IMAPS Home | Join/Renew
October 26, 2011
 

Palomar Technologies

   IMAPS EVENTS
Button Webinar Begins Next Week on Rheology Issues In Electronic Packaging (read more...)

Button Early Registration Ends TODAY - Workshop on Thermal Management (read more...)

Button Register TODAY For Early Rates to System Level Packaging Workshop (read more...)

Button Abstracts Still Being Accepted for Southeastern Microelectronics Conference and co-located Non-Hermetic Packaging Event  (read more...)

Button Abstracts Due Soon for ATW on RF/Microwave Packaging (read more...)

Button Abstracts Due THIS FRIDAY for the ATW on 3D and Conformable Printed Electronic Packaging (read more...)

Button Abstracts Due THIS FRIDAY for CICMT 2012 (Germany) (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Arizona Chapter Lunch Meeting on 2.5D & 3D TSV Product Opportunities and Challenges (read more...)

Bullet Chesapeake Chapter Fall Technical Symposium on November 9 (read more...)

Bullet Central Texas Chapter's Design & Manufacturing Tech Forum & Expo on November 10 (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

Webinar Begins Next Week on Rheology Issues In Electronic Packaging    ^ Top

  • Convenient — education brought to YOU at YOUR desktop/phone - no travel, traffic or time away from the office or home.
  • Inexpensive — avoid travel costs, hotel fees and other costs for traditional in-person meetings.
  • Real-time — featuring current and up-to-date information.

Our Professional Development Course (PDC) Webinar Series is a true on-line meeting - a Webinar. Upon registering, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, have direct interaction with the instructor, and also be sent an attendee list following your webinar(s).

PDC Webinar Series on
Rheology Issues in Electronic Packaging
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, November 2, 9, and 16, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on
Why Wedge Bond?
Sponsored and Presented by: Hesse & Knipps
This webinar will be held Thursday, November 10, 2011. Webinar will be held 12:00 noon - 1:00 pm EASTERN

Hesse & Knipps

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, December 1, 8, and 15, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Assessment of RGA Data and Failures in Microelectronic Devices
Presented by: Philipp Schuessler, Schuessler Consulting
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, December 6, and 13, 2011. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Full Webinar details online at www.imaps.org/webcasts

Early Registration Ends TODAY - Workshop on Thermal Management   ^ Top
IMAPS is holding the Advanced Technology Workshop on Thermal Management at Dinah's Garden Hotel in Palo Alto, CA, on November 7-9, 2011. To view the technical program, tabletop exhibit information, and details about the workshop, visit www.imaps.org/thermal. This workshop is co-located with the ATW on System Level Packaging. The extended early registration deadline is TODAY, October 26. Registration fees increase after today, so be sure to register now. 4 Tabletops are still available - contact bschieman@imaps.org if you wish to reserve a tabletop.

Register TODAY For Early Rates to System Level Packaging Workshop   ^ Top
IMAPS is holding the Advanced Technology Workshop on System Level Packaging at Dinah's Garden Hotel in Palo Alto, CA, on November 10-11, 2011. To view the technical program and details about the workshop, visit www.imaps.org/syspack. This workshop is co-located with the ATW on Thermal Management. The extended early registration deadline is TODAY, October 26. Registration fees increase after today, so be sure to register now.

Abstracts Still Being Accepted for Southeastern Microelectronics Conference and co-located Non-Hermetic Packaging Event   ^ Top
IMAPS is happy to announce to new events being in held at the Rosen Centre Hotel in Orlando, Florida on January 17-18, 2012. Abstracts are due immediately for both events.

1st Southeastern Microelectronics Packaging Conference - January 17th
www.imaps.org/southeast

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging.  Topics of interest for submission are online at www.imaps.org/southeast.

Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics - January 18th
www.imaps.org/hermetic

Conference Focus: Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost.  The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations. Topics of interest for submission are online at www.imaps.org/hermetic.

Those wishing to present a paper at either or both of the events listed above must submit a 250-300 word abstract electronically using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than December 14, 2011. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.  All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

Abstracts Due Soon for ATW on RF/Microwave Packaging   ^ Top
IMAPS is holding the Advanced Technology Workshop on RF/Microwave Packaging at The Crowne Plaza Hotel in San Diego, CA, from February 7-9, 2012. To view the call for abstracts, to submit an abstract, or for other details about the workshop, visit www.imaps.org/rf.

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

The 2012 Workshop will feature two exciting keynote speakers:


Dr. Renzhe Zhao
Chief Specialist of Electronics Material, Huawei Technologies
Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Sean Cahill
VP, Technology, BridgeWave Communications, Inc.
He will share how to leverage government programs to develop new packaging technology.

Sessions are being planned and abstracts are being requested in the following areas:

Emerging Technologies

New Design/Materials

New Applications

  • 60 GHz Personal Area Network (PAN)
  • Short wave IR packaging
  • Nanopackaging
  • 3D RF/MW
  • New and disruptive technology
  • EMI shielding for RF/MW packaging
  • Wafer Level Packaging for Microwave and MMwave Applications
  • Packaging Issues for Wide Band Gap Semiconductors
  • SIP
  • New power amplifier design beyond LDMOS
  • Thermal management
  • New Uncooled IR sensors
  • Plastic RF/MW packaging
  • Lead free
  • RF MEMS
  • Military / Space
  • Optoelectronics (night vision, thermal weapon sight, etc.)
  • High Power Electronics
  • Space/Extreme Environments
  • MEMS/NEMS
  • Biomedical
  • Telecommunications
  • Reliability
  • MMIC
  • Automotive
  • High Speed Electronics

Awards will be given in the following categories: Best ATW Paper; Best Session Papers; and Best Student Paper.

Those wishing to present a paper at the RF and Microwave Packaging Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than December 2, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm.

No formal technical paper is required. A reproduction-ready 2-page extended abstract with figures and graphs included, if necessary will be required for the abstract booklet on January 6, 2012.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Abstracts Due THIS FRIDAY for the ATW on 3D and Conformable Printed Electronic Packaging    ^ Top
IMAPS is holding the Advanced Technology Workshop on 3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications at the University of Texas, El Paso (UTEP) in El Paso, Texas, from February 22-24, 2012. To view the call for abstracts, to submit an abstract, or for other details about the workshop, visit www.imaps.org/printed.

The objective of the 3D and Conformable Printed Electronic Packaging Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of printed electronics and additive manufacturing as emerging electronic packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • 3D & Additive Manufacturing
  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices – Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Cyber Design / Direct Digital Manufacturing
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Thin and ultra miniature components
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present at the Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than October 28, 2011. Abstracts can be submitted using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 18, 2012.

Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.

Abstracts Due THIS FRIDAY for CICMT 2012 (Germany)   ^ Top
IMAPS and ACerS are holding the 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012) at the Radisson Blue Hotel in Erfurt, Germany from April 16-19, 2012. To view the call for abstracts, to submit an abstract, or for other details about the Conference, visit www.cicmt.org.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on material, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at 40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety applications continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low loss ceramic materials for frequencies approaching 100 GHz.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote presentations on the current status and future direction of the technologies.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Energy and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• Green Tape Manufacturing
• Multilayer Ceramics
• Laser trimming and deposition
• Advanced Thick Film Processing
• Fine Structuring Technologies
• Rapid Prototyping
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due October 28, 2011
Notice of Acceptance: December 16, 2011
Final Manuscripts Due: February 6, 2012

Please send your 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org or call 1-305-382-8433 (USA).

  Chapter Activities (events listed in chronological order)
 

TOMORROW: Arizona Chapter Lunch Meeting on 2.5D & 3D TSV Product Opportunities and Challenges    ^ Top

Date: TOMORROW: October 27, 2011
Location:

Dobson Ranch Inn

Registration:

Jody Mahaffey e-Reach Communications
Phone: (480) 216-5049
jody@e-reachcomm.com

Ron Huemoeller
Sr. Vice President of Adv. 3DIC at Amkor Technology, will present:

2.5D & 3D TSV Product Opportunities and Challenges

This talk will present both the challenges and opportunities for high density 3DIC Through Silicon Via (TSV) product technologies in the semiconductor industry. The presentation will review some of the assembly challenges with respect to completing the die stacking of these complicated package structures as well as the various assembly options available today.

Chesapeake Chapter Fall Technical Symposium on November 9    ^ Top

Date: November 9, 2011
Location:

Applied Physics Laboratory of Johns Hopkins University
Howard County Room #3
11100 Johns Hopkins Road
Laurel, MD 20723

Registration:

IMAPS Members-$25, non-members-$35, and students with ID-$5.00. Only on-line registration by credit card guarantees a dinner seating. On-line registration ends COB by 12:00 Noon on Monday, November 7. On-site registrations by checks/cash only. A fee of $5.00 will be surcharged for on-site registrations.

Register On-Line

Program:

3:00 Registration and networking

3:30 “Why Wedge Bond.”
Lee Levine, Principal Consultant of Process Solutions Consulting

4:10 Break

4:30 “Electrical Failure of an Accelerator Pedal Position Sensor (Toyota) Caused by a Tin Whisker. Discussion of Investigative Techniques Used for Whisker Detection.”
Dr. Henning Leidecker, Chief Engineer of Electronic Parts, NASA Goddard

5:10 Event wrap-up. Ideas for next event. IMAPS events (March DPC). Other business.

5:20 Industry Dinner (Grilled Honey Teriyaki Chicken Breast - Pene Pasta – Salad)

Brief Presenter Bios:

Lee Levine, Principal Consultant of Process Solutions Consulting
Lee Levine’s experience includes 20 years as Principal and Staff Metallurgical Process Engineer at Kulicke & Soffa and Distinguished Member of the Technical Staff at Agere Systems. Currently he consults for his own company, Process Solutions Consulting, Inc. providing process consulting, yield improvement, SEM, EDS and metallography services. He has been awarded 4 patents and has published more than 70 technical papers. Major innovations include copper ball bonding, loop shapes for thin, small outline packages (TSOP and TSSOP, and CSPs) and introduction of DOE and statistical techniques for understanding assembly processes. Lee is a graduate of Lehigh University, Bethlehem, Pa where he earned a degree in Metallurgy and Materials Engineering.

Dr. Henning Leidecker, Chief Engineer of Electronic Parts, NASA Goddard Space Flight Center
Dr. Leidecker has become well known throughout NASA for his work investigating the causes of accidents and malfunctions and, where possible, preventing them. As a result of his many contributions, he has been awarded the following medals: NASA Medal for Exceptional Service in recognition of his dedication, expertise, and significant accomplishments contributing to the continued reliability and safety of NASA's space mission: NASA Medal for Outstanding Leadership for dedication, expertise, and fundamental accomplishments in the field of reliability engineering which have contributed to the success of the NASA mission; NASA Medal for Exceptional Engineering Achievement for outstanding engineering analysis of FPGA issues for the Swift Project. n

Central Texas Chapter's Design & Manufacturing Tech Forum & Expo on November 10    ^ Top

Date: November 10, 2011
Location:

Norris Conference Center at Northcross Mall (backside)
2525 West Anderson Lane
Austin, Texas

Registration:

This event is complimentary for IMAPS members and non-members.
Click here to register before COB November 7

Program:

10:30-5:00 Exposition Floor Open

11:00 "Lithium-Ion Batteries and Electric Vehicles."
Joel Sandahl, President and CEO of ZX Technologies

12:00 Complimentary Lunch and Door Prize Drawings

1:00 "Reliability & Metallurgy of ENEPIG Board Finish and Tin-Lead Solder Joints."
Mike Wolverton, Professional Engineer at Raytheon Space & Airborne Systems

2:15 "The iNEMI Roadmap and Research Plan - The Good, The Bad and The Ugly! "
Alan Rae, iNEMI Research Director and Managing Member of TPF Enterprises LLC

3:00 Refreshments, Networking, and More Door Prize Drawings

3:30 "Using Automated Solder Paste Inspection to Improve Print Yields."
Chrys Shea, President of Shea Engineering Services

5:00 Final Door Prize Drawings

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012
Location:

MERCURE OCEANIDE VIEUX PORT SUD
LA ROCHELLE

Details:

www.imapsfrance.org

We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2012 edition and be sure to submit your abstract on time.

The workshop sessions will include the following topics and papers are invited in these areas:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers should submit a 200-300 words abstract accurately/precisely describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions), not later than 4 November, 2011.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: 25 November, 2011.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail: imaps.france@imapsfrance.org, by fax : +33 (0) 1 39 02 71 93

 


   
   

LORD Corporation

EPP

Crane AE Banner

Valtronic

Webinar: Rheology Issues...
11/2/2011, 11/9/2011, 11/16/11

Thermal Management
November 7-9
Palo Alto, CA
*Exhibitors contact modonoghue@imaps.org

System Level Packaging
November 10-11
Palo Alto, CA

Webinar: Why Wedge Bond?
11/10/2011

Webinar: Elec Test Strategies for HDP
12/1/2011, 12/8/2011, 12/15/11
Webinar: RGA Data & Failures in Micro...
12/6/2011, 12/13/2011

Southeastern Microelectronics Packaging Conference
January 17, 2012
Orlando, FL
*Exhibitors contact modonoghue@imaps.org

Non-Hermetic Packaging Technology for Reliable Microelectronics
January 18, 2012
Orlando, FL
*Exhibitors contact modonoghue@imaps.org

RF/Microwave Packaging
February 7-9, 2012
San Diego, CA

3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
February 22-24, 2012
El Paso, TX
*Exhibitors contact modonoghue@imaps.org

8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact modonoghue@imaps.org

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
Erfurt, Germany

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact modonoghue@imaps.org

^ Top

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 

View the Electronic Bulletin Archives