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June 22, 2011

Palomar Technologies

Button IMAPS Mid-Atlantic Microelectronics Conference BEGINS TOMORROW: Complimentary Exhibits Passes and more... (read more...)

Button NEXT WEEK: IMAPS/CPMT Workshop on Optoelectronic Packaging (read more...)

Button Early Registration Deadline FRIDAY for IMAPS/SEMI Workshop on Wire Bonding (read more...)

Button Early Registration and Room Deadlines TOMORROW for HiTEN 2011 - High Temperature Electronics Network (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Rocky Mountain Chapter July 12 Dinner and RFMD Tour (read more...)

Bullet Chesapeake Chapter Summer Meeting on July 13 at CALCE Lab (read more...)

Bullet UK Chapter Hosting EMPC2011 - Early Registration Deadline June 30 (read more...)

Bullet IMAPS Taiwan Chapter's IMPACT (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet Florida Chapter Announces SouthEast Microelectronics Conference (SEMC) in Conjunction with the 2012 Conference on "Near Hermetic Packaging" (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)

IMAPS Mid-Atlantic Microelectronics Conference BEGINS TOMORROW: Complimentary Exhibits Passes and more...   ^ Top
IMAPS and IMAPS Mid-Atlantic Chapters proudly announce the Mid-Atlantic Microelectronics Conference. The conference will be held at the Atlantic City Hilton, Atlantic City, NJ, on June 23-24, 2011. To view the program, exhibit details, to reserve your complimentary "exhibits only" badge, or to register, visit

Many IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to attend the upcoming Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with one half-day professional development course and will begin on the afternoon of Thursday, June 17. The Conference will also feature an evening reception that night.

Register On-line

NEXT WEEK: IMAPS/CPMT Workshop on Optoelectronic Packaging    ^ Top
IMAPS and IEEE-CPMT proudly announce a Advanced Technology Workshop on Optoelectronic Packaging. The workshop will be held at the University of California- Irvine, Irvine, CA, on June 29-30, 2011. To view the preliminary program and registration, visit

This workshop is a joint effort by the International Microelectronics and Packaging Society (IMAPS) and the Institute for Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT). The focus of the workshop is on optoelectronic packaging. We are moving to an age where:

  • Photons will supersede electrons as the preferred carrier of information.
  • Typical optical waveguides transmit many times more data than electrical wires.
  • Optoelectronic devices (LEDs and solar cells) play a great role in new energy generation and energy saving.

Accompanying this change are global efforts in energy efficiency. Issues in the packaging of any device which translates optical energy to or from electrical / thermal / mechanical energy are the focus of the present workshop.

Early Registration Deadline FRIDAY for IMAPS/SEMI Workshop on Wire Bonding    ^ Top
IMAPS and SEMI proudly announce a Topical Workshop on Wire Bonding. The workshop will be held at the Marriott near the Moscone Center, San Francisco, CA - co-located with SEMICON West 2011 - on July 14, 2011. To submit an abstract and for more information, visit

The objective of the Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. The workshop has been specifically organized to allow for the presentation and debate of leading edge Wire Bonding Technology and Applications.

Thursday, July 14, 2011

Registration: 7:00 am - 5:30 pm

Continental Breakfast: 7:00 am - 7:55 am

Opening Remarks: 7:55 am - 8:00 am

Session Chair: Michael McKeown, Materion Technical Materials
8:00 am - 12:00 pm
More than 90% of all chip interconnections are produced by wire bonding either fine gold or copper wire. Gold is still the dominant wire material but the use of copper wire is increasing rapidly and represents the highest growth segment of the market. This session will focus on the use of fine wire (<0.05mm diameter) for chip interconnection.

Getting the Most Out of Gold in Wire Bonding in Semiconductor Packaging
Charles J. Vath, III, Richard Holliday, ComSol Consulting Pte. Ltd.

Multipurpose Wire Bonding - Wires, Bumps, and Combination Interconnects
Daniel D. Evans, Jr., David Rasmussen, Palomar Technologies, Inc.

Physically Robust Interconnect Design n BOAC for Cu Wire Bond
Stevan Hunter, Troy Ruud, Bryce Rasmussen, Diann Dow, Harald Anderson, Jim Mohr, ON Semiconductor

Ball Bond Aging with Integrated Under-Pad Microheater
Michael Mayer, Michael McCracken, Samuel Kim, John Persic, University of Waterloo

Break: 10:00 am - 10:30 am

Fine Pitch Cu Wire Bonding Reaching Maturity
Bernd K. Appelt, Andy Tseng, William T. Chen, ASE Group

The Growth of Copper Ball Bonding
Lee Levine, Process Solutions Consulting, Inc.

Enabling Ultra Fine Pitch Copper Wire Bonding: FAB Formation
John Foley, Bob Chylak, Ivy Qin, Tom Rockey, Kulicke and Soffa Industries, Inc.

Lunch: 12:00 pm - 1:00 pm

Session Chair: Charles Vath III, ComSol Consulting Pte. Ltd.
1:00 pm - 4:30 pm
Wedge bonding is a versatile process often used for heavy wire and ribbon applications but today, because of significant advancements in speed, placement accuracy, and process control it is finding more usage in fine pitch applications. This year’s program will cover both heavy and fine wire applications.

Why Wedge Bond?
Lee Levine, Process Solutions Consulting, Inc.

A New Look at Fine Wire Aluminum Bonding for Molded Packages
K. Pham, A. Prabhu, L. Nguyen, A. Poddar, National Semiconductor Corporation

The Effect of Force and Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds
Mario Marin, Delphi Automotive Systems

Evaluation of Al-Cu Intermetallic Growth at High Temperatures used in PowerClad Ribbon & Leadframe Bonding Applications
Mike McKeown, Barry Njoes, Robert Willis, Materion Technical Materials

Break: 3:00 pm - 3:30 pm

The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules
Mario Marin, Delphi Automotive Systems

Multifilament Tether for Electric Solar Wind Sail
Henri Seppänen, Sergiy Kiprich, Risto Kurppa, Jukka Ukkonen, Tuomo Ylitalo, Pekka Janhunen, Edward Hæggström, University of Helsinki

Round Table Discussion
Moderator: Lee Levine, Process Solutions Consulting, Inc.
4:30 pm - 5:30 pm
This year’s panel will discuss the future of wire bonding: materials, processes, devices.

Bob Chylak, Kulicke & Soffa Industries, Inc.
Leroy Christie, ASM Pacific Technology, Ltd.
Dan Evans, Palomar Technologies, Inc.
Bernd Appelt, ASE Group
Flynn Carson, STATS ChipPAC Ltd.

Closing Remarks: 5:30 pm

Early Registration and Room Deadlines TOMORROW for HiTEN 2011 - High Temperature Electronics Network    ^ Top
IMAPS proudly announce the 2011 International Conference and Exhibition on High Temperature Electronics Network (HiTEN). The conference will be held at St. Catherine's College Oxford in Oxford, United Kingdom, from July 118-20, 2011. The early registration deadline and room/food reservation deadline will be June 23. For full program details, exhibit information or to register, visit

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HiTEN is silicon and silicon on insulator (SOI). However, HiTEN is not simply a semiconductor focused network. HiTEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Thank you to our Corporate Sponsors:

HiTEN Corporate Sponsor - CISSOID
HiTEN Corporate Sponsor - Texas Instruments
HiTEN Corporate Sponsor - Trendsetter Electronics
HiTEN Corporate Sponsor - XREL Semiconductor
HiTEN Corporate Sponsor -  Honeywell
HiTEN Corporate Sponsor - Fairchild Semiconductor


Technical Program | Register On-line | Download Program PDF


  Chapter Activities (events listed in chronological order)

Rocky Mountain Chapter July 12 Dinner and RFMD Tour    ^ Top

Date: July 12, 2011

Buca di Beppo - Broomfield
615 Flatiron Marketplace Drive
Broomfield, CO 80021
(303) 464-7673


IMAPS Members -$25, non-members-$35, and students-$5.00.
Pre-registration only. By credit card only. There is NO tour-only registration category. Participation is limited to the first 25 eligible participants.

Register On-line

4:30 Registration and networking at Buca di Beppo - Broomfield

5:00 Industry Dinner
- Participant introductions
- Ideas for next event.  Chapter leadership-volunteers.  Other business.

6:30 Travel start to RFMD facility.  On-site security sign-in.  Seating. 

7:00 Tour Introduction and Overview by Brian Sousa, Director of Operations
A short video will be shown of RFMD’s GaN wafer processes.
Brian will provide a brief presentation on the production line. 

7:20 Facility Tour
RFMD's gallium nitride (GaN) wafers are fabricated in North Carolina.  The wafers are then shipped to the Broomfield facility to be assembled into high-power packaged RF components for radar, mobile radio, wireless infrastructure, and CATV distribution networks. The Broomfield facility also supports the assembly of high-reliability die and connected modules. There will be times for questions during and following the tour.
8:30 Tour Concludes

Chesapeake Chapter Summer Meeting on July 13 at CALCE Lab    ^ Top

Date: July 13, 2011

University of Maryland
Glenn Martin Hall (Building # 088)
DeWalt Seminar Room (Room# 2164) CALCE
office phone is 301-405-5323 or 301-405-7770


IMAPS Members-$15, non-members-$25, and students-$5.00. Additional fee of $5.00 charged at the door. Checks/cash accepted only on-site. Pre-registering on-line by deadline (Thursday, July 7) guarantees dinner seating.

Register On-line

3:00 Registration

3:15 - Welcome to CALCE (U. of MD) - Dr. Diganta Das
- Participant Introductions.
- Chapter Election Results (Very brief presentations by chapter officers).
- Call for committee chair positions.

3:30 Component Authentication and Screening.
Bhanu Sood, Director of the Test Services and Failure Analysis of CALCE

4:00 Lessons Learned - Lessons Forgotten: A Collection of Case Studies in Electronic Component Design
Lyudmyla Panashchenko, Aerospace Engineer at NASA Goddard

(A problem was resolved and traced back to a phenomenon already known, but somehow forgotten in
the design.)

4:30 Refreshments and student poster contest.

5:15 Industry Dinner

6:00 Poster Contest Results. Event wrap-up.  Ideas for next event.  Other business.

6:15 Optional Tour of CALCE Laboratories
(failure analysis, materials characterization, environmental conditioning, and acceleration testing)

UK Chapter Hosting EMPC2011 - Early Registration Deadline June 30    ^ Top
The "European Microelectronics & Packaging Conference" is being held at the Hilton Metropole in Brighton from 12-15 September.

The International Refereeing Panel has completed the adjudication of the Abstracts that were submitted from around the world (Europe, Japan, Korea, China, USA) etc. and recommended acceptance of 90 Oral and 30 Poster Technical papers.

This exceptional Technical Programme will ensure excellent attendance at the event, providing exhibitors the opportunity to showcase their Company at EMPC-2011 and interact with people working on the latest technologies in the Microelectronics Industry.

EMPC-2011 is hosted by IMAPS-UK on behalf of IMAPS-Europe with technical co-sponsorship from IEEE-CPMT and builds upon the successful IEEE Electronics System-Integration Technology Conference ESTC-2010 (Berlin) and EMPC-2009, (Rimini). Each event attracted large attendances from delegates world-wide.

Details of the Exhibition Hall layout and pricing are provided in the Exhibitor Registration Pack, which is available to download at

IMAPS Taiwan Chapter's IMPACT    ^ Top
The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011) is organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan, ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA, iNEMI and ICEP which will take place in NTUH International Convention Center during October 19 to 21, 2011. Besides, ICEP and iNEMI are the first time to join IMPACT and we believe IMPACT 2011 will become more splendid after their support. This great annual international event - IMPACT will extend the opportunity to bring researchers, engineers and experts engaged in such a distinguished gathering and show the strength of Taiwan and update worldwide tendencies.

IMPACT 2011 as the sixth conference and the theme is "IMPACT-Leading Innovation" which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage. IMPACT is striving to work out the advanced paper scope and reward policy to attract extraordinary papers all around the world. IMPACT has just closed the call for papers. More information about IMPACT 2010, please refer to the conference website, , or contact with secretariat, MS. Sophia Huang (+886 3 3815659 Ext 404).

IMPACT-Leading Innovation
Date: October 19 (Wed) - October 21 (Fri), 2011
Venue: NTUH International Convention Center, Taipei, Taiwan
Conference: The 6th IMPACT Conference

About Paper Submission
Important Date



Abstract Submission

June 10, 2011

Abstract Acceptance Notification

July 15, 2011

Full Paper Submission
(Camera-ready Version)

August 15, 2011

Presentation Material Submission(Oral Presentation)

October 1, 2011

P1. Emerging Systems Packaging Technologies
P2. Advanced Packaging Technologies
P3. Interconnections & Nanotechnology
P4. Modeling, Simulation & Design
P5. Thermal Management
P6. Advanced Sensor & Microsystems Technology (MST)
P7. Advanced Materials, Process & Assembly
P8. 3D Integration *NEW
P9. LED & Optoelectronics Packaging *NEW

Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #404 - Sophia
Fax: +886 3 381 5150

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website or by emailing the events organising committee

Florida Chapter Announces SouthEast Microelectronics Conference (SEMC) in Conjunction with the 2012 Conference on "Near Hermetic Packaging"    ^ Top
IMAPS Florida chapter announces the first South East Microelectronics Conference (SEMC) in conjunction with the first ever Advanced Technology Conference on "Near Hermetic Packaging" (ATC-NHP) to be located in Orlando, FL. The SEMC will be held on February 8th & the ATS-NHP on the following day the 9th of 2012. Classroom presentations, exhibits, panel discussion, keynote speaker & sumptuous heavy hors d'oeuvres will all be embedded in the two-day event! Preliminary details will be announced in June. February in Central Florida can have a salubrious effect on your psyche! Please check





LORD Corporation

Mid-Atlantic Conference
June 23-24
Atlantic City, NJ
*Exhibitors contact

IMAPS/CPMT Optoelectronic Packaging
June 29-30
Irvine, CA

Advanced Interconnect & Substrate
July 13
San Francisco, CA

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact

"Think Thin" - IC Packaging for Mobile Applications
August 23-24
Santa Clara, CA
*Exhibitors contact

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact

Thermal Management
November 7-9
Palo Alto, CA
*Exhibitors contact

System Level Packaging
November 10-11
Palo Alto, CA

^ Top




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