IMAPS Home | Join/Renew
August 31, 2011
 

Palomar Technologies

   IMAPS EVENTS
Button IMAPS 2011, Long Beach - Early Registration & Hotel Deadlines NEXT WEDNESDAY, September 7 (read more...)

Button Webinars Next Week on Polymers in Semicon Packaging & Component Chip Attach... (read more...)

Button Abstracts Still Being Accepted for Workshop on Thermal Management (read more...)

Button System Level Packaging Workshop Abstracts Still Being Accepted (read more...)

Button Abstracts Due Soon for Two Florida Events (read more...)

Button IMAPS Co-Sponsoring 1st Global Interposer Technology (GIT) Workshop (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Less Than 2 Weeks Until IMAPS UK Chapter Hosts EMPC2011 (read more...)

Bullet Carolinas Chapter September 15 Fall Technical Symposium (read more...)

Bullet Chicago/Milwaukee Chapter September 20 Dinner Meeting on Environmentally Innovative Electronic Concept (read more...)

Bullet IMAPS Taiwan Chapter's IMPACT (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

IMAPS 2011, Long Beach - Early Registration & Hotel Deadlines NEXT WEDNESDAY, September 7    ^ Top
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 will feature technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions are planned this year including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; Substrate Materials for Semicon/Solar; MEMS Packaging; and many more. The 2011 symposium offers you 22 professional development courses, a GBC Marketing Forum on "Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges", and a keynote presentation from Mr. Liam Madden, Corporate VP of Xilinx. A truly International Symposium, IMAPS 2011 will also offer: 2 new sessions on European Perspectives on Packaging/Integration; a new Chinese-to-English Translated Session on "Advanced Packaging in China"; and the return of the always popular Japanese-to-English Translated session on "Improvements in Advanced Packaging from Japan."

Early Registration Deadline: September 7, 2011
Hotel Deadline: September 7, 2011

IMAPS 2011 features...

Complimentary Exhibit Hall Passes Exhibits Passes are complimentary this year for all attendees. This complimentary registration will allow participants to visit the exhibitors, the welcome reception, the keynote presentations, the GBC Marketing Forum. (PDCs, Sessions, Proceedings and Lunch are not included)
World-Renown Keynote Presentation
Mr. Liam Madden, Corporate VP, Xilinx
Mr. Liam Madden
Corporate Vice President
Xilinx, Inc.

22 Professional Development Courses Advanced Packaging...(NEW); Basics of Microelectronics Packaging; Packaging Industry Updates & Trends; Polymers in Electronic Packaging; TSV...3D IC/Si Integrations; Wire Bonding...; 3D/TSV Integration and Packaging...; Signal/Power Integrity; MEMS Reliability...; Screen Printing; Counterfeit Electronics...(NEW); Design & Analysis of Experiments...(NEW); Polymeric Packaging Reqs for Solar...(NEW); and many more.
An Unmatched, Global Technical Program
28 Sessions, 190+ Papers and Posters
5-6 Concurrent Technical Tracks
addressing:
3D Packaging; Modeling/Reliability; Next Gen. Materials; Assembly & Packaging; Advanced Technologies; Focus Track: Adv. Packaging & System-Integration
Program Grid (PDF) | Interactive Track | Download Program PDF
State-of-the-Art Exhibition and Technology Showcase Dedicated exhibit hall displaying new products and concepts.
Global Business Council Marketing Forum Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges
Invaluable Student Program Student Industry Panel/Reception, Broadcom HQ Tour, Student Competitions and other programs are designed to provide students with technical information, industry insight, and valuable connections.

...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned for you -- the 17th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, to name only a few.

We hope you enjoy the 44th International Symposium on Microelectronics - IMAPS 2011, Long Beach!

Register On-Line | Reserve Booth(s) | Hotel & Transportation
Technical Program | Professional Development Courses (PDCs) | Exhibition Information

Webinars Next Week on Polymers in Semicon Packaging & Component Chip Attach...    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Polymers in Semiconductor Packaging
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, September 7, 14, and 21, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip
Presented by: Phillip Creter, Creter and Associates
This two-session on-line Professional Development Course (PDC) webinar will be held Thursdays, September 8, and 15, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Florida Chapter Webinar on
Plasma Technology for Microelectronics Packaging
Sponsored and Presented by: Nordson March
This on-line webinar will be held Tuesday, September 13, 2011, from 12:00 noon - 1:00 pm EASTERN

Nordson March

PDC Webinar Series on
Rheology Issues in Electronic Packaging -- DETAILS SOON
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, November 2, 9, and 16, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on
Why Wedge Bond? -- DETAILS SOON
Sponsored and Presented by: Hesse & Knipps
This webinar will be held Thursday, November 10, 2011. Webinar will be held 12:00 noon - 1:00 pm EASTERN

Hesse & Knipps

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, December 1, 8, and 15, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Assessment of RGA Data and Failures in Microelectronic Devices -- DETAILS SOON
Presented by: Philipp Schuessler, Schuessler Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, December 6, and 13, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

Abstracts Still Being Accepted for Workshop on Thermal Management   ^ Top
IMAPS is holding the Advanced Technology Workshop on Thermal Management at Dinah's Garden Hotel in Palo Alto, CA, on November 7-9, 2011. To view the call for abstracts and details about the workshop, visit www.imaps.org/thermal. This workshop is co-located with the ATW on System Level Packaging.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems.  Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.  The focus of all presentations should be on technical content for describing a thermal solution.

This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. The 2010 Workshop featured 37 technical presentations, three of which were competition-selected presentations from university engineering graduate students. Tabletop exhibition has been a part of this workshop since 2008.

ATW schedule and location serve to promote informal discussions and networking by attendees and speakers. All authors and attendees find that this IMAPS workshop format is a proven forum for informal but highly effective networking between the workshop participants. Speakers pay a reduced registration fee.

A student competition is held for engineering undergraduate and graduate students, with stipend awards for winning abstracts, to promote early participation in industry events and the presentation of current academic research.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
  • Thermal Analysis and Modeling:  Tools for thermal analysis, practical techniques for thermal modeling and empirical work, describing difficult thermal design problems with proposed and final solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing. Metallic, polymer matrix, CNT, thermal adhesives, and other materials. 
  • High Conductivity Materials:  Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.         
  • Harsh Environment Applications:  Harsh environment platforms, including military, airborn, hybrid, and electric vehicles.
  • Telecommunications and Consumer Electronics:  Component- and system-level thermal solutions for telcom, consumer, handhelds, displays, routers, and similar systems.
  • LED & Solar Applications:  Component- and system-level thermal management of high-power HBLED / UHBLED and solar applications.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation.  No formal technical paper is required. 

Presentation material must be submitted onsite no later than November 9, 2011, and will be included on the post-conference CD that will contain the full presentation materials as supplied by authors. CD will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433

System Level Packaging Workshop Abstracts Still Being Accepted   ^ Top
IMAPS is holding the Advanced Technology Workshop on System Level Packaging at Dinah's Garden Hotel in Palo Alto, CA, on November 10-11, 2011. To view the call for abstracts and details about the workshop, visit www.imaps.org/syspack. This workshop is co-located with the ATW on Thermal Management.

As we move to smaller submicron lithography in Silicon and denser packaging the boundaries of the system packaging infrastructure are being constantly challenged. The Advance Technology Workshop on System Packaging is an attempt to bring together leading edge technologies and processes that are currently needed in the System Packaging community to address some challenges associated with higher speed, greater bandwidth, higher system performance efficiency, multidisciplinary trade-offs(e.g. thermal, EMI) and greater densification.

Speakers are asked to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers pay a reduced registration fee.

ABSTRACTS ARE SOUGHT BUT NOT LIMITED TO THE FOLLOWING AREAS/SUBJECTS:

POWER: New developments in advanced high density and high efficient power delivery designs from chip level to subsystem level are being introduced at a rapid rate. Development has focused on generation, distribution and management of power. Some of these areas include embedded power components and circuits, Voltage Regulator Modules, DC-DC modules, AC power supply modules, rack-mount power supply units (PSUs) and power distribution units (PDUs), and DC power entry modules.

  • Power architecture - including High Voltage.
  • DC-DC converters
  • Power Semiconductors 
  • Power System Management

THERMAL MANAGEMENT - SYSTEM LEVEL: The growth of High Performance Computing and the densification of products for hand-held application has given rise to some unique opportunities in System Level Thermal Management.

  • Single (air and liquid) and multiphase cooling
  • Thermal management materials
  • Microfabricated thermal management devices and systems.
  • Systems in extreme environments.

SIGNAL INTEGRITY: COPPER and OPTICAL: Higher speeds and greater bandwidth have led to some unique opportunities to insure signal integrity under various operating conditions.

  • PCB power integrity design
  • Model Parameter Determination
  • Device Modeling/Packaging
  • Crosstalk
  • Measurement techniques
  • EMC/EMI

INDUSTRIAL DESIGN: The shape and structure of all consumer products and most industrial products is driven by Industrial Design. The search for improved aesthetics and ergonomics has resulted in innovation in cost effective materials and processes.

  • Ecodesign & Sustainability
  • Human factors & ergonomics
  • Design For Assembly / Design For Manufacturing
  • Material & Processes

INTERCONNECT: As the data rates of next-generation systems exceed several gigabits per second, the passive media connecting the ‘drivers’ and the ‘receivers’ become as important and sophisticated as the solid-state devices themselves. The interconnect media may include chip to board and board to boards connections through fixed and/or removable connectors, printed circuit boards, and cable assemblies. Any discontinuity of the transmission line through these interconnects contribute to signal degradation, non-optimized power dissipation and enhanced radiated emission and can easily become a limiting factor for overall performance of the system.

  • Printed Circuit Boards and Backplanes
  • Cables and Connectors - Traditional / “active” copper and optical.
  • Simulation and Modeling
  • Signal Integrity and Measurement Techniques

MATERIALS: Advances in materials have led to greater design flexibility in system design at significant savings in cost and schedule.

  • Thick and thin film materials
  • Printed Circuit Board materials
  • MEMS materials
  • Nano materials

DISRUPTIVE TECHNOLOGIES - INNOVATIONS: Disruptive technology innovations have resulted in paradigm shifts in how products get designed and manufactured.

  • Innovative Packaging concepts
  • Innovative System solutions

MANUFACTURING TECHNOLOGY: Manufacturing is where the rubber meets the road. Cost, performance, reliability and cycle time are some of the major contributors to the profitability of a product.

  • Low cost high value manufacturing techniques.
  • Right-shoring products.
  • Green technologies

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, October 7, 2011.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433.

Abstracts Due Soon for Two Florida Events   ^ Top
IMAPS is happy to announce to new events being in held at the Rosen Centre Hotel in Orlando, Florida on January 17-18, 2012. Abstracts are due for both events on September 23, 2011.

1st Southeastern Microelectronics Packaging Conference - January 17th
www.imaps.org/southeast

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging.  Topics of interest for submission are online at www.imaps.org/southeast.

Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics - January 18th
www.imaps.org/hermetic

Conference Focus: Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost.  The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations. Topics of interest for submission are online at www.imaps.org/hermetic.

Those wishing to present a paper at either or both of the events listed above must submit a 250-300 word abstract electronically no later than September 23, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than December 14, 2011.  Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.  All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

IMAPS Co-Sponsoring 1st Global Interposer Technology (GIT) Workshop    ^ Top

Date: November 14-15, 2011
Location:

Georgia Institute of Technology
Atlanta Georgia USA

Details:

www.prc.gatech.edu/events/GIT2011

Interposers are becoming highly strategic for applications ranging from mobile products that require miniaturization, convergent systems that require heterogeneous devices and high performance systems that require ultra-high I/O density and ultra short interconnections. The organic packages that are currently used are seen as reaching limits in I/Os thus requiring new interposer technologies.

3D ICs with TSV are being widely developed around the world for the same three reasons: for heterogeneous integration of ICs, improved electrical performance and for miniaturization of modules and systems. But these benefits come at very high cost and with significant disruption in wafer fabs. Additionally, the 3D stack approach presents major technical and manufacturing challenges that include testability and yield, scalability, along with thermal and standardized IC interface challenges.

Industry is exploring a variety of silicon and glass interposers that include an interposer alternative called 2.5 in the short term. Georgia Tech PRC is proposing a 3D interposer approach, as a better alternative, made of either low-cost ultra-thin polycrystalline silicon or low-cost ultra-thin glass, not only in 200-300mm wafer form but also in large, 450-700mm panel form. Such an interposer is identical to one of the 3D ICs in the 3D stack in through-via interconnection length and interconnect density, and thus behaves just like a 3D IC stack .

The GIT Workshop is intended to compare and contrast the wide variety of interposer approaches being developed as well as promote and disseminate revolutionary and evolutionary advances in emerging silicon, glass and other interposer technologies, by bringing together academic and industry researchers, technology developers, users and manufacturers from around the world. Such a technology is seen as not only for packaging of ICs and 3D ICs but also act as a better alternative to 3D ICs with TSV ,and eventually providing a path for entire systems.

Workshop Sessions:

  • Electrical Modeling and Design
  • Mechanical Modeling and Design
  • Interposer Technologies: Silicon, Glass and Others
  • Chip and board level interconnections
  • Applications and Markets
  • Manufacturing Infrastructure
  • Student Poster Session from 5-10 Participating Universities

Important Deadlines:

Call for Titles & Abstracts Oct. 2, 2011
Acceptance: Oct. 15, 2011
Early Registration Closes: Oct. 15, 2011
Preliminary Program: Nov.1, 2011

Registration Fees:

IEEE &IMAPS Non-Members: $400
IEEE & IMAPS Members: $300
Chairs and Speakers: $250
Students: $100

 

  Chapter Activities (events listed in chronological order)
 

Less Than 2 Weeks Until IMAPS UK Chapter Hosts EMPC2011    ^ Top
EMPC-2011 is proudly hosted by the IMAPS-UK chapter and will be held at the Hilton Metropole, Brighton, UK, 12th to 15th September 2011.

JUST TWO WEEKS TO GO TO EMPC2011

What's new in Packaging EDA tools? What's new in the Packaging business? Come and hear it from the experts at EMPC2011 special sessions.

IMAPS-Europe Microelectronics and Packaging Conference, EMPC, is the major electronics packaging, interconnection and integration conference of 2011.

The event features technical presentations from global leaders, an exhibition, Q&A forums on Business and technology trends and EDA/CAD, plus professional development courses. The event is co-sponsored by IMAPS-Europe and IEEE-CPMT.

Details of the Exhibition Hall layout and pricing are provided in the Exhibitor Registration Pack, which is available to download at www.empc2011.com.

Carolinas Chapter September 15 Fall Technical Symposium    ^ Top

Date: September 15, 2011
Location:

Juki Headquarters
507 Airport Blvd.
Morrisville, NC 27560
Phone: 919-460-0111

Registration:

IMAPS Members-$15, non-members-$25, and students-$5.00.
On-line registration by credit card. Checks/cash only on-site.
Additional fee for on-site registrations of $5.00

SEATING IS LIMITED !!! Register on-line by Thursday, September 8th to guarantee your spot.

Click here to Register On-Line

PROGRAM AGENDA

1:00  Registration and Networking

1:15  Industry Lunch

2:00  Participant Introductions and welcome by Scott Morris, President of IMAPS Carolinas. 

2:15  “The Origins, Status, and Future of Flip Chip and Wafer Level Packaging “
Alan Huffman, Research Engineer / Program Manager - Research Triangle Institute

2:45  “Cooling from Down Under – Thermally Conductive Underfill”
          Larry Wang, Staff Scientist - LORD Corporation 
             
3:30  Break 

3:45   “New Component Trends and How It Affects Placement”
Bob Doetzer, Circuit Technology            

4:15   Event wrap-up.  Ideas for next event.  Other business.

4:30   Juki  tour of their equipment area ( 30 minutes).   Optional. 

Chicago/Milwaukee Chapter September 20 Dinner Meeting on Environmentally Innovative Electronic Concepts    ^ Top

Date: September 20, 2011
Location:

Wellington of Arlington
2121 S. Arlington Heights Rd
Arlington Heights, IL 60005
847-439-6610

Registration:

IMAPS Members: $20; Non-Members: $25; Students/Displaced: $5

Register on-line or contact Ken Burke for reservations or additional information. Ken.burke@knowles.com

On-line registration

PROGRAM AGENDA

5:30 PM            Registration and Networking
6:00 PM            Dinner and Chapter Announcements

"Standards and Sustainability"
Roger Franz, Sr. Research Engineer
UL Environment - Underwriters Laboratories Inc.
6:40PM to 7:15PM

Abstract
Consensus-based standards help ensure the interoperability and safety of devices and systems that are all around us, while promoting worldwide commerce and assuring quality.  Current efforts in the three-legged race for environmental, social and economic sustainability have yet to achieve widespread consensus.  In this presentation, we show how standards are emerging to fill a critical role beyond legal compliance in the growing field of independent certification programs and eco-labels.  Life cycle assessment is the key to understanding and implementation.  Examples of trends and opportunities will be provided to show how standards can help drive sustainability in energy generation and energy efficiency, as well as in the chemicals and materials used to make components and products.  We further speculate on prospects for realizing accelerated growth of green technologies that could compare to the semiconductor industry benchmark.  While the presentation is not a catalog of environmental sustainability standards, along the way some of the more significant documents that you should be aware of will be introduced.

"Advanced Ceramic Film Capacitors"
Dr. Beihai Ma
Argonne National Laboratory
7:15 PM to 8:00PM

Abstract
Argonne’s ceramic-film capacitor bridges a technology gap that addresses a critical need of the next generation of electric-drive vehicles. It substantially reduced the weight, volume and cost of capacitor materials of the inverters that will be used to power the motors of electric vehicles. The ceramic film – a lanthanum-modified lead zirconate titanate – is deposited on an inexpensive metal foil that can be stacked on or embedded into printed wire boards. The arrangement frees surface space, increases reliability and minimizes electromagnetic interference and inductance loss in the inverter. And because the capacitor is made of ceramic and metal, degradation due to high-temperature when the engine is running is eliminated

IMAPS Taiwan Chapter's IMPACT    ^ Top
The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011) is organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan, ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA, iNEMI and ICEP which will take place in NTUH International Convention Center during October 19 to 21, 2011. Besides, ICEP and iNEMI are the first time to join IMPACT and we believe IMPACT 2011 will become more splendid after their support. This great annual international event - IMPACT will extend the opportunity to bring researchers, engineers and experts engaged in such a distinguished gathering and show the strength of Taiwan and update worldwide tendencies.

IMPACT 2011 as the sixth conference and the theme is "IMPACT-Leading Innovation" which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage. IMPACT is striving to work out the advanced paper scope and reward policy to attract extraordinary papers all around the world. IMPACT has just closed the call for papers. More information about IMPACT 2010, please refer to the conference website, www.impact.org.tw , or contact with secretariat, MS. Sophia Huang (+886 3 3815659 Ext 404).

IMPACT-Leading Innovation
Date: October 19 (Wed) - October 21 (Fri), 2011
Venue: NTUH International Convention Center, Taipei, Taiwan
Conference: The 6th IMPACT Conference

About Paper Submission
Important Date


Item

Date

Abstract Submission

June 10, 2011

Abstract Acceptance Notification

July 15, 2011

Full Paper Submission
(Camera-ready Version)

August 15, 2011

Presentation Material Submission(Oral Presentation)

October 1, 2011

Secretariat
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #404 - Sophia
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012
Location:

MERCURE OCEANIDE VIEUX PORT SUD
LA ROCHELLE

Details:

www.imapsfrance.org

We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2012 edition and be sure to submit your abstract on time.

The workshop sessions will include the following topics and papers are invited in these areas:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers should submit a 200-300 words abstract accurately/precisely describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions), not later than 4 November, 2011.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: 25 November, 2011.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail: imaps.france@imapsfrance.org, by fax : +33 (0) 1 39 02 71 93

 


   
   

EPP

Valtronic

LORD Corporation

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

Thermal Management
November 7-9
Palo Alto, CA
*Exhibitors contact modonoghue@imaps.org

System Level Packaging
November 10-11
Palo Alto, CA

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives