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August 8, 2012


Button IMAPS 2012 Hotel and Registration Deadline in 7 Days! (read more...)

Button Need Training? With 19 Professional Development Courses at IMAPS 2012, You Are Sure To Find Just What You Need - the Best Industry Experts and Training are All In One Place (read more...)

Button 4 World Reknown Keynotes at IMAPS 2012 - Qualcomm, Case Western, IBM, and Georgia Tech (read more...)

Button IEEE-CPMT & IMAPS Workshop on Optoelectronic Packaging and Assembly (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Chicago/Milwaukee Chapter August 14 Lunch Meeting and Tour on Material & Process Advancements (read more...)

Bullet Abstracts Due for IMAPS France Medical Workshop (read more...)


Palomar Technologies

Master Bond


TJ Green Associates, LLC


  IMAPS Events (view full Web Calendar)

IMAPS 2012 Hotel and Registration Deadline in 7 Days!    ^ Top
The 45th International Symposium on Microelectronics will be held at the Town and Country Convention Center, San Diego, California, USA, September 9-13, 2012. The 45th Symposium on Microelectronics will cover three tiers of electronics: Systems and Applications; Design and related measurements; and Materials, Process and Reliability. IMAPS 2012 will feature 6 technical tracks that span the three days of sessions on: 3D IC/Packaging; Modeling, Design & Reliability; Next Generation Materials; Advanced Technologies; Assembly and Packaging; and the international track entitled Packaging & System Integration: A Global Perspective. There will also be an Interactive University Poster Session. The 2012 San Diego Symposium is loaded with new/enhanced features, including: a revamped Thursday program that features 2 keynotes on 3D, a new 3D panel discussion, and sessions in the afternoon; exhibitor "power hour" presentations each day in the hall; and much more.

The Hotel and Early Registration Deadlines are August 15. IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.

To view the program, registration, exhibit details, and all the activities that are part of IMAPS 2012, visit

Need Training? With 19 Professional Development Courses at IMAPS 2012, You Are Sure To Find Just What You Need - the Best Industry Experts and Training are All In One Place    ^ Top
Do you want to broaden and strengthen your skills and knowledge, optimize your manufacturing processes, and integrate the latest advances in materials and technologies to maintain your strength in today's competitive global market? IMAPS 2012 will feature 19 professional development courses (PDCs) on Sunday, September 9 and Monday, September 10 - see the list below. Full details and registration are online. This is our best year yet for PDCs. Registration fees increase after August 15 - so register today! Don't miss this opportunity to received training from the industry's brightest, all under one roof. Learn more

S1: Basics of Microelectronic Packaging
PDC Instructor: Casey Krawiec, Quik-Pak

S2: TSV and Other Key Enabling Technologies for 3D IC/Si Integration
PDC Instructor: John H. Lau, ITRI

S3: High-Performance Thermal Management Materials
PDC Instructor: Carl Zweben, Ph. D., Zweben Advanced Thermal Materials

S4: Mechanical Design and Reliability Analysis in Microelectronics Packaging
PDC Instructor: Dr. Amaneh Tasooji, Arizona State University

S5: High Temperature Electronics
PDC Instructor: Randall Kirschman, Consultant

S6: Near Hermetic Packaging Concepts for Military and Medical Devices
PDC Instructor: Thomas J Green, TJ Green Associates LLC

S7: Modeling and Optimization of Electronic Packaging Structures for Signal and Power Integrity
PDC Instructors: Dr. Ivan Ndip, Fraunhofer IZM; Professor Ege Engin, San Diego State University; Dr. Antonio Ciccomancini Scogna, CST of America

S8: Understanding Failure and Root-Cause Analysis in Pb-Free Electronics
PDC Instructor: Greg Caswell, DfR Solutions

S9: Patents and Intellectual Property for Technology Companies
PDC Instructor: Paul Hoffman, Sapient Focus, Inc

S10: A Technologists Guide to Determining and Exploiting the Value of Innovation
PDC Instructors: Chris Halliwell, Technology Marketing Center; Lee Smith, IMAPS Executive Council, Guest Speaker

M1: 2.5D and 3D Interposer Technologies and Applications
PDC Instructor: Venky Sundaram, Georgia Tech 3D Systems Packaging Research Center

M2: Microelectronics Packaging 2012 Industry Updates and Trends
PDC Instructor: Phillip G. Creter, Creter & Associates

M3: Wire Bonding
PDC Instructor: Lee Levine, Process Solutions Consulting, Inc.

M4: Package on Package Technology - What It Is, What Works, What Doesn't Work
PDC Instructor: Ning-Cheng Lee, Indium Corporation

M5: Polymers in Electronic Packaging
PDC Instructor: Dr. Jeffrey Gotro, InnoCentrix, LLC

M6: Adhesion Fundamentals in Microelectronic Packaging
PDC Instructor: Raymond A. Pearson, Lehigh University

M7: Technology of Screen Printing
PDC Instructors: Art Dobie, Sefar Inc.; David Malanga, Heraeus, Inc., Thick Film Division

M8: Hermeticity Testing of Microelectronics for Aerospace and Medical Applications
PDC Instructor: Thomas J Green, TJ Green Associates LLC

M9: Design and Analysis of Experiments
PDC Instructor: Jianbiao Pan, California Polytechnic State University

4 World Reknown Keynotes at IMAPS 2012 - Qualcomm, Case Western, IBM, and Georgia Tech    ^ Top
IMAPS 2012 will feature 4 world reknown keynote speakers over the course of the three days of the technical program - September 11-13, 2012. All attendees can attend the keynote presentations, including complimentary "exhibits only" participants. Learn more at and register on-line to reserve your spot.

Keynote Presentations Sponsored by:

Xradia - Keynote Sponsor Indium Corp - Keynote Presentations Sponsor

Keynote - Matt Grob

Tuesday, September 11, 2012
12:00 PM - 12:45 PM

Matt Grob, Qualcomm
Executive Vice President and Chief Technology Officer

Presentation Title:
The Path to a 1000x Increase in Capacity for Mobile Networks

Matt Grob is executive vice president and chief technology officer for Qualcomm Incorporated. In this role, he is responsible for the oversight of Qualcomm's technical path, the coordination of R&D activities across the company and the development of next-generation wireless technologies. Grob also leads Corporate R&D and provides oversight to Qualcomm Corporate Engineering Services.

Matt joined Qualcomm in 1991 as an engineer. His contributions include system design, standardization and project leadership for programs including the early CDMA data services; the Globalstar satellite based mobile voice and data system and later 1x EV-DO high-speed wireless Internet access technology. Matt's focus on cellular data services led to his assignment as co-project engineer for the HDR (High Data Rate) program starting in 1997. This new high-speed Internet access technology become standardized as 1x EV-DO, and commercialized throughout the world. Innovations and techniques from these programs also benefit UMTS evolution including HSPA. In 1998, Matt became the head of Corporate R&D's system engineering department.

In 2006, Matt took the role of leading the Corporate R&D division. The division's mission is to push the boundaries of wireless technology, to innovate and explore new services and technologies - focusing on longer-term and often higher-risk technologies and projects. During the past 5 years, Corporate R&D's efforts have expanded in scale and scope. While maintaining a very strong focus on core cellular WAN technology, Corporate R&D has broadened its mission to include exciting new areas including Augmented Reality, Wireless Charging, processor and applications enhancements, peer-to-peer technologies, position location, and Wireless LAN.

Matt holds a number of patents in the area of wireless data services and technology and holds a BSEE from Bradley University, Peoria, Illinois as well as an MSEE from Stanford University.


Keynote - Mehran Mehregany

Wednesday, September 12, 2012
11:45 AM - 12:30 PM

Mehran Mehregany, Ph.D.
Case Western University

Presentation Title:
Wireless Health: Remaking of Medicine by Pervasive Technologies

Mehran Mehregany received his M.S. and Ph.D. in Electrical Engineering from Massachusetts Institute of Technology in 1986 and 1990, respectively. From 1986 to 1990, he was a consultant to the Robotic Systems Research Department at AT&T Bell Laboratories, where he was a key contributor to ground-breaking research in microelectromechanical systems (MEMS). He joined the Department of Electrical Engineering and Applied Physics at Case Western Reserve University as an Assistant Professor in 1990. He was promoted to Associate Professor in 1994 and Full Professor in 1997, held the George S. Dively Professor of Engineering endowed chair (1998 to 2000), and has since held the Goodrich Professor of Engineering Innovation endowed chair. He served as the Director of the MEMS Research Center( 1995 to 2002) and Chairman of the Electrical Engineering and Computer Science Department (January 2003 to January 2006) at Case. He served as the founding Executive Vice President of Engineering, Chief of Engineering Research, and the Gary and Mary West Endowed Chair of Wireless Health Technology at the West Wireless Health Institute from November 2009 through August 2010 (while on a leave from the University), during which time he formulated the Institute's engineering program, recruited the initial talent, and launched the initial research activities and product developments, including Sense4Baby. He has been serving as the Director of the Wireless Health Program (San Diego (based), Cleveland) since 2010, while also serving as Faculty Director of Development for the Case School of Engineering 2010- 2011, and has a secondary appointment in the Biomedical Engineering Department.

Professor Mehregany is well known for his research in the area of MEMS and silicon carbide, as well as for offering the first MEMS educational resource (starting in early 1990's) and the first graduate education program in wireless health (starting in 2011). He has over 350 publications describing his work, holds 19 U.S. patents, is the recipient of a number of awards/honors and has founded several technology startups. He served as the Editor-in-Chief of the Journal of Micromechanics and Microengineering (1/1996 to 12/1997) and Assistant-to-the-President of the Transducers Research Foundation (1994 to 2004), where he currently serves as a Trustee and the Treasurer. He is an Editor for the Journal of Microelectromechanical Systems. He is the Technical Program Chair (2012) and General Chair (2014) of the Solid-State Sensors, Actuators & Microsystems Workshop, the premier Americas' venue on the topic. He has served on the Board of Directors of EvoNexus (San Diego's only community-supported, fully pro-bono technology incubator), and is on the Advisory Board of the San Diego Venture Group and the Advisory Board of the Electrical Engineering Department at University of Southern California. He has been an active entrepreneur over his career, with NineSigma, Inc. and Qualtre, Inc. being two currently operating technology startups he co-founded. His current research interests are micro/nano-electro-mechanical systems, silicon carbide technology and microsystems, and wireless health.


Keynote - Subu Iyer

Thursday, September 13, 2012
8:00 AM - 8:45 AM

Subu Iyer, IBM Fellow
IBM Systems and Technology Group

Presentation Title:
Three-Dimensional Integration - A Systems' perspective to Orthogonal Scaling

Subramanian S. Iyer is IBM at the Systems & Technology Group, and is responsible for technology strategy and competitiveness, embedded memory and Three-Dimensional Integration.He obtained his B.Tech in Electrical Engineering at the Indian Institute of Technology, Bombay, and his M.S. and Ph.D. in Electrical Engineering at the University of California at Los Angeles. He joined the IBM T. J. Watson Research Center in 1981 and was manager of the Exploratory Structures and Devices Group till 1994, when he founded SiBond LLC to develop and manufacture Silicon-on-insulator materials. He has been with the IBM Microelectronics Division since 1997. Dr. Iyer has received two Corporate awards and four Outstanding Technical Achievement awards at IBM for the development of the Titanium Salicide process, the fabrication of the first SiGe Heterojunction Bipolar Transistor, the development of embedded DRAM technology and the development of eFUSE technology. His current technical interests and work lie in the area of 3-dimensional integration for memory sub-systems and the semiconductor roadmap. He is a Master Inventor. He received the Distingushed Aluminus award from the Indian Institute of Technology, Bombay in 2004. Dr. Iyer has authored over 175 articles in technical journals and several book chapters and co-edited a book on bonded SOI. He has served as an Adjunct Professor of Electrical Engineering at Columbia University, NY. He is the recepient of the 2012 IEEE Daniel Nobel award for emerging techologies In his spare time, he studies Sanskrit and role of Indic languages, traditions and culture in different parts of the world.


Keynote - Rao Tummala

Thursday, September 13, 2012
11:45 AM

Rao Tummala, Director
Georgia Tech 3D Systems Packaging Research Center

Presentation Title:
Inorganic-organic Packaging as the Basis for Smart Systems Packaging Revolution

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech, pioneering Moore's Law for System Integration. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering the first plasma display and multichip electronics for mainframes and servers.

He has received many industry, academic and professional society awards including Industry Week's award for improving U.S. competitiveness, IEEE's David Sarnoff, IMAPS' Dan Hughes, Engineering Materials from ASM, Total Excellence in Manufacturing from SME. He received Distinguished Alumni Awards from University of Illinois, Indian Institute of Science and Georgia Tech. In 2011, Prof. Tummala received the Technovisionary Award from Indian Semiconductor Association and IEEE Field Award for contributions in electronics systems integration, and cross-disciplinary education. He received his BS from Indian Institute of Science, and Ph.D. from University of Illinois.

Prof. Tummala has published about 500 technical papers, holds 74 patents and inventions; authored the first modern Microelectronics Packaging Handbook, the first undergrad textbook Fundamentals of Microsystems Packaging, and the first book introducing the System-On-Package technology. He is a Fellow of IEEE, a member of National Academy of Engineering as well as past President of IEEE-CPMT and the IMAPS Societies.


IEEE-CPMT & IMAPS Workshop on Optoelectronic Packaging and Assembly    ^ Top
The Institute of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) and the International Microelectronics And Packaging Society (IMAPS) jointly announce the 2012 Advanced Technology Workshop on Opto-electronic Packaging and Assembly. This workshop will feature an ITRS Assembly and Packaging Roadmap working session as well. Dates: September 6 & 7, 2012 Location: Embassy Suites, 3100 East Frontera Street, Anaheim, CA 92806. To view the technical announcement, exhibit information, to register, or for other details about the Workshop, visit

Thursday, September 6, 2012
8:00 am – 5:00 pm
Optoelectronic Packaging & Assembly

Invited technical experts will be presenting on the advances and trends in the Optoelectronic Packaging and Assembly Technology areas for applications such as Optical Interconnects & Semiconductor Photonics, Optical Transceivers & Networks, High Brightness LED and CMOS Image Sensors.

Keynote Address:
Prof. Ricky Lee, President, IEEE CPMT Society

Featured Speakers:
Dr. Mehdi Asghari, Kotura; Dr. Daniel Van Blerkom, Forza Silicon; Ron Bonne, Philips Lumileds; Dr. Jack Cunningham, Oracle Labs; Dr. Peter De Dobbelaere, Luxtera; Dr. Ali Ghiasi, Broadcom; Dr. Radha Nagarajan, Infinera; Dr. Adit Narasimha, Molex; Prof. George Papen, UCSD; Dr. Mark Verdiell, Samtec

Friday, September 7, 2012
8:00 am – 12:00 pm
ITRS Assembly & Packaging Roadmap Working Session

The International Technology Roadmap for Semiconductors (ITRS) Organization will hold an assembly and packaging roadmap working session for the workshop participants, with a presentation on the ITRS working process and an interactive discussion about their optoelectronic packaging activities..

For Details, visit


  Chapter Activities (events listed in chronological order)

Chicago/Milwaukee Chapter August 14 Lunch Meeting and Tour on Material & Process Advancements    ^ Top

Date: August 14, 2012

Trace Laboratories, Inc.
1150 West Euclid Avenue
Palatine, IL 60067
(847) 934-5300
For more company information, click here -


IMAPS Members - $20,
Non-members: - $25,
Students with IDs & displaced members: - $5

On-line registration guarantees seating and lunch. Please register by COB on Friday, August 10th. Participants may pay on-site by cash or check only.

For additional chapter information, please contact Ken Burke of GE Healthcare at 847-345-0224 or


11:30 Registration and Networking

12:00 Lunch and Chapter Announcements

12:45 “Palladium Copper and Silver Alloy Bonding Wire.”
William Crockett, Business Development Manager at Tanaka Kikinzoku International (America)

1:15 “High Reliability GGI Flip Chip Interconnect for Small Die.”
Philip Couts, Sales and Marketing Manager at TDK Corporation of America

1:45 Break with refreshments

2:00 “Ceramics for Medical Applications.”
Arne Knudsen, General Manager of Business Development at Kyocera America, Inc.

2:30 “How Silver Powder Metallurgy Affects the Physical Properties of Low Temperature Firing Silver Conductors.”
Samson Shahbazi, Senior Research Scientist at Heraeus Materials Technology, LLC

3:00 “Magnetically Aligned Anisotropic Conductive Adhesives for Electronic Assembly Applications.”
Eric Hoppenjans, President of Indiana Microelectronics, LLC

3:30 Facility Tour of Trace Laboratories
Kevin Mehaffey, General Manager of Trace Laboratories

4:00 Conclusion

Abstracts Due for IMAPS France Medical Workshop    ^ Top
The 1st Workshop on Advanced Technology on Microelectronics, Systems and Packaging for Medical Electronics will be held on December 4-5 in Paris, France. Abstracts are due on Sept. 22, 2012. For further information, please consult the call for papers at the link:

Organized in collaboration with Yole Développement, the first day of the workshop will feature internationally recognized speakers from industry and academia :

• Industry Trends & Forecasts in Medical Electronics
• Implantable and Wearable in New Diagnostics and Therapies

Abstracts are being requested for 22nd of September on following topics (min. 250 words):

  • 3D Packaging & Interconnection
  • Component Manufacturing at Chip & Package Level
  • Implantable and Wearable Applications
  • Systems Communication (High Frequency, Data Remote Monitoring)
  • Sensors, Actuators, Power Supply
  • Embedded Passives and Associated Technologies

Your submission must include the mailing address, business telephone number and email address and the content must be without commercial information. Address your abstract to

Authors will be notified of paper acceptance with instructions for publication before October 15th , 2012. Speaker will benefit with special rate of 120 Euros.


LORD Corporation

RGL Enterprises


Crane AE Banner

2012 Events:

Chicago/Milwaukee Chapter
August 14

CPMT & IMAPS Optoelectronics
September 6-7

IMAPS 2012 (San Diego)
September 9-13
San Diego, CA
*Exhibitors contact

Thermal Management
November 12-14
*Exhibitors contact

Medical Applications (IMAPS France) - Dec. 4-5

2013 Events:

Wire Bonding
January 2013

Device Packaging
March 11-14
*Exhibitors contact

CICMT (Ceramics)
April 22-24
*Exhibitors contact

HiTEN (High Temp)
July 8-10
*Exhibitors contact

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact

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