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October 18, 2012
 

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   IMAPS EVENTS
Button Thermal Management Workshop - Registration Deadline Extended to TOMORROW (Friday, October 19) - Tabletops SOLD-OUT! (read more...)

Button Upcoming Webinars - Microelectronic Packaging Issues and Failure Analysis NEXT WEEK (read more...)

Button Wire Bonding Workshop & Tabletops - Abstracts Still Being Accepted & Tabletops Available Next Week (read more...)

Button Abstracts Due November 2 for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) (read more...)

Button International Conference and Exhibition on High Temperature Electronics Network (HiTEN) Now Open! (read more...)


   CHAPTER ACTIVITIES (events listed in chronological order)
Bullet Chesapeake Chapter October 30 Fall Technical Symposium and Research Poster Contest (read more...)

Bullet Program Soon for IMAPS France Medical Workshop (read more...)

Bullet 2nd Southeastern Microelectronics Packaging Conference (read more...)

Bullet New England Chapter's 40 Symposium & Expo - Call For Papers (read more...)

 

Palomar Technologies

COHERENT
Master Bond
QSIC

 

TJ Green Associates, LLC

 

  IMAPS Events (view full Web Calendar)
 

Thermal Management Workshop - Registration Deadline Extended to TOMORROW (Friday, October 19) - Tabletops SOLD-OUT    ^ Top
IMAPS Advanced Technology Workshop and Tabletop Exhibit on Thermal Management will be held at the Toll House in Los Gatos, California from November 12-14, 2012.Visit www.imaps.org/thermal to view the program, or register to attend.

The Early Registration/Exhibit & Hotel Deadlines has been extended to TOMORROW, Friday, October 19, 2012. IMAPS cannot guarantee room availability and/or rates after the published hotel deadline. Book your rooms directly with the hotel before the deadline noted above.

Thank you to the Workshop Premier Sponsor:
Corporate Sponsor - Bergquist Company

The purpose of this Workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems. The Workshop emphasis is for practical, high-performance solutions intended to meet current and evolving requirements in power electronics, military/aerospace, computing, and telecom systems.

Monday, November 12, 2012

Registration: 1:30 pm - 8:30 pm
Opening Remarks: 1:55 pm - 2:00 pm

Registration, Afternoon Break & Sessions - at OPERA House
Dinner and Evening Session - at TOLL House

Session 1: 2.5D/3D Packaging Thermal Issues
Chair: Vadim Gektin, Futurewei Technologies
2:00 pm - 3:30 pm

Thermal Analysis of xFD DRAM Packages with Rigorous Simulation and Experimental Validation
Ron Zhang, Invensas Corporation (J. Tseng, H. Shaba, E. Chau, W. Zohni, L. Mirkarimi)

Cooling Improvement for Stacked SFP+ Optical Transceivers
Arjan Kole, Electronic Cooling Solutions (Ed Iwamiya)

Stacked Chip Thermal Model Validation Using Thermal Test Chips
Tom Tarter, Package Science Services LLC (Bernie Siegal, Thermal Engineering Associates Inc.)

Break: 3:30 pm - 4:00 pm

Session 2: MCM and SIP Thermal Challenges
Chair: David Copeland, Oracle
4:00 pm - 5:30 pm

On the Difficulty of Measuring the Case Temperature of an Over-Molded IC Package
Guy Wagner, Electronic Cooling Solutions (Arun Raghupathy, Emil Rahim)

Thermal Characterization of a BGA Package Used in the Logic Board of a Handheld Device
Emil Rahim, Electronic Cooling Solutions (William Maltz, Arun Raghupathy, Electronic Cooling Solutions; Weikun He, Mentor Graphics)

Heat Spreading Implications for Hybrid Silicon-Encapsulant Systems-in-Package
Caprice Gray, Charles Stark Draper Laboratory (Brady Caspar, Jason Haley, Peter Kwok, Brian Smith)

Dinner: 5:30 pm - 7:00 pm

Dinner Sponsored by:
Corporate Sponsor - Bergquist Company

Session 3: Thermoelectrics and Vapor Chambers
Chair: George A. Meyer IV, Celsia Technologies
7:00 pm - 8:30 pm

Sub 100 Nanosecond Operation of Thermoelectric Microcoolers
Bjorn Vermeersch, Purdue University (Je-Hyeong Bahk, Ali Shakouri, Purdue University; James Christofferson, Microsanj LLC)

Improved Efficiency of TCPCB-based Thermoelectric Coolers when Cooling Concentrated Heat Loads
Jeff Hershberger, Laird Technologies, Inc (Robert Smythe, Xiaoyi Gu, Rich Hill)

Practical Comparison on Heat Pipes Versus Vapor Chambers in Various Heat Spreading Applications to Show Total Cost vs. Benefit
Christoper A. Soule, Thermshield LLC

 

Tuesday, November 13, 2012

Registration: 8:00 am - 8:30 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibits Open: During Breaks & Lunch
(10:30-11, 12:30-2, 3:30-4)

Registration, Breakfast, Morning/Afternoon Breaks, Lunch, Exhibits & Sessions - at OPERA House
Dinner and Evening Session - at TOLL House

Session 4: High Thermal Conductivity Materials I
Chair: John Peeples, The Citadel
9:00 am - 10:30 am

Transient Operation of Electronics Equipment Subjected to Solar Loading
Ross Wilcoxon, Rockwell Collins

Student
Competition
Presentation

Graphene Heat Spreaders for High-Power GaN Transistors
Zhong Yan, University of California - Riverside (Guanxiong Liu, Alexander Balandin)

Synthetic CVD Diamond - an Enabling Thermal Material
Daniel Twitchen, Element Six

Break: 10:30 am - 11:00 am

Session 5: High Thermal Conductivity Materials II
Chair: Ross Wilcoxon, Rockwell Collins, Inc.
11:00 am - 12:30 pm

Soldering Methods for 6061-T6 Aluminum
William Avery, Superior Flux & Mfg. Co. (Philip Baskin)

Novel Packaging Approach for Moisture Control for Electronic Systems
Ken Credle, Multisorb Technologies

Techniques for Soldering Aluminum Alloys
William Avery, Superior Flux & Mfg. Co. (Yehuda Baskin)

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Session 6: Developments in Thermal Composites
Chair: Marlin Vogel, Juniper Networks
2:00 pm - 3:30 pm

Realizing the Promise of Diamond-Copper Composites for Thermal Management
Todd Johnson, FedTech Group (Sion Pickard, Henry Meeks)

Developments and Applications for Thermal Core PCBs
David Saums, DS&A LLC (R. Hay, MMCC LLC)

Development, Properties, and Applications for a High Thermal Conductivity Sintered Aluminum Material
Richard Hexemer Jr., GKN Sinter Metals (I.W. Donaldson, GKN; L.J.B. Smith, D.P. Bishop, Dalhousie University)

Break: 3:30 pm - 4:00 pm

Session 7: Advances in Thermal Interface Materials I
Chair: Guy R. Wagner, Electronic Cooling Solutions
4:00 pm - 5:30 pm

TIM for CPU Server Applications: High Performance Thermal Conductive Sheets filled with Carbon Fibers
Hiroyuki Ryoson, Dexerials Corporation (Takuhiro Ishii, Keisuke Aramaki)

Non-Silicone Thermal Interface Material Development Strategy
Victor Papanu, AOS Thermal Compounds LLC

Liquid Dispensable TIMs for Electronics Packaging
Ryan Verhulst, The Bergquist Company (Sanjay Misra, Eric Johnson)

Dinner: 5:30 pm – 7:00 pm

Dinner Sponsored by:
Corporate Sponsor - Bergquist Company

 

Session 8: Two-Phase Liquid Cooling
Chair: Tannaz Harirchian, Intel ATTD
7:00 pm - 8:30 pm

Relation of Heat flux Near CHF and Efficiency to Liquid Film Characteristics Using Small Scale Mono-Disperse Sprays
Sergio Escobar-Vargas, Hewlett Packard (Jorge Gonzalez, Drazen Fabris, Ratnesh Sharma, Cullen Bash)

Pumped Two-Phase Cooling Loop for High Heat Flux Thermal Management Applications
Ehsan Yakhshi-Tafti, Advanced Cooling Technologies, Inc. (Xudong Tang)

Electrostatically-Enhanced Boiling of Dielectric Liquids: Effect of Electrostatic Re-wetting
Seyed Reza Mahmoudi, Massachusetts Institute of Technology

 

Wednesday, November 14, 2012

Registration: 8:00 am - 3:00 pm
Continental Breakfast: 8:00 am - 9:00 am
Exhibit Opens: During Breaks & Lunch
(10:30-11, 12:30-2)

Registration, Breakfast, Morning/Afternoon Breaks, Lunch, Exhibits & Sessions - at OPERA House

Session 9: Developments in Liquid Immersion Cooling
Chair: Dave Saums, DS&A LLC
9:00 am - 10:30 am

Data Center Immersion Cooling
Cheryl Tulkoff, DfR Solutions (Chris Boyd, Midas Green Tech)

Design, Fabrication and Operation of a 1.2kW Open Bath Immersion Cooled Server Demo
Philllip Tuma, 3M Company

Investigation of Passive Two-Phase Cooling for High Performance Computers - Preliminary Results from Test Platform
Stephen Polzer, Mayo Clinic (Nathan Harff, Matthew Kueper, Wendy Wilkins, Barry Gilbert, Erik Daniel)

Break: 10:30 am - 11:00 am

Session 10: System-Level Cooling
Chair: Marlin Vogel, Juniper Networks
11:00 am - 12:30 pm

Fresh High Performance, Low Noise Air Cooling Technologies
Roger Dickinson, Bergquist Torrington

SynJets for Forced Air Cooling for Outdoor Telecom Equipment
Raghav Mahalingam, Nuventix (Brad Bringhurst, Andrew Poynot, Markus Schwickert)

Technologies and Tools Enabling Chip-to-System Co-Design of Electronics
Kamal Karimanal, Cielution LLC

Lunch: 12:30 pm - 2:00 pm
(Lunch served 12:30 pm - 1:30 pm)

Session 11: Advances in Thermal Interface Materials II
Chair: Niru Kamari, HP Labs.
2:00 pm - 4:00 pm

Experimental Investigation of Temperature-current Rise in Embedded PCB Traces
Konstantin Petrosyants, Moscow Institute of Electronics and Mathematics (Anton Popov)

Student
Competition
Presentation

Carbon Nanotube Sheet Metal Matrix Composites as Die Attach Thermal Interface Materials
Cristal Vasquez, Georgia Tech (Baratunde Cola)

Thermal Interface Material with Controlling Graphite to Line Vertically and Some Thermal Management Materials
Rei Yamamoto, Hitachi Chemical Co.,Ltd.

Component Compact Modeling in High-power Applications
Herman Chu, Cisco Systems, Inc

Closing Remarks: 4:00 pm

Questions:  Contact Brian Schieman with questions bschieman@imaps.org or 202-548-8715. You may also contact the workshop chairs.

Register On-Line

Upcoming Webinars - Micro Packaging Issues and Failure Analysis NEXT WEEK    ^ Top
Upon registering for one of our webinars, IMAPS provides the log-in details for the web software as well as the audio dial-in through your phone. You are able to view the presentation materials over your computer and listen to the live lecture through your phone. You will receive a copy of the slides for each session, and have direct interaction with the instructor.

PDC Webinar Series on Microelectronic Packaging Issues and Failure Analysis
Tom Green, TJ Green Associates, LLC
Wednesday, October 24 and Thursday, October 25, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Guide to Component Chip Attach - Including Flip Chip
Phillip Creter, Creter and Associates
Tuesday, October 30 and Thursday, November 1, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Introduction to Microelectronics Packaging Technology
Phillip Creter, Creter and Associates
Wednesday, November 7 and Thursday, November 8, 2012 - 12:00pm-1:00pm EASTERN

PDC Webinar Series on Polymers in Semiconductor Packaging
Dr. Jeff Gotro, InnoCentrix, LLC
Tuesdays, November 13, 20 and 27, 2012 - 12:00pm-1:00pm EASTERN

Wire Bonding Workshop & Tabletops - Abstracts Still Being Accepted & Tabletops Available Next Week    ^ Top
IMAPS Topical Workshop & Tabletop Exhibition on Wire Bonding will be held January 22-23, 2013, at the Radisson Hotel San Jose Airport in San Jose, California. Abstracts are Still Being Accepted . Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.imaps.org/wirebonding to submit abstracts, reserve a tabletop or register to attend.

The objective of Focused Wire Bonding Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wire Bonding. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Wire Bonding.

  • Cu/Low-K packaging processes
  • Terminal pad structures and modifications
  • Wire and Tool Advances
  • Assembly processes and handling issues
  • Copper Wire Bonding
  • Heavy and Fine Wire Wedge Bonding
  • Automotive and other Harsh Enviroments
  • Novel packaging and design
  • Failure Analysis and Reliability
  • Electromigration and Interfacial Adhesion
  • Testing and Probing Challenges
  • Simulation and Modeling

Those wishing to present a paper at the Wire Bonding Topical Workshop must submit a 200-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. Full written papers are not required; however, an extended abstract of 1-4 pages is due for accepted presenters no later than November 30, 2012.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form; will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check. The selected student must attend the event to present his or her work and receive the award. The Foundation will return the registration fee for the winner. The winner must pay for travel and lodging expenses.

Abstracts Due November 2 for IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013)    ^ Top
IMAPS/ACerS 9th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2013) will be held April 23-25, 2013, at the Buena Vista Palace Hotel & Spa in Orlando, Florida. Abstracts are due November 2, 2012. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.cicmt.org to submit abstracts, reserve a tabletop or register to attend.

Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Interconnect Track
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, lighting, solar, defense/security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on materials, processes, prototype development, advanced design and application opportunities.

Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors, and metamaterials. These new devices and applications exploit the ability to integrate complex 3D features and active components (e.g., valves, pumps, switches, light pipes, and reaction chambers).

In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include fabricating 3- D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal systems.

Special Features
• Invited keynote and international presentations on the current status ceramic technology and future system directions.

• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.

Planned Session and Paper Topics Include:

Ceramic Microsystems
Ceramic Interconnect

Markets and Applications
• MEMS Technology and Markets
• Batteries and Fuel Cells
• Biological and Medical
• Chemical and Biochemical
• Photonics
Materials and Properties
• Materials Integration & Nano-materials
• Thermal Management and Reliability
• Piezoelectric Materials

• Optoelectronics
Processing and Manufacturing
• MEMS Manufacturing Technology
• Industrial Automation and Rapid Prototyping
• Nano-technology/Integration
• High Temperature Microsystems
Devices
• Sensors and Actuators
• Micro-reactors
• Fluidic Devices
• Biomolecular and cell transport systems
• Energy Conversion systems
Characterization and Reliability
• Materials and Process Characterization
• Systems Reliability, Lifetime, and Failure Estimation
• Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
• Thermal and Heat Transfer
• Computational Fluid Dynamics


Markets and Applications
• Automotive
• Aerospace
• Lighting/Solar
• Wireless/Communication
• Medical Electronics
Materials and Properties/Functions
• Dielectric and Magnetic Materials
• Embedded and Integrated Passives
• Microwave/mm wave characterization
• Zero-shrink Ceramic Systems
Processing and Manufacturing
• LTCC and Multilayer Ceramics
• Roll to Roll and Continuous Manufacturing
• Direct WRite and Drop on Demand
• Advanced Thick Film Processing
• Fine Structuring Technologies
Devices
• Circuits, antennas, and filters
• Embedded Structures & Components
• Optical Devices and Optoelectronics
Characterization and Reliability
• Characterization of Green Tapes
• Life Testing, Quality Issues
• RF performance
Design, Modeling, and Simulation
• High Frequency Design Software

• Design Rules

Integrated Ceramic Technology
 

Advanced Packaging Technology
• Next Generation Packaging Technologies
• Packaging and Integration in BioMEMS
• Packaging Issues for MEMS Devices
• Technologies for Microsystems Components and Substrates
• Packaging Standard for Microsystems
• Environmental Issues, Lead Free Systems
• Cost Reduction


Abstracts Due November 2, 2012
Notice of Acceptance: December 3, 2012
Final Manuscripts Due: February 15, 2013

Please send your 250-300 word abstract electronically, using the on-line submittal form at: www.imaps.org/abstracts.htm. All papers will be presented and published in English. All speakers are required to pay a reduced registration fee.

If you are having problems with the on-line submittal form, please email Brian Schieman bschieman@imaps.org or call 1-202-548-8715 (USA).

International Conference and Exhibition on High Temperature Electronics Network (HiTEN) Now Open!    ^ Top
IMAPS International Conference and Exhibition on High Temperature Electronics Network (HiTEN) will be held July 8-10, 2013, at St. Catherine’s College in Oxford, United Kingdom. Abstracts are due January 25, 2013. Tabletops will be available within the week - contact bschieman@imaps.org if you are interested in a tabletop. Visit www.imaps.org/hiten to submit abstracts, reserve a tabletop or register to attend.

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Those wishing to present a paper at the HiTEN Conference must submit a 200-300 word abstract electronically no later January 25, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. A Final Manuscript of 6-12 pages, two-column format is due May 31, 2013, for all accepted abstract.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging. All Speakers are required to pay a reduced registration fee and are required to attend the entire Conference to maximize opportunities for interaction with registered attendees. 

  Chapter Activities (events listed in chronological order)
 

Chesapeake Chapter October 30 Fall Technical Symposium and Research Poster Contest    ^ Top

Date: October 30, 2012
Location:

Center for Advanced Life Cycle Engineering
University of Maryland at College Park
Glenn Martin Hall (Building 088), DeWalt Seminar Room (Room 2164)
CALCE office phone is 301-405-5323 or 301-405-7770

Registration:

IMAPS Members-$25, non-members-$30, and students-$5.00.
Checks/cash only on-site. Additional fee at the door of $5.00.
Pre-registration on-line by deadline to guarantee dinner seating.

Pre-register on-line by deadline (Monday, October 27) guarantees dinner seating.

Click Here to Register   
Please call Steve Greene at 202-548-8711 if registration becomes complicated. 

PROGRAM:

3:00   Registration and brief opening remarks.

3:30   “Reliability of SAC and Next Generation Lead-free Solders.” 
               Michael Osterman, Senior Research Scientist at CALCE

4:00  Student poster contest. 10 pre-qualified students will present their latest research at their posters.
            All industry participants are encouraged to participate as poster judges.
            Judges will use an easy, one-page evaluation form and their input will be confidential.
            
5:15  "History & Future of Photo Chemical Etching in Hermetic Seam Sealed Microelectronics Packaging."
           Robert Rossi, Executive Vice President of Photofabrication Engineering Inc.
           Brook Spaulding, Director of Sales and Marketing of Photofabrication Engineering

5:45  Event wrap-up.  Ideas for next event.  Student results at IMAPS 2012.  Notice of chapter election.

6:00 Dinner.

6:30 Event Concludes

Parking rates are $3.00 for an hour and $15.00 for the day.  Parking stations accept cash and credit cards.  (Free parking is available at many campus lots after 4:00 PM).  See more parking info. here. The visitor parking spots near the building are shown in this map. 

The closest metro station to Martin Hall is the College Park station on the green line.  Martin Hall is ¾ mile from the station.  University shuttle (#104) can be used to reach Martin Hall from the station - this is a free service and is available to public.

Presenter Abstracts and Bios:

“Reliability of SAC and Next Generation Lead-free Solders.”
While 95.5% tin 3.0% silver 0.5% copper by weight (SAC305) solder has become the conventional material used in printed circuit board assembly for the majority of electronic produced world-wide, research into improved reliability modeling and new solder compositions continues.  In particular, the reliability of products using SAC305 solder under high strain rate mechanical loads, such as drop, has pushed research into low silver content tin-silver copper solders and the addition of elements such as manganese, nickel and germanium. This presentation will review current knowledge on tin-based lead-free solders. It will include reliability models and test findings on SAC305 and low silver content tin based solder.  In addition, current test programs on low silver tin based lead-free solder will be reviewed with preliminary findings.

Bio of Michael Osterman
Dr. Osterman is a Senior Research Scientist and the director of the CALCE Electronic Products and System Consortium at the University of Maryland. Dr. Osterman served as a subject matter expert on phase I and II of the Lead-free Manhattan Project sponsored by Office of Naval Research in conjunction with the Joint Defense Manufacturing Technical Panel (JDMTP).  He has consulted with companies in the transition to lead-free materials and has developed fatigue models for several lead-free solders.  He has organized and chaired five international symposia on tin whiskers authored over fifteen articles related to the tin whisker phenomenon. He has written eight book chapters and over ninety articles, including the Best Session Paper Award in 41st International Symposium on Microelectronics, IMAPS 2008.

“Future of Photo Chemical Etching in Hermetic Seam Sealed Microelectronics Packaging.”
The photo chemical machining process is well known in the aerospace, defense and microelectronics industries because the process produces precision metal parts without burrs, without tool-on-tool wear, without heat and without change to magnetic properties.  The process also offers exacting precision in the z or depth direction.  The presentation will help the audience understand more about the types of metal, plating and tolerances that are available from modern photo chemical etching technology and how this comes together specifically for the manufacture of hermetic seam sealed step lids, flat lids and covers (as well as other sub-components).  The relevant trade-offs will also be explored between photo etching, stamping, CNC milling, laser and EDM (Electrical Discharge Machining).  Combining processes can yield exceptional results.

Bios of Robert Rossi and Brook Spaulding, Photofabrication Engineering, Inc.
Bob Rossi is the Executive Vice President of Photofabrication Engineering Inc. located in Milford, MA.  With nearly 40 years of experience in photo chemical machining, Bob oversees all aspects of the firm's production, quality control and environmental compliance.  He has served as a lecturer on behalf of the Society of Manufacturing Engineers for such topics as lean manufacturing and quality assurance.

Brook Spaulding is the Director of Sales & Marketing at Photofabrication Engineering Inc. (PEI).  Brook graduated from the MIT Sloan School of Management in 1991 with a MSM in Operations/Strategy and developed a deep background in the paper and paper converting industries before joining PEI.

Program Soon for IMAPS France Medical Workshop    ^ Top
The 1st Workshop on Advanced Technology on Microelectronics, Systems and Packaging for Medical Electronics will be held on December 4-5 in Paris, France. Abstracts were due in September. For further information, please consult the call for papers at the link: http://france.imapseurope.org/images/stories/documentPDF/cfp_medical_2012.pdf.

Organized in collaboration with Yole Développement, the first day of the workshop will feature internationally recognized speakers from industry and academia :

• Industry Trends & Forecasts in Medical Electronics
• Implantable and Wearable in New Diagnostics and Therapies

Sessions are being organized on following topics:

  • 3D Packaging & Interconnection
  • Component Manufacturing at Chip & Package Level
  • Implantable and Wearable Applications
  • Systems Communication (High Frequency, Data Remote Monitoring)
  • Sensors, Actuators, Power Supply
  • Embedded Passives and Associated Technologies

Please address your questions to imaps.france@imapsfrance.org

Authors will be notified of paper acceptance with instructions for publication before October 15th , 2012. Speaker will benefit with special rate of 120 Euros.

2nd Southeastern Microelectronics Packaging Conference    ^ Top

Date: February 28, 2013
Location:

Rosen Centre Hotel
9840 International Drive
Orlando, FL 32819

Details:

Abstracts Deadline November 23, 2012
Please email Doug Bokil - dbokil@bokil.com with questions

The objective of the Florida Chapter Microelectronics Symposium is to provide a forum that brings together experts from science, academia, design, manufacturing and business to discuss the latest advances and emerging applications in microelectronics and high density packaging. Topics of interest for submission include, but are not limited to:

  • 2.5D / 3D Packaging
  • Flip Chip and Wafer Bumping Processes
  • MEMS Packaging
  • Wire Bonding / Stud Bumping
  • LED / Optoelectronic / Photonic Packaging
  • Underfill / Encapsulants / Adhesives
  • Printed Electronics Technology
  • Design for Manufacturing / Test / Reliability
  • Substrate / PWB Technology
  • Testing of High Density & Microelectronic Assemblies
  • Thermal Management Solutions
  • Non-Hermetic Packaging for Harsh Environments
  • Embedded Device Packaging
  • Pb-Free Solder and RoHS Compliance
  • Microwave & RF Applications
  • Counterfeit Electronics Detection

Those wishing to present a paper at the Southeastern Microelectronics Packaging Conference must submit a 250-300 word abstract electronically no later than November 23, 2012

Further details regarding the conference and abstract submission will be available in October 2012.

This all day conference will have table top exhibits.

Exhibitors: Table top $450.00 Please email Doug Bokil - dbokil@bokil.com to secure your space. Meanwhile if you have any questions please email Doug Bokil

New England Chapter's 40 Symposium & Expo - Call For Papers    ^ Top

Date: Tuesday May 7th, 2013
Location:

Holiday Inn Boxborough Woods Conference Center
Boxborough, Massachusetts

Details:

Please send 250 word abstract to: Jim McLenaghan, AJM@Creyr.NET for more details visit us at: www.imapsne.org

Deadline for Abstract Submission – Monday December 31, 2012

For details about Sponsoring, Exhibiting or Attending Contact Harvey Smith: harveys@imapsne.org or Call 508-699-4767

CALL FOR PAPERS

Symposium Technical Chair
A. James (Jim) McLenaghan, Creyr Innovation, LLC

The Largest Regional Symposium Dedicated to Microelectronics and Packaging

Tuesday May 7th, 2013
----- Featuring -----
Six to Eight Lecture Sessions, Full Poster Session,
Employment Center & 80 Booth Exhibit Hall

The New England Chapter Symposium Technical Program Committee seeks papers that demonstrate how new technologies and applications are expanding and redefining microelectronics. Areas of interests include:

Industry

  • Medical Electronics
  • Lasers
  • Telecom – RF & Microwave
  • Military Electronics
  • Consumer Electronics
  • Renewable Energy: Fuel Cells, Solar, Wind
  • Thermal & Power Management
  • Manufacturing, Outsourcing & Quality
  • Software and Firmware Applications
  • High Performance Interconnects and Boards
  • Sensors (Manufacturing & Applications)
  • Emerging Technologies
  • Solar, Photovoltaic
  • Aerospace
  • Electronics for Environmental Impact Measurement & Assessment

Advanced Processes & Materials

  • 3D, SiP, and High Density Packaging
  • Nano Materials - Mfg., Applications, & Safety
  • Photonics, Optoelectronics, LED Packaging
  • MEMS and Nano Packaging
  • Underfill - Materials, Applications, Effectiveness
  • Green packaging - Regulation Compliance, Materials, Processes, Recycling
  • Flip-Chip and Bumping Processes & Reliability
  • Wire-bonding and Stud-Bumping
  • Embedded Components – Passives, Magnetics
  • Ceramic, Polymer and Conductive Materials
  • Cu, Low-K
  • Product DFR & DFM Tools, Programs, Implementation
  • Materials Deposition & Delivery - Print, Vapor, Dispensing, Placement, etc.

 

Quik-Pak

LORD Corporation

RGL Enterprises

EPP

Crane AE Banner

2012 Events:

Chesapeake Chapter
October 30

Thermal Management
November 12-14
*Exhibitors contact bschieman@imaps.org

Medical Applications (IMAPS France) - Dec. 4-5


2013 Events:

Wire Bonding
January 22-23

Southeastern Microelectronics Conference
February 28

Device Packaging
March 11-14
*Exhibitors contact bschieman@imaps.org

CICMT (Ceramics)
April 22-24
*Exhibitors contact bschieman@imaps.org

New England Chapter 40th Symposium & Expo
May 7

HiTEN (High Temp)
July 8-10
*Exhibitors contact bschieman@imaps.org

IMAPS 2013 (Orlando)
September 29-Oct. 3
*Exhibitors contact bschieman@imaps.org

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Amkor

 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

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