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November 9, 2011

Palomar Technologies

Button Webinar Tomorrow - Why Wedge Bond? (read more...)

Button System Level Packaging Workshop Begins Tomorrow (read more...)

Button Abstracts Due NEXT FRIDAY for Device Packaging 2012 (read more...)

Button Abstracts Due Soon for ATW on RF/Microwave Packaging (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Central Texas Chapter's Design & Manufacturing Tech Forum & Expo on November 10 (read more...)

Bullet TOMORROW: Indiana Chapter November 10 Tour of Foresite Inc & Technical Presentation (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet Keystone Chapter Holiday Party on December 3 (read more...)

Bullet Chicago-Milwaukee Chapter December 8 Holiday Social (read more...)

Bullet Arizona Chapter December 15 Luncheon on Surface Energy and Wettability Study of Flip Chip Packaging Materials (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

Bullet ICEP-IAAC 2012 Being Held in Tokyo - Abstracts Due November 15 (read more...)

Button In Memoriam - Steve Adamson (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)

Webinar Tomorrow - Why Wedge Bond?    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Upon registering for our Webinars, IMAPS provides the log-in details approximately 24-hours prior to your meeting for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

Corporate Webinar on
Why Wedge Bond?
Sponsored and Presented by: Hesse & Knipps
This webinar will be held Thursday, November 10, 2011. Webinar will be held 12:00 noon - 1:00 pm EASTERN

Hesse & Knipps

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, December 1, 8, and 15, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Assessment of RGA Data and Failures in Microelectronic Devices
Presented by: Philipp Schuessler, Schuessler Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, December 6, and 13, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at

System Level Packaging Workshop Begins Tomorrow   ^ Top
IMAPS is holding the Advanced Technology Workshop on System Level Packaging at Dinah's Garden Hotel in Palo Alto, CA, on November 10-11, 2011. To view the technical program and details about the workshop, visit This workshop is co-located with the ATW on Thermal Management.

Abstracts Due NEXT FRIDAY for Device Packaging 2012   ^ Top
The 8th Annual Device Packaging Conference (DPC2012) will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS). To view the call for abstracts, to submit an abstract, to reserve exhibits, or for other details about the Conference, visit

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2012 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 18, 2011, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 27, 2012. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information (AVAILABLE SOON) or contact Brian Schieman by email at or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 5th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than November 18, 2011.

Abstracts Due Soon for ATW on RF/Microwave Packaging   ^ Top
IMAPS is holding the Advanced Technology Workshop on RF/Microwave Packaging at The Crowne Plaza Hotel in San Diego, CA, from February 7-9, 2012. To view the call for abstracts, to submit an abstract, or for other details about the workshop, visit

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

The 2012 Workshop will feature two exciting keynote speakers:

Dr. Renzhe Zhao
Chief Specialist of Electronics Material, Huawei Technologies
Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Sean Cahill
VP, Technology, BridgeWave Communications, Inc.
He will share how to leverage government programs to develop new packaging technology.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New Uncooled IR sensors
  • Plastic RF/MW packaging
  • Lead free
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than December 2, 2011, using the on-line submittal form at:

No formal technical paper is required. A reproduction-ready 2-page extended abstract with figures and graphs included, if necessary will be required for the abstract booklet on January 6, 2012.

Please contact Jackki Morris-Joyner by email at or by phone at 202-548-4001 if you have questions.


  Chapter Activities (events listed in chronological order)

TOMORROW: Central Texas Chapter's Design & Manufacturing Tech Forum & Expo on November 10    ^ Top

Date: November 10, 2011

Norris Conference Center at Northcross Mall (backside)
2525 West Anderson Lane
Austin, Texas


This event is complimentary for IMAPS members and non-members.


10:30-5:00 Exposition Floor Open

11:00 "Lithium-Ion Batteries and Electric Vehicles."
Joel Sandahl, President and CEO of ZX Technologies

12:00 Complimentary Lunch and Door Prize Drawings

1:00 "Reliability & Metallurgy of ENEPIG Board Finish and Tin-Lead Solder Joints."
Mike Wolverton, Professional Engineer at Raytheon Space & Airborne Systems

2:15 "The iNEMI Roadmap and Research Plan - The Good, The Bad and The Ugly! "
Alan Rae, iNEMI Research Director and Managing Member of TPF Enterprises LLC

3:00 Refreshments, Networking, and More Door Prize Drawings

3:30 "Using Automated Solder Paste Inspection to Improve Print Yields."
Chrys Shea, President of Shea Engineering Services

5:00 Final Door Prize Drawings

TOMORROW: Indiana Chapter November 10 Tour of Foresite Inc & Technical Presentation    ^ Top

Date: November 10, 2011

Foresite Inc.
1982 S. Elizabeth St.
Kokomo, IN 46902
(765) 457-8095


Tour 5:00 Presentation 5:45 Dinner 6:30
Chapter Business Meeting (elections) 7:00

$5 for IMAPS Members. $10 for Non-Members
Reservations can be made by contacting Ray Fairchild at 765-451-1068 or

Dependant and Interdependent SMT Package Failures (Case Histories)
Manuel Solis, Lead Investigator of Foresite Inc.

Presentation Abstract
This presentation is a semi-light hearted look at select SMT failure case histories. All of these cases could have been avoided by better focus. Covered subjects are SMT failures that were materials-related, process-related, and post-process related. The presentation also covers more on process, PCB/PCBA cleanliness, and what the industry is missing by following the no-clean process trend.

Presenter Biography
Manuel "Paco" Solis has over 8 years of experience as the Lead Investigator of contamination studies and failure analysis with Foresite Inc. Previously, he worked for Analog Devices for 15 years in semiconductor failure analysis - as an engineer for interconnect reliability studies.

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal.

Further information on the two day Seminar can be found on the Societys website or by emailing the events organising committee

Keystone Chapter Holiday Party on December 3    ^ Top

Date: December 3, 2011 at 7:00pm

Lee Levine's Home
8009 George Road, New Tripoli, PA

Join Us for an evening of food and fun with your IMAPS friends & spouses.

RSVP to Or call 610-248-2002

Chicago-Milwaukee Chapter December 8 Holiday Social    ^ Top

Date: December 8, 2011

Join us in celebrating the holiday season at the Chapter's Holiday Social. This year's event will be held at the Marriott Lincolnshire Resort and Theater in Lincolnshire, IL.

Featuring a Festive Dinner and Irving Berlin's White Christmas

Join us in celebrating the holiday season at the Chapter's Holiday Social. This year's event will be held at the Marriott Lincolnshire Resort and Theater in Lincolnshire, IL.

Our group will enjoy dinner in a private room where guests will have their choice of three dinner entrees: baked chicken, fresh fish, or char-broiled 8oz. steak. (Dinner includes a house salad and dessert).

Following the dinner, guests will attend the theater production of Irving Berlin's White Christmas. This dinner/theater package is limited to a total of 20 members and their guests. So make your reservations early.

Costs for IMAPS members and their guests is $63.00 per person. Check payments only.

Further details of the holiday event will be sent in advance of the event. For reservations, please contact Sandy Habrych at 847-856-2206 or Please specify the number of attendees and dinner choices.

Arizona Chapter December 15 Luncheon on Surface Energy and Wettability Study of Flip Chip Packaging Materials    ^ Top

Date: December 15, 2011

Dobson Ranch Inn, Mesa AZ


Luncheon and presentations - $20.00 in advance for members / $25.00 in advance for non-members / $30 at door.

Register On-Line    

Registration and exhibits will open at 11:30
Lunch and presentation will be from noon to 1:00pm
Exhibits close at 1:30

Surface Energy and Wettability Study of Flip Chip Packaging Materials

Jinlin Wang
Senior Materials Engineer in the Assembly Materials Characterization Lab
Assembly Test and Technology Development
Intel Corporation

The surface energy of solid surfaces and surface tension of liquids are important parameters in the IC package assembly process. Wettability analyses have been completed for various materials used in the assembly process of flip chip packages, including underfills, substrates, fluxes, and lead free solders. We will highlight some of these results in this presentation. First, we will focus our discussion on substrate surface energy analysis. A brief discussion of different surface energy methods and the liquid selection criteria will be given. The advantage and limitation of the surface energy calculation methods will be discussed. The data from several case studies will be presented. Our results show that contact angle and surface energy measurements are very useful for quality control and product development where interfacial properties are important. Then, several solder wetting analysis methods will be discussed. The solder wetting balance test is a common method used for wettability evaluation. A solder spreading test was used for solder wetting analysis under different reflow conditions. Wetting angles of solder spheres after reflow were calculated by using analytical equations from the solder spreading diameter. The calculated wetting angles were compared with measured values. Values of contact angles calculated using analytical equations were consistent with measurements. For very low contact angles, it is challenging to measure it accurately. The wetting angle calculated from solder spreading provides a good estimate for low contact angles.

Exhibit with us!
Exhibit at any of our AZ luncheons for $100 Includes:
- 6ft Tabletop for your display
- Company promotion via links from our invitations and the AZ Chapter website to your company website
-lunch for one attendee

If you'd like to exhibit, please contact

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012



We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2012 edition and be sure to submit your abstract on time.

The workshop sessions will include the following topics and papers are invited in these areas:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers should submit a 200-300 words abstract accurately/precisely describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions), not later than 4 November, 2011.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: 25 November, 2011.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail:, by fax : +33 (0) 1 39 02 71 93

ICEP-IAAC 2012 Being Held in Tokyo - Abstracts Due November 15    ^ Top

Date: April 17-20, 2012

Tokyo Big Sight, Tokyo, Japan


Sessions and Keywords:

1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package

2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring

3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA

4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics

5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes

6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining

7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications

9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System

10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS

11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications

12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors

13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas

14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness

15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design

16. Metrology Current Density, Power Map, Thermal Map

17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis

Abstract Deadline and Paper Submission : Authors must submit a 300-word abstract in PDF or MS Word format through the JIEP web site by November 15, 2011. It is recommended to attach one piece of figure, picture or table. Notification of acceptance by the beginning of December, 2011. Final manuscript to be submitted by February 13, 2012.

Best Paper Awards : The JIEP will present the Best Paper Awards to selected outstanding papers.

Young Awards : The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old.

Organizing Committee : General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics)

Technical Program Committee : Chair: Shintaro Yamamichi (Renesas Electronics) Co-Chairs: Masahiro Inoue (Osaka University), Hitoshi Sakamoto (NEC), Shoji Uegaki (ASE Marketing & Service Japan), Hiroshi Yamada (Toshiba)

  Membership News

In Memoriam - Steve Adamson    ^ Top

Steve Adamson

It is with great sadness that we announce that Steve Adamson, IMAPS Foundation Chair, passed away on Friday, October 28 after a courageous fifteen month battle against cancer. We will miss Steve's creativity, intellectual curiosity, friendship and dedication to IMAPS and its Foundation. The industry will miss his active participation and leadership, too.

IMAPS has created the Steve Adamson Memorial Annual Scholarship Fund. We thank the Nordson Foundation for their support and contributions. This fund is open to anyone who wishes to make a contribution to the Foundation in Steve's honor.
Make a Donation

Steve started work with Nordson ASYMTEK in early 1998 as applications lab manager, and most recently was market development manager for the semiconductor packaging and hard disk drive industries. Over his career with Asymtek he made many contributions to our success including his work on the marketing launch of the Axiom and DispenseJet product lines. Steve previously held positions with Kodak, Motorola in the U.S., and Plessey, International Computers Ltd in the U.K. He was awarded five US and two UK patents. Originally from the U.K., he held a Higher National Certificate in Electrical Engineering from Stockport College of Technology. In 2005 he was presented an award by the San Diego Engineering Council for "Outstanding Service to Electrical Engineering".

Steve was very active in IMAPS, serving as President in 2008 and as chairman of the IMAPS Microelectronic Foundation in 2009. This IMAPS Foundation is devoted to helping students and academia participate in IMAPS activities through grants and awards.

In 2010, Steve received the IMAPS President's Award in recognition to his lifelong efforts for the organization. In October, 2011, Steve was awarded the DANIEL C. HUGHES, JR. MEMORIAL AWARD by IMAPS. It is presented to the individual who has made the greatest contribution to IMAPS and the microelectronics packaging industry, including technical and/or service contributions.


LORD Corporation

RGL Enterprises


Crane AE Banner

System Level Packaging
November 10-11
Palo Alto, CA

Webinar: Why Wedge Bond?

Webinar: Elec Test Strategies for HDP
12/1/2011, 12/8/2011, 12/15/11

Webinar: RGA Data & Failures in Micro...
12/6/2011, 12/13/2011

Southeastern Microelectronics Packaging Conference
January 17, 2012
Orlando, FL
*Exhibitors contact

Non-Hermetic Packaging Technology for Reliable Microelectronics
January 18, 2012
Orlando, FL
*Exhibitors contact

RF/Microwave Packaging
February 7-9, 2012
San Diego, CA

3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
February 22-24, 2012
El Paso, TX
*Exhibitors contact

8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
Erfurt, Germany

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact

IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact

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