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January 13, 2011
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button Device Packaging 2011 - Program, Registration and Exhibit Details Now On-line! (read more...)

Button Abstracts Due for the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN) (read more...)

Button Announcing the "Think Thin" - IC Packaging for the New Era of Mobile Devices (read more...)

Button 2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Northern California Chapter February 2 Lunch Meeting on Fine Pitch Copper Wire Bonding (read more...)

Bullet Arizona Chapter February 17 Lunch Meeting on Reasons for Optimism in 2011 (read more...)

Bullet Metro Chapter February 17 Dinner Meeting (read more...)

Bullet Florida Chapter's Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition on February 24 (read more...)

Bullet IMAPS France 6th ATW on Micropackaging and Thermal Management (read more...)

Bullet IMAPS Southern California Chapters and OCE Announce SoCal 2011 (read more...)

Bullet New England Chapter 38th Symposium & Expo on May 3 (read more...)

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2011 - Program, Registration and Exhibit Details Now On-line!    ^ Top
The seventh Annual Device Packaging Conference (DPC2011) will be held in Scottsdale, Arizona, on March 7-10, 2011. Early registration/exhibits and hotel deadlines are February 3, 2011. For more information, visit www.imaps.org/devicepackaging.

The 2011 conference will feature 4 keynote presentations, 16 technical sessions, Fan-Out/Embedded and 3D (Memory Cub) panel discussions, a poster session, 8 professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topical workshop areas related to microelectronic packaging: 3D IC & Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration). Sessions will be held in these technical areas on: 3D Marketing & Products, 3D Assembly & Packaging, 3D Materials & Processing, 3D Design, Thermal & Metrology; Flip Chip, Flip Chip Cu Pillar and Solder Bumps; Laminate and Polymer MEMS, MEMS Fabrication & Packaging, MEMS Gyroscope Devices & Systems, MEMS Sensors and Actuators; WLP Process Technologies, Embedded Die & Fan-Out WLP, WLP Applications; LED Packaging; and Passive Integration.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006. Please review the exhibit information or contact Michael O'Donoghue by email at modonoghue@imaps.org or by phone at 202-548-8707.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of 8 half-day courses will be offered on Monday, March 7th, preceding the technical conference.

IMAPS Microelectronics Foundation Fundraising/Social Activities:
This year the Microelectronics Foundation will offer two charity events to raise funds toward its mission "to support student activities related to the study of Microelectronic Packaging, Interconnect and Assembly." On Monday, March 7, the IMAPS Microelectronic Foundation is holding its first charity Texas Hold'em Tournament. On Thursday afternoon, March 11, the IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club.

Texas Hold'Em Tournament Monday, March 7
7:00pm - 10:00pm
Texas Hold'em Tournament
Fort McDowell Resort
Spring Golf Invitational Thursday, March 10
1:00pm Shotgun Start – "Best Ball" Scramble
Desert Canyon Golf Club

.Technical Program | On-line Registration

Abstracts Due for the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN)    ^ Top
The International Conference and Exhibition on High Temperature Electronics Network (HiTEN) is being held July 18-20, 2011, at St. Catherine’s College Oxford in Oxford, United Kingdom. The call for abstracts and full conference details can be found on-line at www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later January 28, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due May 2011, for all accepted abstract.

Announcing the "Think Thin" - IC Packaging for the New Era of Mobile Devices    ^ Top
The workshop will be held at the Biltmore Hotel & Suites in Santa Clara, California, on May 4-5, 2011. Abstracts will be accepted until February 4. To submit an abstract and for more information, visit www.imaps.org/thin.

The market for smart mobile devices is exploding, including smart phones, tablets, and convergence devices, driven by consumers who demand greater functionality and ease of use. As a result, device designs require functional integration of IC’s, especially in the 3rd dimension, hence driving new technology development towards making IC components “thin”. The objective of the “Think Thin” Workshop is to address the numerous aspects of making IC packages “thinner” by providing a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of microelectronics, IC packaging, emerging packaging technology for mobile devices. This event enables discussion and presentations on the latest materials, process, design & emerging applications of “thin” packaging technology.

Abstracts are being solicited in the following areas:

Materials:

  • Substrate requirements (coreless, etc.)
  • Underfill requirements
  • Die attach materials (DAF, dispensed)
  • Mold compounds

Equipment:

  • Die thinning
  • Die handling (carrier bonding and de-bonding, die sawing)
  • Die attach
  • Molding
  • WLP/eWLP/ equipment

Processes:

  • Die thinning
  • Die stacking
  • Molding
  • Interconnect (Cu pillar, Flip Chip, Thermo-Compression, Wirebond, etc.)

Design/Simulation:

  • Modeling for warpage prediction and material selection
  • CPI (chip / package interaction)
  • Reliability / stress simulation

WLP / eWLB / Embedded die technologies:

  • Low cost constructions
  • Horizontal and vertical integration
  • Package thickness challenges

PoP Technologies:

  • Flange/ Bare Die/ Through Mold Via
  • Stack up height reduction
  • Top package (memory) height reduction
  • Warpage control

3D Technologies:

  • TSV
  • Interposers
  • 3D Embedded die technologies

Reliability:

  • Thin Die
  • TCT/ Drop/ Bend
  • Board Level
  • Package Level

Emerging Technologies:

  • Printable circuits
  • Alternative memory stacking interconnect

Those wishing to present at the Workshop, should submit a 250-300 word abstract electronically by February 4, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)    ^ Top
Thursday, March 10, 2011
1:00pm Shotgun Start – “Best Ball” Scramble
Desert Canyon Golf Club
10440 Indian Wells Drive
Fountain Hills, AZ

The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for six consecutive years. Desert Canyon Golf Club’s eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.

Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.

A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course – 1:00pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive; and
  • Longest Putt

Sponsorship Opportunities:

Eagle Sponsor - $3,000

  • Company logo/name displayed as Awards Reception Sponsor.
  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500

  • Company logo/name displayed as Lunch Sponsor - in/on boxed lunches.
  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.

Hole Sponsor - $400

  • Sponsorship of one hole with signage.
  • Entrance of one golfer.
  • Company logo/name on promotional materials and website.

Register On-line
Questions or request teams/partners:
David Virissimo, Foundation Golf Chair - dvirissimo@sempck.com or 619-464-5430

  Chapter Activities (events listed in chronological order)
 

Northern California Chapter February 2 Lunch Meeting on Fine Pitch Copper Wire Bonding    ^ Top

Date: Wednesday, February 2, 2011
Schedule: 11:30 AM – 12 PM Registration & Networking
11:30 AM – 12:15 PM Buffet Luncheon
12:15 PM – 1:00 PM Speaker Presentation
Location:

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054
408-986-1666

Registration:

IMAPS Members $20.00;
Non-members $25.00;
Students (with ID) $10.00
Price includes lunch and program.

Please email Roger Underwood, IMAPS NorCal Treasurer, at runderwood@cctlaser.com before COB January 31, 2011 to guarantee your lunch. SPACE IS LIMITED! Registrations will be confirmed via e-mail. We only accept cash and checks at the door.

Fine Pitch Copper Wire Bonding
Bob Chylak, Vice President
Packaging & Process Integration, Kulicke & Soffa

Abstract:
During the last year, fine pitch copper wire bonding has become a mainstream, high volume, fully commercialized packaging technology. Although copper wire had long been recognized for its advantages of substantially lower cost, higher electrical and thermal conductivity and greater stiffness, it took the quadrupling of gold prices over the last five years to drive the semiconductor packaging industry to solve the numerous technical challenges, such as oxidation and pad cracking, associated with copper wire bonding. Now growth of copper wire bonding has been exponential, approximately doubling every 6 months. By the end of 2010, about 20 % of all bonding wire is expected to be copper.

The conversion from gold to copper wire bonding is a truly revolutionary shift that occurred at a breathtaking pace of innovation. Virtually every aspect of wire bonding required reexamination. There was a need to go far beyond solving the basic challenges of Copper Wire Oxidation and sensitive pad cracking due to its increased hardness. An ever deeper understanding of the differences between Cu and Au wire bonding led to improvements in the mechanical and electrical subsystems of the wire bonder, new software to carry out dramatically different wire bonding processes, Cu-specific bonding tools, and improved copper bonding wire. As more advanced bonders and consumables became available and began to be tested in the industry, a need for additional technology improvements both upstream and downstream from the wire bonder also became apparent. Increasingly, the bond pad design is being reinvestigated with an eye towards the needs of copper wire bonding. Molding compound and even substrates are being reformulated to account for the corrosion-sensitivity of copper bonding wire.

Speaker Bio:
Bob Chylak is Vice President, Packaging and Process Integration for Kulicke & Soffa. He is responsible for the research and development of K&S packaging solutions across all K&S products. Bob has more than 25 years of experience in the semiconductor industry. He has a BS-EE degree from Penn State University and completed Executive Management Studies at Stanford University and MIT Sloan. Bob has published more than 25 papers and holds 2 patents. He can be reached at bchylak@kns.com.

Arizona Chapter February 17 Lunch Meeting on Reasons for Optimism in 2011    ^ Top

Date: Thursday, February 17, 2011
Schedule: Registration and Lunch at 11:30 – 12:00
Presentation at 12:00
Location:

Dobson Ranch Inn
1666 S. Dobson Road
Mesa, AZ 85202

Registration:

Luncheon and presentation -
$25.00 members, $35 at the door or non-members

Vendor display tables available $100 (includes 2 lunch tickets)

RSVP by 28 January 2011

On-line: www.imaps.org/registration/az2011feb.htm
Or via e-mail greg.clemons@live.com

Hear why 2010 was only the beginning of the next high-growth phase for the IC industry!
And…why IC Insights has the highest 2011 growth forecast of any major market research firm!

Bill will summarize the latest trends in the IC industry, especially now as it moves through the upturn portion of its cycle. A few of the reasons for IC Insights' optimism for 2011, will be discussed including:

  • Growth in China, India, and Latin America will drive worldwide GDP growth above its long-term average of 3.5%.
  • After every global recession since 1980, the semiconductor industry entered at least a two-year boom period—2011 will be the second year after the 2009 global downturn.
  • Portable PCs, smartphones, digital TVs, and automotives are spurring healthy electronic system growth.
  • IC industry capacity increased only 6% in 2010 and capital spending is forecast to show only moderate growth in 2011, minimizing the risk of IC industry overcapacity. After averaging a 4% per year decline over the past 10 years, IC average selling prices are forecast to remain stable over the next couple of years.

Presented by Bill McClean, President of IC Insights
Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With nearly 30 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones.

Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide.

Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

Metro Chapter February 17 Dinner Meeting    ^ Top

Date: Thursday, February 17, 2011
Schedule: Registration/Networking 5-6:30 PM
Dinner Buffet: 6:30-7:15 PM
Presentation: 7:15-8:15 PM
Location:

Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
631-585-9500

Registration:

Members: $30.00 if Pre-Registered by February 14, 2011
$50.00 after February 14, 2011

Non-Members: $50.00 if Pre-Registered by February 14, 2011
$75.00 After February 14, 2011

Student Members: Free if Pre-Registered by February 14, 2011
$25.00 after February 14, 2011

Registration Email: metroimaps@optonline.net
Phone: Steve Lehnert (650) 644-5218
WEB: www.imaps.org/chapters/metro

There are a limited number of vendor tables available for this event. Please contact Steve Lehnert for further details.

AlSiC Thermal Management Applications - Heat Spreader Lids, IGBT Baseplates, Pin Fin Power Module Coolers for Hybrid Electric Vehicles (HEV) and Hermetic Packages

Presented By: Bo Sullivan, CPS Technologies

Performance requirements of Multicore Communications Processors, High Power/Reliability IGBT Modules, Hybrid Electric Vehicles (HEV) power module systems and Hermetic Packages lead to design focus on thermal management issues such as Coefficient of Thermal Expansion (CTE) compatibility and thermal dissipation. The same attributes that make AlSiC ideal for high reliability power conversion IGBT’s, Heat Spreader Lids and Hermetic Packages make the Aluminum Silicon Carbide (AlSiC) metal matrix composite an ideal material for thermal management in HEV applications which need CTE compatibility with the attached electronic components combined with good heat dissipation. AlSiC is also lightweight (1/3 the weight of Copper) while being shock and vibration tolerant. The AlSiC fabrication process allows for functional designs to be cast rather than machined, resulting in a cost effective product. This presentation will outline the AlSiC material properties and fabrication process as well as outlining the power conversion applications that have led to the evolution of AlSiC from an “exotic material” used mainly in “R&D environments” to its use in mainstream automotive, power generation, military and communications applications over the past 10 years.

About Bo Sullivan:
Bo Sullivan joined CPS Technologies in 2006 as Senior Account Manager. Previous to this, Bo has worked for Westinghouse, Texas Instruments, VideoServer and Telco Systems. Bo has a Bachelor of Science Degree in Electrical Engineering from Brown University and over 35 years of experience in technical sales & marketing positions.

IMAPS France 6th ATW on Micropackaging and Thermal Management    ^ Top

Dates: February 2-3, 2011
Location:

Mercure Oceanide Vieux Port Sud La Rochelle

Program Details: www.imapsfrance.org

Conference Chairman :
Jean-Claude RAMES (MBDA France)

Technical Programme Committee:
Nick CHANDLER (BAE SYSTEMS)
Pierre LEWANDOWSKI (CONTINENTAL AUTOMOTIVE)
Michel MASSIOT (EGIDE)
Michel MERMET GUYENNET (ALSTOM)
Gilles POUPON (CEA LETI)
Claude SARNO (THALES AVIONICS)
Dave SAUMS (DS & A LLC)
Richard SEDDON (TECNALIA AEROSPACE)
Jean-Marc YANNOU (YOLE Développement)

The workshop will present improvements in thermal management materials, components and services, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and subsystems

Please note that 2 keynotes papers from France & United states as well as 22 conferences from Austria, France, Germany, Spain,Switzerland, United Kingdom, United States and table top exhibition will be presented.

Reminder: Final registration end on January 25, 2011.

Speakers are required to pay a reduced registration fee (441.47 € exlcuded VAT) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Answer to Florence Vireton
by e-mail: imaps.france@imapsfrance.org
by fax: +33 (0) 1 39 02 71 93

TABLE TOP EXHIBITION (limited number first come first serve basis) : 1 table, 2 chairs 1 panel. Presentation of your activity, your last products and results (only for companies in relation with thermal management). 300 € excluded VAT

Florida Chapter's Microelectronics, Manufacturing, Materials and Application Symposium & Exhibition on February 24    ^ Top
February 24, 2011
Crowne Plaza Hotel, ORLANDO-UNIVERSAL
7800 Universal Boulevard
O rlando, FL 32819, USA
Hotel Front Desk: 1-407-3550550 | Hotel Fax: 1-407-3550504

ADVANCE PROGRAM
Key Words from the planned presentations:
3-D Cube Antennas, 3D Packaging, Au-Sn intermetallic, Ceramic Packaging, Chip floating,
Compact Wireless Sensor Nodes, Counterfeit components, Flip chip assembly, Hermeticity, High Density Feedthrough, High Density Packaging, Hi-Rel Packaging, Hybrids, Inspection, Interconnect Reliability, LTCC/HTCC fabrication, Magnetic Nanoparticle, Magneto-Dielectric Polymer, Material Analysis, Medical devices, Microelectronics, MEMS, Nanocomposites, Near Hermetic, NEMS fabrication, Neurostimulator, No flow underfill, Platinum-alumina intermetallic, Printed Electronics, RF, RF/MW Antenna Applications, Sintering kinetics, Titanium housing, Wire Bonding

Partial List of Presentations (Tentative):
Keynote: Packaging Technology Expectations for Next Generation Military Communications Systems
1. “Global Technology Survey of Anisotropic Conductive Interconnect Technologies, Past Present and Future - An Industry Intellectual Property Approach” - EDAM LAW PLLC
2. “Development of Novel 3-D Cube Antennas for Compact Wireless Sensor Nodes” - University of South Florida
3. “Silver Epoxy Filled Via Analysis for High Reliability RF MCM Microelectronics” - Harris Corp
4. “Measuring and Controlling Volatiles in Hermetically Sealed Enclosures” - Electronic Materials Characterization
5. Continuous Au-Sn-Ni-Cu-Pb (ASN-CP) Layer Formation on Double Tin and Wicked Thick-Au/Ni Plaed Printed Circuit Boards” - Harris Corp
6. “Conditions for Optimized Deep Access - Gold Ball Bonding Performance” - Harris Corp
7. “MEMS Device Sealing in a High Vacuum Atmosphere - Achieving Long Term Reliable Vacuum Levels” - SST International
8. “High Current Handling and High Reliability Solder ACFs FOB (Flex On Board) Joints using an Ultrasonic Bonding Method” - KAIST, South Korea

TECHNICAL PROGRAM:
Two parallel sessions from 1:00 PM to 4:30 PM (12-14 papers total, beverages available in each classroom)

EXHIBITS from 3:00PM - 7:30PM with HOT hors d'oeuvres served in the Exhibits area. Cash Bar.

REGISTRATION RATES:

  1. Attendee-Symposium: $30 member; $35 non-member prior to 2/11/2011; $40/45 after 2/11/2011
  2. Attendee-Exhibits only: $10 prior to 2/11/2011; $15 after 2/11/2011

Attendee registration amounts may be paid by Credit Card, Company/ Personal Check (USA Banks only) or Cash (at-door only).

  1. Exhibitor: $350.00 prior to 2/11/2011; $400 after 2/11/2011. Exhibitor amounts may be paid by Credit Card or Company/ Personal Check only. Fee includes one 8’ table, full symposium benefits for one person & 3 free Exhibits Only tickets.

SPONSORS: We need Symposium General Sponsorships at $250.each - Only Exhibitors can be Sponsors who will receive 6 free Exhibits Only tickets.

PAST EXHIBITORS:
Hesse & Knipps, Orthodyne Electronics, NorCom Systems, Geib Refining, Dour Technical  Sales, Sypris Test & Measurement, Thermo Electron, Reldan Metals, Cyber Technologies, JG Associates, Newport Corporation, Dupont Microcircuit Materials, Palomar Technologies, AI Technologies, NTK Technologies, Chip Supply, Midas Technologies, Minco Technology Labs, Oneida Research, Natel Engineering, Harrington Group, Epoxy Technology, Kyocera America

Registration: Please Email or FAX completed form to Tim Davis-Email: tim@jdm-associates.com or FAX: 321-244-1110  
Payment:

  1. By Credit Card: Please complete online payment form at http://www.imaps.org/chapters/florida/
  2. By Check: Mail check made out to “IMAPS-Florida” to  Tim Davis, P.O. Box 623309, Oviedo, FL 32762-3309

For general information please email Doug Bokil at dbokil@bokil.com or call 781-354-0962. You may also check our website http://www.imaps.org/chapters/florida/ for updates.

IMAPS Southern California Chapters and OCE Announce SoCal 2011    ^ Top
The Southern California Chapters of IMAPS are partnering with OCE Shows this year for SoCal11. SoCal 2011 will be held March 15-16, 2011, at the OC Fairgrounds.

EXHIBITORS
To reserve your booth. Go to www.oceshow.com and click on Exhibiting Information

ATTENDEES
To Sign up to attend the show and reserve your seat for the technical program Go to www.oceshow.com and click on Register for Free

Orange County Electronics Show, Inc. 1514 First Street Manhattan Beach, CA 90266 Phone: (310) 937-1006/E-mail: sales@oceshow.com

Bill Gaines
Program Chairman, SoCal11
626-812-2199 (office)      714-403-5053 (cell)

New England Chapter 38th Symposium & Expo on May 3    ^ Top

Date: May 3, 2011
Schedule: Technical Program and Registration available soon
Location:

Holiday Inn – Boxborough Woods Conference Center
Boxborough, Massachusetts

The Largest Regional Symposium Dedicated to Microelectronics and Electronics Packaging

The New England Chapter Symposium Technical Program Committee is finalizing the technical program which will feature sessions/presentations on:

Industry
• Biomedical Electronics • Telecom - Microwave • Military Electronics • Consumer Electronics • Renewable Energy: Fuel Cells, Solar, Wind • Thermal/Power Management • Manufacturing, Outsourcing & Quality • Software and Firmware Applications • High Performance Interconnects and Boards • Sensor Applications • Emerging Technologies • Photovoltaic/Solar

Advanced Processes & Materials
• 3D and High Density Packaging • Photonic/ Optoelectronic Packaging • LED Packaging • MEMS and Nano Packaging • Underfill/ Encapsulants and Adhesives • Green Packaging / Compliance with RoHS • Electronics Recycling • Flip-Chip and Bumping: Processes, Reliability • Wire Bonding and Stud Bumping • Embedded and Integrated Passives • Ceramic, Polymer and Conductive Materials • Cu/ Low-K

Symposium Technical Chair:
Roger S. Benson
International Rectifier
Leominster, MA
roger.benson@verizon.net
Phone: (978) 457-4014

Visit us at - www.imapsne.org – for details

----- also -----
SIX Lecture Sessions, Full Poster Session, Employment Center and an 80 Booth Exhibit Hall

For details about Sponsoring, Exhibiting or Attending Contact:
Harvey Smith: harveys@imapsne.org or Call 508-699-4767

 


   
   

LORD Corporation

Global Business Council Spring Conference
March 6-7
Ft. Hills, AZ

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact modonoghue@imaps.org

IMAPS/ACerS CICMT
April 5-7
San Diego, CA
*Exhibitors contact modonoghue@imaps.org

"Think Thin" - IC Packaging for Mobile Applications
May 4-5
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

Medical Device Packaging
June TBD
Minneapolis, MN
*Exhibitors contact modonoghue@imaps.org

Mid-Atlantic Conference
June TBD
Atlantic City, NJ
*Exhibitors contact modonoghue@imaps.org

IMAPS/CPMT Optoelectronic Packaging
June 28-30
Irvine, CA

Wire Bonding
July TBD
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

RF/Microwave
September 20-22
San Diego, CA

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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