Device Packaging 2012 Less Than 2 Weeks Away - PDCs, Conference, Exhibits, 2 Panel Discussions, 4 Keynotes and More! (read more...)
Global Business Council (GBC) Spring Conference on Global Supply Chain Management in 2 Weeks (read more...)
Microelectronics Foundation Spring Golf Invitational Almost Sold-Out (read more...)
CHAPTER ACTIVITIES (events listed in chronological order)
New England Chapter March 13 Technical Meeting (read more...)
Chesapeake Chapter March 14 Spring Meeting on Thermal Management (read more...)
Metro Chapter April 5 Vendor Day (read more...)
ICEP-IAAC 2012 Being Held in Tokyo (read more...)
New England Chapter's 39th Symposium & Expo - Program Available Soon (read more...)
||IMAPS Events (view full Web Calendar)
Device Packaging 2012 Less Than 2 Weeks Away - PDCs, Conference, Exhibits, 2 Panel Discussions, 4 Keynotes and More! ^ Top
The 8th Annual Device Packaging Conference (DPC2012) begins in less than 2 weeks. The Conference will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS). To view the technical program, to register, or for other details about the Conference, visit www.imaps.org/devicepackaging.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
The 2012 conference will feature: 17 technical sessions; 4 Keynote Presentations (Hynix Semiconductor, Amkor Technology, Taiwan Semiconductor, and Fairchild Semiconductor); 2 panel discussions on 3D and Wafer Level Packaging Materials; a poster session, 8 professional development courses and a SOLD-OUT vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging: 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; High Brightness LEDs; and Passive Integration.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. The Exhibit Hall sold out again this year.
Global Business Council (GBC) Spring Conference on Global Supply Chain Management in 2 Weeks ^ Top
IMAPS is holding the 2012 GBC Spring Conference on Global Supply Chain Management: Increased Collaboration, Business Models, and Dynamic Market Implications on March 4-5, 2012, at the Radisson Fort McDowell Resort in Scottsdale/Fountain Hills, AZ. This GBC event precedes the Device Packaging Conference. To view the program and register, visit http://www.imaps.org/programs/gbc12spring.htm.
GBC/DPC Premier Sponsors:
The IMAPS GBC is pleased to announce its 2012 Spring Conference. Key industry leaders will provide important information on the critical role that supply chain management plays in our global industry. Presenters will address how business models, industry collaboration, and market dynamics can have profound impacts on the increasingly interconnected semiconductor supply chains. Participants will gain valuable industry insight to achieve a competitive advantage in product development, manufacturing, marketing, and sales. The conference will facilitate networking with key decision-makers across our broad industry supply chain.
Thank you to the GBC Speaker Dinner Sponsors:
Sunday, March 4, 2012
5:30 - 7:30: Registration and GBC Welcome Reception (Beverages and Appetizers)
7:30 - 9:00: Speaker Dinner (by Invitation)
Monday, March 5, 2012
7:00am - 8:00am -- Continental Breakfast and Registration
8:00am - 8:15am -- Opening Remarks
Steve Annas, National Sales Manager, Natel Engineering Co., Inc.
8:15am - 12:15pm -- Morning Presentations
Moderator: Peter Tortorici, Process Development Manager of Medtronic, Inc.
8:15am - 9:00am -- “State of the Global Semiconductor Industry.”
Ron Steger, Partner from KPMG LLC
9:00am - 9:45am -- “Supply Chain Implications from the Growing Overlap between Wafer Foundry and Semiconductor Assembly and Test Suppliers (SATS) in Wafer-level Interconnection and Package Processing.”
E. Jan Vardaman, President of TechSearch International
9:45am - 10:00am -- Coffee Break
10:00am - 10:45am -- “Packaging Materials Markets and Supply Chain– Recent SEMI Report. Evolution of the Materials Supply Chain and Emergence of New Entrants.”
Daniel Tracy, Senior Director of Industry Research and Statistics of SEMI
10:45am - 11:30am -- “China's impact on the Semiconductor Industry - 2011 Update.”
Clememts “Ed” Pausa, Director Emeritus at PricewaterhouseCoopers
11:30am - 12:15pm -- “Global Supply Chain Compliance Security Management and Best Practices.”
Rennie Alston, Chief Operating Officer of American River International
12:15pm - 1:30pm -- Lunch Presentation
Moderator: Lee Smith, VP of Business Development at Amkor Technology, Inc.
“2012 and 5-year Electronics and Semiconductor Market Outlook; Facing Macro-economic Headwinds.”
Bill McClean, President of IC Insights
1:30pm - 4:45pm -- Afternoon Presentations
Moderator: Richard Rice, Senior Vice President of Sales & Engineering of ASE US, Inc.
1:30pm - 2:15pm -- “iNEMI Roadmap Process & Industry Collaboration Projects to Close Roadmap Gaps.”
Bill Bader, Chief Executive Officer of iNEMI
2:15pm - 3:00pm -- “Wafer Scale Packaging Supply Chain Evolution: Increased Collaboration, Competition, and Urgency.”
Jeff Perkins, President of Yole Developpement
3:00pm - 3:15pm -- Coffee Break
3:15pm - 4:00pm -- “Global Supply Chain Sourcing for Minor Metals for High Volume Manufacturing for Electronics: Risks and Opportunities.”
Robert Ploessl, Product Manager of Chemicals and Technology Assessment at Indium Corporation
4:00pm - 4:45pm -- “The No-Package Package: Are We Virtually There Yet?”
Jim Walker, Research Vice President of Semiconductor Manufacturing at Gartner-Dataquest
4:45pm - 5:00pm -- Closing Remarks, Final Questions, and Conference Evaluation
Iris Labadie, Market Development Specialist at Kyocera America, Inc.
Device Packaging Welcome Reception
5:00pm - 7:00pm (Beverages and Appetizers) GBC Participants Invited
Texas Hold'em Poker Tournament
7:00pm – 10:00pm -- To benefit the IMAPS Educational Foundation
On-line Registration | Device Packaging Conference 2012
Spring Golf Invitational | Texas Hold'em Tournament
Interested in participating? Need details on registration, and other program areas?
Contact Steve Greene - firstname.lastname@example.org or 202-548-8711.
Microelectronics Foundation Spring Golf Invitational Almost Sold-Out ^ Top
Immediately following the Device Packaging Conference, the Microelectronics Foundation will host its Spring Golf Invitational on Thursday, March 8, 2012, with a 1:00pm Shotgun Start – “Best Ball” Scramble. This year's outing will be held at the Desert Canyon Golf Club,
10440 Indian Wells Drive,
Fountain Hills, AZ. The golf tournament is nearly sold-out with more than 50 golfers already registered and only 5 golf holes still available for sponsorship.
The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for six consecutive years. Desert Canyon Golf Club’s eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.
Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.
A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course – 1:00pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.
All proceeds from this event will benefit the IMAPS Microelectronics Foundation.
Special Awards and Activities tentatively planned:
- Closest to the Pin;
- Longest Drive
Eagle Sponsor - $3,000 -- SOLD OUT
Birdie Sponsor - $1,500 -- SOLD OUT
Hole Sponsor - $400 ($750 w/ four-some) -- 5 Holes Remain
- Sponsorship of one hole with signage.
- Entrance of one golfer ($400 or $750 includes 4-some).
- Company logo/name on promotional materials and website.
Questions or request teams/partners:
David Virissimo, Foundation Golf Chair - email@example.com or 619-464-5430
||Chapter Activities (events listed in chronological order)
New England Chapter March 13 Technical Meeting ^ Top
||March 13, 2012
Courtyard By Marriott Marlborough
75 Felton Street
5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Buffet Dinner
7:15 PM Technical Presentation
Meeting & Dinner Cost:
$30.00 (Non-Member), $25.00 (Member), $20.00 (Retired/Unemployed), $10.00 (Student)
SEND NO MONEY! BRING checks payable to “IMAPS New England”
Pre-Registration deadline is Thursday, March 8.
E-Mail: Jennifer Bailey firstname.lastname@example.org or call 781-696-9369
After March 8, you must register at-door. At-door registration is an additional $5.00 [ Limited Availability ] If you fail to cancel by noon on Friday [3/9] The Chapter will bill you for the registration fee.
Conformal Electronic Systems
Conor Rafferty, Director of Technology Development
mc10 Incorporated (www. mc10inc.com)
MC10 has developed a technology platform using ultra-thin components linked with flexible interconnects and embedded in low modulus polymers which provide an excellent match to biological tissues. MC10 technology uses existing high-performance active components in radically new mechanical form factors. The platform is based on three key ideas. Any material when sufficiently thin compared to its planar dimensions becomes flexible. Paper and lumber are both comprised of cellulose; thickness is the difference. Secondly, we have developed techniques to transfer islands of silicon and other semiconductors, under 10 µm thick, from their native crystalline substrates to polymeric substrates while preserving the electrical properties intact. Thirdly, the islands are linked by flexible interconnections patterned like springs, allowing considerable deformation to be accommodated by the flexible interconnect so that the crystalline materials remains unstrained. In this work we describe the technology platform and demonstrate medical devices developed using MC10 technology.
Dr. Conor Rafferty is Director of Technology Development at MC10, Inc., a venture-backed start-up exploiting novel mechanical concepts to bring flexible silicon-based electronics to market. Prior to MC10, Dr. Rafferty founded NoblePeak Vision in 2003 and served as CTO. NoblePeak developed infrared imagers fabricated in a conventional CMOS foundry. It was acquired by IR Labs in 2010. Dr. Rafferty has a PhD in Electrical Engineering from Stanford University, where he co-authored the now industry-standard TCAD simulation codes Suprem4 and Pisces/Medici. He spent fifteen years in silicon process and design research at Bell Labs.
Chesapeake Chapter March 14 Spring Meeting on Thermal Management ^ Top
||March 14, 2012
CALCE, University of Maryland, College Park
Martin Hall (Building 088) - Engineering Classroom Building
DeWalt Seminar Room
3:00 PM Registration, Opening
IMAPS Members-$20, non-members-$25, and students-$5.00.
On-site registrations by checks/cash only.
A fee of $5.00 will be surcharged for on-site registrations.
Pre-registration on-line by March 8 guarantees dinner seating.
Program (times approximate):
3:00 Registration and brief opening remarks.
3:30 “Techniques to Enhance Two-Phase Cooling Performance.”
Darin Sharar, Thermal Fluids Engineer at U. S. Army Research Labs.
4:00 “Two-Phase Dielectric Liquid Cooling for Power Electronics.”
David Saums, Principal at DS&A, LLC
4:30 Brief break
4:45 “Thermal Packaging - The Inward Migration”
Dr. Avram Bar-Cohen, Program Manager of the Microsystems Technology Office, DARPA
5:15 Event wrap-up. Ideas for next event. Other business. Light Dinner
5:45 Review of CALCE Research Posters. Industry participants can serve as poster judges and interact with students who provide summaries and details on their recent research.
Metro Chapter April 5 Vendor Day ^ Top
||April 5, 2012
Ronkonkoma, New York
Hotel Phone Number (631) 585-9500
$450.00 (reservation must be received with payment by 3/15/2012 ) $500.00 after 3/15/2010
$100.00 Discount if you have exhibited at a Metro chapter event in the past 2 years and you register by 3/15/2012.
Please make/mail check payable to: Metro IMAPS
10 Northview Trail
Ridge, NY 11961
Attendee Schedule: Vendor Schedule
7:00am-8:00am-Attendee Registration 1:00pm- Vendor registration/setup
8:00am-5pm-PDC #1 3:00pm- Exhibit opens
8:00am-5pm-PDC#2 6:00pm-Hospitality hour
4:30pm-Technical presentation 8:00pm-Exhibits close
Walter Becker Steve Lehnert
WJB Sales, Inc Space Systems Loral
631 331 0689 650 644 5218
Space is limited so register early to guarantee your spot
METRO IMAPS is also pleased to offer the following full day
Professional Development Course
Microwave Packaging Technology
Course Leader: Tom Green, TJ Green Associates
Microwave Hybrids, MICs, RF MMIC modules, conventional chip and wire hybrids all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This full day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for military, space and other hi reliability commercial and medical device applications.
This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.
Introduction to Microwave Technology
Terminology and product definitions
RF Manufacturing Assembly Process Overview
Design for Manufacturability (DFM)
Rationale and significance of DFM
Typical problems encountered during hybrid manufacturing and
How they can be prevented!
Wafer Fabrication Processes
GaAs Gallium Arsenide wafer fabrication
GaN Gallium Nitride on SIC wafer fab technology
Teflon PTFE (duroid) and other soft board material sets
Alumina ceramic substrate fabrication
Thin Film Processes on Ceramic
Plating processes and specifications
Material and Process Fundamentals for Component Attach
Silver epoxy attach of substrate and MMIC die
Handling and assembly of bare die
Solder and epoxy attach of discrete components
Eutectic Soldering Processes
AuSn solder attach of GaAs chips
Issues with die voiding and how to detect
Die, Substrate and Package Compatibility
Coefficient of Thermal Expansion (CTE)
Material selection and design trade offs
Thermal Impedance and Importance of Minimizing Junction Temperature
Simple excel spreadsheet demonstrates importance of proper material selection for typical microwave hybrid material sets
Wirebonding and Interconnect Process Overview
Ribbon bonding, Gap Welding
Deep access bonding
Fine wire (.7 mil) bonding gate pads on FETs
Hermetic Packaging Process Overview
Seam sealing, laser welding aluminum alloys
Soldering in RF Feedthrus
Traditional gross and fine helium leak testing per MIL-STD-883 TM 1014
Hermeticity testing options; Optical Leak vs. CHLD vs. Kr -85 Radiflow
Impact of a tighter hermeticity specification
Near Hermetic Packaging Options
LCP and other packaging approaches
Student Examination Test and Review
Student Feedback and Course Critique
Mr. Thomas Green is an independent consultant and respected teacher. Tom is the principal at TJ Green Associates LLC (www.tjgreenllc.com) a veteran owned small business specializing in teaching and consulting for the microelectronics industry. Tom previously worked at Lockheed Martin in Denver CO and at USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military satellites. Tom has broad experience in microwave packaging and demonstrated expertise in die bond, wirebond, package sealing and hermeticity testing of products intended for high rel military and aerospace applications. Tom regularly attends JEDEC meetings and is an active member of IMAPS and a Fellow of the Society. He has a B.S. in Materials Engineering from Lehigh University and a Masters in Engineering.
Course fees: 550.00 IMAPS Member 600.00 Non Member
Includes Continental Breakfast and Lunch. Also included is admission to the METRO Chapter Vendor Night and Cocktail Reception immediately following
Group discounts are available
Contact Steve Lehnert Phone (650) 644-5218
Email email@example.com to register
Time: 8:00 AM-4:30 PM
Registration and Continental Breakfast start at 7:30 AM.
ICEP-IAAC 2012 Being Held in Tokyo ^ Top
Sessions and Keywords:
1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package
2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring
3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA
4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics
5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes
6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining
7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards
8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications
9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System
10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS
11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications
12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors
13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas
14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness
15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design
16. Metrology Current Density, Power Map, Thermal Map
17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis
Best Paper Awards : The JIEP will present the Best Paper Awards to selected outstanding papers.
Young Awards : The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old.
Organizing Committee : General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics)
Technical Program Committee : Chair: Shintaro Yamamichi (Renesas Electronics) Co-Chairs: Masahiro Inoue (Osaka University), Hitoshi Sakamoto (NEC), Shoji Uegaki (ASE Marketing & Service Japan), Hiroshi Yamada (Toshiba)
New England Chapter's 39th Symposium & Expo - Program Available Soon ^ Top
IMAPS New England – 39th Symposium & Expo
The Largest Regional Symposium Dedicated to
Microelectronics and Electronics Packaging
May 8, 2012
Holiday Inn – Boxborough Woods Conference Center, Boxborough, Massachusetts
The New England Chapter Symposium Technical Program Committee is planning sessions in the following areas:
- Biomedical Electronics
- Telecom - Microwave
- Military Electronics
- Consumer Electronics
- Renewable Energy: Fuel Cells, Solar, Wind
- Thermal Management
- Manufacturing, Outsourcing & Quality
- Software and Firmware Applications
- High Performance Interconnects and Boards
- Imaging Sensors
- Emerging Technologies
Advanced Processes & Materials
- 3D and High Density Packaging
- Photonic/ Optoelectronic Packaging
- LED Packaging
- MEMS and Nano Packaging
- Underfill/ Encapsulants and Adhesives
- Green Packaging / Compliance with RoHS
- Flip-Chip and Bumping: Processes, Reliability
- Wire Bonding and Stud Bumping
- Embedded and Integrated Passives
- Ceramic, Polymer and Conductive Materials
- Cu/ Low-K
Symposium Technical Chair: Roger S. Benson
International Rectifier, Leominster, MA
Program Questions? firstname.lastname@example.org
----- also -----
SIX Lecture Sessions, Full Poster Session,
Employment Center and an 80 Booth Exhibit Hall
For details about Sponsoring, Exhibiting or Attending
GBC Spring Conference 2012
March 4-5, 2012
Fountain Hills, AZ
8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact email@example.com
Foundation Spring Golf Invitational
March 8, 2012
Fountain Hills, AZ
Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
High Temperature Electronics (HiTEC)
May 8-10, 2012
*Exhibitors contact firstname.lastname@example.org
Automotive Microelectronics 2012
May 22-23, 2012
IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact email@example.com