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February 17, 2011
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Device Packaging 2011 - Professional Development Courses Are Filling Up (read more...)

Button Webinar February 25 on How to Mitigate the Risk of Counterfeit Electronic Parts (read more...)

Button GBC Spring Conference on The Business of Semiconductor Packaging in the Era of 3D and Energy Efficiency (read more...)

Button Abstracts Due Wednesday: "Think Thin" - IC Packaging for the New Era of Mobile Devices (read more...)

Button Now Accepting Abstracts for the IMAPS/CPMT ATW on Optoelectronic Packaging (read more...)

Button 2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TONIGHT: Metro Chapter February 17 Dinner Meeting (read more...)

Bullet NEXT TUESDAY: San Diego Chapter February 22 Lunch Meeting (read more...)

Bullet NEXT THURSDAY: Florida Chapters Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition on February 24 (read more...)

Bullet IMAPS Southern California Chapters and OCE Announce SoCal 2011 (read more...)

Bullet Chicago/Milwaukee Chapter March 15 Winter Technical Forum on Materials and Advanced Technologies (read more...)

Bullet New England Chapter 38th Symposium & Expo on May 3 (read more...)

Bullet France Chapter To Hold MiNaPAD Forum 2011 on May 11-12 (read more...)

Bullet Abstracts Due Tomorrow: Nordic Chapter Conference in Finland June 5-8 (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2011 - Professional Development Courses Are Filling Up    ^ Top
The seventh Annual Device Packaging Conference (DPC2011) will be held in Scottsdale, Arizona, on March 7-10, 2011. For more information, visit www.imaps.org/devicepackaging.

The 2011 conference will feature 8 professional development courses related to microelectronic packaging: 3D IC & Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration). For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 7th, preceding the technical conference. Morning PDCs will run from 8:00am until 12:00 noon. Afternoon PDCs will be held from 1:00pm until 5:00pm. The Welcome Reception will immediately follow the PDCs from 5:00pm until 7:00pm in the foyer. A Microelectronics Foundation Texas Hold-em Tournament will be held this year from 7:00pm until 10:00pm. All are invited to register for this fun, new event which benefits the IMAPS Microelectronics Foundation.

PDC1: 3D Integration: Technology, Applications & Markets for 3D Integrated Circuits
PDC2: Guide to Component Chip Attach - Including Flip Chip
PDC3: MEMS Reliability and Packaging
PDC4: Fundamentals of Microelectronic Packaging
PDC5: Introduction to MEMS Design and Fabrication
PDC6: Polymers in Semiconductor Packaging
PDC7: Hermetic Sealing and Testing of Small Volume MEMS Packages

PDC8: Area Array Microelectronics Package Reliability

Register on-line for the PDC, conference and all activities at www.imaps.org/devicepackaging.

IMAPS Microelectronics Foundation Fundraising/Social Activities:
This year the Microelectronics Foundation will offer two charity events to raise funds toward its mission "to support student activities related to the study of Microelectronic Packaging, Interconnect and Assembly." On Monday, March 7, the IMAPS Microelectronic Foundation is holding its first charity Texas Holdem Tournament. On Thursday afternoon, March 11, the IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club.

Texas Hold'Em Tournament Monday, March 7
7:00pm - 10:00pm
Texas Holdem Tournament
Fort McDowell Resort
Spring Golf Invitational Thursday, March 10
1:00pm Shotgun Start -- "Best Ball" Scramble
Desert Canyon Golf Club

.Technical Program | On-line Registration

Webinar February 25 on How to Mitigate the Risk of Counterfeit Electronic Parts    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

Webinar on
How to Mitigate the Risk of Counterfeit Electronic Parts
Presented by: Phil Zulueta, Jet Propulsion Laboratory, California Institute of Technology
This webinar will be held Friday, February 25, 2011, from 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Introduction to Microelectronics Packaging Including Industry Updates and Trends
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, March 24, 30, and April 7, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, March 29, April 5, and 12, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Hybrid and Microwave Module Design for Manufacturability (DFM)
Presented by: Tom Green, TJ Green Associates, LLC
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesday, April 19, and Wednesday, April 20, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Design for Thermal Cycling - DETAILS SOON
Presented by: DfR Solutions
This webinar will be held Tuesday, May 24, 2011, from 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
High Density Package Testing - DETAILS SOON
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held June 7, 8 and 9, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

GBC Spring Conference on The Business of Semiconductor Packaging in the Era of 3D and Energy Efficiency    ^ Top
The 2011 Global Business Council Spring Conference will be held in Scottsdale, Arizona, on March 6-7, 2011. For more information, visit http://www.imaps.org/programs/gbc11spring.htm.

Sunday, March 6 - Registration and Opening Reception:

Monday, March 7 - Presentations:

"Business of Semiconductor Packaging in the Era of 3D"

Market Outlook Panel:   Applications Driving 3D IC Adoption.  Industry Trends and Forecasts.

Moderator Lee Smith, Vice President, Marketing & Business Development, Amkor Technology, Inc.
Panelists: Jan Vardaman, President and Founder, TechSearch International
Brandon Prior, Senior Consultant, Prismark Partners, LLC

"The Role Road Maps Play in 3D Packaging and 3D IC Technologies."
Dr. Bill Bottoms, CEO, NanoNexus, Inc.  And Chair of the ITRS Assembly and Packaging Task Force.

Status Update and the Role Consortia Has Played in Development of TSV Technologies.
"3DEMC Consortia Status to Cost of Ownership Objectives."
Rozalia Beica, Global 3D Interconnect Director, Applied Materials, Inc.

"Emerging Standards and Summary of SEMATECH's Programs in 3D IC Technology Development."
Sitaram Arkalgud, Director of 3D Interconnect Program, SEMATECH

Status in Development of 3D IC Interface and Package Standards.
"The Evolution of Standardization for 3D Package Technology."
James Malatesta, Sr. Applications Engineer, Micron Technology Inc.
Chair of JEDEC JC-63 Committee on Multichip Packaging

Key Role Supply Chain Collaboration Plays in 3D IC Product Development.
"A Case Study on a Fabless Model of Collaboration in Developing Highly Anticipated New FPGA 3D Architecture Using Si Interposers with TSV and Micro-bump Technologies."
Suresh Ramalingan, Director of Package Design and Advanced Package Development, Xilinx, Inc.

Lunch Presentation
"Reasons for Optimism in 2011 and 2012."  
Brian Matas, Vice President, Market Research, IC Insights

"Market Drivers for Semiconductors and Packaging in the era of Energy Efficiency."

"Increasing Energy Efficiency Through Power Semiconductors."
Oleg Khaykin, CEO, International Rectifier

"Emerging Technologies to Enable Utility Scale Solar Power Growth."
Eelco Bergman, Senior Vice President of Business Development, Cyrium Technologies Inc.

"Power Packaging Challenges and Market Drivers for Next Generation Energy Efficiency."
Chris Bull, Marketing Manager - Power Stage Business Unit, Texas Instruments

"The HEVs Are Coming!  The Change of the Automotive Electronics Market With the Rise of the Hybrid/ Electric Power Train."
Tom Deitrich, Senior Vice President of RF and Sensor Products, Freescale Semiconductor

"Semiconductor Opportunities with Hybrid/Electric Automobiles."
Marques McCammon, Chief Marketing Officer, Aptera Motors

Device Packaging Welcome Reception -- GBC Participants Invited

Texas Hold-em Poker Tournament  

Co-Chairs and Session Chairs of the Conference are Iris Labadie of Kyocera America, Rich Rice of ASE, Inc., Lee Smith of Amkor Technology, Inc., Jan Vardaman of TechSearch International, Inc.    

The IMAPS GBC produces valuable programs that cover many business factors important to the microelectronics industry.  Please visit http://www.imaps.org/gbc/index.htm for more information.

Abstracts Due Wednesday: "Think Thin" - IC Packaging for the New Era of Mobile Devices    ^ Top
The workshop will be held at the Biltmore Hotel & Suites in Santa Clara, California, on May 4-5, 2011. Abstracts will be accepted until February 23. To submit an abstract and for more information, visit www.imaps.org/thin.

The market for smart mobile devices is exploding, including smart phones, tablets, and convergence devices, driven by consumers who demand greater functionality and ease of use. As a result, device designs require functional integration of ICs, especially in the 3rd dimension, hence driving new technology development towards making IC components "thin". The objective of the "Think Thin" Workshop is to address the numerous aspects of making IC packages "thinner" by providing a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of microelectronics, IC packaging, emerging packaging technology for mobile devices. This event enables discussion and presentations on the latest materials, process, design & emerging applications of "thin" packaging technology.

Abstracts are being solicited in the following areas:

Materials:

  • Substrate requirements (coreless, etc.)
  • Underfill requirements
  • Die attach materials (DAF, dispensed)
  • Mold compounds

Equipment:

  • Die thinning
  • Die handling (carrier bonding and de-bonding, die sawing)
  • Die attach
  • Molding
  • WLP/eWLP/ equipment

Processes:

  • Die thinning
  • Die stacking
  • Molding
  • Interconnect (Cu pillar, Flip Chip, Thermo-Compression, Wirebond, etc.)

Design/Simulation:

  • Modeling for warpage prediction and material selection
  • CPI (chip / package interaction)
  • Reliability / stress simulation

WLP / eWLB / Embedded die technologies:

  • Low cost constructions
  • Horizontal and vertical integration
  • Package thickness challenges

PoP Technologies:

  • Flange/ Bare Die/ Through Mold Via
  • Stack up height reduction
  • Top package (memory) height reduction
  • Warpage control

3D Technologies:

  • TSV
  • Interposers
  • 3D Embedded die technologies

Reliability:

  • Thin Die
  • TCT/ Drop/ Bend
  • Board Level
  • Package Level

Emerging Technologies:

  • Printable circuits
  • Alternative memory stacking interconnect

Those wishing to present at the Workshop, should submit a 250-300 word abstract electronically by February 23, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

Now Accepting Abstracts for the IMAPS/CPMT ATW on Optoelectronic Packaging    ^ Top
The IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging is being held June 28-30, 2011, at the McDonnell Douglas Engineering Auditorium at the University of California- Irvine, in Irvine, California . The call for abstracts and full conference details can be found on-line at www.imaps.org/opto.

This workshop is a joint effort by the International Microelectronics and Packaging Society (IMAPS) and the Institute for Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT). The focus of the workshop is on optoelectronic packaging. We are moving to an age where:

  • Photons will supersede electrons as the preferred carrier of information.
  • Typical optical waveguides transmit many times more data than electrical wires.
  • Optoelectronic devices (LEDs and solar cells) play a great role in new energy generation and energy saving.

Accompanying this change are global efforts in energy efficiency. Issues in the packaging of any device which translates optical energy to or from electrical / thermal / mechanical energy are the focus of the present workshop, and abstracts are being requested in the following areas:

Optoelectronic Device Packaging: Optical Interconnections: Energy Generation and Saving:
  • Package design for performance and manufactuability
  • Packaging materials & processes
  • Device thermal management
  • Module thermal management
  • LEDs, lasers, solar cells, etc
  • Materials and designs
  • Modeling and simulation
  • Characterization
  • Processes and manufacturing
  • Multi-level interconnections
  • Design for efficiency
  • Measurement and certification
  • System integration
  • Solar cells and packaging
  • Energy storage

Those wishing to present at the Workshop, should submit a 250-300 word abstract electronically by February 28, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)    ^ Top
Thursday, March 10, 2011
1:00pm Shotgun Start -- " Best Ball" Scramble
Desert Canyon Golf Club
10440 Indian Wells Drive
Fountain Hills, AZ

The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 "Best Places to Play" by Golf Digest and has been voted "Best Public Golf Course" in Fountain Hills for six consecutive years. Desert Canyon Golf Clubs eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.

Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.

A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course -- 1:00pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive; and
  • Longest Putt

Sponsorship Opportunities:

Eagle Sponsor - $3,000 - SOLD

  • Company logo/name displayed as Awards Reception Sponsor.
  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500 - SOLD

  • Company logo/name displayed as Lunch Sponsor - in/on boxed lunches.
  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.

Hole Sponsor - $400 - FEW HOLES REMAIN

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($750 includes four-some).
  • Company logo/name on promotional materials and website.

Register On-line
Questions or request teams/partners:
David Virissimo, Foundation Golf Chair - dvirissimo@sempck.com or 619-464-5430

  Chapter Activities (events listed in chronological order)
 

TONIGHT: Metro Chapter February 17 Dinner Meeting    ^ Top

Date: Thursday, February 17, 2011
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Registration:

Members: $30.00 if Pre-Registered by February 14, 2011
$50.00 after February 14, 2011

Non-Members: $50.00 if Pre-Registered by February 14, 2011
$75.00 After February 14, 2011

Student Members: Free if Pre-Registered by February 14, 2011
$25.00 after February 14, 2011

Registration Email: metroimaps@optonline.net
Phone: Steve Lehnert (650) 644-5218
WEB: www.imaps.org/chapters/metro

There are a limited number of vendor tables available for this event. Please contact Steve Lehnert for further details.

AlSiC Thermal Management Applications - Heat Spreader Lids, IGBT Baseplates, Pin Fin Power Module Coolers for Hybrid Electric Vehicles (HEV) and Hermetic Packages

Presented By: Bo Sullivan, CPS Technologies

Performance requirements of Multicore Communications Processors, High Power/Reliability IGBT Modules, Hybrid Electric Vehicles (HEV) power module systems and Hermetic Packages lead to design focus on thermal management issues such as Coefficient of Thermal Expansion (CTE) compatibility and thermal dissipation. The same attributes that make AlSiC ideal for high reliability power conversion IGBTs, Heat Spreader Lids and Hermetic Packages make the Aluminum Silicon Carbide (AlSiC) metal matrix composite an ideal material for thermal management in HEV applications which need CTE compatibility with the attached electronic components combined with good heat dissipation. AlSiC is also lightweight (1/3 the weight of Copper) while being shock and vibration tolerant. The AlSiC fabrication process allows for functional designs to be cast rather than machined, resulting in a cost effective product. This presentation will outline the AlSiC material properties and fabrication process as well as outlining the power conversion applications that have led to the evolution of AlSiC from an "exotic material" used mainly in "R&D environments" to its use in mainstream automotive, power generation, military and communications applications over the past 10 years.

About Bo Sullivan:
Bo Sullivan joined CPS Technologies in 2006 as Senior Account Manager. Previous to this, Bo has worked for Westinghouse, Texas Instruments, VideoServer and Telco Systems. Bo has a Bachelor of Science Degree in Electrical Engineering from Brown University and over 35 years of experience in technical sales & marketing positions.

NEXT TUESDAY: San Diego Chapter February 22 Lunch Meeting    ^ Top

Date: February 22, 2011 at 12:00 PM
Location:

Location and Host:
Quik-Pak
10987 Via Fronteria
San Diego, CA 92127

Registration:

Cost: $20.00 for RSVPd IMAPS, ACerS Members.
$25.00 Others.
Complimentary for students with ID

Please RSVP by Monday February 21, 2pm***
To register, please contact Dave Virissimo of Semiconductor Packaging Materials at dvirissimo@sempck.com or 619-464-5430

Program:
Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology

Abstract:
Mechanical reliability issues in electronic packages have drawn significant attention in semiconductor industry for decades and have increased product development cost significantly. Recent rapid growth of various portable electronic devices like Smartphone and smart book with increasing demand for more functionality in tighter space further challenges the limit of mechanical reliability. To reduce the product development cost and time-to-market, mechanical simulation has been extensively employed in semiconductor industry for the purpose of design optimization and reliability assessment. The importance of having the correct simulation methodology can't be overemphasized considering the extent of its utilization throughout the product development cycle. Simulated warpage, as well as reliability assessment regarding different failure mechanisms using these three modeling methodologies are discussed.

Bio:
Dr. Andy Bao is a staff engineer specialized in process and packaging technology development at Qualcomm Inc since 2009. He has worked extensively on BEOL process optimization, 45nm/32nm/28nm ELK cracking assessment, package thermal analysis, Wafer-Level-Packaging and Through-Silicon-Stacking technologies. Before joining Qualcomm Inc., Dr. Bao was senior engineer at Intel Co. located in Chandler, AZ. Dr. Bao graduated with Ph.D from Department of Mechanical & Aerospace Engineering in Cornell University, Aug. 2004.

NEXT THURSDAY: Florida Chapters Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition on February 24    ^ Top
February 24, 2011
Crowne Plaza Hotel, ORLANDO-UNIVERSAL
7800 Universal Boulevard
Orlando, FL 32819, USA
Hotel Front Desk: 1-407-3550550 | Hotel Fax: 1-407-3550504

FINAL TECHNICAL PROGRAM
 

Two parallel sessions from 1:00 PM to 4:30 PM; Keynote Presentation 5:00 to 5:30PM

EXHIBITS from 3:00PM - 7:30PM with hors doeuvres served in the Exhibits area - Cash Bar.

 

Keynote:  Packaging Technology Expectations for Next Generation Military Communications Systems - Michael P. O'Reilly, Harris Corporation

 

  Michael P. O'Reilly is vice president of Engineering and Advanced Systems and Technology (AS&T) for the Defense Programs business unit within Government Communications Systems Division. The Defense Programs business provides communications systems, networks, and products for military aerospace, terrestrial, and maritime applications.

Mr. O'Reilly is responsible for technical management and execution within the Defense Programs business unit which services domestic and international defense markets. He oversees an engineering department of 200 professionals in Melbourne , Florida , and Long Beach , California . In addition to his engineering leadership duties, Mr. O'Reilly oversees the AS&T organization, chartered with identifying and incubating strategic technologies with the goal of long term business growth.

Defense Programs is a $500 million world-class provider of assured communications® systems and information technology solutions. Its customers include the U.S. Army, Navy, Air Force, and Marine Corps, foreign defense organizations, and other major defense contractors.

Mr. O'Reilly holds bachelors and Masters engineering degrees from the University of California where he also performed postgraduate management coursework. Holder of three Harris Engineering awards and five patents, Mr. O'Reilly has also received numerous leadership awards since joining Harris.
 

FINAL PROGRAM 

 

Time

Session 1: Interconnect Reliability

Session 2: High Density / 3D Packaging

1:00 -- 1:25

Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics

Joe Kreuzpaintner, Harris Corporation

Development of Biocompatible Implantable Package with Very High Density for Neurostimulator Applications

Ali Karbasi, Florida International University

1:25 -- 1:50

Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plated Printed Circuit Boards

Jeffrey Jennings, Harris Corporation

Device Level 3D Integration Technologies for High Performance System in Package Modules 

Daniel Baldwin, Engent, Inc.

1:50 -- 2:15

Reliability Issues with Pb-Free Soldering

 

Werner Engelmaier, Engelmaier Associates

Development of Novel 3-D Cube Antennas for Compact Wireless Sensor Nodes 

Thomas Weller, University of South Florida

2:15 -- 2:40

High Current Handling and High Reliability Solder ACFs FOB (Flex On Board) Joints using an Ultrasonic Bonding Method 

Kyung W. Paik, KAIST

A Printed-Electronics Flying Camera

 

Paul Deffenbaugh, nScrypt

2:40 -- 2:50

Break

Time

Session 3: Microelectronic Assembly / Packaging

Session 4: Advanced Technology & Emerging Industry Issues

2:50 -- 3:15

Conditions for Optimized Deep Access - Gold Ball Bonding Performance

Larry Crider, Harris Corporation

IMAPS National Technical workshop initiatives and Educational Outreach

Mike Newton, IMAPS NEC - VP Technical Programs

3:15 -- 3:40

Measuring and Controlling Volatiles in Hermetically Sealed Enclosures

 

Bob Lowry, Electronic Materials Characterization

Global Technology Survey of Anisotropic Conductive Interconnect Technologies, Past Present and Future - An Industry Intellectual Property Approach

Edmar Amaya, EDAM LAW PLLC

3:40 -- 4:05

MEMS Device Sealing in a High Vacuum Atmosphere - Achieving Long Term Reliable Vacuum Levels

Bruce Wilson, STT International

Implementation of Magneto-Dielectric Polymer Nanocomposites for RF/MW Antenna Applications 

Jing Wang, University of South Florida

4:05 -- 4:30

The Growth of Copper Wire Bonding

Lee Levine – Process Solutions Consulting Inc

Identifying and Avoiding Counterfeit Electronic Components

 

Bob Lowry, Electronic Materials Characterization

 

 

5:00 -- 5:30

Keynote:  Packaging Technology Expectations for Next Generation Military Communications Systems

       



















































 

 

 

 

 

 

 

REGISTRATION RATES:

  1. Attendee-Symposium: $40 member; $45 non-member after 2/11/2011
  2. Attendee-Exhibits only: $15 after 2/11/2011

Attendee registration amounts may be paid by Credit Card, Company/ Personal Check (USA Banks only) or Cash (at-door only).

  1. Exhibitor: $400 after 2/11/2011. Exhibitor amounts may be paid by Credit Card or Company/ Personal Check only. Fee includes one 8 table, full symposium benefits for one person & 3 free Exhibits Only tickets.

 

SPONSORS: We need Symposium General Sponsorships at $250.each - Only Exhibitors can be Sponsors who will receive 6 free Exhibits Only tickets.

PAST EXHIBITORS:
Hesse & Knipps, Orthodyne Electronics, NorCom Systems, Geib Refining, Dour Technical  Sales, Sypris Test & Measurement, Thermo Electron, Reldan Metals, Cyber Technologies, JG Associates, Newport Corporation, Dupont Microcircuit Materials, Palomar Technologies, AI Technologies, NTK Technologies, Chip Supply, Midas Technologies, Minco Technology Labs, Oneida Research, Natel Engineering, Harrington Group, Epoxy Technology, Kyocera America

Registration: Please Email or FAX completed form to Tim Davis-Email: tim@jdm-associates.com or FAX: 321-244-1110  
Payment:

  1. By Credit Card: Please complete online payment form at http://www.imaps.org/chapters/florida/
  2. By Check: Mail check made out to "IMAPS-Florida" to  Tim Davis, P.O. Box 623309, Oviedo, FL 32762-3309

For general information please email Doug Bokil at dbokil@bokil.com or call 781-354-0962. You may also check our website http://www.imaps.org/chapters/florida/ for updates.

IMAPS Southern California Chapters and OCE Announce SoCal 2011    ^ Top
The Southern California Chapters of IMAPS are partnering with OCE Shows this year for SoCal11. SoCal 2011 will be held March 15-16, 2011, at the OC Fairgrounds.

EXHIBITORS
To reserve your booth. Go to www.oceshow.com and click on Exhibiting Information

ATTENDEES
To Sign up to attend the show and reserve your seat for the technical program Go to www.oceshow.com and click on Register for Free

Orange County Electronics Show, Inc. 1514 First Street Manhattan Beach, CA 90266 Phone: (310) 937-1006/E-mail: sales@oceshow.com

Bill Gaines
Program Chairman, SoCal11
626-812-2199 (office)      714-403-5053 (cell)

Chicago/Milwaukee Chapter March 15 Winter Technical Forum on Materials and Advanced Technologies    ^ Top

Date: March 15, 2011 at 11:30 AM
Location:

HOSTED BY: LASERAGE – WAUKEGAN, IL
3021 Delany Rd.
Waukegan, IL 60087
847-856-2216

Registration:

Cost: $15.00 for RSVPd IMAPS Members
$20.00 Others.
$20.00 Students & Displaced Members

On-line registration guarantees seating and lunch. Please register by COB on Friday, March 11th. Participants may pay on-site by cash or check only.

11:30 AM -- Registration and Networking

12:00 PM -- Lunch and Chapter Announcements

12:45 PM -- Multilayer Ceramics for MEMS Packaging
Adam Schubring / Kyocera

01:15 PM -- Advanced Anisotropic Conductive Paste for Flip Chip Assembly
Ken Araujo / Namics Technologies

01:45 PM -- Break: Refreshments

02:00 PM -- Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology.
Sarah Groman / Heraeus Materials Technology

02:30 PM -- Advanced Solid State Lighting using MID Technology
Vic Zaderej / Molex

03:00 PM -- Advance Packaging Cleaning & Process Development
Tim Noble & Sherry Hoard / Kyzen Corporation

03:30 PM -- Overview of Laserage and Tour
Steve Capp

04:00 PM -- Conclusion

New England Chapter 38th Symposium & Expo on May 3    ^ Top

Date: May 3, 2011
Schedule: Technical Program and Registration available soon
Location:

Holiday Inn -- Boxborough Woods Conference Center
Boxborough, Massachusetts

The Largest Regional Symposium Dedicated to Microelectronics and Electronics Packaging

The New England Chapter Symposium Technical Program Committee is finalizing the technical program which will feature sessions/presentations on:

Industry
-- Biomedical Electronics -- Telecom - Microwave -- Military Electronics -- Consumer Electronics -- Renewable Energy: Fuel Cells, Solar, Wind -- Thermal/Power Management -- Manufacturing, Outsourcing & Quality -- Software and Firmware Applications -- High Performance Interconnects and Boards -- Sensor Applications -- Emerging Technologies -- Photovoltaic/Solar

Advanced Processes & Materials
-- 3D and High Density Packaging -- Photonic/ Optoelectronic Packaging -- LED Packaging -- MEMS and Nano Packaging -- Underfill/ Encapsulants and Adhesives -- Green Packaging / Compliance with RoHS -- Electronics Recycling -- Flip-Chip and Bumping: Processes, Reliability -- Wire Bonding and Stud Bumping -- Embedded and Integrated Passives -- Ceramic, Polymer and Conductive Materials -- Cu/ Low-K

Symposium Technical Chair:
Roger S. Benson
International Rectifier
Leominster, MA
roger.benson@verizon.net
Phone: (978) 457-4014

Visit us at - www.imapsne.org -- for details

----- also -----
SIX Lecture Sessions, Full Poster Session, Employment Center and an 80 Booth Exhibit Hall

For details about Sponsoring, Exhibiting or Attending Contact:
Harvey Smith: harveys@imapsne.org or Call 508-699-4767

France Chapter To Hold MiNaPAD Forum 2011 on May 11-12    ^ Top

Date: May 11-12, 2011
Schedule: Technical Program and Registration available soon
Location: Grenoble, France
Details: imaps.france@imapsfrance.org or www.imapsfrance.org

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum Conference & 'Interconex' Exhibition

Bringing closer the design and the semiconductor assembly & packaging communities

The program is being developed and sessions are planned on the following topics:

  • Design: CAD and design techniques, IO placement for advanced packaging (fan-out, 3D packaging), design for reliability, IC and package co-design, RF package design, thermal and mechanical predictability (models and simulations)
  • Innovative packaging for MEMS and emerging applications: photovoltaic, biosensors, energy scavenging and batteries, high brightness LEDs,...
  • Process, test, reliability, characterization and challenges of advanced packaging
    platforms: 3D Packaging (with or w/o TSVs), fan-out WLP and embedded IC
    package.
  • Advanced interconnections: flip-chip for high IO count devices and sub 45nm
    CMOS, new flip-chip and WLP metallurgies, bumping techniques
  • System-in-Package for smart systems, telecom, automotive and medical
    applications: solving test and reliability challenges
  • A poster session will address all of the above topics. At the discretion of the
    program committee, submitted abstracts may be considered for poster presentation

Abstracts Due Tomorrow: Nordic Chapter Conference in Finland June 5-8    ^ Top
IMAPS Nordic Chapter is proud to announce the year 2011 conference in Finland. The conference will take place in Dipoli in the centre of the technology in Otaniemi, Espoo hosting a range of high tech companies as well as Aalto University and the Technical Research Center of Finland.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2011. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org no later than February 18. Speakers will be notified of paper acceptance by email by March 4. The deadline for the final paper is April 8.

Proposed topics include:

  • 3D Advanced interconnect, TSV, Advanced packaging
  • MEMS, MOEMS, sensor integration & applications
  • Harsh environment
  • High temperature electronics
  • Printed electronics
  • Future electronics, trends & strategies
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Microvia, HDI laminates, flex, embedded passives
  • Chip thinning & stacking, 3D-packaging, TSV, embedding
  • Pb and halogen free electronics, methods and consequences
  • CSP, flip chips, area array
  • Reliability assessment, SPC
  • High frequency packaging
  • SMT and board assembly
  • Integrated passive devices (IPD) & System in Package (SiP)
  • System cost assessment
  • Manufacturing management & outsourcing
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
  • Modelling and simulation

Tutorial:
Tutorial suggestions are also welcome to conference@imapsnordic.org.
For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org.

Hotel:
The conference hotel is Radisson Blu Hotel in Espoo (http://www.radissonblu.com/). Use code IMAPS when booking. Rates: 110€/single standard and 130€/double standard. The social events will take place at the hotel.

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.


   
   

LORD Corporation

Webinar: How To Mitigate the Risk of Counterfeit Electronic Parts
February 25

Global Business Council Spring Conference
March 6-7
Ft. Hills, AZ

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact modonoghue@imaps.org

IMAPS/ACerS CICMT
April 5-7
San Diego, CA
*Exhibitors contact modonoghue@imaps.org

"Think Thin" - IC Packaging for Mobile Applications
May 4-5
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

Medical Device Packaging
June 14-15
Minneapolis, MN
*Exhibitors contact modonoghue@imaps.org

Mid-Atlantic Conference
June 23-24
Atlantic City, NJ
*Exhibitors contact modonoghue@imaps.org

IMAPS/CPMT Optoelectronic Packaging
June 28-30
Irvine, CA

Advanced Interconnect & Substrate
July 13
San Francisco, CA

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

RF/Microwave
September 20-22
San Diego, CA

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

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