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January 26, 2012

Palomar Technologies

Button Device Packaging 2012 Conference Program and Registration Now On-Line (read more...)

Button ATW on RF/Microwave Packaging Begins February 7 (read more...)

Button Upcoming Webinars - Registrations Opening Next Week (read more...)

   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet NEXT WEEK: Northern California Chapter February 1 Lunch Meeting on 2.5D and 3D Packaging Challenges (read more...)

Bullet NEXT WEEK: France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle (read more...)

Bullet New England Chapter February 7 Technical Meeting (read more...)

Bullet Arizona Chapter February 16 Luncheon on 2012 and 5-year Electronics and Semiconductor Market Outlook; Facing Macro-economic Headwinds (read more...)

Bullet ICEP-IAAC 2012 Being Held in Tokyo - Abstracts Now Due November 29 (read more...)

Bullet New England Chapter's 39th Symposium & Expo - Program Available Soon (read more...)

TJ Green Associates, LLC

  IMAPS Events (view full Web Calendar)

Device Packaging 2012 Conference Program and Registration Now On-Line   ^ Top
The 8th Annual Device Packaging Conference (DPC2012) will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS). To view the technical program, to register, to reserve exhibits, or for other details about the Conference, visit

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2012 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging: 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; High Brightness LEDs; and Passive Integration.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Only 7 Full 8' by 10' exhibit spaces are still available. The Exhibit Hall sold out each year since 2006 and is 60% sold for 2012. Contact Brian Schieman by email at or by phone at 202-548-8715.

ATW on RF/Microwave Packaging Begins February 7   ^ Top
IMAPS is holding the Advanced Technology Workshop on RF/Microwave Packaging at The Crowne Plaza Hotel in San Diego, CA, from February 7-8, 2012. To view the call for abstracts, to submit an abstract, or for other details about the workshop, visit

The objective of the RF and Microwave Packaging Workshop is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of RF and Microwave packaging technologies. This workshop enables discussion and presentation of the latest RF and Microwave technology.

Tuesday, February 7, 2012

Keynote Presentation: 8:15 am - 9:00 am
Dr. Renzhe Zhao, Chief Specialist of Electronics Material, Huawei Technologies

Dr. Renzhe Zhao

Dr. Zhao will share how Huawei sees the electronic material needs in the future.

Bio: Dr. Renzhe Zhao received his B.S. and M.S. degrees from Tianjin University, China, in 1990 and 1995 respectively, and M.S. and Ph.D. degrees from Auburn University, Auburn AL, in 2000 and 2002 respectively. His research at Auburn focused on flip chip assembly with fluxing underfills and with wafer applied underfills. From 2002 to 2009, he was employed by Henkel Corporation in Irvine, CA, where he worked with materials and processes for electronics assembly, specifically underfill, die attach, and molding compound for electronics packaging applications. He joined InvenLux Corporation as Manager of LED Packaging in 2010. He was responsible for LED packaging development and manufacturing. He is working in Huawei Technologies, as Chief Specialist of Electronics Material from Sept. 2010, where he is in charge of material's selection and reliability. Dr. Zhao is a member of IEEE and IMAPS. He is the recipient of The Charles Hutchins Educational Grant from SMTA. He was the columnist of Materials world for Circuits Assembly from 2007 to 2009.

Session 1: Advanced Materials and Interconnect Solutions for RF Packaging
Chair: Susan Trulli, Raytheon RF Components
9:00 am - 12:30 pm

VHF & UHF energy harvesting radio system physical and MAC layer considerations
Xiaohu Zhang, Qualcomm, Inc.; William B. Kuhn, Kansas State University

RF Packaging: Challenges and New Approaches to Achieve Optimal Performance and Cost
Fernando Roa, Amkor Technology 

Break in Exhibit Hall: 10:00 am - 10:30 am

Millimeter Wave Characterization of DuPont (TM) GreenTape (TM) 9K5 LTCC System in 40 to 110 GHz Frequency Range
Deepukumar Nair, K. M. Nair, M. F. McCombs, J. M. Parisi, Michael Smith, Elizabeth Hughes, Tony Orzel, Brad Thrasher, Scott E. Gordon, DuPont

PolyStrata (R): Finally, Microwaves Get Wired
Steve Huettner, Donald Wu, Nuvotronics LLC 

3D Stacked Die SIP Packaging for High Performance Cost Sensitive Applications
Marc Robinson, Jeff Leal, Suzette Pangrle, Vertical Circuits, Inc.

New Developments in Die Attach Film Adhesive for RF and MW Application
Kevin Chung, Fred Lo, AI Technology, Inc.

Lunch in Exhibit Hall: 12:30 pm - 1:30 pm

Session 2: Design and Simulation
Chair: Martin Goetz, Northrop Grumman Corporation
2:00 pm - 3:30 pm

RF/Microwave Packaging Trend and Thermal Challenges
Qian "Angel" Han, Huawei Technologies

Enhancing Overall System Functionality and Performance with the Right Packaging Solution
Nozad Karim, Amkor Technology

Chip in Package on Board Simulations for Balanced RF Power Amplifier Design
Marshall Loewenstein, Tony Donisi, ANSYS, Inc.

Coffee Break in Exhibit Hall: 3:30 pm - 4:00 pm

Session 3: RF Packaging Process and Reliability
Chair: Michel de Langen, NXP Semiconductors
4:00 pm - 6:00 pm

NiPdGold Plating Qualification of QFN RF-IC Packages
Mumtaz Y. Bora, Peregrine Semiconductor

Wedge Bonding for RF and Microwave Devices
Lee Levine, Joseph S. Bubel, Hesse & Knipps, Inc.

PCB Creep Corrosion and Board Design Considerations
Jingqiang He, Huawei Technologies

A Low Cost Sniff Testing Method for RF/MW Products
Hakan P. Partal, Syracuse University & Yildiz Technical University

Wednesday, February 8, 2012

Registration: 7:00 am - 6:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Exhibit Hours: 10:00 am - 2:00 pm & 4:00 pm - 6:00 pm

Keynote Presentation: 8:15 am - 9:00 am
Sean Cahill, VP, Technology, BridgeWave Communications, Inc.

Sean Cahill

He will share how to leverage government programs to develop new packaging technology.

Bio: Sean Cahill is VP Technology at BridgeWave Communications, where he is working on next generation millimeter-wave systems. Sean earned his MSEE/Solid State Physics from UC Santa Barbara where he fabricated some of the first surface micromachined MOEMS (Micro-opto-electro-mechanical systems). His undergraduate work culminated in dual BS degrees in ECE/Signals and Systems and Biochemistry/Biophysics from UC Davis. Over his nearly 30 years in industry, Sean has led research and product development efforts focused on micro-fabrication technologies at numerous companies including Exxon Research, NovaSensor, Stanford Research Institute, Teknekron Sensor Development, and Maxim Integrated Products. Sean has served in consulting, advisory, and board member capacities at several Silicon Valley MEMS companies. Sean holds 23 US Patents for micromachined devices addressing many industries including automotive, process control, semiconductor, medical, and communications fields. His released products include a catalytic gas sensor microheater for GasTech; a high-sensitivity capacitive pressure sensor for Omron; scanning force microscope probes with sharpest tips available (Science, 260, pp.1451) for Tencor, and inertial measurement sensors for several companies. He is founder and co-chair of MEPTEC MEMS Symposium, which is now in its 10th year, editor of a book on microelectronics packaging (ISBN 978-1-4419-0983-1) and has been a Principle Investigator on multiple government research and development grants across multiple agencies.

Session 4: Thermal Management
Chair: Dr. Qian "Angel" Han, Huawei Technologies
9:00 am - 11:00 am

Functional Fillers Add Versatility to Silicone Elastomer Systems in Extreme Environments
Michelle Velderrain, Vincent Malave, NuSil Technology, Inc.

Thermal Pyrolytic Graphite Composite with Coefficient of Thermal Expansion Matching for Thermal Management in RF Electronics
Wei Fan, Xiang Liu, John Mariner, Momentive Performance Materials Inc.

Break in Exhibit Hall: 10:00 am - 10:30 am

A Quantitive Oil Bleeding Evaluation Method for Thermal Conductive Gap Pads in Telecom Industry
J. Q. Zhao, J. B. Shen, W. T. Wan, K. Bruzda, Laird Technologies, Thermal BU; Y. Xu, R. Zhao, HuaWei Technologies

Session 5: Academic Research
Chair: Casey Krawiec, Gel-Pak/Quik-Pak
11:00 am - 3:00 pm

Thermal Characterization and Modeling for System on Chip Packages
Justin Deguzman, James Gilstrap, Brian Fang, Jianbiao Pan, California Polytechnic State University

Reliability Analysis of Low-Silver BGA Solder Joints using Four Different Failure Criteria
Erin Kimura, California Polytechnic State University

Lunch & General Presentation in Exhibit Hall: 12:00 pm - 1:00 pm

Artificial Photosynthesis - "Turn Plant Power to Power Plant"
Ke Sun, Deli Wang, University of California, San Diego

Interactive Session with Premier Sponsors in Exhibit Hall: 1:00 pm - 2:00 pm

Session 5: Academic Research - Continued
Chair: Casey Krawiec, Gel-Pak/Quik-Pak

High Frequency Signal Propagation in Through Silicon Vias
Srinidhi Raghavan Narasimhan, A. Ege Engin, San Diego State University

Printed Impedance Elements by Micro-Dispensing
Ubaldo Robles, Harvey Tsang, Paul Deffenbaugh, Raymond C. Rumpf, University of Texas at El Paso

Virtual Ground Fence for Power Filtering on IC Packages and Printed Circuit Boards
Jesse Bowman, A. Ege Engin, San Diego State University

Reception & Student Award Ceremony in Exhibit Hall: 4:00 pm - 6:00 pm

Upcoming Webinars - Registrations Opening Next Week    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on
Guide to Component Chip Attach - Including Flip Chip - DETAILS SOON
Presented by: Phillip Creter, Creter and Associate
This two-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, February 21 and 28, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Space and Military Standards for Hybrids and RF Microwave Modules
Presented by: Tom Green, TJ Green Associates, LLC
This two-session on-line Professional Development Course (PDC) webinar will be held Thursday, February 23 and Friday, February 24. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Wire Bonding - DETAILS SOON
Presented by: Lee Levine, Process Solutions Consulting
This four-session on-line Professional Development Course (PDC) webinar will be held Tuesday, March 20, Thursday, March 22, Tuesday, March 27, and Thursday, March 29, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Rheology Issues in Electronic Packaging
Presented by: Dr. Jeff Gotro, InnoCentrix, LLC
This three-session on-line Professional Development Course (PDC) webinar will be held Thursdays, April 5, 12 and 19, 2012. All webinars will be held 12:00 noon - 1:00 pm EASTERN

PDC Webinar Series on
Electrical Test Strategies for High-Density Packages
Presented by: Bruce Kim, University of Alabama
This three-session on-line Professional Development Course (PDC) webinar will be held Tuesdays, April 10, 17 and 24, 2012.. All webinars will be held 12:00 noon - 1:00 pm EASTERN

Corporate Webinar on Hi-Rel/Accuracy for Military Applications (TBD) - DETAILS SOON
The corporate webinar will be held Tuesday, May 15, 2012, from 12:00 noon - 1:00 pm EASTERN.
The webinar is Sponsored and Presented by: Palomar Technologies, Inc.


  Chapter Activities (events listed in chronological order)

NEXT WEEK: Northern California Chapter February 1 Lunch Meeting on 2.5D and 3D Packaging Challenges    ^ Top

Date: February 1, 2012

David’s Restaurant, Banquet & Conference Facility
5151 Stars & Stripes Drive
Santa Clara, CA 95054


11:30 AM - 12 PM Registration & Networking
11:30 AM - 12:15 PM Buffet Luncheon
12:15 PM - 1:00 PM Speaker Presentation


IMAPS Members $25; non-members $30; students (with ID) $15. Price includes lunch & program. SPACE IS LIMITED! So guarantee your lunch seating by pre-registering soon!

Please RSVP by e-mailing Roger Underwood at before COB Monday January 30. Registrations will be confirmed via e-mail. Only cash and checks are accepted at the door.

2.5D and 3D Packaging Challenges
Ron Huemoeller, Senior Vice President Adv. 3D Products, Amkor Technology, Inc.

This presentation will discuss the challenges and opportunities for high density 3DIC Through Silicon Via (TSV) product technologies in the semiconductor industry. TSV product technology offers significant opportunity in the advanced product sector of the semiconductor industry as compared to traditional System on Chip (SOC) methods for packaging die. The first part of this presentation will focus on the opportunities provided by TSV product technology in the following key areas: performance and power improvement, form factor reduction and in cost reduction at the system level. The second part will focus on the challenges remaining in bringing this new product technology to high volume production. Particular focus will be given to the issues surrounding supply chain constraints as well as the issues associated with current state of the art approaches to completing the die stacking of these complex package structures. The assembly of these complicated die stacks requires new materials and process techniques to produce not only functional but also reliable packages. This includes multi‐die stacking on Interposers as well as some of the demands on Interposer technology. As the assembly process will ultimately influence mechanical, electrical and thermal performance, special consideration must be given to the process methodology chosen.

Presenter Bio:
Ron has 20+ years of experience in the semiconductor industry in advanced product development. He is currently Sr. Vice President of Adv. 3DIC at Amkor Technology. Prior to Amkor, Ron was Head Engineer/Director of Engineering at Cray Computer Corporation in Colorado Springs, where state of the art super computers were developed. He has authored numerous technical publications, co‐authored the chapter on ‘Assembly and Test Aspects of TSV Technology’ in the Handbook of 3D Stacking (McGraw Hill) and has been granted more than 50 U.S. patents. Ron holds a BS in Chemistry from Augsburg College, a MBA from Arizona State University, and a Master’s in Technology Management from the University of Phoenix.

NEXT WEEK: France Chapter Hosting the 7th Advanced technology Workshop on Micropackaging and Thermal management workshop in La Rochelle    ^ Top

Date: February 1-2, 2012



We are pleased to open the Call for Papers of the 7th Advanced Technology Workshop on Micropackaging and Thermal Management which will be held in La Rochelle in February 2012. This yearly conference has grown year after year by the number of presented papers and attendees.

The workshop sessions will include the following topics:

  • Cooling solutions for microelectronics packaging,
  • Micro-cooling solutions,
  • Heat conductive materials at chip, board, sub-system and system levels,
  • Advances in PCBs for thermal management
  • Thermal modeling and simulation,
  • Heatsinks, heatpipes and other cooling products,
  • Liquid and phase change cooling,
  • New cooling solutions,
  • Overviews or examples of products, systems cooling, power electronics, automotive transport,...
  • Thermal management of optoelectronics components (LEDs, IR sensors...),
  • Reliability of electronic components across extended and changing temperature ranges.

Speakers are required to pay a reduced registration fee (441.47E excluding VAT including hotel accommodation for 2 nights and meals) and are also requested to attend the entire workshop to maximize opportunities for interaction with registered attendees.

TABLE TOP EXHIBITION (limited number, first come first served basis): 1 table, 2 chairs 1 panel. Presentation of your activity, your latest products and results (only for companies in relation to thermal management), 300E excluding VAT.

Please respond to Florence Vireton by e-mail:, by fax : +33 (0) 1 39 02 71 93

New England Chapter February 7 Technical Meeting    ^ Top

Date: February 7, 2012

Courtyard By Marriott Marlborough
75 Felton Street
Marlborough, MA


5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Buffet Dinner
7:15 PM Chapter Introductions & Announcements
7:30 PM Technical Presentation


Meeting & Dinner Cost:
$30.00 (Non-Member), $25.00 (Member), $20.00 (Retired/Unemployed), $10.00 (Student)

SEND NO MONEY! BRING checks payable to “IMAPS New England”
Pre-Registration deadline is Thursday, February 2.

E-Mail: Jennifer Bailey or call 781-696-9369

After February 2, you must register at-door. At-door registration is an additional $5.00 [ Limited Availability ] If you fail to cancel by noon on Friday [2/3] The Chapter will bill you for the registration fee.

Novel "Quilt Packaging" Technology Enables 3D Multi-Die RF Modules to Emulate Monolithics

To maintain the pace of innovation projected by Moore’s Law, technologists have been focused on modifying or extending current technologies into so-called 3D packaging (Through-Silicon-Via, Wafer Level Packaging, die stacking), but significant obstacles, such as thermal dissipation, CTE mismatches etc. continue to limit wide-spread adoption. “Quilt Packaging™” is a direct, edge-interconnect technology that has achieved less than 0.1 dB of insertion loss from 50 MHz to over 100 GHz. Quilt Packaging or “QP” enables multiple die from disparate materials and/or processing technologies to be integrated into a monolithic-like system that performs as if created as a single chip… with significant potential in MEMs integration, power management, and large-format imaging array applications.

Jason Kulick is an experienced research engineer in the semiconductor and MEMs arena, and founded IIC along with Dr. Gary H. Bernstein. Combining project management and research expertise, Mr. Kulick led the creation of IIC through its spin-out from the University of Notre Dame, subsequent patent licensing, and initial investment funding stages. Mr. Kulick is a Principal Investigator on IIC research projects and oversees day-to-day operations. He is a graduate of the University of Notre Dame with a degree in Electrical Engineering.

Arizona Chapter February 16 Luncheon on 2012 and 5-year Electronics and Semiconductor Market Outlook; Facing Macro-economic Headwinds    ^ Top

Date: Thursday, February 16, 2012

Dobson Ranch Inn, Mesa AZ


Luncheon and presentations - $20.00 in advance for members / $25.00 in advance for non-members / $30 at door.

Register On-line by February 14th.  

Registration and exhibits will open at 11:30
Lunch and presentation will be from noon to 1:00pm
Exhibits close at 1:30

2012 and 5-year Electronics and Semiconductor Market Outlook; Facing Macro-economic Headwinds

Bill McClean
President, IC Insights

This presentation will be a review of the 2012 global economic outlook and the impacts on the electronics and semiconductor markets. Bill will discuss some of today's big questions including:

  • Will GDP and IC growth correlations still hold?
  • Where are we in the IC market cycle?
  • Why 2012 could surprise on the upside!
  • What is happening to IC average selling prices?
  • How will IC unit shipments grow over the next 5 years?
  • What are the capital spending and capacity trends?
  • What are the key IC product trends and new development?
  • What are the key IC packaging trends and technologies?

About Our Speaker:

Bill McClean - President - IC Insights Prior to forming IC Insights, Mr. McClean worked at ICE Corporation for 17 years--the last 10 as Vice President of Market Research. With 32 years of experience tracking the IC industry, Mr. McClean has become a well-known authority on market and technology analysis and forecasting. He specializes in tracking global economic conditions, developing IC market forecasts, analyzing capital spending and fab capacity trends, researching ASIC markets and technologies, and following emerging markets for ICs such as cellular phones.

Mr. McClean serves as contributor and managing editor of IC Insights' studies and other products. In addition, he instructs for IC Insights' seminars and has been a guest speaker at many important annual conferences held worldwide.

Mr. McClean has a Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

Exhibit with us!
Exhibit at any of our AZ luncheons for $100 Includes:
- 6ft Tabletop for your display
- Company promotion via links from our invitations and the AZ Chapter website to your company website
-lunch for one attendee

If you'd like to exhibit, please contact

ICEP-IAAC 2012 Being Held in Tokyo    ^ Top

Date: April 17-20, 2012

Tokyo Big Sight, Tokyo, Japan


Submitting an abstract site:

Sessions and Keywords:

1. Advanced Packaging Area Array Packages, SiP, PoP, PiP, Wafer Level Packaging, System Integration, LCD Modules, MCM, System on Package

2. Substrate Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE, Thin Film Wiring

3. Design, Modeling, and Reliability Signal Integrity, Power Integrity, High Speed Board Design, Reliability, Failure Analysis, Testing, Evaluation, EDA

4. Thermal Management Advanced Cooling Modules, Fans and Blowers, Heat Pipes, Heat Sinks, Micro and Nano Scale Heat Transfer, Optical Devices, Power Devices, Thermal Interface Materials, Thermal Measurements, Thermoelectrics

5. Manufacturing and Process Flip Chip, Plating, Inkjet, Process Control, Equipment, Thin Films, Underfills, Encapsulation, Molding, Fluxes

6. Interconnection Flip Chip, Wire Bonding, Soldering, Bump Formation, Chip Package Interaction, Low k, NCF/NCP, ACF/ACP, Leadframe, Surface Finishes, BGA, Fluxless Joining

7. Optoelectronics Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

8. Printed Electronics Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFT, Device Applications

9. 3D and TSV Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV, Via Formation and Filling, Wafer Thinning, Wireless Interconnection, 3D LSI Design and CAD System

10. MEMS/Sensor MEMS/Sensor Devices, Process, Assembly and Packaging, System Integration, MOEMS

11. Self-organization/Self-assembly Nano Materials/Devices, Self-organization/Self-assembly, Dissipative Structures, Hierarchical Structures, Bottom-up Manufacturing Bio-mimetic, Nature-oriented Processes/Design/Applications

12. Emerging Technologies Nano Technology, Nano Imprint, Organic Semiconductors

13. RF RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas

14. Automotive Electronics Power Devices, Power Electronics, ECU, Sensors, Lead Free Solder, Wire Harness

15. Energy and Environment PV, Lead Free, Fuel Cells, Power Electronics, Power Devices, Energy Efficient Package Design

16. Metrology Current Density, Power Map, Thermal Map

17. Others Market Trends, Environmentally Conscious Product and Processes, Cost Analysis

Best Paper Awards : The JIEP will present the Best Paper Awards to selected outstanding papers.

Young Awards : The IEEE CPMT Society Japan Chapter will present the Young Awards to young parson under 35 years old.

Organizing Committee : General Chair: Yasumitsu Orii (IBM Japan) Vice General Chair: Yasuhiro Ando (Fujikura), Yoshio Nogami (Toray Engineering), Shintaro Yamamichi (Renesas Electronics)

Technical Program Committee : Chair: Shintaro Yamamichi (Renesas Electronics) Co-Chairs: Masahiro Inoue (Osaka University), Hitoshi Sakamoto (NEC), Shoji Uegaki (ASE Marketing & Service Japan), Hiroshi Yamada (Toshiba)

New England Chapter's 39th Symposium & Expo - Program Available Soon    ^ Top

IMAPS New England – 39th Symposium & Expo
The Largest Regional Symposium Dedicated to
Microelectronics and Electronics Packaging

May 8, 2012
Holiday Inn – Boxborough Woods Conference Center, Boxborough, Massachusetts

The New England Chapter Symposium Technical Program Committee is planning sessions in the following areas:


  • Biomedical Electronics
  • Telecom - Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal  Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Imaging Sensors
  • Emerging Technologies

Advanced Processes & Materials

  • 3D and High Density Packaging
  • Photonic/ Optoelectronic Packaging
  • LED Packaging
  • MEMS and Nano Packaging
  • Underfill/ Encapsulants and Adhesives
  • Green Packaging / Compliance with RoHS
  • Flip-Chip and Bumping: Processes, Reliability
  • Wire Bonding and Stud Bumping
  • Embedded and Integrated Passives
  • Ceramic, Polymer and Conductive Materials
  • Cu/ Low-K

Symposium Technical Chair: Roger S. Benson
International Rectifier, Leominster, MA

Program Questions?
Phone: 978-514-5825

----- also -----

SIX Lecture Sessions, Full Poster Session,
Employment Center and an 80 Booth Exhibit Hall
For details about Sponsoring, Exhibiting or Attending

Contact Harvey Smith: or Call 508-699-4767

LORD Corporation

RGL Enterprises


Crane AE Banner

RF/Microwave Packaging
February 7-9, 2012
San Diego, CA

3D and Conformable Printed Electronic Packaging Materials, Manufacturing & Applications
February 22-24, 2012
El Paso, TX
*Exhibitors contact

8th International Conference and Exhibition on Device Packaging
March 5-8, 2012
Fountain Hills, AZ
*Exhibitors contact

Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2012)
April 16-19, 2012
Erfurt, Germany

High Temperature Electronics (HiTEC)
May 8-10, 2012
Albuquerque, NM
*Exhibitors contact

IMAPS 2012 (San Diego)
September 9-13, 2012
San Diego, CA
*Exhibitors contact

^ Top





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