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April 4, 2012

Palomar Technologies

Button HiTEC 2012 - Booths/Sponsorship SOLD OUT - Registration/Hotel Deadline April 23 (read more...)

Button CICMT 2012 Begins in 2 Weeks in Germany (read more...)

Button Upcoming Webinars - Rheology Issues TOMORROW; Elect. Test Strategies NEXT WEEK (read more...)

Button Announcing the 1st Workshop on Packaging The Next Generation of Nano Devices - Abstracts Due May 1 (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: Metro Chapter Vendor Day (read more...)

Bullet NEXT WEEK: Chicago/Milwaukee Chapter Lunch Meeting at Connor-Winfield (read more...)

Bullet ICEP-IAAC 2012 Being Held in Tokyo (read more...)

Bullet IMAPS France MiNaPAD Forum April 24-26 (read more...)

Bullet New England Chapter's 39th Symposium & Expo - Program On-Line, Register Today! (read more...)

Bullet UK Chapter MicroTalk - Nihal Sinnadurai (read more...)

TJ Green Associates, LLC

Master Bond
  IMAPS Events (view full Web Calendar)

HiTEC 2012 - Booths/Sponsorship SOLD OUT - Registration/Hotel Deadline April 23   ^ Top
IMAPS International Conference on High Temperature Electronics (HiTEC 2012) begins in a few weeks. The Conference will be held in Albuquerque, New Mexico, on May 8-10, 2012. The early registration and hotel deadlines are April 23. Registration fees increase after this date and IMAPS cannot guarantee hotel room availability or pricing after the 23rd. To view the technical program, exhibit information, to register, or for other details about the Conference, visit

The members of the Conference Committee are pleased to invite you to the IMAPS High Temperature Electronics Conference (HiTEC 2012). This is the premier event addressing the needs of the high temperature (>150C) electronics community. Applications for high temperature electronics include smart energy, underhood automotive, oil well logging, geothermal, more electric aircraft, space, industrial sensors, etc. HiTEC 2012 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to meet the challenges of these applications. Tabletop exhibits will compliment the technical program by providing you an opportunity to view the latest products for high temperature electronics. Luncheons and breaks provide you the opportunity to network and establish valuable contacts in the high temperature electronic community. This is a truly unique opportunity for suppliers, fabricators, and users to meet and talk about the needs, issues and opportunities in this exciting and important technology.

Please join us in Albuquerque, New Mexico for HiTEC 2012.

General Co-Chairs:
Wayne Johnson, Auburn University
Colin Johnston, Oxford Applied Technology – UK

Register On-Line | Registration Fees
Technical Program | Tabletop Exhibit Information

CICMT 2012 Begins in 2 Weeks in Germany   ^ Top
The IMAPS/ACerS 8th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012) will be held April 16-19, at the Radisson Blu Hotel in Erfurt, Germany. To view the program, exhibits information, and register, visit

Message from the General Co-Chairs...
After two successful meetings abroad held in Munich and Tokyo, it was decided to take the International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) back to Germany. This year the CICMT will be held in the capital of the state Thuringia which is also called the Green Heart of Germany. Thuringia itself has a long history in the glass and ceramic industry including the production of electro ceramics dating back to the late 19th century.

The conference is organized under the joint sponsorship of the International Microelectronics And Packaging Society (IMAPS),The American Ceramic Society (ACerS), IMAPS Deutschland, the Institute of Micro- and Nanotechnologies MacroNano® of Ilmenau University of Technology, the Deutsche Keramische Gesellschaft (DKG) and Mikro-Nano-Thüringen e.V. This year’s CICMT runs in conjunction with the 3rd International MacroNano-Colloquium sponsored by the Thuringian Ministry of Education, Science and Culture. The colloquium program fills the last half day with an emphasis on functional materials and high frequency characterization.

We thank our session chairs, who were very active and successful in recruiting speakers from all over the world. Thanks to their commitment we have three days filled with more than 120 papers and posters.

In addition we’d like to thank the technical co-chairs, Marija Kosec (Jozef Stefan Institute), Soshu Kirihara (Osaka University) and Alexander Michaelis (Fraunhofer IKTS), the IMAPS staff, the conference management team of Ilmenau University of Technology and the CICMT local committee: Andreas Roosen (University of Erlangen-Nuremberg), Heinz Osterwinter (HS Esslingen), Jörg Töpfer (FHS Jena),Torsten Rabe (BAM Berlin), Sebastian Brunner (EPCOS), Thomas Bartnitzek (Micro-Hybrid Electronic GmbH), and Rubén Perrone (MSE GmbH) for their support and leadership in putting this program together.

This year's keynote speakers will focus on the electro-ceramic traditions in Thuringia and the perspective of electro-ceramics in Japan and Europe.

Do not miss THE Ceramic Interconnect and Ceramic Microsystems Technologies event in Erfurt, April16 - 19, 2012.

Jens Müller, Technical University Ilmenau and Rich Eitel, University of Kentucky

Upcoming Webinars - Rheology Issues TOMORROW; Elect. Test Strategies NEXT WEEK    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on
Rheology Issues in Electronic Packaging

Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, April 5, 12 and 19, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, April 10, 17 and 24, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Microelectronics Packaging Industry Update
Presented by: Phillip Creter, Creter and Associate
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesdays, April 18 and 25, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on High-Reliability Component Attachment Process for <5µm Placement Accuracy
The corporate webinar will be held Tuesday, May 15, 2012, from 12:00 noon - 1:00 pm EASTERN.
The webinar is Sponsored and Presented by: Palomar Technologies, Inc.


PDC Webinar Series on
Introduction to Microelectronics Packaging Technology
Presented by: Phillip Creter, Creter and Associate
This two-session on-line Professional Development Course (PDC) webinar will be held Wednesday, May 16, and Thursday, May 17, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Announcing the 1st Workshop on Packaging The Next Generation of Nano Devices - Abstracts Due May 1    ^ Top
IMAPS is pleased to announced the first Advanced Technology Workshop and Tabletop Exhibits on Packaging the Next Generation of Nano Devices which will be held June 14-15, at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York 12203. Workshop details and abstract submission can be found online at Abstracts are due: May 1, 2012.

Workshop Focus:
The International Microelectronics And Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held June 14th and June 15th, in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

Abstracts being requested include the following topics:

  • Wafer thickness, TTV, bow, and warp metrology
  • High-aspect ratio TSV diameter, depth and profile measurements
  • Cu void detection in TSV’s
  • Wafer bond quality - void detection
  • Scanning Acoustic Microscopy
  • X-ray tomography and imaging
  • Via stress measurements
  • Infrared microscopy
  • Bonded wafer pair overlay metrology
  • Detecting defects at bonded wafer pair interfaces
  • TSV interconnect, defects, processing
  • Wafer edge defects
  • Confocal microscopy techniques
  • Bonder force uniformity measurement
  • Post bond strength measurements
  • Electrical test
  • 3D interconnect reliability
  • Optical microscopy
  • Infratometry
  • Die package metrology – voids in underfill, delamination, bonding connectivity
  • Bump coplanarity
  • FIB and plasma FIB; wafer contamination
  • 3D packaging advances
  • Novel packaging techniques
  • Advance materials
  • Novel metrology techniques

Those wishing to make a presentation at the Workshop, please submit a 250-300 word abstract electronically by May 1, 2012, using the on-line submittal form at: If you need assistance with the on-line submission form, please email Brian Schieman ( or call 202-548-8715.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

No formal technical paper is required.  A post-conference CD containing the full presentation material as supplied by authors will be distributed to all attendees. All speakers are required to pay a reduced registration fee.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award.


  Chapter Activities (events listed in chronological order)

TOMORROW: Metro Chapter Vendor Day    ^ Top

Date: April 5, 2012

Holiday Inn
Ronkonkoma, New York
Hotel Phone Number (631) 585-9500


$450.00 (reservation must be received with payment by 3/15/2012 ) $500.00 after 3/15/2010
$100.00 Discount if you have exhibited at a Metro chapter event in the past 2 years and you register by 3/15/2012.

Please make/mail check payable to: Metro IMAPS
                                                                   10 Northview Trail
                                                                    Ridge, NY 11961


Attendee Schedule:                                               Vendor Schedule
7:00am-8:00am-Attendee Registration      1:00pm- Vendor registration/setup
8:00am-5pm-PDC #1 cancelled               3:00pm- Exhibit opens
1:00pm-5pm-PDC                                 6:00pm-Hospitality hour
4:30pm-Technical presentation                          8:00pm-Exhibits close
5:30pm-Technical presentation

      Vendor Information
     Walter Becker                                                         Steve Lehnert
     WJB Sales, Inc                                                         Space Systems Loral
     631 331 0689                                                         650 644 5218                               

Space is limited so register early to guarantee your spot

METRO IMAPS is also pleased to offer the following full day
 Professional Development Course Free Of Charge

April 5, 2012
Holiday Inn Ronkonkoma
Counterfeit Component Detection & Prevention
Course Leader: Donald V. Trenholm
Custom Analytical Services

At this point in time it is generally recognized as the single biggest problem in the Microelectronic Industry, These fraudulent components (millions of them) are finding their way into all facets of the Microelectronic industry including the Medical and Aerospace/Military. 

 The purpose of this course is to give the attendees tools that will help aid them in recognizing what a fraudulent device looks like.  The vast majority of the components that make up this fraudulent Counterfeit problem are refurbished components.  They have a number of distinct characteristics that give them away, there are many tips and we will show a number of slides from real cases, as well, as units showing the alterations.  We will also show you a number of tools you can use for determining the difference between false and real. The art of refurbishing these reclaimed devices has risen to astonishing capability.    What are the primary sources.?? As most of us know, several years back the world began to ship their excess and scrapped populated PCB to China and other Asian countries to be disposed of. We believe this session will better enable you to have an improved ability to find these fraudulent devices at incoming inspection..

Instructor Bio: Donald V. Trenholm,  CEO of Custom Analytical Services Inc, an analytical laboratory engaged in performing Surface Analysis, Material Analysis, Failure Mode Analysis (FMA),  Destructive Physical Analysis (DPA) of microelectronic components, printed circuits boards, component device packaging and related materials. 
Dons background has been primarily semiconductors starting with a part time job with Transitron in 1965 while studying at Northeastern University.  He moved onto Fairchild Semiconductor in 1968 where he spent the next 14 years.  From there he moved onto national Semiconductor, General Instruments and various other organizations until he opened his current company in 1991

Course fees: $0 - complimentary
Includes Continental Breakfast and Lunch. Also included is admission to the METRO Chapter Vendor Night and Cocktail Reception immediately following
Group discounts are available
Contact Steve Lehnert Phone (650) 644-5218
Email to register

Time: 1:00 PM-4:00 PM
Registration and Continental Breakfast start at 7:30 AM

NEXT WEEK: Chicago/Milwaukee Chapter Lunch Meeting at Connor-Winfield    ^ Top

Date: April 10, 2012

Connor-Winfield Corp.
2359 Diehl Road, Aurora, IL 60502
Phone: (630) 851-4722
Click Here For Map and Directions


IMAPS Members - $20
Non-members - $25
Students with IDs & Displaced Members $5
Register On-Line


11:30    Registration and Networking

12:00   Lunch and Chapter Announcements

12:45   “New Improvements in Thermal Management: Thick Print Copper Thick Film as a Replacement for                
                    Direct Bond Copper.”
Sarah Groman,  Technical Service Engineer at Heraeus Materials Technology LLC

1:15     “Advanced Ceramic Film Capacitors.”
Beihai Ma, Materials Scientist at Argonne National Laboratory
1:45     Refreshments Break

2:00    “Printed Electronics - The Future.”
Dan Gamota, President of Printovate Technologies

2:30  “Soldering Materials for Next Generation Fine Pitch (0.4mm) On-Board Stack PoP Assembly with
                Through Mold Vias in Air Flow.”
Rafael Padilla, Jr., National Sales Representative at Senju Comtek Corporation

3:00   “Leadless Device Rework and Prototyping Placement Technique.”
                        Bob Wettermann, President of BEST

3:30    Tour of Connor-Winfield.
                       Rich Epich, Sales Manager at Connor-Winfield

4:00    Conclusion

For additional chapter information contact: Ken Burke (847) 345-0224 or

ICEP-IAAC 2012 Being Held in Tokyo    ^ Top

Date: April 17-20, 2012

Tokyo Big Sight, Tokyo, Japan


Sessions and Keywords:

1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package

2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring

3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA

4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics

5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes

6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining

7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications

9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System

10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS

11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications

12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors

13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas

14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness

15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design

16. Metrology Current Density, Power Map, Thermal Map

17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis

Best Paper Awards : The JIEP will present the Best Paper Awards to selected outstanding papers.

Young Awards : The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old.

Organizing Committee : General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics)

Technical Program Committee : Chair: Shintaro Yamamichi (Renesas Electronics) Co-Chairs: Masahiro Inoue (Osaka University), Hitoshi Sakamoto (NEC), Shoji Uegaki (ASE Marketing & Service Japan), Hiroshi Yamada (Toshiba)

IMAPS France MiNaPAD Forum April 24-26    ^ Top

Date: April 24-26, 2012

3 Parvis Louis Neel
Grenoble, France


The 2nd annual IMAPS France MiNaPAD Forum will be held on April 24-26 at the Minatec campus in Grenoble, France. Information about the conference agenda, tutorials and registration is available here:

In conjunction with the MiNaPAD Forum, Semi will hold a workshop on the subject of "Beyond 300mm". Please refer to the website for the program.

New England Chapter's 39th Symposium & Expo - Program On-Line, Register Today!    ^ Top

IMAPS New England – 39th Symposium & Expo
The Largest Regional Symposium Dedicated to
Microelectronics and Electronics Packaging

May 8, 2012
Holiday Inn – Boxborough Woods Conference Center, Boxborough, Massachusetts

2012 Technical Program At A Glance (last update 9-March-2012):

Session A: Surface Mount Technology - Session Chairs: Leo Lambert - EPTAC, and Tom Healy

"Void Free Soldering in Vapor Phase Reflow", John Bashe, Rehm Thermal Systems LLC

"Overcoming the Challenges of the QFN Package", Karl Seelig and Tim O'Neil, AIM Cranston, RI

"The Power & Performance of Smart Heat Technology: Performance Verification", Mike Connolly, REStronics NE

"Stencil Technology and the Role of Nanocoating", Rob Tyrell

"Evaluation of Stencil Materials, Manufacturing Processes and Coatings", Chrys Shea, Shea Engineering Services

"RoHS Recast", Kenneth Stanvick, DCA

Session B: Packaging A - Session Chairs: Jim McLenaghan - Creyr Innovation, and Bill Boyce - Sensata

"Critical Plating Configuration for Reliable Aluminum-to-Gold Wire Bonds", Richard Share, Share Consulting, LLC

"Satisfying Advanced Plating Requirements through Collaboration and Process Improvement", Manny Medeiros, Ametek Electronic Packaging

"Aluminum Inlay Lead-frame Design Considerations for Large Diameter Wire and Power-Clad Ribbon Bonding", Mike McKeown and Barry Njoes, Materion - Technical Materials

"A Comparison of Eutectic AuSn Alloy Delivery Options and Assembly Processes for LED Die-Attachment", Amanda Hartnett, Seth Homer, Indium Corporation, Utica, NY USA, Don Beck, and Daniel Evans, Jr., Palomar Technologies, Carlsbad, CA

"Flux Free Die Attach Utilizing Pressure Variation to Achieve Void Free Results", Bruce Wilson, SST International

"Moisture Sensing in Microelectronic Packages", Tom Green, TJ Green Associates LLC

Session C: Thermal/Power Management - Session Chair: David Saums - DS&A LLC , and Don Lockard

"Thermal Challenges for Wind Turbines", Peter Hansen, Vestas North America, and D. Saums, DS&A LLC

"Thermal Bottleneck LED Testing", Alexandra Francois-Saint-Cyr, and Jimmy He, Mentor Graphics Fremont CA USA

"Low Temperature Direct Aluminum Soldering Paste", William Avery, Superior Flux and Mfg. Co. Chicago IL USA

"TIM Reliability", Radesh Jewram, The Bergquist Company Chanhassen MN USA

"Metallic TIM Application for GaN RF", Amanda Hartnett, Indium Corporation, Dick Frey, Microsemi Bend, OR USA

Session D: TBD - Session Chair: John Roman - CTTEI

"High Power Semiconductor Fiber Laser Module Evolution", Ta-Jen Hou Worcester Polytechnic Institute IPG Photonics Corp.

"LCP & PTFE Substrate Technologies for RF Applications", Glen Thomas, Susan Bagen, Endicott Interconnect Technologies, Inc.

"Cost and Impact of Skills and Knowledge Base Training", Leo Lambert, EPTAC Corp

"Embedded and Integrated Passives", Tian Yang, Nanyang Technological University, Singapore

"No Clean Soldering and the Impact on DC Signals", Nathan Langford, Teradyne

Session E: Advanced Materials & Applications - Session Chairs: Dan Blazej - Assembly Answers , and Joe McCabe - Epoxy Technology

" Silver, Gold, Platinum, and Palladium Conductive Traces Printed using Nanoparticle Inks and Pastes", David Van Heerden, Hichang Yoon, and David Williams, NanoMas Technologies, Inc.

"Aerosol Jet Printing of A Silver-Epoxy Conductive Adhesive for High Density Applications", Kurt K Christenson and Michael J. Renn, Optomec; Donald J. Giroux, Resin Designs; Daniel C. Blazej, Assembly Answers

"New Developments in ENIG and ENEPIG for Today's Electronic Products", George Milad, UYEMURA Company

"Materials for Thin & Advanced Packaging Technology", Ken Araujo, NAMICS Technologies, Inc.

"Use of Encapsulants and adhesives for improved Reliability", Tina Barcley

Session F: Packaging B - Session Chairs: Jim McLenaghan - Creyr Innovation, and Bill Boyce - Sensata

"Understanding the Influences of the Drop-Shock Test Vehicle in Ultra-portable WLCSP", Matt Ring, Fairchild Semiconductor

"Damage Mechanisms & Acceleration Factors for No-Pb LGA, TSOP, & QFN Type Assemblies in Thermal Cycling", Liang Yin and Michael Meilunas, Universal Instruments Corporation; Luke Wentlent, Babak Arfaei, and Peter Borgesen, Binghamton University

"Reliable TMV PoP Assembly", Brian Roggeman and David Vicari, Universal Instruments Corporation; Lee Smith and Ahmer Syed, Amkor Technology, Inc.

"Pre-Stacking of Package on Packages Mitigating the Effects of Warpage", Farrell, Paul Bodmer, and Doug Sommer, Benchmark Electronics, Inc.

"Conformal Medical Electronics", Conor Rafferty, Dan Davis, Brian Elolampi, Colby Hobart, YY Hsu, Stephen Lee, and Henry Wei, MC10 Inc, Cambridge, MA

Session G: MEMS & Nano Packaging - Session Chairs: Dr. Jianyu Liang - Worcester Polytechnic Institute, and Sarah McLenaghan - Creyr Innovation

"Li2MSiO4/graphene Cathode Materials for Lithium Ion Batteries", Yinjie Cen, Cunguo Wang, Richard D. Sisson, Jr., Jianyu Liang, Worcester Polytechnic Institute

"Galvanic Synthesis of Novel Porous Metal Nanostructures and their Application as Electrochemical Biosensors", Molly Clay, Qingzhou Cui, Julie Chen, and Zhiyong Gu, University of Massachusetts Lowell

"Ferromagnetic Nanowires and Nanorings for Magnetic Random Access Memory (MRAM) and storage Devices", Nihar R. Pradhan, Xiaolin Hu, Stefan Dickert, Huajie Ke, Mark T. Tuominen, and Katherine E. Aidala

"Lead-free Nanosolders and their Application for Nanowire Assembly and Joining", Fan Gao, and Zhiyong Gu, University of Massachusetts Lowell

"Solution Processed Functional Oxide Nanostructures for Field Emission and Fire Safety Applications", Gregory Wrobel, Pu-Xian Gao, Univertisy of Connecticut

Session H: Solar/PV - Session Chair: Dr. Alan Rae - TPF Enterprises

"Searching for a Game Changer: Sorting New Materials Technologies for High Efficiency Solar Cells", Dr. Fatima Toor, Lux Research

"Photovoltaic Module Technology", Dr. Philip Heinz, Prismark Partners, LLC

"Use of Ink Jet Precision Deposition for Printed Microelectronics, Solar and Fuel Cell Manufacturing", Steve Liker, Trident Industrial Ink Jet

"String-Central-Inverter", Ingo Kraus, CEO, Wind & Sun USA, Inc.

"Novel Adhesion Methods for Solar Cell Assemblies using Pressure Sensitive Adhesives and Films", Jeff Caruso, Rob Thomaier, and Nathan Lipps, NuSil Technology

Session I: Posters - Session Chairs: Jun Wang - Saint-Gobain , and Michael Anello - MindSpring

"Synthesis and Characterization of Tin Oxide-Supported Platinum for Cathode Catalysts of Direct Methanol Fuel Cells", Manish Chawla, Tony Chou, Kevin McCarthy, Xi Geng, Ravindra Datta, and Jianyu Liang, Worcester Polytechnic Institute

"Adhesion Strength Ag Nanoparticles", Robert Cakoune, Michael Judelso, Nancy Burnham and Jianyu Liang,Worcester Polytechnic Institute

"Developing Lead-free Nanosolders for Nanoelectronics Assembly and Packaging", Fan Gao, and Zhiyong Gu, University of Massachusetts Lowell

"Novel Porous Metal Nanostructures for Electrochemical Biosensor Applications", Molly Clay, Qingzhou Cui, Julie Chen, and Zhiyong Gu, University of Massachusetts Lowell

"Low Melting Point Tin/Indium (Sn/In) Nanosolder Particles: Synthesis and Applications", Yang Shu, Karunaharan Rajathurai, Fan Gao, Qingzhou Cui, and Zhiyong Gu, University of Massachusetts Lowell

"Individual domain wall manipulation along ferromagnetic nanowires in a local oersted circular field for memory storage devices", Nihar R. Pradhan, Xiaolin Hu, Huajie Ke, Stefan Dickert, Mark T. Tuominen, and Katherine E. Aidala, Mount Holyoke College/UMass Amherst

"ACES characterization of damping in micro-beam resonators", Xiuping Chen, Vu D. Nguyen, Jason C. Parker, and Dr. Ryszard J. Pryputniewicz, Worcester Polytechnic Institute


Symposium Technical Chair: Roger S. Benson
International Rectifier, Leominster, MA

Program Questions?
Phone: 978-514-5825

----- also -----

SIX Lecture Sessions, Full Poster Session,
Employment Center and an 80 Booth Exhibit Hall
For details about Sponsoring, Exhibiting or Attending

Contact Harvey Smith: or Call 508-699-4767

UK Chapter MicroTalk - Nihal Sinnadurai    ^ Top

IMAPS-UK Trustee News:
Life Member Professor Nihal Sinnadurai recently announced that he will step down at the forthcoming AGM from the IMAPS-UK Committee which he joined in September 1980 and on which he has remained an enthusiastic and dedicated member. During this long period of service Nihal has made several significant contributions to the advancement and success of the Society.

Nihal became deeply involved with the organisation of most MicroTech meetings especially with the Technical Programmes, Professional Advancement Courses and the various Technical Workshops, working tirelessly to secure top speakers and session chairmen. The same dedicated effort was forthcoming with the three European Conferences held in the UK, chairing the organising committee for the 1987 event and chairing the Technical Programme Committee for both the 1999 and 2011 events.  ! ;

He served as Chairman of the UK Society in 1987, 1995 and again in 2001, each time for a two year tenure.

In 1985, alongside Peter Barnwell and Alan Fairbairn, Nihal was instrumental in proposing that the Society should become a registered charity. Following committee endorsement, Nihal lead a small team charged with establishing charitable status. This was achieved in 1989 after forming  the company, International Society for Hybrid Microelectronics - UK Conferences and Exhibitions Limited, in 1986. This enabled the charity to use the company to trade without being liable to Corporation Tax since all profits were sequestered to the charity. Some years later in the mid '90's the rules regarding Charities and Corporation Tax were changed removing the need for a trading company.

In 1989 Nihal became one of three Trustees of the charity as appointed by the committee, a position held until January2012.    

In 1997, Nihal was one of the proponents for the change of name of the Society from ISHM-UK to IMAPS-UK enabling the Society to maintain its c! onnection with IMAPS North America. This was followed later by all the European Chapters.

Nihal has served several periods on the European Liaison Committee and became its Chairman in 1987 until 1989 and again from 2009 until 2011. He also served on the Technical Programme Committee for many of the conferences held across Europe using his skill and expertise to  establish excellent content technical programmes. In June 2009 Nihal became President of IMAPS Europe, a position held until October 2011.

Nihal has received many awards for technical contribution including the John A. Wagnon Technical Achievement Award in 1983 and the Electronics Weekly UK Man of the Year award in 1986.  In 1998 he became a Fellow of IMAPS NA for significant and continuing contributions to IMAPS and was awarded the Daniel C Hughes Jr. Memorial Award for outstanding contribution to microelectronics in 2003.

Over the years Nihal presented many technical papers at confe! rences around the world and it will be clear to all that Nihal! 's contribution to the Society, both in the UK and overseas has been enormous and in leaving he will create a very large hole that will be difficult to fill.

Current IMAPS-UK Chairman, Andrew Holland led the plaudits “Nihal has made an enormous contribution to the success of IMAPS-UK and its strong ties to European, US and Asian chapters. His depth of technical expertise and business incite have ensured that our events continue to attract highly respected speakers and knowledgeble audiences.
I would like to add my personal thanks to Nihal for his dedication and excellent organization in chairing the Technical Programme of IMAPS-Europe’s flag-ship event EMPC2011, hosted by IMAPS-UK and held in Brighton last September.

Although Nihal is stepping away from the IMAPS-UK committee I am encouraged to know that he will continue to be an active life-member of the society. The current committee wish him well”.

We wish Nihal every success in his future ventures and hope he will continue to support, promote and attend future IMAPS-UK events

Thank you Nihal.


LORD Corporation

RGL Enterprises


Crane AE Banner

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
Erfurt, Germany

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact

Automotive Microelectronics 2012
May 22-23, 2012

Dearborn, MI

Packaging the Next Generation of Nano Devices
June 14-15, 2012
Albany, NY
*Exhibitors contact

IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact

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