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March 17, 2011
 

TJ Green Associates, LLC

   IMAPS EVENTS
Button CICMT 2011 Conference Begins April 5 in San Diego - Register to Attend or Exhibit Today (read more...)

Button Webinars Start Soon on Package on Package (PoP) and Intro to Micro...Industry Updates/Trends (read more...)

Button Abstracts Due TOMORROW: Workshop on Microelectronic Packaging and Materials for Medical Devices (read more...)

Button TOMORROW: Abstracts Due for Mid-Atlantic Microelectronics Conference (read more...)

Button Abstracts Due Soon for "Think Thin" - IC Packaging for the New Era of Mobile Devices (read more...)

Button Abstracts Due March 31 for the IMAPS/CPMT ATW on Optoelectronic Packaging (read more...)

Button Abstracts Being Accepted for the ATW on High Reliability Microelectronics for Military Applications (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT THURSDAY: Carolinas Chapter Spring Technical Symposium on March 24 (read more...)

Bullet New England Chapter March 29 Technical Meeting on Chemically Vapor Deposited Polymer Coatings for Non-Hermetic Packaging of Microelectronics (read more...)

Bullet Chesapeake Chapter March 30 Dinner Meeting at JHU/APL (read more...)

Bullet Northern California April 6 Lunch Meeting on Solar PV Modules: Opportunities for the Electronics Assembly Industry (read more...)

Bullet Metro Chapter April 7 Spring Symposium and Vendor's Night (read more...)

Bullet Keystone Chapter April 14 Dinner Meeting (read more...)

Bullet New England Chapter 38th Symposium & Expo on May 3 (read more...)

Bullet France Chapter To Hold MiNaPAD Forum 2011 on May 11-12 (read more...)

Bullet Nordic Chapter Conference in Finland June 5-8 (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

  IMAPS Events (view full Web Calendar)
 

CICMT 2011 Conference Begins April 5 in San Diego - Register to Attend or Exhibit Today    ^ Top
The IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2011) will be held at the Westgate Hotel in San Diego, California, on April 5-7, 2011. Tabletop exhibits are almost sold out. Registrations are very full. For full conference details, and to register, visit www.cicmt.org.

The CICMT Conference is back in the U.S. after a successful meeting in Japan last year. This two and a half day event will bring together experts from Asia, Europe, and North and South America to present and discuss the latest advances in ceramic interconnect and ceramic microsystems technologies. Coming from more than 40 different organizations including universities as well as industry and government laboratories, the conference will provide a wide spectrum of interests reflected in more than 50 papers in 14 sessions.   This year’s keynote and international session speakers will focus on multilayer ceramic components and future applications.

In addition to the Microsystems and Ceramic Integration paths, we continue to offer a Low Temperature Co-fired Ceramic Processing (LTCC) standards session to promote industrial interactions. Tabletop exhibits and a poster session are available to provide an opportunity to meet suppliers who support our industry.

Do not miss THE ceramic interconnect and ceramic microsystems event in San Diego this year.  

Webinars Start Soon on Package on Package (PoP) and Intro to Micro...Industry Updates/Trends    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Introduction to Microelectronics Packaging Including Industry Updates and Trends
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, March 24, 30, and April 7, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, March 29, April 5, and 12, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Hybrid and Microwave Module Design for Manufacturability (DFM)
Presented by: Tom Green, TJ Green Associates, LLC
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesday, April 19, and Wednesday, April 20, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Mitigate the Risk of Counterfeit Electronic Parts
Presented by: Phil Zulueta, Jet Propulsion Laboratory, California Institute of Technology
This webinar will be held Friday, May 20, 2011, from 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Design for Thermal Cycling
Presented by: DfR Solutions
This webinar will be held Tuesday, May 24, 2011, from 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Solar Module Packaging Requirements: Designing for Decades of Reliable Performance while Minimizing Environmental Impacts
Presented by: Dr. Michelle Poliskie, Packaging Consultant in Silicon Valley
This two-session on-line Professional Development Course (PDC) webinar will be held Mondays, June 6, and 13, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held June 7, 8 and 9, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

Abstracts Due TOMORROW: Workshop on Microelectronic Packaging and Materials for Medical Devices    ^ Top
The workshop will be held at the Crowne Plaza Northstar in Minneapolis, Minnesota, on June 14-15, 2011. To submit an abstract and for more information, visit www.imaps.org/medical.

Overview: The combination of advancing demographics (an aging world population) and an explosion of new micro-electronics technology set the stage for significant improvement and miniaturization in the area of medical electronics.

Abstracts are being solicited in the following areas:

  • Trends and Challenges for Class III Medical Implants
  • Applications for Ultra-Miniature Micro-Electronics
    • Human Portable Monitoring Devices
    • Patient Monitoring
  • Innovations in 3-D Packaging
  • Embedded Passives and Associated Technologies
  • Sensor/MEMS Technology for Medical Devices
  • Enabling Technologies for Power Management
  • Micro-Fluidics, Bio-Sensors and Bio-Chips
  • Hermetic and Near-Hermetic Packaging Solutions
  • Advances in Technology for Folded Flex Circuits

An outstanding program is planned with internationally-recognized authorities from industry and academia. Those wishing to present at the Medical Devices Workshop, should submit a 200-word abstract electronically by March 18, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

TOMORROW: Abstracts Due for Mid-Atlantic Microelectronics Conference    ^ Top
The 2011 Mid-Atlantic Microelectronics Conference will be held at the Atlantic City Hilton, Atlantic City, New Jersey, on June 23-24, 2011. To submit an abstract and for more information, visit www.imaps.org/midatlantic.

IMAPS leaders in the Empire, Metropolitan, Garden State, Keystone, Chesapeake and Cleveland/Pittsburgh chapters invite you to submit an abstract for review for the Mid-Atlantic Microelectronics Packaging Conference.

The Conference will be co-located with two half-day professional development courses. The PDCs will address: Advanced Packaging Technologies – Chip Scale & Embedded Chip; and 3D Integration: Technology, Applications & Markets for 3D Integrated Circuits.

The Program Committee seeks papers that demonstrate how products, technologies, and applications are expanding and redefining the microelectronics industry. All session presentations and a poster session will be determined based on the following business and industry topics:

Industry

  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal Managemen
  • Manufacturing, Outsourcing & Quality
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Nano-Technologies
  • Opto-electronics
  • Market Analysis and Drivers

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green packaging / Compliance with RoHS
  • Flip-Chips
  • Wirebonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Those wishing to present a paper at the Mid-Atlantic Microelectronics Conference must submit a 200-300 word abstract electronically by March 18, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than May 20, 2011.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form; will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award. The Foundation will return the registration fee for the winner. The winner must pay for travel and lodging expenses.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Abstracts Due Soon for "Think Thin" - IC Packaging for the New Era of Mobile Devices    ^ Top
The workshop will be held at the Biltmore Hotel & Suites in Santa Clara, California, on May 4-5, 2011. To submit an abstract and for more information, visit www.imaps.org/thin.

The market for smart mobile devices is exploding, including smart phones, tablets, and convergence devices, driven by consumers who demand greater functionality and ease of use. As a result, device designs require functional integration of ICs, especially in the 3rd dimension, hence driving new technology development towards making IC components "thin". The objective of the "Think Thin" Workshop is to address the numerous aspects of making IC packages "thinner" by providing a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of microelectronics, IC packaging, emerging packaging technology for mobile devices. This event enables discussion and presentations on the latest materials, process, design & emerging applications of "thin" packaging technology.

Abstracts are being solicited in the following areas:

Materials:

  • Substrate requirements (coreless, etc.)
  • Underfill requirements
  • Die attach materials (DAF, dispensed)
  • Mold compounds

Equipment:

  • Die thinning
  • Die handling (carrier bonding and de-bonding, die sawing)
  • Die attach
  • Molding
  • WLP/eWLP/ equipment

Processes:

  • Die thinning
  • Die stacking
  • Molding
  • Interconnect (Cu pillar, Flip Chip, Thermo-Compression, Wirebond, etc.)

Design/Simulation:

  • Modeling for warpage prediction and material selection
  • CPI (chip / package interaction)
  • Reliability / stress simulation

WLP / eWLB / Embedded die technologies:

  • Low cost constructions
  • Horizontal and vertical integration
  • Package thickness challenges

PoP Technologies:

  • Flange/ Bare Die/ Through Mold Via
  • Stack up height reduction
  • Top package (memory) height reduction
  • Warpage control

3D Technologies:

  • TSV
  • Interposers
  • 3D Embedded die technologies

Reliability:

  • Thin Die
  • TCT/ Drop/ Bend
  • Board Level
  • Package Level

Emerging Technologies:

  • Printable circuits
  • Alternative memory stacking interconnect

Those wishing to present at the Workshop, should submit a 250-300 word abstract electronically using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

Abstracts Due March 31 for the IMAPS/CPMT ATW on Optoelectronic Packaging    ^ Top
The IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging is being held June 28-30, 2011, at the McDonnell Douglas Engineering Auditorium at the University of California- Irvine, in Irvine, California . The call for abstracts and full conference details can be found on-line at www.imaps.org/opto.

This workshop is a joint effort by the International Microelectronics and Packaging Society (IMAPS) and the Institute for Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT). The focus of the workshop is on optoelectronic packaging. We are moving to an age where:

  • Photons will supersede electrons as the preferred carrier of information.
  • Typical optical waveguides transmit many times more data than electrical wires.
  • Optoelectronic devices (LEDs and solar cells) play a great role in new energy generation and energy saving.

Accompanying this change are global efforts in energy efficiency. Issues in the packaging of any device which translates optical energy to or from electrical / thermal / mechanical energy are the focus of the present workshop, and abstracts are being requested in the following areas:

Optoelectronic Device Packaging: Optical Interconnections: Energy Generation and Saving:
  • Package design for performance and manufactuability
  • Packaging materials & processes
  • Device thermal management
  • Module thermal management
  • LEDs, lasers, solar cells, etc
  • Materials and designs
  • Modeling and simulation
  • Characterization
  • Processes and manufacturing
  • Multi-level interconnections
  • Design for efficiency
  • Measurement and certification
  • System integration
  • Solar cells and packaging
  • Energy storage

Those wishing to present at the Workshop, should submit a 250-300 word abstract electronically by March 31, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If you need assistance with the on-line submission form, please e-mail Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

Abstracts Being Accepted the ATW on High Reliability Microelectronics for Military Applications    ^ Top
The Advanced Technology Workshop on High Reliability Microelectronics for Military Applications is being held May 17-19, 2011, at the Holiday Inn Baltimore-BWI International Airport in Baltimore, Maryland. The call for abstracts and full conference details can be found on-line at www.imaps.org/military.

The International Microelectronics And Packaging Society (IMAPS) is sponsoring an Advanced Technology Workshop on Military High Reliability Packaging Issues and Applications to be held May 17 - 19, 2011, at the Holiday Inn Baltimore-BWI International Airport (soon to be the Doubletree BWI), Linthicum Heights, Maryland.

In our current global situation where the focus is on military electronics reliability and performance in hostile environments, extensive work is being done to advance the state-of-the-art in high reliability electronics packaging. The technical program will focus on the latest military electronic devices, systems, and applications, with particular emphasis on system level issues that have an impact on mission assurance as well as the connected issues at the design and applications level.

Abstracts are being requested for the following Military High Reliability: Packaging Issues and Application topics:

  • System Level Issues Impact on Mission Assurance
  • Embedded Actives and Associated Technologies
  • Advanced Organic Substrate Development
  • Lead-Free Soldering and Associated Reliability Issues and Concerns
  • MCM Packaging for Military Applications
  • Outsourcing of Military Packaging
  • Unique Testing Approaches to Enhance Reliability
  • Obsolescence and Counterfeit Part Challenges
  • Reliability Analysis of Applications and Packaging Issues
  • Sensor Technology
  • COTS, Near Hermetic Packaging Solutions for Military
  • Packaging Design Impact on Radiation Effects

Those wishing to present a paper at the workshop must submit a 200-300 word abstract electronically using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than April 8, 2011.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

 

  Chapter Activities (events listed in chronological order)
 

NEXT THURSDAY: Carolinas Chapter Spring Technical Symposium on March 24    ^ Top

Date: March 24, 2011
Location: RF Micro Devices
7907 Thorndike Road (packaging building)
Greensboro, NC 27409
(336) 664-1233
Registration:

IMAPS Members-$15, non-members-$25, and students-$5.00.
On-line registration by credit card. Checks/cash only on-site.
Additional fee for on-site registrations of $5.00

SEATING IS LIMITED !!!
Register on-line by Monday, March 21 to guarantee your spot.

Program

1:00 Registration and Networking

1:15 Industry Lunch

2:00 Participant Introductions and welcome by Scott Morris, President of IMAPS Carolinas.

2:15 “Overview of RFMD and the Wireless Industry. “ Jerry Neal, Executive Vice President at Marketing & Strategic Development, RF Micro Devices

2:45 “New and Emerging Technologies in Electronics and Electronics Manufacturing.” Daniel Baldwin, President, Engent, Inc.

3:30 Break (with drinks)

3:45 “Trends And Challenges For Package Reliability Testing and Analysis.” Mike Ferrara, Staff Reliability Engineer, RF Micro Devices

4:15 Event wrap-up. Ideas for next event. Other business.

4:30 RFMD window tour of their reliability area ( 30 minutes). Optional. General overview of JEDEC level tests that are utilized for reliable packages.

New England Chapter March 29 Technical Meeting on Chemically Vapor Deposited Polymer Coatings for Non-Hermetic Packaging of Microelectronics    ^ Top

Date: March 29, 2011
Location:

Crowne Plaza Hotel
320 Washington Street
Newton, MA
617-630-2935

Registration:

There's no charge for the Technical Meeting, only for dinner. You may attend without eating dinner.

Non-Member $30; Member $25; Retired/Unemployed $20; Student $10

SEND NO MONEY! BRING checks payable to “IMAPS New England”
Pre-Registration deadline is Thursday, March 24

Program

"Chemically Vapor Deposited Polymer Coatings for Non-Hermetic Packaging of Microelectronics"

Abstract: Initiated Chemical Vapor Deposition (iCVD), is a new technology enabling the fabrication of chemically well-defined thin polymeric films on complex objects with micro- and nano-scale features without solvents, dispersants or curing. iCVD requires only low energy inputs affording the retention of sensitive chemical functionalities’ of polymer constituents and allowing temperature-sensitive substrates to be coated. Thin coatings of insoluble polymers, such as PTFE, and electrically conductive polymers are possible. The technology addresses applications ranging from aerospace structures and biomedical implants to microelectronics. Special emphasis will be directed toward the environmental protection of microelectronics.

Speaker: Aleksandr White is a Senior Engineer with GVD Corporation. He holds the B.S. degree from the University of Michigan and Masters of Engineering degrees from MIT both in Materials Science and Engineering. He has served as lead engineer in the development, scale-up and commercialization of initiated chemical vapor deposition (iCVD) polytetrafluoroethylene (PTFE) coatings. Aleks has served as lead engineer for Phase I and II SBIR programs of both the DOD and National Institutes of Health (NIH).

Chesapeake Chapter March 30 Dinner Meeting at JHU/APL    ^ Top

Date: March 30, 2011
Location:

Applied Physics Laboratory of Johns Hopkins University
Howard County Room #3
11100 Johns Hopkins Road
Laurel, MD 20723

Map and directions (www.jhuapl.edu)
Enter in the area marked Lobby 1 and check-in with APL staff Call Bruce Romenesko of APL at 240-228-8065 for on-site info. only.

Registration:

IMAPS Members-$25, non-members-$35, and students with ID-$5.00. Only on-line registration by credit card guarantees a dinner seating.
On-line registration ends COB on Monday, March 28.
On-site registrations by checks/cash only.
A fee of $5.00 will be surcharged for on-site registrations.

Program

3:00 Registration, Networking, and Participant Introductions.

3:30 “Reliability of Printed Circuit Boards in Humid Environments.”
Michael Azarian, Research Scientist at the Center for Advanced Life Cycle Engineering (CALCE) of the University of Maryland
Dr. Azarian’s research on reliability of electronic products covers electrochemical migration, capacitor reliability, prognostics, and tribology. He holds 5 U.S. patents for inventions in data storage and contamination control. Before joining CALCE, he spent 13 years in the disk drive, advanced materials, and fiber optics industries.

4:00 “Using Manifold Microchannel Coolers to Reduce the Power Electronics Thermal Stack.”
Ms. Lauren Boteler, Mechanical Engineer, Army Research Laboratory
Lauren Boteler has been working as a packaging and thermal management engineer at the Army Research Laboratory for over five years. She has a Mechanical Engineering degree and is currently finishing her PhD. Her packaging expertise focuses on power electronics and MEMS.

4:30 Break (beverages served)

4:45 “Reliability and Testing of Medical Devices, both Implanted and Non-implanted.”
William Regnault, Senior Materials Scientist, U.S. Food & Drug Administration
Dr. Regnault is the Senior Materials Scientist of the Center for Devices and Radiological Health at the FDA. He joined the FDA in 1985 and has worked on numerous projects dealing with the effects of fabrication processes and in-use service conditions on the long-term stability and reliability of biomaterials and medical devices.

5:15 Event wrap-up. Ideas for next event. Elections logistics. Other business.

5:30 Dinner

Northern California April 6 Lunch Meeting on Solar PV Modules: Opportunities for the Electronics Assembly Industry    ^ Top

Date: April 6, 2011
Location: David's Restaurant, Banquet & Conference Facilities
5151 Stars and Stripes Drive
Santa Clara, CA 95054
Registration:

Please respond to Roger Underwood, IMAPS NorCal Chapter Treasurer, at runderwood@cctlaser.com to make your lunch reservations.

Program

IMAPS Northern California Chapter's April 6, 2011 Lunch Meeting which will be held at David's Restaurant, Banquet & Conference Facilities, 5151 Stars and Stripes Drive, Santa Clara, CA 95054.

The speaker is Dr. Dongkai Shangguan, Vice President, Advanced Technologies and Leadership Engineering, Flextronics. His presentation on "Solar PV Modules: Opportunities for the Electronics Assembly Industry" will not only be addressing current developments and trends that could have a major impact on the semiconductor interconnect and assembly industry, but will also be highlighting future opportunities for the industry as we move forward. This will be another very informative, engaging and thought-provoking talk, in keeping with the tradition of IMAPS. This presentation will be of great interest to all microelectronics and optoelectronics assembly and interconnect professionals. Dr. Shangguan is a highly accomplished individual whose technological capabilities and accomplishments have been widely recognized. He obtained his Ph.D. in Materials Science from Oxford University, U.K., is a guest Professor at several universities, has published over 200 technical papers and two books, and holds over 20 U.S. and international patents. He is very active in several professional societies including serving on the IEEE CPMT Board of Governors, and has received numerous awards including the Distinguished MBA Alumnus Award from the College of Business, San Jose State University.

Metro Chapter April 7 Spring Symposium and Vendor's Night    ^ Top

Date: April 7, 2011
Location: Holiday Inn Ronkonkoma
3845 Veterans Highway
Ronkonkoma, NY 11779
Ph: 631-585-9500

Schedule:

8:00-4:30

Two Professional Development Courses

Understanding the Wire Bonding Process
Course Leader: Lee Levine
Process Solutions

Hybrid Pre-Cap Visual Inspection Mil-Std 883 TM 2017
Course Leader: Tom Green
TJ Green Associates

3:00-8:00

Metro IMAPS Vendor Night

5:00-6:30 Additional Technical Presentations

Metropolitan IMAPS Chapter Vendor Registration
Thursday, April  7th 2011
Exhibit Hours: 3:00pm till 8:00pm-Setup available from 9:00am that morning
Place: Holiday Inn at MacArthur Airport, Veterans Highway, Bohemia
Cost:   $400.00 to Exhibit if your reservation is received  with payment by 3/15/2010
            $500.00 after 3/15/2010        
*$100.00 Additional discount if you have exhibited at a Metro chapter event in the past 2 years  and you register by 3/15/2010

 The vendor night will be preceded by 2 Professional Development  Courses and 1-2 short technical sessions designed to bring out  the Engineering Professionals and Decision Makers from the Tri- State area.

 Space is limited so register early to guarantee your spot

 Registration Information:

Exhibitor Company__________________________________________
Contact Name _____________________________________________

Contact Phone Number______________________________________
Contact Email______________________________________________
Will you be staying at Holiday Inn?______________________________
Please send registration  and check  to following

Make check payable to Metro IMAPS
Walter Becker
WJB Sales
42 Jesse Way
Mt Sinai, New York  11766
Phone:631 331 0689
Fax: 631-331-0689
wbecker@wjbsales.com
Steve Lehnert
Space Systems Loral
650 644 5218
metroimaps@optonline.net

Keystone Chapter April 14 Dinner Meeting    ^ Top

Date: April 14, 2011
Location:

Holiday Inn Lansdale
1750 Sumneytown Pike
Kulpsville PA 19443

Located just off the I-476 / PA Tpke NE Extension, Lansdale Exit 31. Go to traffic light at end of exit ramp, turn left, go 150 feet, Holiday Inn is on right.

Registration:

Dinner $30 Advance Registration, $33 at door.
Checks are appreciated. Students are free.
Apr 11, Monday, is deadline for advanced registration.

Please register ahead of time with Greg Chesmar at GregChes@aol.com or 215-822-0510. Email preferred. Give name and company affiliation, if any. You need not be a member to attend. Vendor Tables are available $100 for a 6 foot table.

Program

5:00 Keystone Chapter Leadership Meeting
Please attend if you would like to benefit by helping to organize future events.

5:30 Happy Hour – Cash Bar
Build connections with local peers.

6:15 Buffet Dinner
A brief chapter business meeting will be held during the dinner hour.

7:15 Student Presentation by Son Nguyen, Temple University graduate student

Talk Title: Hardware Design for Novel Morphology and Packaging of Multi-Cellular Meta-Processing Unit

Speaker Bio: Son Nguyen is a PhD candidate at Electrical and Computer Engineering Department, College of Engineering, Temple University. He has been an active IMAPS student member since 2001, and President of IMAPS Student Chapter at Temple University from 2005 to present. His research interest includes sensing device and computer architecture. He has been working part-time for Kuclike & Soffa Industries in the process engineering lab since 2007.

7:35 Industry Speaker: Bonnie Martin, Senior Staff Engineer, Lockheed Martin Space Systems, Newtown PA, Commercial Space Systems Division

Talk Title: “Space Qualification of Electronics, Current Requirements and Future Trends”

Speaker Bio: Ms Martin has over 15 years of experience designing, manufacturing, and qualifying high reliability electronic hardware for space missions. Her particular focus is on R&D, Technology Readiness Level (TRL) advancement and affordable product transition from research and development to space flight deployment. Ms. Martin holds a B.S. in Mechanical Engineering from the College of New Jersey and a M.S. in Mechanical Engineering from Cornell University.

New England Chapter 38th Symposium & Expo on May 3    ^ Top

Date: May 3, 2011
Schedule: Technical Program and Registration available soon
Location:

Holiday Inn -- Boxborough Woods Conference Center
Boxborough, Massachusetts

The Largest Regional Symposium Dedicated to Microelectronics and Electronics Packaging

The New England Chapter Symposium Technical Program Committee is finalizing the technical program which will feature sessions/presentations on:

Industry
-- Biomedical Electronics -- Telecom - Microwave -- Military Electronics -- Consumer Electronics -- Renewable Energy: Fuel Cells, Solar, Wind -- Thermal/Power Management -- Manufacturing, Outsourcing & Quality -- Software and Firmware Applications -- High Performance Interconnects and Boards -- Sensor Applications -- Emerging Technologies -- Photovoltaic/Solar

Advanced Processes & Materials
-- 3D and High Density Packaging -- Photonic/ Optoelectronic Packaging -- LED Packaging -- MEMS and Nano Packaging -- Underfill/ Encapsulants and Adhesives -- Green Packaging / Compliance with RoHS -- Electronics Recycling -- Flip-Chip and Bumping: Processes, Reliability -- Wire Bonding and Stud Bumping -- Embedded and Integrated Passives -- Ceramic, Polymer and Conductive Materials -- Cu/ Low-K

Symposium Technical Chair:
Roger S. Benson
International Rectifier
Leominster, MA
roger.benson@verizon.net
Phone: (978) 457-4014

Visit us at - www.imapsne.org -- for details

----- also -----
SIX Lecture Sessions, Full Poster Session, Employment Center and an 80 Booth Exhibit Hall

For details about Sponsoring, Exhibiting or Attending Contact:
Harvey Smith: harveys@imapsne.org or Call 508-699-4767

France Chapter To Hold MiNaPAD Forum 2011 on May 11-12    ^ Top

Date: May 11-12, 2011
Schedule: Technical Program and Registration available soon
Location: Grenoble, France
Details: imaps.france@imapsfrance.org or www.imapsfrance.org

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum Conference & 'Interconex' Exhibition

Bringing closer the design and the semiconductor assembly & packaging communities

The program is being developed and sessions are planned on the following topics:

  • Design: CAD and design techniques, IO placement for advanced packaging (fan-out, 3D packaging), design for reliability, IC and package co-design, RF package design, thermal and mechanical predictability (models and simulations)
  • Innovative packaging for MEMS and emerging applications: photovoltaic, biosensors, energy scavenging and batteries, high brightness LEDs,...
  • Process, test, reliability, characterization and challenges of advanced packaging
    platforms: 3D Packaging (with or w/o TSVs), fan-out WLP and embedded IC
    package.
  • Advanced interconnections: flip-chip for high IO count devices and sub 45nm
    CMOS, new flip-chip and WLP metallurgies, bumping techniques
  • System-in-Package for smart systems, telecom, automotive and medical
    applications: solving test and reliability challenges
  • A poster session will address all of the above topics. At the discretion of the
    program committee, submitted abstracts may be considered for poster presentation

Nordic Chapter Conference in Finland June 5-8    ^ Top
IMAPS Nordic Chapter is proud to announce the year 2011 conference in Finland. The conference will take place in Dipoli in the centre of the technology in Otaniemi, Espoo hosting a range of high tech companies as well as Aalto University and the Technical Research Center of Finland.

Sessions are being formed on the following topics:

  • 3D Advanced interconnect, TSV, Advanced packaging
  • MEMS, MOEMS, sensor integration & applications
  • Harsh environment
  • High temperature electronics
  • Printed electronics
  • Future electronics, trends & strategies
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Microvia, HDI laminates, flex, embedded passives
  • Chip thinning & stacking, 3D-packaging, TSV, embedding
  • Pb and halogen free electronics, methods and consequences
  • CSP, flip chips, area array
  • Reliability assessment, SPC
  • High frequency packaging
  • SMT and board assembly
  • Integrated passive devices (IPD) & System in Package (SiP)
  • System cost assessment
  • Manufacturing management & outsourcing
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
  • Modelling and simulation

For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org.

Hotel:
The conference hotel is Radisson Blu Hotel in Espoo (http://www.radissonblu.com/). Use code IMAPS when booking. Rates: 110€/single standard and 130€/double standard. The social events will take place at the hotel.

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.


   
   

Amkor Technology

LORD Corporation

Webinar: Intro to Micro Industry Updates & Trends March 24, 31, April 7

Webinar: Package on Package (PoP)
March 29, April 5, 12

IMAPS/ACerS CICMT
April 5-7
San Diego, CA
*Exhibitors contact modonoghue@imaps.org

Webinar: Hybrid and Microwave DFM
April 19, 20

"Think Thin" - IC Packaging for Mobile Applications
May 4-5
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

Hi-Rel for Military Applications
May 17-19
Baltimore, MD

Medical Device Packaging
June 14-15
Minneapolis, MN
*Exhibitors contact modonoghue@imaps.org

Mid-Atlantic Conference
June 23-24
Atlantic City, NJ
*Exhibitors contact modonoghue@imaps.org

IMAPS/CPMT Optoelectronic Packaging
June 28-30
Irvine, CA

Advanced Interconnect & Substrate
July 13
San Francisco, CA

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

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