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March 2, 2011
 

Amkor Technology

   IMAPS EVENTS
Button Device Packaging 2011 Next Week - PDCs, GBC, and Complimentary Exhibit Passes (read more...)

Button GBC Spring Conference on The Business of Semiconductor Packaging in the Era of 3D and Energy Efficiency (read more...)

Button Attend An Upcoming Webinar (read more...)

Button 2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet IMAPS Southern California Chapters and OCE Announce SoCal 2011 (read more...)

Bullet Chicago/Milwaukee Chapter March 15 Winter Technical Forum on Materials and Advanced Technologies (read more...)

Bullet New England Chapter 38th Symposium & Expo on May 3 (read more...)

Bullet France Chapter To Hold MiNaPAD Forum 2011 on May 11-12 (read more...)

Bullet Abstracts Due Tomorrow: Nordic Chapter Conference in Finland June 5-8 (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2011 Next Week - PDCs, GBC and Complimentary Exhibit Passes    ^ Top
The seventh Annual Device Packaging Conference (DPC2011) begins next week! The conference will be held in Scottsdale, Arizona, on March 7-10, 2011. For more information, visit www.imaps.org/devicepackaging.

The 2011 conference will feature 4 keynote presentations, 16 technical sessions, Fan-Out/Embedded and 3D (Memory Cub) panel discussions, a poster session, 8 professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topical workshop areas related to microelectronic packaging: 3D IC & Packaging; Flip Chip Technologies; MEMS & Associated Microsystems; Wafer Level Packaging; and Emerging Technologies (LEDs & Passive Integration). Sessions will be held in these technical areas on: 3D Marketing & Products, 3D Assembly & Packaging, 3D Materials & Processing, 3D Design, Thermal & Metrology; Flip Chip, Flip Chip Cu Pillar and Solder Bumps; Laminate and Polymer MEMS, MEMS Fabrication & Packaging, MEMS Gyroscope Devices & Systems, MEMS Sensors and Actuators; WLP Process Technologies, Embedded Die & Fan-Out WLP, WLP Applications; LED Packaging; and Passive Integration.

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 7th, preceding the technical conference. Morning PDCs will run from 8:00am until 12:00 noon. Afternoon PDCs will be held from 1:00pm until 5:00pm. The Welcome Reception will immediately follow the PDCs from 5:00pm until 7:00pm in the foyer. A Microelectronics Foundation Texas Hold-em Tournament will be held this year from 7:00pm until 10:00pm. All are invited to register for this fun, new event which benefits the IMAPS Microelectronics Foundation.

Exhibit passes to attend the 65 full exhibit booths is complimentary. Register on-line for the PDC, conference and all activities at www.imaps.org/devicepackaging.

IMAPS Microelectronics Foundation Fundraising/Social Activities:
This year the Microelectronics Foundation will offer two charity events to raise funds toward its mission "to support student activities related to the study of Microelectronic Packaging, Interconnect and Assembly." On Monday, March 7, the IMAPS Microelectronic Foundation is holding its first charity Texas Holdem Tournament. On Thursday afternoon, March 11, the IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club.

Texas Hold'Em Tournament Monday, March 7
7:00pm - 10:00pm
Texas Holdem Tournament
Fort McDowell Resort
Spring Golf Invitational Thursday, March 10
1:00pm Shotgun Start -- "Best Ball" Scramble
Desert Canyon Golf Club

.Technical Program | On-line Registration

GBC Spring Conference on The Business of Semiconductor Packaging in the Era of 3D and Energy Efficiency    ^ Top
The 2011 Global Business Council Spring Conference will be held in Scottsdale, Arizona, on March 6-7, 2011. For more information, visit http://www.imaps.org/programs/gbc11spring.htm.

Sunday, March 6 - Registration and Opening Reception:

Monday, March 7 - Presentations:

"Business of Semiconductor Packaging in the Era of 3D"

Market Outlook Panel: Applications Driving 3D IC Adoption. Industry Trends and Forecasts.

Moderator Lee Smith, Vice President, Marketing & Business Development, Amkor Technology, Inc.
Panelists: Jan Vardaman, President and Founder, TechSearch International
Brandon Prior, Senior Consultant, Prismark Partners, LLC

"The Role Road Maps Play in 3D Packaging and 3D IC Technologies."
Dr. Bill Bottoms, CEO, NanoNexus, Inc. And Chair of the ITRS Assembly and Packaging Task Force.

Status Update and the Role Consortia Has Played in Development of TSV Technologies.
"3DEMC Consortia Status to Cost of Ownership Objectives."
Rozalia Beica, Global 3D Interconnect Director, Applied Materials, Inc.

"Emerging Standards and Summary of SEMATECH's Programs in 3D IC Technology Development."
Sitaram Arkalgud, Director of 3D Interconnect Program, SEMATECH

Status in Development of 3D IC Interface and Package Standards.
"The Evolution of Standardization for 3D Package Technology."
James Malatesta, Sr. Applications Engineer, Micron Technology Inc.
Chair of JEDEC JC-63 Committee on Multichip Packaging

Key Role Supply Chain Collaboration Plays in 3D IC Product Development.
"A Case Study on a Fabless Model of Collaboration in Developing Highly Anticipated New FPGA 3D Architecture Using Si Interposers with TSV and Micro-bump Technologies."
Suresh Ramalingan, Director of Package Design and Advanced Package Development, Xilinx, Inc.

Lunch Presentation
"Reasons for Optimism in 2011 and 2012."
Brian Matas, Vice President, Market Research, IC Insights

"Market Drivers for Semiconductors and Packaging in the era of Energy Efficiency."

"Increasing Energy Efficiency Through Power Semiconductors."
Oleg Khaykin, CEO, International Rectifier

"Emerging Technologies to Enable Utility Scale Solar Power Growth."
Eelco Bergman, Senior Vice President of Business Development, Cyrium Technologies Inc.

"Power Packaging Challenges and Market Drivers for Next Generation Energy Efficiency."
Chris Bull, Marketing Manager - Power Stage Business Unit, Texas Instruments

"The HEVs Are Coming! The Change of the Automotive Electronics Market With the Rise of the Hybrid/ Electric Power Train."
Tom Deitrich, Senior Vice President of RF and Sensor Products, Freescale Semiconductor

"Semiconductor Opportunities with Hybrid/Electric Automobiles."
Marques McCammon, Chief Marketing Officer, Aptera Motors

Device Packaging Welcome Reception -- GBC Participants Invited

Texas Hold-em Poker Tournament

Co-Chairs and Session Chairs of the Conference are Iris Labadie of Kyocera America, Rich Rice of ASE, Inc., Lee Smith of Amkor Technology, Inc., Jan Vardaman of TechSearch International, Inc.

The IMAPS GBC produces valuable programs that cover many business factors important to the microelectronics industry. Please visit http://www.imaps.org/gbc/index.htm for more information.

Attend An Upcoming Webinar    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Introduction to Microelectronics Packaging Including Industry Updates and Trends
Presented by: Phillip Creter, Creter and Associates
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, March 24, 30, and April 7, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Package on Package (PoP) Applications, Requirements, Infrastructure and Technologies
Presented by: Moody Dreiza, Amkor Technology
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, March 29, April 5, and 12, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Hybrid and Microwave Module Design for Manufacturability (DFM)
Presented by: Tom Green, TJ Green Associates, LLC
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesday, April 19, and Wednesday, April 20, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Mitigate the Risk of Counterfeit Electronic Parts
Presented by: Phil Zulueta, Jet Propulsion Laboratory, California Institute of Technology
This webinar will be held Friday, May 20, 2011, from 12:00 noon - 1:00 pm EASTERN

Webinar on
How to Design for Thermal Cycling - DETAILS SOON
Presented by: DfR Solutions
This webinar will be held Tuesday, May 24, 2011, from 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
High Density Package Testing - DETAILS SOON
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held June 7, 8 and 9, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

2011 IMAPS Microelectronics Foundation Spring Golf Invitational (read more...)    ^ Top
Thursday, March 10, 2011
1:00pm Shotgun Start -- " Best Ball" Scramble
Desert Canyon Golf Club
10440 Indian Wells Drive
Fountain Hills, AZ

The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 "Best Places to Play" by Golf Digest and has been voted "Best Public Golf Course" in Fountain Hills for six consecutive years. Desert Canyon Golf Clubs eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.

Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.

A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course -- 1:00pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive; and
  • Longest Putt

Sponsorship Opportunities:

Eagle Sponsor - $3,000 - SOLD

  • Company logo/name displayed as Awards Reception Sponsor.
  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500 - SOLD

  • Company logo/name displayed as Lunch Sponsor - in/on boxed lunches.
  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.

Hole Sponsor - $400 - FEW HOLES REMAIN

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($750 includes four-some).
  • Company logo/name on promotional materials and website.

Register On-line
Questions or request teams/partners:
David Virissimo, Foundation Golf Chair - dvirissimo@sempck.com or 619-464-5430

  Chapter Activities (events listed in chronological order)
 

IMAPS Southern California Chapters and OCE Announce SoCal 2011    ^ Top
The Southern California Chapters of IMAPS are partnering with OCE Shows this year for SoCal11. SoCal 2011 will be held March 15-16, 2011, at the OC Fairgrounds.

EXHIBITORS
To reserve your booth. Go to www.oceshow.com and click on Exhibiting Information

ATTENDEES
To Sign up to attend the show and reserve your seat for the technical program Go to www.oceshow.com and click on Register for Free

Orange County Electronics Show, Inc. 1514 First Street Manhattan Beach, CA 90266 Phone: (310) 937-1006/E-mail: sales@oceshow.com

Bill Gaines
Program Chairman, SoCal11
626-812-2199 (office)      714-403-5053 (cell)

Chicago/Milwaukee Chapter March 15 Winter Technical Forum on Materials and Advanced Technologies    ^ Top

Date: March 15, 2011 at 11:30 AM
Location:

HOSTED BY: LASERAGE – WAUKEGAN, IL
3021 Delany Rd.
Waukegan, IL 60087
847-856-2216

Registration:

Cost: $15.00 for RSVPd IMAPS Members
$20.00 Others.
$20.00 Students & Displaced Members

On-line registration guarantees seating and lunch. Please register by COB on Friday, March 11th. Participants may pay on-site by cash or check only.

11:30 AM -- Registration and Networking

12:00 PM -- Lunch and Chapter Announcements

12:45 PM -- Multilayer Ceramics for MEMS Packaging
Adam Schubring / Kyocera

01:15 PM -- Advanced Anisotropic Conductive Paste for Flip Chip Assembly
Ken Araujo / Namics Technologies

01:45 PM -- Break: Refreshments

02:00 PM -- Improvements in Solid State Lighting Applications with the use of Traditional Thick Film Technology.
Sarah Groman / Heraeus Materials Technology

02:30 PM -- Advanced Solid State Lighting using MID Technology
Vic Zaderej / Molex

03:00 PM -- Advance Packaging Cleaning & Process Development
Tim Noble & Sherry Hoard / Kyzen Corporation

03:30 PM -- Overview of Laserage and Tour
Steve Capp

04:00 PM -- Conclusion

New England Chapter 38th Symposium & Expo on May 3    ^ Top

Date: May 3, 2011
Schedule: Technical Program and Registration available soon
Location:

Holiday Inn -- Boxborough Woods Conference Center
Boxborough, Massachusetts

The Largest Regional Symposium Dedicated to Microelectronics and Electronics Packaging

The New England Chapter Symposium Technical Program Committee is finalizing the technical program which will feature sessions/presentations on:

Industry
-- Biomedical Electronics -- Telecom - Microwave -- Military Electronics -- Consumer Electronics -- Renewable Energy: Fuel Cells, Solar, Wind -- Thermal/Power Management -- Manufacturing, Outsourcing & Quality -- Software and Firmware Applications -- High Performance Interconnects and Boards -- Sensor Applications -- Emerging Technologies -- Photovoltaic/Solar

Advanced Processes & Materials
-- 3D and High Density Packaging -- Photonic/ Optoelectronic Packaging -- LED Packaging -- MEMS and Nano Packaging -- Underfill/ Encapsulants and Adhesives -- Green Packaging / Compliance with RoHS -- Electronics Recycling -- Flip-Chip and Bumping: Processes, Reliability -- Wire Bonding and Stud Bumping -- Embedded and Integrated Passives -- Ceramic, Polymer and Conductive Materials -- Cu/ Low-K

Symposium Technical Chair:
Roger S. Benson
International Rectifier
Leominster, MA
roger.benson@verizon.net
Phone: (978) 457-4014

Visit us at - www.imapsne.org -- for details

----- also -----
SIX Lecture Sessions, Full Poster Session, Employment Center and an 80 Booth Exhibit Hall

For details about Sponsoring, Exhibiting or Attending Contact:
Harvey Smith: harveys@imapsne.org or Call 508-699-4767

France Chapter To Hold MiNaPAD Forum 2011 on May 11-12    ^ Top

Date: May 11-12, 2011
Schedule: Technical Program and Registration available soon
Location: Grenoble, France
Details: imaps.france@imapsfrance.org or www.imapsfrance.org

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum Conference & 'Interconex' Exhibition

Bringing closer the design and the semiconductor assembly & packaging communities

The program is being developed and sessions are planned on the following topics:

  • Design: CAD and design techniques, IO placement for advanced packaging (fan-out, 3D packaging), design for reliability, IC and package co-design, RF package design, thermal and mechanical predictability (models and simulations)
  • Innovative packaging for MEMS and emerging applications: photovoltaic, biosensors, energy scavenging and batteries, high brightness LEDs,...
  • Process, test, reliability, characterization and challenges of advanced packaging
    platforms: 3D Packaging (with or w/o TSVs), fan-out WLP and embedded IC
    package.
  • Advanced interconnections: flip-chip for high IO count devices and sub 45nm
    CMOS, new flip-chip and WLP metallurgies, bumping techniques
  • System-in-Package for smart systems, telecom, automotive and medical
    applications: solving test and reliability challenges
  • A poster session will address all of the above topics. At the discretion of the
    program committee, submitted abstracts may be considered for poster presentation

Abstracts Due Tomorrow: Nordic Chapter Conference in Finland June 5-8    ^ Top
IMAPS Nordic Chapter is proud to announce the year 2011 conference in Finland. The conference will take place in Dipoli in the centre of the technology in Otaniemi, Espoo hosting a range of high tech companies as well as Aalto University and the Technical Research Center of Finland.

You are welcome to submit an abstract or suggestion for a paper to the IMAPS Nordic Conference 2011. The abstract must be non-commercial and submitted in electronic form to conference@imapsnordic.org. Speakers will be notified of paper acceptance by email by March 4. The deadline for the final paper is April 8.

Proposed topics include:

  • 3D Advanced interconnect, TSV, Advanced packaging
  • MEMS, MOEMS, sensor integration & applications
  • Harsh environment
  • High temperature electronics
  • Printed electronics
  • Future electronics, trends & strategies
  • Ceramics: thick film, copper plated, DBC, LTCC
  • Microvia, HDI laminates, flex, embedded passives
  • Chip thinning & stacking, 3D-packaging, TSV, embedding
  • Pb and halogen free electronics, methods and consequences
  • CSP, flip chips, area array
  • Reliability assessment, SPC
  • High frequency packaging
  • SMT and board assembly
  • Integrated passive devices (IPD) & System in Package (SiP)
  • System cost assessment
  • Manufacturing management & outsourcing
  • Unique materials, PTF, underfills and ACF, encapsulation
  • Wirebonding, COB
  • Modelling and simulation

Tutorial:
Tutorial suggestions are also welcome to conference@imapsnordic.org.
For the latest information about the conference and the exhibition, visit our homepage at http://nordic.imapseurope.org/ or send e-mail to info@imapsnordic.org or to the Exhibition Host at exhib@imapsnordic.org.

Hotel:
The conference hotel is Radisson Blu Hotel in Espoo (http://www.radissonblu.com/). Use code IMAPS when booking. Rates: 110€/single standard and 130€/double standard. The social events will take place at the hotel.

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal for consideration prior to the closing date of 30 March 2011.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.


   
   

LORD Corporation

Global Business Council Spring Conference
March 6-7
Ft. Hills, AZ

Device Packaging Conference
March 7-10
Ft. Hills, AZ
*Exhibitors contact modonoghue@imaps.org

IMAPS/ACerS CICMT
April 5-7
San Diego, CA
*Exhibitors contact modonoghue@imaps.org

"Think Thin" - IC Packaging for Mobile Applications
May 4-5
Santa Clara, CA
*Exhibitors contact modonoghue@imaps.org

Medical Device Packaging
June 14-15
Minneapolis, MN
*Exhibitors contact modonoghue@imaps.org

Mid-Atlantic Conference
June 23-24
Atlantic City, NJ
*Exhibitors contact modonoghue@imaps.org

IMAPS/CPMT Optoelectronic Packaging
June 28-30
Irvine, CA

Advanced Interconnect & Substrate
July 13
San Francisco, CA

Wire Bonding
July 14
San Francisco, CA

High Temp. Network (HiTEN)
July 18-20
Oxford, UK
*Exhibitors contact modonoghue@imaps.org

RF/Microwave
September 20-22
San Diego, CA

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

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