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November 30, 2011
 

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   IMAPS EVENTS
Button Abstracts Due Friday for Device Packaging 2012 (read more...)

Button Abstracts Due Friday for ATW on RF/Microwave Packaging (read more...)

Button Program and Registration Now Available For Southeastern Microelectronics Packaging Conference (read more...)

Button Conference on Non-Hermetic Packaging Technology for Reliable Microelectronics - Now On-line  (read more...)

Button Webinar Begins Next Tuesday: Assessment of RGA Data and Failures in Microelectronic Devices (read more...)

Button Announcing the 2012 International Conference on High Temperature Electronics (HiTEC)   (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Keystone Chapter Holiday Party on December 3 (read more...)

Bullet San Diego Chapter Holiday Social and DInner on December 6 (read more...)

Bullet Northern California Chapter December 7 Lunch Meeting on Package Modeling of MEMS Devices (read more...)

Bullet Chicago-Milwaukee Chapter December 8 Holiday Social (read more...)

Bullet Metro Chapter Holiday Party on December 8 (read more...)

Bullet Arizona Chapter December 15 Luncheon on Surface Energy and Wettability Study of Flip Chip Packaging Materials (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

Bullet ICEP-IAAC 2012 Being Held in Tokyo - Abstracts Now Due November 29 (read more...)

Bullet New England Chapter's 39th Symposium & Expo - Abstracts Due December 31 (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

Abstracts Due Friday for Device Packaging 2012   ^ Top
The 8th Annual Device Packaging Conference (DPC2012) will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS). To view the call for abstracts, to submit an abstract, to reserve exhibits, or for other details about the Conference, visit www.imaps.org/devicepackaging.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2012 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 2, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 27, 2012. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006 and is 60% sold for 2012. Please review the exhibit information (AVAILABLE SOON) or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 5th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 2, 2011.

Abstracts Due Friday for ATW on RF/Microwave Packaging   ^ Top
IMAPS is holding the Advanced Technology Workshop on RF/Microwave Packaging at The Crowne Plaza Hotel in San Diego, CA, from February 7-9, 2012. To view the call for abstracts, to submit an abstract, or for other details about the workshop, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

The 2012 Workshop will feature two exciting keynote speakers:


Dr. Renzhe Zhao
Chief Specialist of Electronics Material, Huawei Technologies
Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Sean Cahill
VP, Technology, BridgeWave Communications, Inc.
He will share how to leverage government programs to develop new packaging technology.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New Uncooled IR sensors
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than December 2, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm.

No formal technical paper is required. A reproduction-ready 2-page extended abstract with figures and graphs included, if necessary will be required for the abstract booklet on January 6, 2012.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Program and Registration Now Available For Southeastern Microelectronics Packaging Conference   ^ Top
IMAPS and the Southeast Chapters are holding the first annual Southeastern Microelectronics Packaging Conference at Rosen Centre Hotel in Orlando, Florida on January 17, 2012. To view the program, exhibit information, or to register on-line, visit www.imaps.org/southeast.

Co-located with the Advanced Technology Conference on Non-Hermetic Packaging Technology for Reliable Microelectronics, January 18, 2012 - www.imaps.org/hermetic

The objective of the Southeast Microelectronics Packaging Conference is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging.

Tuesday, January 17, 2012

Registration: 11:00 am - 8:30 pm

Speakers' Luncheon: 12:00 pm - 12:50 pm

Exhibit Opens: 4:30 pm - 8:30 pm

Opening Remarks: 12:50 pm - 1:00 pm
General Chair: Doug Bokil, IMAPS Florida Chapter President
Namark Process Design LLC

Session 1: Packaging Reliability
Chair: Donny Chen, nScrypt, Inc.
1:00 pm - 2:40 pm

Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds
Richard Share, Share Consulting LLC

How Clean is That Surface? How Do You Know?
Robert K. Lowry, Electronic Materials Characterization

Thermo-Mechanical Properties of the Molding Compound in Harsh Environment
Mahdi Sadeghinia, K. M. B. Jansen, L. J. Ernst, H. Pape, Delft University of Technology (The Netherlands)
* Student Paper

Session 2: Thermal Management Solutions
Chair: Jeff Jennings, Harris Corporation
1:00 pm - 2:40 pm

Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results
Bruce Wilson, Paul W. Barnes, SST International

Piezoelectric Active Cooling Substrates for Thermal Management of Microelectronics
Brian A. English, EngeniusMicro LLC

Reliability Investigation of Various Au-In TLP Bonds
Brian Grummel, University of Central Florida

* Student Paper

Break: 2:40 pm - 2:55 pm (Refreshments & Networking)

Session 3: High Density (3D) Packaging
Chair: Donny Chen, nScrypt, Inc.
3:00 pm - 4:40 pm

Converting Au Stud Bumps to a Non-Embrittling Surface for Sn Based Solders 
Terence Collier, Bal Benavidez, Indira Gubeljic, CV Inc.

Advanced Wedge Bonding Capabilities Enable New Package Developments in RF, Microwave, Optoelectronic and Military Devices
Lee Levine, Joseph S. Bubel, Hesse & Knipps, Inc.

Fine Pitch Die-Level Testing Can Accelerate Development of Multi-Die Packaging Technologies Using Die Bonding Equipment 
David Herndon, Suzanne Dunphy, Harris Corporation

Session 4: Advanced Materials & Packaging
Chair: Jeff Jennings, Harris Corporation
3:00 pm - 4:40 pm

NAMICS Materials for Thin & Advanced Packaging Technology 
Ken Araujo, Brian Schmaltz, Abe Yukinari, NAMICS Technologies, Inc.

Printed Electronics
Mike Newton, nScrypt, Inc.

Materials Interaction in Cofired Platinum /Alumina High Density Feedthrough for Implantable Neurostimulator Applications
Ali Karbasi, W. Kinzy Jones, Florida International University

* Student Paper

Exhibit Hall & Cash Bar Open at 4:30pm


Dinner Buffet Open
(hot hors d'oeuvres): 5:00 pm - 8:30pm

Keynote Presentation: 5:30 pm - 5:55 pm

Industry and Market Trends in the Electronic Interconnect Supply Chain: Findings from IPC Market Research
Sharon Starr, Director of Market Research, IPC

IMAPS Florida Chapter President's Closing Remarks: 5:55 pm - 6:00 pm

Conference & Exhibit Hall Closed: 8:30 pm

Register On-Line
Tabletop Exhibition | Reserve Tabletop

Conference on Non-Hermetic Packaging Technology for Reliable Microelectronics - Now On-line   ^ Top
IMAPS is holding the first Advanced Technology Conference and Tabletop Exhibits on Non-Hermetic Packaging Technology for Reliable Microelectronics at the Rosen Centre Hotel in Orlando, Florida on January 18, 2012. To view the program, exhibit information, or to register on-line, visit www.imaps.org/hermetic.

Co-located with IMAPS Southeastern Microelectronics Packaging Conference, January 17, 2012 - www.imaps.org/southeast

Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost. The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations.

Wednesday, January 18, 2012

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Opens: 10:00 am - 4:00 pm

Opening Remarks: 8:00 am - 8:15 am
Tom Green, TJ Green Associates LLC

Moisture Failures in Electronic Devices
Robert K. Lowry, Electronic Materials Characterization

Class Y Update
Speaker - TBD

Verification of the QSS Model for Predicting Moisture Ingress in Hollow Plastic Packages
Ray Pearson, Lehigh University

Advantages of using LCP Based Pre-Molded Leadframe Packages for RF & MEMS Applications
Andy Longford, Interplex Engineered Products/PandA Europe; Jack Matlis, Interplex Engineered Products USA; Joseph Lynch, Interplex Industries Inc, USA 

Coffee Break in Exhibit Hall: 10:15 am - 10:45 am

Development of Epoxy Sealed Packages for MEMS
S. Joshua Jacobs, Texas Instruments Inc. 

Summary of Epoxy Sealed Air Cavity Packages (ceramic, metal, glass and LCP)
Dick Ross, John Ni, RJR Polymers Inc.

Lunch in the Exhibit Hall: 11:45 am - 1:30 pm

KEYNOTE Speaker Presentation
TBD

Characterization of Plastic Encapsulants for Packaging of Non-Hermetic Electronic Modules for Monitoring of Steam Sterilizers
Jinto George, John Barrett, Cork Institute of Technology

Low Cost, Non-Hermetic Multi-Chip Module
Matthew Gruber, Lockheed Martin

Wafer-Level Parylene Diffusion Barriers for a Self-Referenced CMOS LC Oscillator
Nathaniel Gaskin, Bhusan Gupta, Integrated Device Technology 

Advanced Conformal Barrier Technology for Non-Hermetic Packaging of Electronics
Rakesh Kumar, Specialty Coating Systems, Inc. 

Coffee Break in Exhibit Hall: 3:30 pm - 4:00 pm

Corporate Sponsor Presentation: 3:30pm - 3:40pm

Materion - Corporate Sponsor

Open Panel Discussion: 4:00 pm - 5:00 pm
Government - Academia - OEMs - Suppliers

Closing Remark: 5:00 pm
Robert Lowry, Electronic Materials Consultant

Register On-Line

Webinar Begins Next Tuesday: Assessment of RGA Data and Failures in Microelectronic Devices    ^ Top
This two-session on-line Professional Development Course (PDC) webinar will be held:
Tuesdays, December 6 and 13, 2011

All webinars will be held 12:00 noon - 1:00 pm EST

Registration:
IMAPS Members: $125 per webinar; 2-course series $200
Non-members: $200 per webinar; 2-course series $375

Registration Deadlines: December 5, 2011

Register On-Line

Program Description

These 2 one-hour PDC lectures can be taken in total or separately, but to gain the most benefit it is recommended to attend the whole series in order. Each session is scheduled for 50 minutes of presentation followed by 10 minutes of Questions and Answers. A brief description of the topics to be covered follows:

SUBJECT MATTER FOR THE WEBINAR TO INCLUDE:

  • REDEFINE HERMETICITY
  • WHY DETERMINE MOISTURE CONTENT
  • WHO DETERMINES MOISTURE CONTENT
  • SOURCES OF MOISTURE LEAKS
    • RESIDUALS
    • IN-SITU FORMATION
  • WHEN TO PERFORM RGA
  • HOW TO DETERMINE MOISTURE CONTENT
    • EQUIPMENT & ASSOCIATED PROBLEMS
    • CALIBRATION & ASSOCIATED PROBLEMS
  • INTERPRETATION OF RGA DATA

 

  Philipp wh Schuessler

Presenter

Mr. Schuessler completed his undergraduate and graduate work in Analytical and Synthetic Inorganic Chemistry in 1965. He retired from IBM/FSD and Lockheed Martin as a Senior Scientist after thirty-five years in 1996 and since then has done consulting for the microelectronic industries. His specialties were analytical chemistry and the failure analysis of electronic devices for DOD and NASA, as well as Applied R&D for the U.S. Navy in moisture permeation. He led the IBM/FSD Challenger Shuttle Recovery Team at the Cape, where he extemporaneously developed recovery, stabilization and storage protocols for the computer hardware at the recovery site and later at the reconstruction facilities.

In Materials and Process Development, he was responsible for the polymeric seal process of the first IBM/FSD hybrid-LSI devices. Later, he organized an adhoc group of technologists to address the issue of hydrogen evolution and moisture formation in hermetic microelectronic devices.

In JEDEC, he chaired the task groups for Method 5011 (Adhesives and Polymeric Materials) and Method 1018 (Residual Gas Analysis).

He has authored on various aspects of industrial chemistry, has over fifty five papers and published articles, twenty published invention disclosures and four published patents. He has been the coordinator of the Minnowbrook Microelectronic Conference since 1985.

Register On-Line

Full Webinar details online at www.imaps.org/webcasts

Announcing the 2012 International Conference on High Temperature Electronics (HiTEC)   ^ Top
IMAPS is holding International Conference on High Temperature Electronics (HiTEC 2012) at the Albuquerque Marriott Pyramid North in Albuquerque, New Mexico, from May 8-10. Abstracts are now being accepting and are due not later than January 11, 2012. To view the call for abstracts, exhibit information, or to register on-line, visit www.imaps.org/hitec.

Companies wishing to sponsor this conference or exhibit, please contact Brian Schieman at bschieman@imaps.org for more information. Interested in submitting an abstract or getting involved as a session chair? Contact Jackki Morris-Joyner at jmorris@imaps.org.

HiTEC 2012 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics And Packaging Society, HiTEC 2012 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics.

Papers will be presented on, but not limited to, the following subjects:

Applications:
- Geothermal
- Oil well logging
- Automotive
- Military/aerospace
- Space
- Etc.
Device Technologies:
- Si, SOI
- SiC
- Diamond
- GaN
- GaAs
- Contacts
- Dielectrics
MEMS and Sensors:
- Vibration
- Pressure
- Seismic
- Etc.
Packaging:
- Materials
- Processing
- Solders/Brazes
- PC Boards
- Wire Bonding
- Flip Chip
- Insulation
- Thermal
management

Circuits:
- Analog
- Digital
- Power
- Wireless
- Optical

Energy Sources:
- Batteries
- Nuclear
- Fuel Cells
- Etc.
Passives:
- Resistors
- Inductors
- Capacitors
- Oscillators
- Connectors
Reliability:
- Failure
mechanisms
- Experimental and
modeling results

Those wishing to present a paper at the HiTEC 2012 Conference must submit a 200-300 word abstract electronically by January 11, 2012, using the on-line submittal form at: www.imaps.org/abstracts.htm. All abstracts submitted must represent original, previously unpublished work.  All speakers are required to pay a reduced registration fee. 

Students wishing to present at the High Temperature Electronics Conference must also submit a 200-300 word abstract electronically no later than January 11, 2012; you must check the “YES, I’m a full-time Student” button at the bottom of the submission page after you enter your abstract text in order to be considered for the student competition award.

If your abstract is selected, a Final Manuscript for publication on the Conference CD-ROM Proceedings will be due on March 23, 2012.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.

  Chapter Activities (events listed in chronological order)
 

Keystone Chapter Holiday Party on December 3    ^ Top

Date: December 3, 2011 at 7:00pm
Location:

Lee Levine's Home
8009 George Road, New Tripoli, PA

Join Us for an evening of food and fun with your IMAPS friends & spouses.

RSVP to levilr@ptd.net Or call 610-248-2002

San Diego Chapter Holiday Social and DInner on December 6    ^ Top

Date: Tuesday, December 6th at 6:00
Industry reception starts at 6:00, followed by dinner at 7:00.
Location:

Casa Machado Restaurant
3750 John J. Montgomery Drive
For venue directions and information, go to www.casamachadorestaurant.com/locations.html

Registration:

Only $25.00 per person. Complimentary for students with ID.
Reservations required please. Please RSVP by Friday, Dec. 2 at 4:00
To register, please contact Dave Virissimo of Semiconductor Packaging Materials at David.Virissimo@ametek.com or 619-464-5430

Come join the holiday cheer with your local industry colleagues and enjoy a scrumptious Mexican food buffet!

Join in the prize drawing - lucky winners will win wonderful prizes.

The chapter event will include a Toys for Tots toy drive. Please bring new, unwrapped toys to support this great cause. The U.S. Marine Corps will distribute these toys as holiday gifts to needy children in our San Diego community.

Northern California Chapter December 7 Lunch Meeting on Package Modeling of MEMS Devices    ^ Top

Date: December 7, 2011
Location:

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054
408-986-1666

Registration:

IMAPS Members $25; non-members $30; students (with ID) $15. Price includes lunch & program. SPACE IS LIMITED! So guarantee your lunch seating by pre-registering soon!

Please RSVP by e-mailing Roger Underwood at runderwood@cctlaser.com before COB Monday December 5. Registrations will be confirmed via e-mail. Only cash and checks are accepted at the door.

Package Modeling of MEMS Devices
John Bloomsburgh, Principal Engineer of Fairchild Semiconductor

Abstract:
MEMS devices are designed to directly interact with the natural environment which presents a more nuanced set of headaches for MEMS package designers. MEMS are made of silicon and are typically required to move or vibrate in response to a stimulus (e.g. acceleration, pressure, acoustic waves). So not only does a MEMS package often need to provide special interfaces for the MEMS to interact with the outside world, but also the different thermo-mechanical properties between silicon and other packaging materials will create stresses that bend and shape the moving members of a MEMS device. This can significantly alter the basic designed performance of the device. Successfully modeling the interaction between a MEMS device and its package requires an in-depth knowledge of package construction, BOM properties over temperature variations, and MEMS functionality.

Presenter Bio:
John Bloomsburgh earned his B.S. in Mechanical Engineering from M.I.T. in 2003. From 2005 to 2009, John worked at the IntelliSense Software Corporation where he worked extensively both to design MEMS devices for customer applications and to develop accurate FEA models of customer devices. In 2009, he moved to California to join a start-up, Jyve, as an FEA modeling expert. As the company matured, it was acquired by Fairchild Semiconductor, where John continues to model packaging impacts on MEMS devices.

Event Logistics:
Wednesday, December 7, 2011
11:30 – 12:00 Registration & Networking
11:30 – 12:15 Buffet Luncheon
12:15 – 1:00 Presentation

Chicago-Milwaukee Chapter December 8 Holiday Social    ^ Top

Date: December 8, 2011
Location:

Join us in celebrating the holiday season at the Chapter's Holiday Social. This year's event will be held at the Marriott Lincolnshire Resort and Theater in Lincolnshire, IL.

Featuring a Festive Dinner and Irving Berlin's White Christmas

Join us in celebrating the holiday season at the Chapter's Holiday Social. This year's event will be held at the Marriott Lincolnshire Resort and Theater in Lincolnshire, IL.

Our group will enjoy dinner in a private room where guests will have their choice of three dinner entrees: baked chicken, fresh fish, or char-broiled 8oz. steak. (Dinner includes a house salad and dessert).

Following the dinner, guests will attend the theater production of Irving Berlin's White Christmas. This dinner/theater package is limited to a total of 20 members and their guests. So make your reservations early.

Costs for IMAPS members and their guests is $63.00 per person. Check payments only.

Further details of the holiday event will be sent in advance of the event. For reservations, please contact Sandy Habrych at 847-856-2206 or sandyh@laserage.com. Please specify the number of attendees and dinner choices.

Metro Chapter Holiday Party on December 8    ^ Top

Date: December 8, 2011 | 6:00-10:00pm
Location:

Holiday Inn Ronkonkoma

Come out and socialize with all your friends

Not a member? Join or renew prior to November 30, 2011 and receive the member price

Want to bring a guest? Only 40.00

FREE to IMAPS Member (not affiliated with Metro) that has paid to attend any Metro event in the past 18 months

Guest 40.00
40.00 to IMAPS Members that has not attended a Metro event in the past 18 months
60.00 to all others

Dinner buffet
Prize drawings
50/50 Drawing
4 hours open bar

First come first served. If you would like to make a reservation send an email to: metroimaps@optonline.net Please include your IMAPS Membership Number.

If you would like to contribute a door prize, please contact Steve Lehnert (631) 405-0494 or email metroimaps@optonline.net

Arizona Chapter December 15 Luncheon on Surface Energy and Wettability Study of Flip Chip Packaging Materials    ^ Top

Date: December 15, 2011
Location:

Dobson Ranch Inn, Mesa AZ

Registration:

Luncheon and presentations - $20.00 in advance for members / $25.00 in advance for non-members / $30 at door.

Register On-Line    

Registration and exhibits will open at 11:30
Lunch and presentation will be from noon to 1:00pm
Exhibits close at 1:30

Surface Energy and Wettability Study of Flip Chip Packaging Materials

Jinlin Wang
Senior Materials Engineer in the Assembly Materials Characterization Lab
Assembly Test and Technology Development
Intel Corporation

The surface energy of solid surfaces and surface tension of liquids are important parameters in the IC package assembly process. Wettability analyses have been completed for various materials used in the assembly process of flip chip packages, including underfills, substrates, fluxes, and lead free solders. We will highlight some of these results in this presentation. First, we will focus our discussion on substrate surface energy analysis. A brief discussion of different surface energy methods and the liquid selection criteria will be given. The advantage and limitation of the surface energy calculation methods will be discussed. The data from several case studies will be presented. Our results show that contact angle and surface energy measurements are very useful for quality control and product development where interfacial properties are important. Then, several solder wetting analysis methods will be discussed. The solder wetting balance test is a common method used for wettability evaluation. A solder spreading test was used for solder wetting analysis under different reflow conditions. Wetting angles of solder spheres after reflow were calculated by using analytical equations from the solder spreading diameter. The calculated wetting angles were compared with measured values. Values of contact angles calculated using analytical equations were consistent with measurements. For very low contact angles, it is challenging to measure it accurately. The wetting angle calculated from solder spreading provides a good estimate for low contact angles.

Exhibit with us!
Exhibit at any of our AZ luncheons for $100 Includes:
- 6ft Tabletop for your display
- Company promotion via links from our invitations and the AZ Chapter website to your company website
-lunch for one attendee

If you'd like to exhibit, please contact jody@e-reachcomm.com

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012
Location:

MERCURE OCEANIDE VIEUX PORT SUD
LA ROCHELLE

Details:

www.imapsfrance.org

We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees.

The workshop sessions will include the following topics:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail: imaps.france@imapsfrance.org, by fax : +33 (0) 1 39 02 71 93

ICEP-IAAC 2012 Being Held in Tokyo    ^ Top

Date: April 17-20, 2012
Location:

Tokyo Big Sight, Tokyo, Japan

Details:

http://jiep.or.jp/icep/

Submitting an abstract site:
https://www.pasreg.jp/reg/top/icep/author

Sessions and Keywords:

1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package

2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring

3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA

4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics

5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes

6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining

7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications

9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System

10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS

11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications

12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors

13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas

14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness

15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design

16. Metrology Current Density, Power Map, Thermal Map

17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis

Best Paper Awards : The JIEP will present the Best Paper Awards to selected outstanding papers.

Young Awards : The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old.

Organizing Committee : General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics)

Technical Program Committee : Chair: Shintaro Yamamichi (Renesas Electronics) Co-Chairs: Masahiro Inoue (Osaka University), Hitoshi Sakamoto (NEC), Shoji Uegaki (ASE Marketing & Service Japan), Hiroshi Yamada (Toshiba)

New England Chapter's 39th Symposium & Expo - Abstracts Due December 31    ^ Top

IMAPS New England – 39th Symposium & Expo
The Largest Regional Symposium Dedicated to
Microelectronics and Electronics Packaging

Click Here to Submit

May 8, 2012
Holiday Inn – Boxborough Woods Conference Center, Boxborough, Massachusetts

The New England Chapter Symposium Technical Program Committee seeks papers to demonstrate that new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal  Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Emerging Technologies

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic Packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green Packaging / Compliance with RoHS
  • Flip-Chip and Bumping: Processes, Reliability
  • Wire Bonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Symposium Technical Chair: Roger S. Benson
International Rectifier, Leominster, MA

Please send 250 word abstract to roger.benson@verizon.net
Phone: 978-514-5825

Or Click Here to Submit

visit us at - www.imapsne.org – for details

Deadline for Abstract Submission – December 31, 2011

----- also -----

SIX Lecture Sessions, Full Poster Session,
Employment Center and an 80 Booth Exhibit Hall
For details about Sponsoring, Exhibiting or Attending

Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

LORD Corporation

RGL Enterprises

EPP

Crane AE Banner

Webinar: RGA Data & Failures in Micro...
12/6/2011, 12/13/2011

Southeastern Microelectronics Packaging Conference
January 17, 2012
Orlando, FL
*Exhibitors contact bschieman@imaps.org

Non-Hermetic Packaging Technology for Reliable Microelectronics
January 18, 2012
Orlando, FL
*Exhibitors contact bschieman@imaps.org

RF/Microwave Packaging
February 7-9, 2012
San Diego, CA

3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
February 22-24, 2012
El Paso, TX
*Exhibitors contact bschieman@imaps.org

8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact bschieman@imaps.org

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
Erfurt, Germany

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact bschieman@imaps.org

IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact bschieman@imaps.org

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