Impact of Dwell Time on Solder Joint Reliability under Four Point Bend Testing 
Sandeep Menon, Michael Osterman, University of Maryland - CALCE

Break: 10:30 am - 11:00 am

Effectiveness of Conformal Coatings on Surface Mount Components as Tin Whisker Mitigation 
Curtis Johnson, Sungwon Han, Michael Osterman, University of Maryland - CALCE

3D X-Ray CT Analysis of Solder Joints in Area Array Electronic Package Assemblies 
Rajen Chanchani, Jeremy Palmer, Sandia National Laboratories

Computational Modeling of Plastic Ball Grid Array Reliability in Satellite Applications
Stephen Garrett, Sandia National Laboratories

Lunch: 12:30 pm - 1:30 pm

Keynote Speaker: 1:35 pm - 2:20 pm
The Revolution in Military Affairs: IT and CYBER
Mark B. Pizzo, Colonel, USMC (Ret.)
Chief of Staff / Dean of Students
National War College

Colonel Mark B. Pizzo enlisted in March 1971, and was commissioned a second lieutenant in October, 1971.  He reported to 3rd Marine Division, Okinawa, Japan, and was assigned to the 9th Marines where he completed duties in Vietnam and Southeast Asia.  In 1974, he completed naval aerial observer training and then Amphibious Warfare School.

As a Major, from 1982 to 1984, he was assigned duties as the Commanding Officer, Marine Barracks, Sigonella, Sicily, and CO, 14th Interrogator Translator Team, Beirut, Lebanon.  Following these tours, he attended the Marine Corps Command and Staff College where he was a distinguished graduate.

Upon promotion to Lieutenant Colonel, he was ordered to Washington D.C., where he served at Headquarters Marine Corps, attended the National War College, and served in the Office of the Secretary of Defense for Drug Enforcement Policy and Strategy.

Promoted to the rank of Colonel in 1993, he was ordered to Okinawa, Japan where he served as the 3rd Marine Division G3 (Operations), and as Commanding Officer, 31st Marine Expeditionary Unit (Special Operations Capable).  In 1998, he was ordered to duties as the Senior Marine Fellow, National War College, where he completes a career of over 31 years of honorable service to the nation.

In 2002, he worked as a consultant for ANSER Homeland Security and The Department of Agriculture regarding Bio-terrorism. From 2002-2004 he conducted seminars and lectures about National Security Strategy, Military Operations, and Terrorism for community outreach programs.

In 2004 he assumed the civilian position (SES equivalent) as Chief of Staff and Dean of Students of the National War College, where he continues to work and teach today.

Session 2: System Level Issues
Session Chairs: Carolynn Drudik, DMEA
 2:20 pm - 5:50 pm

Conversion of a High Reliability Exempt Product to Lead Free: Lessons Learned - 4 Years Into RoHS 
Robert Farrell, Paul Bodmer, Jim Angell, Tony Cosentino, David Sparrow, Robert Gardiner, Greg Morose, Benchmark Electronics

Structural Electronics: A New 3D Additive Manufacturing Paradigm 
Ken Church, Mike Newton, Eric MacDonald, Ryan Wicker, nScrypt, Inc. 

Microelectronics Packaging of a Micro Gas Analyzer 
Jay Johnson, Dahwey Chu, Matt Moorman, R. J. Simonson, Greg Bogart, Sandia National Laboratories 

Break: 3:50 pm - 4:20 pm

Canary - Ion Spectroscopy for Ionospheric Sensing 
Howard Feldmesser, M. A. G. Darrin, R. Osiander, L. J. Paxton, A. Q. Rogers, J. A. Marks, The Johns Hopkins University Applied Physics Laboratory; M. G. McHarg, R. L. Balthazor, L. H. Krause, J. G. FitzGerald, United States Air Force Academy   

This Is Not a Test
Walt Tomczykowski, Cheryl Tulkoff, DfR Solutions, LLC

Considerations for System Level Integration of High-Reliability Microelectronics
Maxine Pennington, Honeywell Federal Manufacturing and Technology

Wednesday, May 18

Registration: 7:00 am - 3:30 pm
Continental Breakfast: 7:15 am - 8:00 am

Session 3: Application Issues
Session Chair: Jeremy Palmer, Sandia National Laboratories
8:00 am - 11:30 am

Using Manifold Microchannel Coolers to Reduce the Power Electronics Thermal Stack
Lauren Boteler, Nicholas Jankowski, Brian Morgan, Army Research Laboratory; Patrick McCluskey, University of Maryland - CALCE

Prognostics of Lithium-Ion Batteries using Extended Kalman Filtering
Wei He, Nicholas Williard, Michael Osterman, Michael Pecht, University of Maryland - CALCE

Quantitatively Predicting the Reliability of Complex Integrated Circuits
Ed Wyrwas, DfR Solutions, LLC

Break: 9:30 am - 10:00 am

Superhydrophobic Coatings on Microelectronics
Andrew Jones, Vinod Sikka, Ross Nanotechnologies, LLC

Why Wedge Bond?
Lee Levine, Process Solutions Consulting, Inc.; Joe Bubel, Hesse & Knipps Inc.

Reliability Strategies for Lithium-Ion Batteries in Portable Electronic Systems
Nicholas Williard, Wei He, Michael Osterman, University of Maryland - CALCE

Lunch: 11:30 am - 12:30 pm

Session 4: Package Related Reliability Issues
Session Chair: Greg Caswell, DfR Solutions, LLC; Pamela Ball, DoD
12:30 pm - 3:30 pm

Evaluation of Process Indicators in High-Reliability Microelectronic Package Failure Analysis 
Jeremy Palmer, Michael K. Neilsen, Paul T. Vianco, Sandia National Laboratories

Identification of Cracked MLCCs on Printed Circuit Board Assemblies using Time Domain Reflectometry 
Thomas Fritzler, Michael H. Azarian, Michael Pecht, University of Maryland 

High Performance and Reliability Microelectronics Packaging
Kevin G. Ewsuk, Lu Fang, Dahwey Chu, Nathan Young, Sandia National Laboratories 

Break: 2:00 pm - 2:30 pm

CLCC Life Prediction under Complex Temperature Cycling Test 
Fei Chai, Michael Osterman, Michael Pecht, University of Maryland - CALCE

DNA to Safeguard Electrical Components & Protect Against Counterfeiting & Diversion
Janice Meraglia, Applied DNA Science

Thursday, May 19

Registration: 7:00 am - 11:00 am
Continental Breakfast: 7:30 am - 8:00 am

Session 5: Short Course - An Expert Reliability Analysis Tool
Session Chair: Dr. Nathan Blattau, Chief Technologist DfR Solutions, LLC
8:00 am - 11:00 am

This course will introduce a first‐of‐its‐kind Electronics Design Reliability (EDR) solution that will transform the process of analyzing, grading, and certifying the expected reliability of electronics products at the circuit board level.  Three outputs that become critical to the design process will be presented:

  • A reliability score - which calculates the likelihood that a product will perform reliably in the marketplace. The higher the score, the better the reliability.
  • Predicted performance over time - which product teams can use to help to project the profitability of a product over its lifecycle.
  • A physical map of reliability issues - which identifies to the user the likely points of failure (red flags) for rapid comprehension.

For the first time the principles of Physics‐of‐failure (PoF)‐based analysis - a new, more accurate method for predicting product reliability - including the following will be demonstrated, addressing:

  • Thermal measurement
  • PTH fatigue
  • Solder fatigue
  • CAF Analysis
  • Mechanical response to vibration, shock, and bending
  • IC Wearout
  • Electrolytic Capacitor Wearout
  • Component stress analysis
Dr. Nathan Blattau, Vice President of DfR Solutions, LLC has been involved in the packaging and reliability of electronic equipment for over eight years. Dr. Blattau is also experienced in failure analysis and accelerated testing methods. His primary research interests are in the areas of development of Physics of Failure models and algorithms, design-for-reliability in electronic packaging, nonlinear finite element analysis, solder joint reliability, fracture, and fatigue mechanics of materials. Through extensive testing, analysis, and simulation, Dr. Blattau has developed a thorough understanding of the defects and degradation mechanisms that can induce failure in Pb-free product.  Due to his efforts, Dr. Blattau was recently selected to lead a comprehensive reliability study on SN100C, a Pb-free alternative that is being considered as a replacement for SAC due to superior manufacturability. Dr. Blattau has written numerous articles and holds two patents pending in software-based simulation and accelerated life testing. He holds a B.S. in Civil Engineering, M.S. in Mechanical Engineering, and PhD in Mechanical Engineering, all from the University of Maryland.

Closing Remarks: 11:00 am

MET Laboratories Tour (Free to all Workshop Attendees)
Pre-Registration Required - See Registration Page.

Attendees have a special opportunity to extend their workshop with a free tour of a local testing laboratory. 

MET Laboratories does extensive MIL-STD testing, including Environmental Simulation (810, 202, 167 & RTCA/DO-160) and EMC Testing (461 & 462).

MET also does extensive testing and certification for Product Safety, Energy Star, Wireless, and Telecom/NEBS. In addition to its Baltimore lab, MET also has labs and operations in California, Texas, North Carolina, China, Korea, and Taiwan.

MET is just 7 miles away, and has offered to provide a free lunch and complimentary transportation to and from the hotel.  MET will be showing off a new EMC chamber that was just built in March 2011.

Here is the agenda:
11:45 Leave for MET
12:00 Lunch at MET
1:00 Introduction to MET & Lab Tour
2:30 Leave for hotel
2:45 Arrive at hotel

Register On-Line

Hybrid and Microwave Module Design for Manufacturability (DFM) Webinar NEXT WEEK    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Hybrid and Microwave Module Design for Manufacturability (DFM)
Presented by: Tom Green, TJ Green Associates, LLC
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesday, April 19, and Wednesday, April 20, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Mitigate the Risk of Counterfeit Electronic Parts
Presented by: Phil Zulueta, Jet Propulsion Laboratory, California Institute of Technology
This webinar will be held Friday, May 20, 2011, from 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Design for Thermal Cycling
Presented by: DfR Solutions
This webinar will be held Tuesday, May 24, 2011, from 12:00 noon - 1:00 pm EASTERN

A repeat of this webinar will be schedule for 8pm Eastern for the convenience of those in Asia, perhaps west coast USA and others.

PDC Webinar Series on
Solar Module Packaging Requirements: Designing for Decades of Reliable Performance while Minimizing Environmental Impacts
Presented by: Dr. Michelle Poliskie, Packaging Consultant in Silicon Valley
This two-session on-line Professional Development Course (PDC) webinar will be held Mondays, June 6, and 13, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held June 7, 8 and 9, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

Abstracts Due Next Week for the IMAPS/SEMI Workshop on Wire Bonding    ^ Top
IMAPS and SEMI proudly announce a Topical Workshop on Wire Bonding. The workshop will be held at the Marriott near the Moscone Center, San Francisco, CA - co-located with SEMICON West 2011 - on July 14, 2011. To submit an abstract and for more information, visit www.imaps.org/wirebonding.

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

  • Copper Ball Bonding and Bumping
  • Cu/Low-K Processes and Materials
  • Stacked Die and 3D Packaging
  • Au Wire Bonding and Bumping
  • Bonding High Brightness LEDs
  • Solar cell Bonding and Packaging
  • Novel Packaging and Design
  • Heavy Al Wire & Large Ribbon Bonding
  • Failure Analysis and Reliability
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically by April 22, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 17, 2011.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Be sure to attend other IMAPS co-located events:
IMAPS Workshop on Advanced Interconnect and Substrate Technologies (July 13); and

IMAPS TechXPOT on Next Generation Materials and Processing for High Performance Packaging (July 13).
And don't miss othe activities at SEMICON West 2011

IMAPS/SEMI Workshop on Advanced Interconnect and Substrate Technologies - Abstracts Due    ^ Top
IMAPS and SEMI proudly announce a Topical Workshop on Advanced Interconnect and Substrate Technologies. The workshop will be held at the Marriott near the Moscone Center, San Francisco, CA - co-located with SEMICON West 2011 - on July 13, 2011. To submit an abstract and for more information, visit www.imaps.org/advintercon.

The Advanced Interconnect Technologies Workshop has been organized to allow for the presentation and debate of some of the latest interconnect and processing technologies in Electronic Packaging that support ever increasing device pitch and the need to embed increased levels of both passive and active functionality. Sessions and presentations are planned around (but not limited to) the following topics:

  • 2D and 3D Interconnect, Materials/Processes
    • Innovative materials and processes are the key enablers for continuous development of advanced interconnect technologies for electronic packaging, such as 3D and high density packaging, photonic/optoelectronic packaging, underfill/encapsulants and adhesive, flip-chips, wirebonding and stud bumping, ceramic, polymer, nanomaterials, conductive materials, Cu/low-K, etc. Presentations in this session will cover the most recent developments in materials and processes for advanced interconnect technologies that support.
  • Substrate Technologies for Integrated Active and Passive Devices
    • Consumer and DoD demand for more function per unit volume require a move towards more volumetric efficient 3D packaging. This in turn drives the need for integrating higher levels of electronic functionality into laminates and substrates. The heterogeneous nature of fabrication required dictates new strategies of material integration/compatibility, thermal management and electrical testing. This session will explore technologies that support the both the embedding of passives and active devices as a heterogeneous structure and the challenges and opportunities this capability brings.

Those wishing to present a paper at the Advanced Interconnect Technologies Workshop must submit a 200-300 word abstract electronically by April 22, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than June 17, 2011.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Be sure to attend other IMAPS co-located events:
IMAPS Workshop on Wire Bonding; and

IMAPS TechXPOT on Next Generation Materials and Processing for High Performance Packaging (July 13).
And don't miss othe activities at SEMICON West 2011

 

  Chapter Activities (events listed in chronological order)
 

Florida Chapter April 28 Technical Meeting on Near-Hermetic Electronic Packages    ^ Top

Date: April 28, 2011
Schedule: 6:30 pm meet and greet in the lounge
(Happy hour 2 for 1 until 7pm)cash bar;
7pm dinner;
Presentation from 7:30 - 8:30pm
Location:

Holiday Inn Melbourne-Viera Hotel & Conference Center
8298 N Wickham Rd, Melbourne, FL 32940
(321) 255-0077 | http://www.himelbournefl.com/

Registration Details:
Attendees:
$15.00 at-door cash or check - or credit card on-line
Exhibitors: $175.00 fee includes 6' table and one dinner (must pre-register on-line. payable by credit card online, or, make checks payable to "IMAPS-Florida" & mail to Tim Davis, P.O. Box 623309, Oviedo, FL 32762-3309

Potential Exhibitors- we expect 30-40 attendees & have room for three tabletop displays (6ft.) but only two left! So hurry!

By Credit Card: If you are an IMAPS member or have registered previously, please login here using your credentials -> Click to Register  If not, please click here -> New Visitor Registration. This will take you to the IMAPS On-LIne Store for registration and the meeting info will be automatically selected for you. Simply conplete the process for registration and payment and a receipt will be provided for printing.

Please note: Any problems with web registration email: dbokil@bokil.com

Near-Hermetic Electronic Packages -- An Overview

Robert K. Lowry
Electronic Materials Consultant
321-777-9949
www.electronic-materials.com

Hermetic packages provide full protection for electronic devices from mechanical and handling damage and external sources of dust, dirt, contaminants, and moisture. But cost and availability of materials for building hermetics are driving designers to consider near-hermetic style packages in a flip-chip configuration or a plastic cavity housing for devices. Unlike hermetic housings of metal or ceramic, Teflon or the liquid crystal polymers (LCP) used for near-hermetics are not absolute barriers to moisture. Moisture can gain access to packaged devices by diffusing through the bulk of these kinds of materials, hence the “near-hermetic” designation. This presentation discusses physical and chemical properties of LCP and contrasts aspects of construction of hermetic, non-hermetic plastic encapsulated (used successfully in harsh-environment automotive applications!), and near-hermetic LCP cavity packages as they affect functional reliability. Data on moisture permeation and headspace gas composition of LCP cavity packages are presented. Seemingly paradoxical efforts to establish a “Class Y” designation for near-hermetics in space applications and to tighten leak rate requirements to ≤1E-10 cc atm sec-1 for small cavity hermetics are reviewed. The overall outlook for near-hermetic technologies is bright, but adopters must carefully evaluate and qualify materials and processes to assure such packages remain dry enough long enough to provide reliability over expected service life.

New England Chapter 38th Symposium & Expo on May 3    ^ Top

Date: May 3, 2011
Schedule: Technical Program and Registration available soon
Location:

Holiday Inn -- Boxborough Woods Conference Center
Boxborough, Massachusetts

The Largest Regional Symposium Dedicated to Microelectronics and Electronics Packaging

The New England Chapter Symposium Technical Program Committee is finalizing the technical program which will feature sessions/presentations on:

Industry
-- Biomedical Electronics -- Telecom - Microwave -- Military Electronics -- Consumer Electronics -- Renewable Energy: Fuel Cells, Solar, Wind -- Thermal/Power Management -- Manufacturing, Outsourcing & Quality -- Software and Firmware Applications -- High Performance Interconnects and Boards -- Sensor Applications -- Emerging Technologies -- Photovoltaic/Solar

Advanced Processes & Materials
-- 3D and High Density Packaging -- Photonic/ Optoelectronic Packaging -- LED Packaging -- MEMS and Nano Packaging -- Underfill/ Encapsulants and Adhesives -- Green Packaging / Compliance with RoHS -- Electronics Recycling -- Flip-Chip and Bumping: Processes, Reliability -- Wire Bonding and Stud Bumping -- Embedded and Integrated Passives -- Ceramic, Polymer and Conductive Materials -- Cu/ Low-K

Symposium Technical Chair:
Roger S. Benson
International Rectifier
Leominster, MA
roger.benson@verizon.net
Phone: (978) 457-4014

Visit us at - www.imapsne.org -- for details

----- also -----
SIX Lecture Sessions, Full Poster Session, Employment Center and an 80 Booth Exhibit Hall

For details about Sponsoring, Exhibiting or Attending Contact:
Harvey Smith: harveys@imapsne.org or Call 508-699-4767

France Chapter To Hold MiNaPAD Forum 2011 on May 11-12    ^ Top

Date: May 11-12, 2011
Schedule: Technical Program and Registration available on-line
Location: Grenoble, France
Details: imaps.france@imapsfrance.org or www.imapsfrance.org

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum Conference & 'Interconex' Exhibition

Bringing closer the design and the semiconductor assembly & packaging communities

You will fill the conference program of MINAPAD on-line.

Registration is now open and we hope to welcome you in Grenoble soon.

Please do not hesitate to contact us if you need more information.
Florence VIRETON
Responsable Salon IMAPS/INTERCONEX
Versailles France
Tél: 33 (0) 1 39 67 17 73
email:imaps.france@imapsfrance.org

Nordic Chapter Conference in Finland June 5-8    ^ Top
IMAPS Nordic Chapter is proud to announce the year 2011 conference in Finland. The conference will take place in Dipoli in the centre of the technology in Otaniemi, Espoo hosting a range of high tech companies as well as Aalto University and the Technical Research Center of Finland.

Sessions are being formed on the following topics:

  • 3D Advanced interconnect, TSV, Advanced packaging
  • MEMS, MOEMS, sensor integration & applications
  • Harsh environment
  • High temperature electronics
  • Printed electronics
  • Future electronics, trends & strategies
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Microvia, HDI laminates, flex, embedded passives
  • Chip thinning & stacking, 3D-packaging, TSV, embedding
  • Pb and halogen free electronics, methods and consequences
  • CSP, flip chips, area array
  • Reliability assessment, SPC
  • High frequency packaging
  • SMT and board assembly
  • Integrated passive devices (IPD) & System in Package (SiP)
  • System cost assessment
  • Manufacturing management & outsourcing
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
  • Modelling and simulation

For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org.

Hotel:
The conference hotel is Radisson Blu Hotel in Espoo (http://www.radissonblu.com/). Use code IMAPS when booking. Rates: 110€/single standard and 130€/double standard. The social events will take place at the hotel.

UK Chapter Hosting EMPC2011    ^ Top
The "European Microelectronics & Packaging Conference" is being held at the Hilton Metropole in Brighton from 12-15 September.

The International Refereeing Panel has completed the adjudication of the Abstracts that were submitted from around the world (Europe, Japan, Korea, China, USA) etc. and recommended acceptance of 90 Oral and 30 Poster Technical papers.

This exceptional Technical Programme will ensure excellent attendance at the event, providing exhibitors the opportunity to showcase their Company at EMPC-2011 and interact with people working on the latest technologies in the Microelectronics Industry.

EMPC-2011 is hosted by IMAPS-UK on behalf of IMAPS-Europe with technical co-sponsorship from IEEE-CPMT and builds upon the successful IEEE Electronics System-Integration Technology Conference ESTC-2010 (Berlin) and EMPC-2009, (Rimini). Each event attracted large attendances from delegates world-wide.

Details of the Exhibition Hall layout and pricing are provided in the Exhibitor Registration Pack, which is available to download at www.empc2011.com.

IMAPS Taiwan Chapter's IMPACT is now calling papers until June 10    ^ Top
The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011) is organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan, ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA, iNEMI and ICEP which will take place in NTUH International Convention Center during October 19 to 21, 2011. Besides, ICEP and iNEMI are the first time to join IMPACT and we believe IMPACT 2011 will become more splendid after their support. This great annual international event - IMPACT will extend the opportunity to bring researchers, engineers and experts engaged in such a distinguished gathering and show the strength of Taiwan and update worldwide tendencies.

IMPACT 2011 as the sixth conference and the theme is "IMPACT-Leading Innovation" which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage. IMPACT is striving to work out the advanced paper scope and reward policy to attract extraordinary papers all around the world. IMPACT now is calling papers until June 10, 2011. More information about IMPACT 2010, please refer to the conference website, www.impact.org.tw , or contact with secretariat, MS. Sophia Huang (+886 3 3815659 Ext 404).

IMPACT-Leading Innovation
Date: October 19 (Wed) - October 21 (Fri), 2011
Venue: NTUH International Convention Center, Taipei, Taiwan
Conference: The 6th IMPACT Conference

About Paper Submission
Important Date


Item

Date

Abstract Submission

June 10, 2011

Abstract Acceptance Notification

July 15, 2011

Full Paper Submission
(Camera-ready Version)

August 15, 2011

Presentation Material Submission(Oral Presentation)

October 1, 2011

SCOPE OF PAPER SOLICITED
P1. Emerging Systems Packaging Technologies
P2. Advanced Packaging Technologies
P3. Interconnections & Nanotechnology
P4. Modeling, Simulation & Design
P5. Thermal Management
P6. Advanced Sensor & Microsystems Technology (MST)
P7. Advanced Materials, Process & Assembly
P8. 3D Integration *NEW
P9. LED & Optoelectronics Packaging *NEW

Secretariat
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #404 - Sophia
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.


   
   

LORD Corporation

Webinar: Hybrid and Microwave DFM
April 19, 20

Hi-Rel for Military Applications
May 17-19
Baltimore, MD

Medical Device Packaging
June 14-15
Minneapolis, MN
*Exhibitors contact modonoghue@imaps.org

Mid-Atlantic Conference
June 23-24
Atlantic City, NJ
*Exhibitors contact modonoghue@imaps.org

IMAPS/CPMT Optoelectronic Packaging
June 28-30
Irvine, CA

Advanced Interconnect & Substrate
July 13
San Francisco, CA

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

"Think Thin" - IC Packaging for Mobile Applications
August 23-24
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

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