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September 22, 2011
 

Palomar Technologies

   IMAPS EVENTS
Button IMAPS 2011, Long Beach - Register Today: Avoid The Lines In Long Beach (read more...)

Button IMAPS 2011's 21 Professional Development Courses (PDCs) Are Filling Up (read more...)

Button Have a Little Fun at IMAPS 2011 - Join Us for the 17th Annual IMAPS Golf Classic to benefit The Microelectronics Foundation (read more...)

Button Join us for the IMAPS 2011 Ca-Si-No Night to Benefit the Microelectronics Foundation -- Space Is Limited (read more...)

Button Abstracts Due This Friday, September 23 for Southeastern Microelectronics Conference and co-located Non-Hermetic Packaging Event (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT WEEK: San Diego Chapter September 27 Lunch Meeting on Thick Film Technology in Automotive LED Applications (read more...)

Bullet NEXT WEEK: New England Chapter September 27 Dinner Meeting onElectronics, Solar Energy, and New Technologies (read more...)

Bullet Northern California Chapter October 5 Lunch Meeting with Talk on NEXT-GENERATION 3D IC PACKAGING: AVAILABLE SOON AT AN OSAT NEAR YOU (read more...)

Bullet IMAPS Taiwan Chapter's IMPACT (read more...)

Bullet UK Chapter Announces November 30-December 1 "iPower" Event (read more...)

Bullet France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)
 

IMAPS 2011, Long Beach - Register Today: Avoid The Lines In Long Beach    ^ Top
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 will feature technical tracks on 3D Packaging; Modeling, Design & Reliability; Next Generation Materials; Assembly & Packaging; Advanced Technologies; and a Focus Track on Advanced Packaging & System-Integration. 28 technical sessions are planned this year including sessions on: 3D-TSV Processes & Materials; 3D TSV Interposers; 3D Packaging/Applications; Signal & Power Integrity; Package Reliability; Microwave/RF; Advanced Materials; Ceramic & LTCC; Thermal Management; Wire Bonding; Printed Electronics; Substrate Materials for Semicon/Solar; MEMS Packaging; and many more. The 2011 symposium offers you 22 professional development courses, a GBC Marketing Forum on "Tomorrow's Supply Chain: Overcoming Environmental & Societal Challenges", and two keynote presentations. A truly International Symposium, IMAPS 2011 will also offer: 2 new sessions on European Perspectives on Packaging/Integration; a new Chinese-to-English Translated Session on "Advanced Packaging in China"; and the return of the always popular Japanese-to-English Translated session on "Improvements in Advanced Packaging from Japan."

...and that's only the technical side of the Symposium! There are also a lot of other exciting activites planned for you -- the 17th Annual Golf Classic, the Welcome Reception and opening ceremonies, a Foundation Ca-Si-No Night, to name only a few.

Register On-Line | Reserve Booth(s) | Hotel & Transportation
Technical Program | Professional Development Courses (PDCs) | Exhibition Information

IMAPS 2011's 21 Professional Development Courses (PDCs) Are Filling Up    ^ Top
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). IMAPS 2011 will feature 22 professional development courses. Details below or on-line at www.imaps2011.org.

Register On-Line
PDCs under SESSIONS
during IMAPS 2011 Registrations

Sunday, October 9, 2011
All Sunday PDCs are ½ Day Course: 1:00 pm - 5:00 pm

S1: Design and Analysis of Experiments
Course Leader: Dr. Jianbiao (John) Pan, California Polytechnic State University

S3: MEMS Reliability and Packaging
Course Leader: Dr. Slobodan Petrovic, Oregon Institute of Technology

S4: Microwave Hybrid Design for Manufacturability (DFM)
Course Leader: Thomas J. Green, TJ Green Associates LLC

S5: Understanding Failure and Root-Cause Analysis in Pb-Free Electronics
Course Leader: Greg Caswell, DfR Solutions

S6: Mechanical Analysis & Design for Microelectronics Packages
Course Leader: Dr. Amaneh Tasooji, Arizona State University

S7: Polymeric Packaging Requirements for Solar Modules
Course Leader: Michelle Poliskie, Consultant

S8: Technology Advances in 3D-TSV Integration and Packaging
Course Leader: Dr. James Jian-Qiang Lu, Rensselaer Polytechnic Institute

S9: Counterfeit Electronics - Risks and Mitigation
Course Leader: Bhanu Sood, University of Maryland

Monday, October 10, 2011
Monday PDCs run 9:00 am - 5:00 pm, unless otherwise noted

M1: Advanced Packaging Technologies: Multichip, 3-D, Chip Scale & Embedded Chip
Course Leader: Ray Fillion, Fillion Consulting

M2: Polymers in Electronic Packaging
Course Leader: Dr. Jeff Gotro, InnoCentrix, LLC

M3: Hermeticity Testing, RGA and “Near Hermetic” Packaging Concepts
Course Leader: Thomas J. Green, TJ Green Associates LLC

M4: Technology of Screen Printing
Course Leaders: Arthur Dobie, Sefar, Inc.; David Malanga, Heraeus Materials Technology LLC - Thick Film Materials Division

M5: Microelectronics Packaging Industry Updates and Trends
Course Leader: Phillip G. Creter, Creter & Associates

M6: TSV and Key Enabling Technologies for 3D IC/Si Integration and WLP
Course Leader: Dr. John H. Lau, ITRI

M7: Plating Processes for High Reliability Microelectronic Devices
Course Leader: Fred Mueller, CEF, General Magnaplate Corp.

M8: Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
Course Leaders: Dr. Ivan Ndip, Fraunhofer IZM; Professor Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, Computer Simulation Technology (CST) of America

M9: Wire Bonding in Microelectronics
Course Leader: Lee Levine, Process Solutions Consulting, LLC

M10: Basics of Microelectronic Packaging
Course Leader: Casey Krawiec, Quik-Pak

M11: RF/Microwave Hybrids; Basics, Materials and Processes
Course Leader: Richard Brown, Richard Brown Associates, Inc.

M12: An Electronics Expert Reliability Analysis Tool
Course Leader: Greg Caswell, DfR Solutions

½ Day Course: 8:00 am - Noon

M13: Area Array Microelectronics Package Reliability
Course Leader: Dr. Amaneh Tasooji, Arizona State University

½ Day Course: 1:00 pm - 5:00 pm

Have a Little Fun at IMAPS 2011 - Join Us for the 17th Annual IMAPS Golf Classic to benefit The Microelectronics Foundation    ^ Top
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). Details at www.imaps2011.org.

The 17th Annual IMAPS Golf Classic to benefit The Microelectronics Foundation will be held Monday, October 10, 2011. This year's outing is a 7:30am Shotgun Start - "Best Ball" Scramble at the Skylinks Country Club - www.skylinks.americangolf.com. It is a championship 18 hole links-style course with rolling bermuda fairways. With over 70 sand bunkers added to the golf course in 2004, Skylinks at Long Beach is now the total package for golfers of any level who are looking for a superior golfing experience.

Cost is $125 per person. $450 for a team of four; $750 for a team of four including a hole sponsorship. $400 for one individual golfer and 1 hole sponsorship. The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, and a breakfast/lunch. A bus will pick up all golfers around 6:30am at the Westin next to the convention center. Golfers will tee off shortly after arriving at the course. Times are tentative and will be confirmed before the outing.

Register On-Line
Golf fees and hole sponsorships under SESSIONS
during IMAPS 2011 Registrations

Join us for the IMAPS 2011 Ca-Si-No Night to Benefit the Microelectronics Foundation -- Space Is Limited    ^ Top
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California, USA, and is being organized by the International Microelectronics And Packaging Society (IMAPS). Details at www.imaps2011.org.

Join us for a little fun, all for a good cause - Ca-Si-No Night at IMAPS 2011 to benefit the Microelectronics Foundation. The Ca-Si-No night will be held Tuesday, October 11, 2011, from 7:30 pm - 10:30 pm at the Westin Hotel, Salon A.

Events will include: Black Jack, Poker, Craps, and Roulette. We will also hold and Silent Auction. Refreshments will be available (No Host Bar).

Tickets $50
Limited to 70 Players

Register On-Line
Casino Night Tickets under SESSIONS
during IMAPS 2011 Registrations

Abstracts Due This Friday, September 23 for Southeastern Microelectronics Conference and co-located Non-Hermetic Packaging Event   ^ Top
IMAPS is happy to announce to new events being in held at the Rosen Centre Hotel in Orlando, Florida on January 17-18, 2012. Abstracts are due for both events on September 23, 2011.

1st Southeastern Microelectronics Packaging Conference - January 17th
www.imaps.org/southeast

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging. Topics of interest for submission are online at www.imaps.org/southeast.

Advanced Technology Conference and Tabletop Exhibits on
Non-Hermetic Packaging Technology for Reliable Microelectronics - January 18th
www.imaps.org/hermetic

Conference Focus: Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost. The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations. Topics of interest for submission are online at www.imaps.org/hermetic.

Those wishing to present a paper at either or both of the events listed above must submit a 250-300 word abstract electronically no later than September 23, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than December 14, 2011. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.  All Speakers are required to pay a reduced registration fee and are required to attend the entire event.

  Chapter Activities (events listed in chronological order)
 

NEXT WEEK: San Diego Chapter September 27 Lunch Meeting on Thick Film Technology in Automotive LED Applications    ^ Top

Date: September 27, 2011
Location:

Ferro Corporation
1395 Aspen Way
Vista, CA 92081
Facility phone: 760-305-1000

Registration:

$20.00 for RSVPed IMAPS members. $25.00 for all else. Complimentary for students with ID. To register, please contact Dave Virissimo of Semiconductor Packaging Materials by September 23 at dvirissimo@sempck.com or 619-464-5430

Please join us for a technical presentation and industry lunch. "Thick Film Technology in Automotive LED Applications" by Orville Brown, Senior Research Scientist at Ferro Corporation.

Light Emitting Diodes, (LEDs) are playing an increasing role in automotive applications. Proper selection of dielectric and conductor materials can assure a reliable and efficient lighting application is realized. This talk will provide information on the selection, testing, and design of LED systems incorporated into new BMW vehicles.

Orville Brown is a Senior Research Scientist at Ferro Corp in Vista, CA. Orville holds several patents in the hybrid microelectronic field and has presented and co-authored many articles and papers throughout his 27 years in this field. He holds a B.S. from Hunter College of the City University of NY and a M.S. from Columbia University. Orville’s primary job function is to develop paste for the electronic component markets.

Logistics: Tuesday, September 27th, at 12:00 PM - Lunch starts.

NEXT WEEK: New England Chapter September 27 Dinner Meeting onElectronics, Solar Energy, and New Technologies    ^ Top

Date: September 27, 2011
Location:

Courtyard By Marriott Marlborough
75 Felton Street
Marlborough, MA

Registration:

There's no charge for the Technical Meeting, only for dinner. You may attend without reserving for dinner. Non-Member $30, Member $25, Retired/Unemployed Member $20, Student $10

After September 22, you must register at-door. At-door registration is an additional $5.00 If you fail to cancel by noon on Friday, Sept. 23, The Chapter will bill you for the registration fee.

Jennifer Bailey at bailey_jj@yahoo.com or call 781-696-9369

Electronics, Solar Energy, and New Technologies
Alan Rae, Managing Member - TPF Enterprises LLC

Alternative energy, in particular solar PV, is a major growth area for materials companies, equipment suppliers, and EMS providers. Despite recent painful bankruptcy filings by prominent solar PV companies, there is solid growth and strong government investment to develop the next generation thin-film cells under the SunShot and other programs. This presentation looks at the growth of this industry segment, some of the gaps & show-stoppers identified in the iNEMI roadmap, and new technologies that are quietly enabling many new developments.

SCHEDULE: (times approximate):
5:30 Registration, Socializing, Networking & Cash Bar
6:30 Dinner
7:15 Presentation

Northern California Chapter October 5 Lunch Meeting with Talk on NEXT-GENERATION 3D IC PACKAGING: AVAILABLE SOON AT AN OSAT NEAR YOU    ^ Top

Date: October 5, 2011
Location:

David's Restaurant, Banquet & Conference Facilities
5151 Stars and Stripes Drive
Santa Clara, CA 95054

Registration:

Please respond to Roger Underwood, IMAPS NorCal Chapter Treasurer, at runderwood@cctlaser.com to make your lunch reservations.

The speaker is Dr. Raj Pendse, Vice President and Chief Marketing Officer, STATSChipPAC, Inc. His presentation on "NEXT-GENERATION 3D IC PACKAGING: AVAILABLE SOON AT AN OSAT NEAR YOU" will be addressing the state of the technology in 2.5D and 3D packaging and the transformed role of the OSAT industry. He will also be addressing the evolution of the infrastructure, the latest developments in the key building blocks of 3D TSV, and the future outlook and evolution path for the technology and associated package architectures.

This will be another very informative, engaging and thought-provoking talk, in keeping with the tradition of IMAPS. The presentation will be of great interest to all microelectronics and optoelectronics assembly and interconnect professionals.

Dr. Pendse holds a Ph.D. in materials science, is the Vice President and Chief Marketing Officer at STATS ChipPAC, and his professional life has spanned various aspects of packaging, including high-end microprocessors, and ASIC and graphics products. His current focus is on Flip Chip and 3D Wafer Level Packaging.

IMAPS Taiwan Chapter's IMPACT    ^ Top
The 6th International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT 2011) is organized by IEEE-CPMT, ITRI, i-MAPS- Taiwan, ISU, SIPO ,TPCA and co-organizers are SMTA ,TTMA, iNEMI and ICEP which will take place in NTUH International Convention Center during October 19 to 21, 2011. Besides, ICEP and iNEMI are the first time to join IMPACT and we believe IMPACT 2011 will become more splendid after their support. This great annual international event - IMPACT will extend the opportunity to bring researchers, engineers and experts engaged in such a distinguished gathering and show the strength of Taiwan and update worldwide tendencies.

IMPACT 2011 as the sixth conference and the theme is "IMPACT-Leading Innovation" which reflects the age of technology resolution. The appearance of smart phones and touch panels declare the innovation time and we highly welcome outstanding papers from all over the world to respond the theme and compete with elites overseas on the international stage. IMPACT is striving to work out the advanced paper scope and reward policy to attract extraordinary papers all around the world. IMPACT has just closed the call for papers. More information about IMPACT 2010, please refer to the conference website, www.impact.org.tw , or contact with secretariat, MS. Sophia Huang (+886 3 3815659 Ext 404).

IMPACT-Leading Innovation
Date: October 19 (Wed) - October 21 (Fri), 2011
Venue: NTUH International Convention Center, Taipei, Taiwan
Conference: The 6th IMPACT Conference

About Paper Submission
Important Date


Item

Date

Abstract Submission

June 10, 2011

Abstract Acceptance Notification

July 15, 2011

Full Paper Submission
(Camera-ready Version)

August 15, 2011

Presentation Material Submission(Oral Presentation)

October 1, 2011

Secretariat
Taiwan Printed Circuit Association (TPCA)
Tel: +886 3 381 5659 #404 - Sophia
Fax: +886 3 381 5150
E-Mail: service@impact.org.tw

UK Chapter Announces November 30-December 1 "iPower" Event    ^ Top
The IMAPS UK Chapter has announced a call for papers and abstracts for their forthcoming "iPower" event which is intended to 'Showcase UK Power Electronics. The event will be held on 30 November & 1 December 2011 at the University of Warwicks prestigious IDL Conference Centre.

"iPower", being held in conjunction with the Universitys Electronics, Power and Microsystems Research Group, will bring together leading experts in the field of power electronics from Science, Academia, Supply and Industry, providing a unique insight into the fields latest developments and technologies.

The two day event and accompanying exhibition will offer delegates the chance to discover technical information on a wide range of topics, including: Applications, Trends & Emerging Markets, Packaging, Test and Reliability, Assembly Materials & Technologies, Integrated Processes (micro-machining, micro-moulding), Thermal Management & Efficiency, Product Design Development & Modeling, Interconnection Integration & Systems, Solutions For Harsh Environments, High Reliability & Temperature, Novel Designs & Future Concepts.

Researchers and innovators in industry, supply and academia who would like to take part and consider that they can offer original and exciting technical presentations or poster displays on any of the topics listed above, should contact the Society with their abstract or proposal.

Further information on the two day Seminar can be found on the Societys website www.imaps.org.uk or by emailing the events organising committee events@imaps.org.uk.

France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012
Location:

MERCURE OCEANIDE VIEUX PORT SUD
LA ROCHELLE

Details:

www.imapsfrance.org

We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees. Be part of a successful 2012 edition and be sure to submit your abstract on time.

The workshop sessions will include the following topics and papers are invited in these areas:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers should submit a 200-300 words abstract accurately/precisely describing their proposed 25 minutes presentation (20 minutes + 5 minutes for questions), not later than 4 November, 2011.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

Notification of acceptance to the authors by the Technical Committee: 25 November, 2011.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail: imaps.france@imapsfrance.org, by fax : +33 (0) 1 39 02 71 93

 


   
   

LORD Corporation

EPP

Crane AE Banner

Valtronic

IMAPS 2011 - Long Beach
October 9-13
Long Beach, CA
*Exhibitors contact modonoghue@imaps.org

Thermal Management
November 7-9
Palo Alto, CA
*Exhibitors contact modonoghue@imaps.org

System Level Packaging
November 10-11
Palo Alto, CA

Southeastern Microelectronics Packaging Conference
January 17, 2012
Orlando, FL
*Exhibitors contact modonoghue@imaps.org

Non-Hermetic Packaging Technology for Reliable Microelectronics
January 18, 2012
Orlando, FL
*Exhibitors contact modonoghue@imaps.org

RF/Microwave Packaging
February 7-9, 2012
San Diego, CA

3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
February 22-24, 2012
El Paso, TX
*Exhibitors contact modonoghue@imaps.org

8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact modonoghue@imaps.org

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact modonoghue@imaps.org

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