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July 13, 2011
 

Palomar Technologies

   IMAPS EVENTS
Button Abstracts Due July 25 for Workshop on Thermal Management (read more...)

Button System Level Packaging Workshop Abstracts Due July 25 (read more...)

Button NEXT WEEK: HiTEN 2011 - High Temperature Electronics Network (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Northern California Chapter August 3 Lunch Meeting with talk on Development of Pd-Coated Cu Wire Bonding (read more...)

Bullet UK Chapter Hosting EMPC2011 - Early Registration Deadline June 30 (read more...)

Bullet IMAPS Taiwan Chapter's IMPACT (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

Bullet Florida Chapter Announces SouthEast Microelectronics Conference (SEMC) in Conjunction with the 2012 Conference on "Near Hermetic Packaging" (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

Abstracts Due July 25 for Workshop on Thermal Management   ^ Top
IMAPS is holding the Advanced Technology Workshop on Thermal Management at Dinah's Garden Hotel in Palo Alto, CA, on November 7-9, 2011. To view the call for abstracts and details about the workshop, visit www.imaps.org/thermal. This workshop is co-located with the ATW on System Level Packaging.

This workshop is organized each year by IMAPS to promote discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions to meet current and evolving requirements in computing, telcom, and power semiconductor devices and systems.  Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on novel and innovative contributions to the industry knowledge.  The focus of all presentations should be on technical content for describing a thermal solution.

This Advanced Technology Workshop (ATW) and Tabletop Exhibition on Thermal Management has been held since 1992 and is considered to be one of the most successful of the IMAPS workshops held each year. The 2010 Workshop featured 37 technical presentations, three of which were competition-selected presentations from university engineering graduate students. Tabletop exhibition has been a part of this workshop since 2008.

ATW schedule and location serve to promote informal discussions and networking by attendees and speakers. All authors and attendees find that this IMAPS workshop format is a proven forum for informal but highly effective networking between the workshop participants. Speakers pay a reduced registration fee.

A student competition is held for engineering undergraduate and graduate students, with stipend awards for winning abstracts, to promote early participation in industry events and the presentation of current academic research.

ABSTRACTS ARE SOLICITED IN THE FOLLOWING AREAS:

  • Market Drivers:  Market trends, technical drivers, cost drivers, performance and reliability requirements, developing markets.
  • Thermal Analysis and Modeling:  Tools for thermal analysis, practical techniques for thermal modeling and empirical work, describing difficult thermal design problems with proposed and final solutions.
  • Thermal Interface Materials and Testing:  Developments in thermal materials for high-performance processors, memory, RF, and telcom components and systems. Standards for reliability and testing. Metallic, polymer matrix, CNT, thermal adhesives, and other materials. 
  • High Conductivity Materials:  Metallic, ceramic and composite materials with high thermal conductivity and CTE matching.
  • Liquid, Phase-Change, and Refrigeration Cooling:  Advances in alternative solutions as well as reliability, serviceability, and availability.
  • System Cooling:  Component- and system-level thermal management solutions for high-performance computing systems.
  • Data Center Cooling:  Studies of cooling provisioning, airflow and temperature distribution, and migration from air to liquid cooling.         
  • Harsh Environment Applications:  Harsh environment platforms, including military, airborn, hybrid, and electric vehicles.
  • Telecommunications and Consumer Electronics:  Component- and system-level thermal solutions for telcom, consumer, handhelds, displays, routers, and similar systems.
  • LED & Solar Applications:  Component- and system-level thermal management of high-power HBLED / UHBLED and solar applications.

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 25, 2011.  No formal technical paper is required. 

Presentation material must be submitted onsite no later than November 9, 2011, and will be included on the post-conference CD that will contain the full presentation materials as supplied by authors. CD will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433

System Level Packaging Workshop Abstracts Due July 25   ^ Top
IMAPS is holding the Advanced Technology Workshop on System Level Packaging at Dinah's Garden Hotel in Palo Alto, CA, on November 10-11, 2011. To view the call for abstracts and details about the workshop, visit www.imaps.org/syspack. This workshop is co-located with the ATW on Thermal Management.

As we move to smaller submicron lithography in Silicon and denser packaging the boundaries of the system packaging infrastructure are being constantly challenged. The Advance Technology Workshop on System Packaging is an attempt to bring together leading edge technologies and processes that are currently needed in the System Packaging community to address some challenges associated with higher speed, greater bandwidth, higher system performance efficiency, multidisciplinary trade-offs(e.g. thermal, EMI) and greater densification.

Speakers are asked to attend the entire Workshop to maximize opportunities for interaction with registered attendees.  All authors and attendees find that this IMAPS Workshop format is a proven forum for informal but highly effective networking between attendees and speakers. Speakers pay a reduced registration fee.

ABSTRACTS ARE SOUGHT BUT NOT LIMITED TO THE FOLLOWING AREAS/SUBJECTS:

POWER: New developments in advanced high density and high efficient power delivery designs from chip level to subsystem level are being introduced at a rapid rate. Development has focused on generation, distribution and management of power. Some of these areas include embedded power components and circuits, Voltage Regulator Modules, DC-DC modules, AC power supply modules, rack-mount power supply units (PSUs) and power distribution units (PDUs), and DC power entry modules.

  • Power architecture - including High Voltage.
  • DC-DC converters
  • Power Semiconductors 
  • Power System Management

THERMAL MANAGEMENT - SYSTEM LEVEL: The growth of High Performance Computing and the densification of products for hand-held application has given rise to some unique opportunities in System Level Thermal Management.

  • Single (air and liquid) and multiphase cooling
  • Thermal management materials
  • Microfabricated thermal management devices and systems.
  • Systems in extreme environments.

SIGNAL INTEGRITY: COPPER and OPTICAL: Higher speeds and greater bandwidth have led to some unique opportunities to insure signal integrity under various operating conditions.

  • PCB power integrity design
  • Model Parameter Determination
  • Device Modeling/Packaging
  • Crosstalk
  • Measurement techniques
  • EMC/EMI

INDUSTRIAL DESIGN: The shape and structure of all consumer products and most industrial products is driven by Industrial Design. The search for improved aesthetics and ergonomics has resulted in innovation in cost effective materials and processes.

  • Ecodesign & Sustainability
  • Human factors & ergonomics
  • Design For Assembly / Design For Manufacturing
  • Material & Processes

INTERCONNECT: As the data rates of next-generation systems exceed several gigabits per second, the passive media connecting the ‘drivers’ and the ‘receivers’ become as important and sophisticated as the solid-state devices themselves. The interconnect media may include chip to board and board to boards connections through fixed and/or removable connectors, printed circuit boards, and cable assemblies. Any discontinuity of the transmission line through these interconnects contribute to signal degradation, non-optimized power dissipation and enhanced radiated emission and can easily become a limiting factor for overall performance of the system.

  • Printed Circuit Boards and Backplanes
  • Cables and Connectors - Traditional / “active” copper and optical.
  • Simulation and Modeling
  • Signal Integrity and Measurement Techniques

MATERIALS: Advances in materials have led to greater design flexibility in system design at significant savings in cost and schedule.

  • Thick and thin film materials
  • Printed Circuit Board materials
  • MEMS materials
  • Nano materials

DISRUPTIVE TECHNOLOGIES - INNOVATIONS: Disruptive technology innovations have resulted in paradigm shifts in how products get designed and manufactured.

  • Innovative Packaging concepts
  • Innovative System solutions

MANUFACTURING TECHNOLOGY: Manufacturing is where the rubber meets the road. Cost, performance, reliability and cycle time are some of the major contributors to the profitability of a product.

  • Low cost high value manufacturing techniques.
  • Right-shoring products.
  • Green technologies

PREPARATION OF ABSTRACT:
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than July 25, 2011.  No formal technical paper is required.  A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, October 7, 2011.  A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees.

Abstracts must be submitted on-line at http://www.imaps.org/abstracts.htm.

Questions:  Jackki Morris-Joyner, Technical Programs Manager.  Email: jmorris@imaps.org or 305-382-8433.

NEXT WEEK: HiTEN 2011 - High Temperature Electronics Network    ^ Top
IMAPS proudly announce the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN). The conference will be held at St. Catherine's College Oxford in Oxford, United Kingdom, from July 18-20, 2011. For full program details, exhibit information or to register, visit www.imaps.org/hiten.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEN is silicon and silicon on insulator (SOI). However, HiTEN is not simply a semiconductor focused network. HiTEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Thank you to our Corporate Sponsors:

HiTEN Corporate Sponsor - CISSOID
HiTEN Corporate Sponsor - Texas Instruments
HiTEN Corporate Sponsor - Trendsetter Electronics
HiTEN Corporate Sponsor - XREL Semiconductor
HiTEN Corporate Sponsor -  Honeywell
HiTEN Corporate Sponsor - Fairchild Semiconductor
       

 

Technical Program | Register On-line | Download Program PDF

 

  Chapter Activities (events listed in chronological order)
 

Northern California Chapter August 3 Lunch Meeting with talk on Development of Pd-Coated Cu Wire Bonding    ^ Top

Date: August 3, 2011
Location:

David's Restaurant, Banquet & Conference Facilities
5151 Stars and Stripes Drive
Santa Clara, CA 95054

Reservations:

Please respond to Roger Underwood, IMAPS NorCal Chapter Treasurer, at runderwood@cctlaser.com to make your lunch reservations.

The speaker is Dr. J.T. Moon, Chief Technology Officer, MK Electron Co., Ltd, Korea. His presentation on "DEVELOPMENT OF Pd-COATED Cu WIRE BONDING" will be addressing issues related to the practical realities of implementation of Cu wire bonding, a development that is having a major impact on the semiconductor interconnect and assembly industry. This will be another very informative, engaging and thought-provoking talk, in keeping with the tradition of IMAPS. This presentation will be of great interest to all microelectronics and optoelectronics assembly and interconnect professionals as the speaker will be discussing important issues such as oxidation of copper wires and stability of bonds, among others. Dr. Moon holds a Ph.D. in materials science, is the Chief Technology Officer at MK Electron, and his research over the last 15 years has focused on microelectronic packaging core materials. He has published more than 20 papers and holds 15 patents related to the materials science of bonding wires and solder balls, among others.

UK Chapter Hosting EMPC2011    ^ Top
The "European Microelectronics & Packaging Conference" is being held at the Hilton Metropole in Brighton from 12-15 September.

The International Refereeing Panel has completed the adjudication of the Abstracts that were submitted from around the world (Europe, Japan, Korea, China, USA) etc. and recommended acceptance of 90 Oral and 30 Poster Technical papers.

This exceptional Technical Programme will ensure excellent attendance at the event, providing exhibitors the opportunity to showcase their Company at EMPC-2011 and interact with people working on the latest technologies in the Microelectronics Industry.

EMPC-2011 is hosted by IMAPS-UK on behalf of IMAPS-Europe with technical co-sponsorship from IEEE-CPMT and builds upon the successful IEEE Electronics System-Integration Technology Conference ESTC-2010 (Berlin) and EMPC-2009, (Rimini). Each event attracted large attendances from delegates world-wide.

Details of the Exhibition Hall layout and pricing are provided in the Exhibitor Registration Pack, which is available to download at www.empc2011.com.

IMAPS Taiwan Chapter's IMPACT    ^ Top
The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011) is organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan, ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA, iNEMI and ICEP which will take place in NTUH International Convention Center during October 19 to 21, 2011. Besides, ICEP and iNEMI are the first time to join IMPACT and we believe IMPACT 2011 will become more splendid after their support. This great annual international event - IMPACT will extend the opportunity to bring researchers, engineers and experts engaged in such a distinguished gathering and show the strength of Taiwan and update worldwide tendencies.

IMPACT 2011 as the sixth conference and the theme is "IMPACT-Leading Innovation" which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage. IMPACT is striving to work out the advanced paper scope and reward policy to attract extraordinary papers all around the world. IMPACT has just closed the call for papers. More information about IMPACT 2010, please refer to the conference website, www.impact.org.tw , or contact with secretariat, MS. Sophia Huang (+886 3 3815659 Ext 404).

IMPACT-Leading Innovation
Date: October 19 (Wed) - October 21 (Fri), 2011
Venue: NTUH International Convention Center, Taipei, Taiwan
Conference: The 6th IMPACT Conference

About Paper Submission
Important Date


Item

Date

Abstract Submission

June 10, 2011

Abstract Acceptance Notification

July 15, 2011

Full Paper Submission
(Camera-ready Version)

August 15, 2011

Presentation Material Submission(Oral Presentation)

October 1, 2011

Secretariat
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #404 - Sophia
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012
Location:

MERCURE OCEANIDE VIEUX PORT SUD
LA ROCHELLE

Details:

www.imapsfrance.org

We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2012 edition and be sure to submit your abstract on time.

The workshop sessions will include the following topics and papers are invited in these areas:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers should submit a 200-300 words abstract accurately/precisely describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions), not later than 4 November, 2011.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: 25 November, 2011.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail: imaps.france@imapsfrance.org, by fax : +33 (0) 1 39 02 71 93

Florida Chapter Announces SouthEast Microelectronics Conference (SEMC) in Conjunction with the 2012 Conference on "Near Hermetic Packaging"    ^ Top
IMAPS Florida chapter announces the first South East Microelectronics Conference (SEMC) in conjunction with the first ever Advanced Technology Conference on "Near Hermetic Packaging" (ATC-NHP) to be located in Orlando, FL. The SEMC will be held on February 8th & the ATS-NHP on the following day the 9th of 2012. Classroom presentations, exhibits, panel discussion, keynote speaker & sumptuous heavy hors d'oeuvres will all be embedded in the two-day event! Preliminary details will be announced in June. February in Central Florida can have a salubrious effect on your psyche! Please check http://dlis.dos.state.fl.us/fgils/tourism.html.

 


   
   

EPP

Valtronic

LORD Corporation

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

"Think Thin" - IC Packaging for Mobile Applications
August 23-24
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

Thermal Management
November 7-9
Palo Alto, CA
*Exhibitors contact modonoghue@imaps.org

System Level Packaging
November 10-11
Palo Alto, CA

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

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