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November 6, 2012
 

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   IMAPS EVENTS
Button Device Packaging 2013 - Abstracts Due November 16 and Booths Now Available (read more...)

Button Thermal Management Workshop Begins Next Week - Still Time to Register...Tabletops SOLD-OUT (read more...)

Button Upcoming Webinars - Polymers in Semiconductor Packaging NEXT WEEK (read more...)

Button Abstracts Due November 16 for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) (read more...)

Button Workshop on Digital Printed Circuit Structures - Abstracts Due, Tabletops Available (read more...)

Button IMAPS Supporting the 2nd Annual IEEE Global Interposer Technology (GIT) Workshop at Georgia Tech (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet TOMORROW: New England Chapter Joint Facilities Tour & Open House - November 7 (read more...)

Bullet THIS THURSDAY: Indiana Chapter Facility Tour, Dinner, and Presentation on November 8 (read more...)

Bullet Program and Registration now Open for IMAPS France Medical Workshop (read more...)

Bullet 2nd Southeastern Microelectronics Packaging Conference (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Call For Papers (read more...)

 

Palomar Technologies

COHERENT
Master Bond
QSIC

 

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Device Packaging 2013 - Abstracts Due November 16 and Booths Now Available    ^ Top
IMAPS 9th International Conference and Exhibition on Device Packaging will be held at the Radisson Fort McDowell Resort in Fountain Hills, Arizona from March 11-14, 2013.Visit www.imaps.org/devicepackaging to submit your abstracts, to propose a short-course, or for exhibit details.

Device Packaging 2012 was another great conference. The exhibit hall sold again for the 7th consecutive year. We saw an increase in attendance with more than 560 participating in 2012. Abstracts are now being accepted for 2013. 8x10 exhibit booths are also available. We are again limited to 65 booths and expect to sell-out EARLY for the 8th consecutive year. Contact Brian Schieman at bschieman@imaps.org with any questions or if you wish to speak, attend, sponsor and/or exhibit.

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2013 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 4 topical workshop areas related to microelectronic packaging:

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 25, 2013. A post-conference USB or CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. A maximum of 65 full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. For an exhibit application and questions, please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 11th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 no later than November 16, 2012.

Thermal Management Workshop Begins Next Week - Still Time to Register...Tabletops SOLD-OUT    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibit on Thermal Management will be held at the Toll House in Los Gatos, California from November 12-14, 2012.Visit www.imaps.org/thermal to view the program, or register to attend.

Thank you to the Workshop Premier Sponsor:
Corporate Sponsor - Bergquist Company

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems.

Upcoming Webinars - Polymers in Semiconductor Packaging NEXT WEEK    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates
Wednesday, November 7 and Thursday, November 8, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Polymers in Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC
Tuesdays, November 13, 20 and 27, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Microelectronic Packaging Issues and Failure Analysis
Tom Green, TJ Green Associates, LLC
RESCHEDULED DATES
Tuesday, December 18 and Wednesday, December 19, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates
RESCHEDULED DATES
Tuesday, January 29 and Thursday, January 31, 2013 - 12:00pm-1:00pm EASTERN

Abstracts Due November 16 for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013)    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. Abstracts are now due November 16, 2012. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.cicmt.org to submit abstracts, reserve a tabletop or register to attend.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due November 16, 2012
Notice of Acceptance: December 3, 2012
Final Manuscripts Due: February 15, 2013

Please send your 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-202-548-8715 (USA).

Workshop on Digital Printed Circuit Structures - Abstracts Due, Tabletops Available    ^ Top
IMAPS Advanced Technology Workshop & Tabletop Exhibition on Digital Printed Circuit Structures: Materials, Manufacturing & Markets will be held February 20-21, 2013, at the Hilton Garden Inn in El Paso, Texas . Abstracts are due November 20, 2012. Tabletops are now open - only 6 will be available for this workshop! Visit www.imaps.org/printed to submit abstracts, reserve a tabletop or register to attend.

The objective of the Digital Printed Circuit Structures Workshop and Symposium is to provide a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who work in the area of 2D and 3D digital manufacturing, printed electronics and additive manufacturing as an emerging electronic packaging technology. This workshop enables discussion and presentations on the latest materials, process, design & emerging applications of printed electronics technology.

  • 3D & Additive Manufacturing
  • Digital Printing / Deposition Technologies
  • Nanomaterials, inks & epoxies
  • Printed devices - Active and passive
  • Thin & printable battery technology
  • Membrane and capacitive switches
  • Novel die interconnect
  • Cyber Design / Direct Digital Manufacturing
  • Paper based, PET & PVC substrate media
  • Printable display & lighting
  • Thin and ultra miniature components
  • Design, Simulation and Modeling
  • Applications and new markets
  • Convergence of Graphics & electronics

Those wishing to present at the Advanced Technology Workshop must submit a 200-300 word abstract electronically no later than November 20, 2012. Abstracts can be submitted using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than January 18, 2013.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

IMAPS Supporting the 2nd Annual IEEE Global Interposer Technology (GIT) Workshop at Georgia Tech    ^ Top
IMAPS is supporting the 2nd Annual IEEE Global Interposer Technology (GIT) Workshop at Georgia Tech. The workshop will be held November 14-16 at the Georgia Tech Hotel and Conference Center in Atlanta, Georgia.

The Global Interposer Technology (GIT) 2012 Workshop is intended to stimulate and disseminate the development of a wide variety of interposers such as silicon, glass and others. The GIT brings together academic and industry researchers as well as technology developers, users and manufacturers from around the globe. Such a technology is seen as, not only for packaging of ICs and 3D ICs, but also as a future ultra-miniaturized platform for entire smart mobile and high performance systems. For more information or to register on-line, visit: www.prc.gatech.edu/git2012.

  Chapter Activities (events listed in chronological order)
 

TOMORROW: New England Chapter Joint Facilities Tour & Open House - November 7    ^ Top

Date: November 7, 2012
Location:

National Technical Systems (NTS)
1146 Massachusetts Avenue
Boxborough, MA
You Must be a U.S. Citizen or Green Card Holder to Attend this Event

Details:

ALL PRE-REGISTRATIONS will be done On-Line Click Here for Event Details & Registration
There is a limit of 80 participants. Register Early!!
Late registration is an additional $5.00 [Limited Availability]
The Cost is $15.00 for All Members of SMTA, IMAPS or IEEE – Non Members pay $5.00 more.
You must Pre-Register. There will be no at-door registration.

If you make a reservation & can't come, notify us by COB Monday, November 5th. OR you will be billed for your registration fee!
To Cancel, E-mail Minh Tran mtran@mini-systemsinc.com
If you have difficulty registering On-Line, E-mail your details to Minh Tran mtran@mini-systemsinc.com

Check www.imapsne.org for updates

SCHEDULE: (times approximate):
5:30 PM Registration, Socializing, Pizza Buffet
6:15 PM NTS Overview
7:00 PM Tours & Seminars

OVERVIEW:
NTS is an engineering-testing facility, supporting commercial, defense, and telecommunications programs for ground, aircraft, shipboard, and submarine applications. With two new buildings and a state-of-the-art 10 meter anechoic chamber, capabilities include EMI/EMC, radiated-magnetic emissions, harmonics, electrical power, airborne noise, ESD, power fault, lightning simulation and ESD up to 25kV plus immunity testing up to 200v/m from 10kHz to 40GHz.

Extensive climatic and environmental test capabilities are available, as well as custom test set ups for hydraulic testing and FAA fire testing. Environmental testing disciplines include: independent and combined thermal, humidity and altitude, salt fog, wind driven rain, fire, icing, thermal, vacuum and explosive atmospheres. The large scale dynamics laboratory includes electro-dynamic shaker systems, shock towers and seismic systems including independent triax, acceleration, shock, static and dynamic loading capabilities.

THIS THURSDAY: Indiana Chapter Facility Tour, Dinner, and Presentation on November 8    ^ Top

Date: November 8, 2012 - Begins 4:00 PM EST
Location:

VACCINE Center is at 101 North Grant Street. West Lafayette, IN 47907

The Trails is at 325 Burnetts Road. West Lafayette, IN 47906

Details:

Registration Fees:
IMAPS Members $20.00. Non-Members $25.00

Advance reservations will be accepted until 4:00 pm on Tuesday, November 6th. Please contact Ray Fairchild at 765-451-1068 or m.ray.fairchild@delphi.com.

4:00 VACCINE Tour
5:30 Travel to The Trails
6:00 Dinner
7:00 Presentation
7:30 Chapter Meeting to 8:00

Tour and Demonstration of VACCINE Center
Tour of Visual Analytics for Command, Control, and Interoperability Environments By Sally Luzader, Assistant Director of Engagement & Education Purdue University, www.purdue.edu/discoverypark/vaccine

VACCINE Center Tour
VACCINE is dedicated to creating methods and tools to analyze and manage vast amounts of information for all mission areas of homeland security. This mission is accomplished through an integrated program of research, education and technology transition, spanning the disciplines of visualization and computer graphics, engineering, computer science, geographic information systems, cognitive psychology, information technology, and emergency management and public safety. Established in 2009 (and our country’s newest DHS Center of Excellence), VACCINE was created to develop interactive visualization and analytical tools to help our country’s 2.3 million+ extended homeland security personnel understand an ever-growing sea of data. VACCINE focuses on the education, research, development, and deployment of new tools and technologies that communicate and disseminate information to first responders and decision makers. These technologies allow them to make sense of the massive amounts of homeland security data that they face every day, and make decisions accordingly. Powered by advanced analytics, VACCINE tools provide interactive visual displays of essential, relevant information. Solutions are provided on mobile phones to desktops to wall-sized displays. Their goal is to help people become more effective and efficient in making decisions and solving problems by turning this data flood into a powerful resource.

Dinner Presentation (See Abstract and Bio Below)
“Adaptive RF Technologies.”
Dr. William Chappell, DARPA Program Manager

The Adaptive RF Technology (ART) is a DARPA program that aims to significantly advance the hardware used in handheld communication radios by developing a fully adaptive and reconfigurable architecture that is agnostic to specified waveform and standards; i.e., ART-enabled radios will be able to cognitively choose to operate in any frequency band with any modulation and multiple access specification depending on the restrictions of the environmental and operating conditions. The program intends to demonstrate a reconfigurable RF front-end covering a frequency range of less than or equal to 10 MHz to greater than or equal to 30 GHz and capable of identifying, receiving and/or transmitting more than 100 military and commercial waveforms specified over this range on the fly, with a projected size, weight, and power consumption that is significantly smaller than currently available hardware. This front-end will consist of fully waveform-agile channels and analog-sensing channels designed to detect and identify waveforms over the spectral field of regard.

William Chappell joined DARPA as a program manager in July 2011. His interests include advanced packaging, adaptable RF systems, and antenna arrays. Dr. Chappell came to DARPA from Purdue University, where he served as an associate professor in the Electrical and Computer Engineering (ECE) department. His research focus has been on wireless components, specifically the unique integration of RF and Microwave components based on electromagnetic analysis. This has ranged from advanced RF sensors such as miniature RF Ion Trap Mass Spectrometry to advanced digital-at-every element antenna arrays. A particular focus has been the development of adaptable RF systems, particularly focusing on the tunable pre-selects filters. He has shown the ability to design a single RF system that is adaptable to numerous application areas and/or adjust to dynamic changes within the spectral environment.

Program and Registration now Open for IMAPS France Medical Workshop    ^ Top
The 1st Workshop on Advanced Technology on Microelectronics, Systems and Packaging for Medical Electronics will be held on December 4-5 in Paris, France. For full program details, questions and to register, please contact:

Florence Vireton - Tel.: +33 (0) 1 39 67 17 73
E -mail: imaps.france@imapsfrance.org - Web site: www.imapsfrance.org

CONFERENCE SCHEDULE:

December 4, 2012 (Tuesday)
12:00 pm Registration

01:00 pm Conference Opening J.M. Yannou, President of IMAPS-France

01:00 – 01:30 pm Endoscopy and X-Ray image sensors markets
BREUSSIN Frédéric, YOLE Developpement

SESSION : MARKETS
02:00 – 02:30 pm Evaluation et prise en charge des
DM, SNITEM

02:30 – 03:00 pm Intelligent implants for diagnosis and therapy
Dr. A. STETT, NMI Natural and Medical Sciences Institute at the University of Tuebingen

03:00 – 03:30 pm Active Implant Medical Devices (AIMD) market and challenges
Renzo DAL MOLIN, SORIN CRM group

03:30 – 04:00 pm Coffee Break

SESSION : INDUSTRIAL - APPLICATIONS
04:00 – 04:30 pm Integration and miniaturization of electronic connectors for medical devices (Titre provisoire)
L. GODIN, HighTec

04:30 – 05:00 pm A high performance telemedicine platform
HYPERMED

05:00 – 05:30 pm COCHLEAR (NXM) – Alain Ripart contact lundi

December 5, 2012 (Wednesday)
08:30 am Opening ATW

09:00 am Opening address: A. VAL, General Chairman of IMAPS MEDICAL

SESSION 1 APPLICATIONS
Chairs : A. RIPART (SORIN Group) / F. BREUSSIN (YOLE Développement)

09:00 am Chip in the Tip ultra-compact cameras for endoscopic applications
E. BECKERT, Fraunhofer-Institute for Applied Optics and Precision Engineering, Germany

09:30 am Three-dimensional micro-packaging with high-density hermetic feedthroughs for implantable applications
T.S. SRIRAM, The Charles Stark Draper Laboratory, Cambridge, MA, USA

10:00 am Biocompatible multielectrolyte sensors for artificial kidney
J. FILS, CEA-LETI, France

10:30 am – 11:00 am Coffee break

SESSION 2 SENSORS
Chairs: B. SAYAG (CICOR Microelectronics) / S. BELLENGER (IPDIA)

11:00 am Integrated planar polymer waveguides for medical applications
Dr. F. BETSCHON, Vario-optics ag, Germany

11:30 am Self-carried implant for wireless transmitting of vital diagnosis parameters
A. CHARBELA, VectraWave, France

12:00 pm Measurement system for investigation of foot pressure distribution on the ground in dynamic conditions
E. KLIMIEC, Institute of Electron Technology Cracow Division, France

12:30 pm – 2:00 pm Lunch

SESSION 3 PACKAGING
Chairs: C. VAL (SiP Packaging) / G. SIMON (CEA-LETI)

02:00 pm The novel thin flexible PCB module for 3D packages
B. ZHANG, Institute of Microelectronics Chinese Academic of Sciences, China

02:30 pm Embedded UTCP interposers for miniature smart sensors
T. STERKEN, CMST (Affiliated with IMEC and Universiteit Gent), Belgium

03:00 pm Electronic packaging technologies for advanced medical device applications
F.D. EGITTO, Endicott Interconnect Technologies, USA

03:30 pm 3D technology for advanced medical devices applications
P. COUDERC, 3D PLUS, France

04:00 pm – 04:30 pm Coffee break

SESSION 4 RELIABILITY
Chairs: A. VAL (3D PLUS) / B. BRAUX-TOUCHAT (EADS-ASTRIUM)

04:30 pm Biostability and corrosion resistance of a biocompatible encapsulation and Interconnect technology for implantable electronics
M. de BEECK, IMEC, Belgium

05:00 pm Reliability studies of anisotropically conductive adhesive joined Flip Chip Components with conformal coatings
K. KOKKO, Tampere University of Technology, Finland

05:30 - 06:00 pm End of session / Final Coffee / Departure.

2nd Southeastern Microelectronics Packaging Conference    ^ Top

Date: February 28, 2013
Location:

Rosen Centre Hotel
9840 International Drive
Orlando, FL 32819

Details:

Abstracts Deadline November 23, 2012
Submit Abstracts On-Line
Please email Doug Bokil - dbokil@bokil.com with questions

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging. Topics of interest for submission include, but are not limited to:

  • 2.5D / 3D Packaging
  • Flip Chip and Wafer Bumping Processes
  • MEMS Packaging
  • Wire Bonding / Stud Bumping
  • LED / Optoelectronic / Photonic Packaging
  • Underfill / Encapsulants / Adhesives
  • Printed Electronics Technology
  • Design for Manufacturing / Test / Reliability
  • Substrate / PWB Technology
  • Testing of High Density & Microelectronic Assemblies
  • Thermal Management Solutions
  • Non-Hermetic Packaging for Harsh Environments
  • Embedded Device Packaging
  • Pb-Free Solder and RoHS Compliance
  • Microwave & RF Applications
  • Counterfeit Electronics Detection

Those wishing to present a paper at the Southeastern Microelectronics Packaging Conference must submit a 250-300 word abstract on-line at www.imaps.org/abstracts.htm no later than November 23, 2012.

This all day conference will have table top exhibits. Register On-Line.

Exhibitors: Table top $450.00 Please email Doug Bokil - dbokil@bokil.com with questions.

New England Chapter's 40 Symposium & Expo - Call For Papers    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to: Jim McLenaghan, AJM@Creyr.NET for more details visit us at: www.imapsne.org

Deadline for Abstract Submission – Monday December 31, 2012

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

CALL FOR PAPERS

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation, LLC

The Largest Regional Symposium Dedicated to Microelectronics and Packaging

Tuesday May 7th, 2013
----- Featuring -----
Six to Eight Lecture Sessions, Full Poster Session,
Employment Center & 80 Booth Exhibit Hall

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Medical Electronics
  • Lasers
  • Telecom – RF & Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal & Power Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Sensors (Manufacturing & Applications)
  • Emerging Technologies
  • Solar, Photovoltaic
  • Aerospace
  • Electronics for Environmental Impact Measurement & Assessment

Advanced Processes & Materials

  • 3D, SiP, and High Density Packaging
  • Nano Materials - Mfg., Applications, & Safety
  • Photonics, Optoelectronics, LED Packaging
  • MEMS and Nano Packaging
  • Underfill - Materials, Applications, Effectiveness
  • Green packaging - Regulation Compliance, Materials, Processes, Recycling
  • Flip-Chip and Bumping Processes & Reliability
  • Wire-bonding and Stud-Bumping
  • Embedded Components – Passives, Magnetics
  • Ceramic, Polymer and Conductive Materials
  • Cu, Low-K
  • Product DFR & DFM Tools, Programs, Implementation
  • Materials Deposition & Delivery - Print, Vapor, Dispensing, Placement, etc.

 

Quik-Pak

LORD Corporation

RGL Enterprises

EPP

Crane AE Banner

2012 Events:

Thermal Management
November 12-14
*Exhibitors contact bschieman@imaps.org

Medical Applications (IMAPS France) - Dec. 4-5


2013 Events:

Wire Bonding
January 22-23

Digital Printed Circuit Structures
February 20-21
*Exhibitors contact bschieman@imaps.org

Southeastern Microelectronics Conference
February 28

Device Packaging
March 11-14
*Exhibitors contact bschieman@imaps.org

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

^ Top

 

Amkor

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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